Vacuum pump shell with good sealing performance for semiconductor equipment

Abstract

The utility model provides a vacuum pump shell for semiconductor equipment, which is good in sealing performance and comprises a pump shell body and a motor connecting end seat which are connected through a sealing mechanism. The sealing mechanism comprises a sealing fence, an outer edge frame and an inflation sealing belt, the sealing fence is integrally formed and arranged at the opening end of the pump shell body, a concave ring face is arranged on the outer surface of the sealing fence, the outer edge frame is integrally formed and arranged at the opening end of the motor connecting end base, and the inflation sealing belt is arranged at the opening end of the motor connecting end base. The inflatable sealing tape is located on the inner side of the outer edge frame, the concave ring surface is filled with the inflatable sealing tape, and the sealing fence and the outer edge frame are connected in a sealed mode; according to the utility model, good sealing performance of the connection between the two is ensured, the phenomenon of tail gas leakage in the use stage of the vacuum pump is reduced, the safety is improved, the noise is effectively reduced, and the noise pollution is reduced.

Description

TECHNICAL FIELD

[0001] The utility model belongs to vacuum pump shell technical field relates to the good sealing semiconductor equipment vacuum pump shell. BACKGROUND

[0002] In the semiconductor production process, often need to use vacuum pump. The existing vacuum pump is mostly two stage pump of Roots and claw combination structure, the vacuum pump will produce a large amount of heat in the running process, if the heat is not exported or export efficiency is low, will make the pump body in each component long-term exposure in high temperature, thereby leading to the pump body in the component is easy to damage. Therefore, the surface of the vacuum pump shell is provided with a plurality of concave and convex lines, increase the area of contact with air, ensure the heat dissipation effect, such as patent number CN202190000670.7 discloses a two-stage rotary vane vacuum pump, its shell and shell assembly. The shell includes an outer surface and a first plurality of cooling fins protruding from the outer surface, wherein each cooling fin extends along the outer surface between a first cooling fin end and a second cooling fin end, and is a non-planar element, which also provides a two-stage rotary vane vacuum pump shell made by extrusion.

[0003] The shell structure disclosed above has the following disadvantages: the connection sealing property of the front end of the shell and the motor base part cannot be guaranteed, since the tail gas amount of the semiconductor equipment is large, the poor sealing property between the connections will cause the tail gas to overflow. Therefore, we design a good sealing semiconductor equipment vacuum pump shell. SUMMARY

[0004] The utility model discloses a good sealing semiconductor equipment vacuum pump shell to solve the problem in the background art.

[0005] The utility model discloses a good sealing semiconductor equipment vacuum pump shell, including pump shell main part and motor connecting end seat, the pump shell main part and motor connecting end seat are connected through sealing mechanism between,

[0006] The sealing mechanism includes sealing enclosure, outer edge frame and inflatable sealing belt, the sealing enclosure is integrally formed and arranged at the opening end of the pump shell main part, the outer surface of the sealing enclosure is provided with a concave ring surface, the outer edge frame is integrally formed and arranged at the opening end of the motor connecting end seat, the inflatable sealing belt is located on the inner side of the outer edge frame, and the inflatable sealing belt is filled in the concave ring surface and makes the sealing enclosure and the outer edge frame sealedly connected.

[0007] In the above-mentioned good sealing semiconductor equipment vacuum pump shell, the other end of the motor connecting end seat is provided with a motor connecting flange ring, and the bottom of the other end of the motor connecting end seat is provided with two motor connecting feet.

[0008] In the aforementioned vacuum pump housing for semiconductor devices with good sealing performance, a sound-insulating inner plate is provided inside the main body of the pump housing, and a hollow sound-insulating layer is provided inside the sound-insulating inner plate.

[0009] In the aforementioned well-sealed vacuum pump housing for semiconductor devices, a junction box is installed at the top of the main body of the pump housing. A cover plate is provided at the opening of the junction box, and a cover fixing seat is provided at the top of the cover plate. An electrical electrode is installed inside the junction box, and the electrical electrode's electrical terminal passes through the main body of the pump housing.

[0010] In the aforementioned well-sealed vacuum pump housing for semiconductor devices, oil ports are provided on one side of the top end and one side of the bottom end of the pump housing body. The oil port located at the top of the pump housing body and the oil port located at the bottom of the pump housing body are respectively the oil inlet and the oil outlet.

[0011] In the aforementioned well-sealed vacuum pump housing for semiconductor devices, bolt lugs are provided on both sides of the opening of the pump housing body. The pump housing body is fastened to the end of the motor connection seat by the two bolt lugs and the bolt threads.

[0012] Compared with the prior art, the advantages of this invention for a vacuum pump housing for semiconductor equipment with good sealing performance are as follows: A sealing mechanism connects the pump housing body and the motor connection end seat. The sealing mechanism includes a sealing barrier, an outer frame, and an inflatable sealing strip. The sealing barrier is integrally formed and located at the open end of the pump housing body, with a concave annular surface on its outer surface. The outer frame is integrally formed and located at the open end of the motor connection end seat. The inflatable sealing strip fills the concave annular surface, ensuring a sealed connection between the sealing barrier and the outer frame. This ensures good sealing performance between the two, reducing exhaust gas leakage during vacuum pump operation and improving safety. Furthermore, a sound-insulating inner plate is installed inside the pump housing body, with a hollow sound-insulating layer inside, further reducing noise generation and pollution. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the vacuum pump housing for semiconductor equipment with good sealing performance according to this utility model.

[0014] Figure 2 This is a schematic diagram of the sealing mechanism of the vacuum pump housing for semiconductor equipment with good sealing performance according to this utility model.

[0015] Figure 3 This is a three-dimensional structural diagram of the junction box for a vacuum pump housing in semiconductor equipment with good sealing performance, according to this utility model.

[0016] In the figure, 1, pump shell main body; 2, motor connecting end seat; 3, motor connecting flange ring; 4, motor connecting leg; 5, oil port position; 6, junction box; 7, sealing enclosure; 8, concave ring surface; 9, outer frame; 10, inflatable sealing band; 11, hollow sound insulation layer; 12, sound insulation inner plate; 13, bolt lug; 14, box cover plate; 15, box cover fixing seat; 16, power electrode. DETAILED DESCRIPTION

[0017] The following is a specific embodiment of the utility model and further describes the technical scheme of the utility model in combination with the drawings, but the utility model is not limited to these embodiments.

[0018] As Figure 1 , Figure 2 and Figure 3 indicated, the utility model good sealing vacuum pump shell for semiconductor equipment, including pump shell main body 1 and motor connecting end seat 2, motor connecting end seat 2's other end part is provided with motor connecting flange ring 3, and the bottom of the other end of motor connecting end seat 2 is provided with two motor connecting legs 4, and the top of pump shell main body 1 is installed with junction box 6, and the opening of junction box 6 is equipped with box cover plate 14, and the top of box cover plate 14 is provided with box cover fixing seat 15, and the inside of junction box 6 is installed with power electrode 16, and the power end of power electrode 16 passes through pump shell main body 1, and the side of the top of pump shell main body 1 and the side of the bottom are provided with oil port position 5, and the oil port position 5 at the top of pump shell main body 1 and the oil port position 5 at the bottom of pump shell main body 1 are oil inlet and oil outlet respectively.

[0019] Embodiment one: the pump shell main body 1 and motor connecting end seat 2 are connected through a sealing mechanism; the sealing mechanism includes sealing enclosure 7, outer frame 9 and inflatable sealing band 10, the sealing enclosure 7 is integrally formed at the opening end of pump shell main body 1, the outer surface of sealing enclosure 7 is provided with concave ring surface 8, the outer frame 9 is integrally formed at the opening end of motor connecting end seat 2, the inflatable sealing band 10 is located at the inner side of outer frame 9, and the inflatable sealing band 10 is filled at the concave ring surface 8 and makes sealing enclosure 7 and outer frame 9 sealingly connected.

[0020] The scheme ensures that the connection between the pump shell main body 1 and the motor connecting end seat 2 has good sealing performance, reduces the phenomenon of tail gas leakage of the vacuum pump during use, and improves the safety.

[0021] Further, bolt lugs 13 are arranged at both sides of the opening of the pump shell main body 1, and the pump shell main body 1 is fastened at the end of the motor connecting end seat 2 through the two bolt lugs 13 and bolts, so that the connection between the pump shell main body 1 and the motor connecting end seat 2 is more firm.

[0022] Embodiment two: including pump shell body 1 and motor connecting end seat 2, pump shell body 1 and motor connecting end seat 2 are welded, motor connecting flange ring 3 is arranged at the other end of motor connecting end seat 2, two motor connecting feet 4 are arranged at the bottom of the other end of motor connecting end seat 2, the top end of pump shell body 1 is provided with terminal box 6, box cover plate 14 is arranged at the opening of terminal box 6, box cover fixing seat 15 is arranged at the top end of box cover plate 14, and power electrode 16 is arranged in terminal box 6, the power end of power electrode 16 passes through pump shell body 1, oil port position 5 is arranged at the top end of pump shell body 1 and the bottom end of pump shell body 1, the oil port position 5 at the top of pump shell body 1 and the oil port position 5 at the bottom of pump shell body 1 are respectively oil inlet and oil outlet, sound insulation inner plate 12 is arranged in pump shell body 1, and hollow sound insulation layer 11 is arranged in sound insulation inner plate 12.

[0023] The scheme more effectively reduces the generation of noise and reduces the pollution of noise.

[0024] The contents not described in detail in the specification belong to the prior art known to the person skilled in the art. The specific embodiments described in the specification are only illustrative of the spirit of the utility model. The person skilled in the art to which the utility model belongs can make various modifications or supplements to the described specific embodiments or replace them with similar ways, but will not deviate from the spirit of the utility model or exceed the scope defined by the attached claims.

Claims

1. A vacuum pump housing for semiconductor equipment with good sealing, comprising a pump housing main body (1) and a motor connecting end seat (2), characterized in that, The pump shell body (1) and the motor connecting end seat (2) are connected through a sealing mechanism; The sealing mechanism comprises a sealing enclosure (7), an outer frame (9) and an inflatable sealing band (10), the sealing enclosure (7) is integrally formed at the open end of the pump shell body (1), the outer surface of the sealing enclosure (7) is provided with a concave annular surface (8), the outer frame (9) is integrally formed at the open end of the motor connecting end seat (2), the inflatable sealing band (10) is located inside the outer frame (9), the inflatable sealing band (10) is filled at the concave annular surface (8) and makes the sealing enclosure (7) and the outer frame (9) sealingly connected.

2. The vacuum pump housing for a semiconductor device according to claim 1, wherein The motor connecting flange ring (3) is arranged at the other end of the motor connecting end seat (2), and two motor connecting feet (4) are arranged at the bottom of the other end of the motor connecting end seat (2).

3. The vacuum pump housing for a semiconductor device according to claim 1, wherein The inside of the pump shell body (1) is provided with a sound insulation inner plate (12), and the inside of the sound insulation inner plate (12) is provided with a hollow sound insulation layer (11).

4. The vacuum pump housing for a semiconductor device according to claim 1, wherein The top end of the pump shell body (1) is provided with a junction box (6), the opening of the junction box (6) is provided with a box cover plate (14), the top end of the box cover plate (14) is provided with a box cover fixing seat (15), the inside of the junction box (6) is provided with an electric contact electrode (16), and the electric contact end of the electric contact electrode (16) penetrates through the pump shell body (1).

5. The vacuum pump housing for a semiconductor device according to claim 1, wherein The top end and the bottom end of the pump shell body (1) are provided with oil port positions (5), the oil port position (5) at the top end of the pump shell body (1) is an oil inlet, and the oil port position (5) at the bottom end of the pump shell body (1) is an oil outlet.

6. The vacuum pump housing for a semiconductor device according to claim 1, wherein The two sides of the opening of the pump shell body (1) are provided with bolt lugs (13), and the pump shell body (1) is fastened at the end of the motor connecting end seat (2) through the two bolt lugs (13) and bolts.

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