Detection device applied to chip packaging process

Abstract

The utility model discloses a detection device applied to a chip packaging process, which comprises a rack, a conveying belt arranged on the rack, a first material box bearing mechanism, a second material box bearing mechanism and an optical detection mechanism, and is characterized in that the first material box bearing mechanism is used for placing a plurality of layers of PCBA material boxes and pushing the PCBA material boxes to the conveying belt layer by layer; the conveying belt is used for conveying PCBA material boxes to a detection station, the second material box bearing mechanism is used for collecting the detected PCBA material boxes, the optical detection mechanism is arranged above the detection station, and when the PCBA material boxes move to the position below the optical detection mechanism, the optical detection mechanism obtains image information of chips in the PCBA material boxes and transmits the image information to the background control system. The detection device applied to the chip packaging process can automatically detect the chip through the optical detection mechanism, avoids the loss of manual visual inspection, realizes full-automatic testing, reduces the labor intensity of workers, and improves the production efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of chip package manufacturing, particularly to a detection device applied to a chip packaging process. BACKGROUND

[0002] The conventional inspection mode after chip mounting and gold wire binding is artificial visual inspection using a desktop microscope. Based on the objective existence of many chip types, small chip rotation and offset, high wire binding density, thin wire diameter, and small spacing, there are missed inspection and misjudgment in the process of artificial visual inspection, and long-time naked eye detection on the microscope is prone to eye discomfort. UTILITARY MODEL

[0003] The utility model discloses a detection device applied to a chip packaging process, which can automatically obtain image information of the chip to be detected through an optical detection mechanism, avoid missed inspection of artificial visual inspection, and fully automatically test, thereby reducing the labor intensity of workers and improving production efficiency.

[0004] To solve the above technical problems, the utility model adopts the technical scheme of a detection device applied to a chip packaging process, which comprises a rack, a conveying belt arranged on the rack, a first magazine carrying mechanism, a second magazine carrying mechanism, and an optical detection mechanism. The first magazine carrying mechanism is used for placing several layers of PCBA magazines and pushing the PCBA magazines layer by layer onto the conveying belt. The conveying belt is used for conveying the PCBA magazines to a detection station. The second magazine carrying mechanism is used for collecting the PCBA magazines after detection. The optical detection mechanism is arranged above the detection station. When the PCBA magazine moves below the optical detection mechanism, the optical detection mechanism obtains image information of the chip in the PCBA magazine and transmits the image information to a background control system.

[0005] In a preferred embodiment of the utility model, the optical detection mechanism comprises a camera fixing seat arranged on the rack at the side of the conveying belt, a CCD camera arranged on the camera fixing seat through an adjusting block, and a matched light source assembly.

[0006] In a preferred embodiment of the utility model, the adjusting block is used for fixing the CCD camera and adjusting the left and right positions of the CCD camera.

[0007] In a preferred embodiment of the utility model, a baffle is arranged below the optical detection mechanism and at both sides of the conveying belt.

[0008] In a preferred embodiment of the utility model, the first material box bearing mechanism and the second material box bearing mechanism are the same in structure, comprising a bottom plate, a jacking mechanism arranged below the bottom plate, limiting plates arranged on both sides of the bottom plate and an electric push cylinder for pushing the PCBA material box to move to the conveying belt.

[0009] In a preferred embodiment of the utility model, a display screen arranged on the rack is further included, and the display screen is connected with the background control system.

[0010] In a preferred embodiment of the utility model, a carrier is arranged on the PCBA material box, and the PCBA chip to be detected is placed in the cavity of the carrier.

[0011] The utility model has the advantages that the image information of the chip to be detected can be automatically obtained through the optical detection mechanism, the loss of manual visual inspection is avoided, full-automatic testing is realized, the labor intensity of workers is reduced, the production cost is reduced and the production efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from these drawings without creative labor, wherein:

[0013] Fig. 1 It is the structural schematic diagram of the detection device of the utility model applied to the chip packaging process;

[0014] Fig. 2 It is the schematic diagram of the optical detection mechanism in the utility model. DETAILED DESCRIPTION

[0015] The technical scheme in the embodiments of the utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0016] Please refer to Figs. 1-2The utility model relates to a detection device applied to chip packaging process, include: frame 1, set up on the conveying belt 2 of frame, first material box bearing mechanism 3, second material box bearing mechanism 4 and optical detection mechanism 5, first material box bearing mechanism is used for placing several layers PCBA material box 6 and pushes PCBA material box to the conveying belt layer by layer, the conveying belt is used for conveying PCBA material box to detection station, second material box bearing mechanism is used for collecting the PCBA material box after detection, optical detection mechanism is located above the detection station, when PCBA material box moves to the optical detection mechanism below, optical detection mechanism obtains the image information of chip in PCBA material box and is transmitted to background control system, realizes the full -automatic transmission of PCBA material box, detects and judges, avoids the loss of artificial visual inspection, full -automatic test, reduces the labor intensity of worker, improves the detection efficiency.

[0017] Specifically, the optical detection mechanism includes a camera fixing seat 51 disposed on the frame at the side of the conveying belt, a CCD camera 53 disposed on the camera fixing seat through an adjusting block 52, and a matching light source assembly 54, wherein the adjusting block adopts a screw rod type adjustment mode for fixing the CCD camera while adjusting the left and right positions of the CCD camera.

[0018] Specifically, a baffle 7 is disposed below the optical detection mechanism and at both sides of the conveying belt, the baffle is located at the detection station, a carrier 8 is disposed on the PCBA material box, the PCBA chip to be detected is placed in the cavity of the carrier, and the background control system controls the start and stop of the conveying belt to facilitate the optical detection mechanism to align the chip to be detected in the cavity of the carrier.

[0019] Specifically, the first material box bearing mechanism and the second material box bearing mechanism have the same structure, in this embodiment, including a bottom plate 31, a jacking mechanism 32 disposed below the bottom plate, limiting plates 33 disposed at both sides of the bottom plate, and an electric push cylinder (not shown in the figure) for pushing the PCBA material box to move onto the conveying belt.

[0020] Specifically, it further includes a display screen 9 disposed on the frame, the display screen is connected with the background control system, displays the data information after testing, and is convenient for workers to check.

[0021] The utility model discloses the beneficial effect is: can through optical detection mechanism automatic acquisition the image information of the chip of detection, avoids the loss of artificial visual inspection, fully automatic test, has reduced the labor intensity of worker, has reduced personnel production cost and has improved production efficiency.

[0022] The above-mentioned is only the embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process transformation using the utility model specification content, or direct or indirect application in other related technical fields, are all included in the patent protection range of the utility model.

Claims

1. A detection device applied in a chip packaging process, characterized in that, The application relates to a PCBA (Printed Circuit Board Assembly) optical detection device. The device comprises a rack, a conveying belt arranged on the rack, a first material box bearing mechanism, a second material box bearing mechanism and an optical detection mechanism, the first material box bearing mechanism is used for placing several layers of PCBA material boxes and pushing the PCBA material boxes to the conveying belt layer by layer, the conveying belt is used for conveying the PCBA material boxes to a detection station, the second material box bearing mechanism is used for collecting the PCBA material boxes after detection, and the optical detection mechanism is arranged above the detection station; when the PCBA material box moves below the optical detection mechanism, the optical detection mechanism acquires image information of a chip in the PCBA material box and transmits the image information to a background control system.

2. The detection device applied in the chip packaging process according to claim 1, wherein, The optical detection mechanism comprises a camera fixing seat arranged on the rack and located on the side of the conveying belt, a CCD camera arranged on the camera fixing seat through an adjusting block and a matched light source assembly.

3. The inspection apparatus for use in a chip packaging process according to claim 2, wherein The adjusting block is used for fixing the CCD camera and can adjust the left and right positions of the CCD camera.

4. The inspection apparatus for use in a chip packaging process according to claim 1, wherein A baffle is arranged below the optical detection mechanism and on both sides of the conveying belt.

5. The inspection apparatus for use in a chip packaging process according to claim 1, wherein The first material box bearing mechanism and the second material box bearing mechanism have the same structure and comprise a bottom plate, a jacking mechanism arranged below the bottom plate, limiting plates arranged on both sides of the bottom plate and electric push cylinders used for pushing the PCBA material boxes to move to the conveying belt.

6. The inspection apparatus for use in a chip packaging process according to claim 1, wherein A display screen arranged on the rack is further included, and the display screen is connected with the background control system.

7. The inspection apparatus for use in a chip packaging process according to claim 1, wherein A carrier is arranged on the PCBA material box, and a PCBA chip to be detected is arranged in a cavity of the carrier.

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