Copper ion concentration monitoring device and VCP plating line

Abstract

The utility model provides a copper ion concentration monitoring device and a VCP plating line, and belongs to the technical field of PCB production. The copper ion concentration monitoring device comprises a monitoring probe and a monitoring main body, wherein the monitoring probe is electrically connected with the monitoring main body. A display screen, an alarm and a controller are arranged in the monitoring main body, and the controller is electrically connected with the monitoring probe, the display screen and the alarm. The copper ion concentration monitoring device can monitor the copper ion concentration of a solution, gives an alarm when the copper ion concentration of the solution exceeds a set value, is applied to a VCP plating line, and is beneficial to guaranteeing the production quality of circuit boards.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of PCB production, especially to a copper ion concentration monitoring device and VCP plating line. BACKGROUND

[0002] Printed circuit board (PCB) as the key carrier of electrical connection of electronic components, its production quality has important influence on the quality of electronic products. Vertical continuous plating equipment (VCP) is a kind of efficient, automatic plating equipment, and is widely used in the manufacturing process of printed circuit board. VCP production process usually includes the steps of pretreatment cleaning, washing, pre-dipping, copper cylinder, washing, pickling, washing, drying, plate receiving and the like, and PCB board is vertically hung on plating clamp and sequentially completes each link through conveying steel belt during operation.

[0003] In the pretreatment stage of VCP copper plating, the PCB board after copper deposition needs to be soaked in the cleaning cylinder and pre-dipping cylinder solution. In the existing production process, the copper ions in the solution of the cleaning cylinder and the pre-dipping cylinder will continuously accumulate. When the copper ion concentration exceeds a certain limit, or the soaking time of the PCB board in the two cylinder bodies is too long, the copper deposition layer deposited in the hole in the PCB board in the previous copper deposition process will be eroded by the solution, causing the thickness to become thin, and eventually causing the adverse phenomenon of no copper in the hole. Therefore, the copper ion concentration of the solution in the cleaning cylinder and the pre-dipping cylinder needs to be strictly controlled. For example, the copper ion concentration of the solution in the cleaning cylinder and the pre-dipping cylinder must be controlled to be ≤0.7g / L. Once it exceeds this range, the cylinder needs to be replaced for processing to ensure the production quality of the PCB.

[0004] However, in the prior art, there is a lack of effective means for monitoring the copper ion concentration of the solution. SUMMARY

[0005] To overcome the problems in the related art, one of the purposes of the utility model is to provide a copper ion concentration monitoring device, which can monitor the copper ion concentration of the solution and alarm when the copper ion concentration of the solution exceeds the set value, and is applied in the VCP plating line, which helps to ensure the production quality of the circuit board.

[0006] A copper ion concentration monitoring device, comprising:

[0007] A monitoring probe and a monitoring main body, the monitoring probe is electrically connected with the monitoring main body;

[0008] The monitoring main body is provided with a display screen, an alarm and a controller, and the controller is electrically connected with the monitoring probe, the display screen and the alarm.

[0009] In the preferable technical scheme of the utility model, signal processor is further arranged in the monitoring main body, the input end of the signal processor is electrically connected with the monitoring probe, and the output end of the signal processor is electrically connected with the controller.

[0010] In the preferable technical scheme of the utility model, wireless communication module is further arranged in the monitoring main body, and the wireless communication module is electrically connected with the controller.

[0011] In the preferable technical scheme of the utility model, the monitoring main body comprises a shell, the controller is arranged in the shell, and the lateral wall of the shell is provided with heat dissipation holes.

[0012] Cooling end and heating end are further arranged in the shell, the cooling end is connected with the controller, and the heating end is arranged close to the heat dissipation holes.

[0013] The second purpose of the utility model is to provide a VCP electroplating line, which comprises a cleaning tank and a pre-dipping tank, and further comprises the copper ion concentration monitoring device as described above, and the monitoring probe is arranged in the cleaning tank and the pre-dipping tank.

[0014] In the preferable technical scheme of the utility model, conveying chains are arranged above the cleaning tank and the pre-dipping tank, clamping jigs are arranged on the conveying chains, the clamping jig comprises a mounting plate, an adjusting plate and a plurality of clamping heads, the mounting plate is arranged on the conveying chain, lifting driving structures are arranged on the mounting plate, the output ends of the lifting driving structures are provided with the adjusting plate, and a plurality of clamping heads are arranged on the adjusting plate.

[0015] In the preferable technical scheme of the utility model, the output ends of the lifting driving structures are provided with connecting plates, electric sliding blocks are arranged on the connecting plates, and the adjusting plate is fixed on the electric sliding blocks.

[0016] In the preferable technical scheme of the utility model, a control system is further arranged, and the control system is electrically connected with the monitoring main body, the lifting driving structures and the electric sliding blocks.

[0017] The utility model has the advantages of the following:

[0018] The utility model provides a copper ion concentration monitoring device, the copper ion concentration monitoring device includes monitoring probe and monitoring main part, and monitoring probe is connected with monitoring main part electricity. The display screen, alarm and controller are provided in monitoring main part, and the controller is connected with monitoring probe, display screen and alarm electricity. The copper ion concentration monitoring device in the use process, install monitoring probe in the front treatment jar (including clean jar and pre -immersion jar) of VCP electroplating line, ensure that the probe can contact solution fully and be in the area that solution flow is more stable, to obtain representative copper ion concentration data. Monitoring probe detects copper ion concentration in solution in real time, and the electric signal is transmitted to the controller in monitoring main part. The controller carries out analysis processing to the signal received, and shows the copper ion concentration value after processing on the display screen, and the operator can check at any time. If the copper ion concentration in solution is close to or exceeds the set value, the controller triggers the alarm immediately. The operator can take measures quickly after hearing the alarm, such as treating or replacing the jar body of solution. Through real -time monitoring copper ion concentration and timely alarm, effectively prevent the problem of no copper in PCB board hole caused by copper ion overproof, ensure the quality stability of PCB board in the process of electroplating pretreatment, reduce the generation of defective products, improve the yield of products.

[0019] The application also provides a VCP electroplating line comprising the copper ion concentration monitoring device, which can monitor the copper ion concentration of the solution in real time, thereby discovering and effectively preventing the erosion of the copper ion concentration overproof to the copper layer in the hole of the PCB board in time, greatly reducing the probability of occurrence of serious quality defects such as no copper in the hole, and avoiding the generation of a large number of defective products. BRIEF DESCRIPTION OF DRAWINGS

[0020] REFERENCE NUMERALS

[0021] 1, monitoring main part;11, display screen;12, alarm;13, heat dissipation hole;14, signal processor;15, controller;16, wireless communication module;17, shell;2, monitoring probe;3, cooling fin;100, clean jar;200, pre -immersion jar;300, conveying chain;310, mounting plate;400, lifting drive structure;410, connecting plate;420, electric sliding block;500, adjusting plate;510, chuck.

[0022] Figure 1 It is the perspective view of the existing copper ion concentration monitoring device provided by the utility model;

[0023] Figure 2 It is the schematic diagram of the electric connection of each component in the detection main body provided in the embodiment of the utility model;

[0024] Figure 3It is the structural schematic view of the heat dissipation fin provided in the embodiment of the utility model in the shell of the monitoring main body.

[0025] Figure 4 It is the schematic view of the VCP electroplating line provided in the embodiment of the utility model. DETAILED DESCRIPTION

[0026] Preferred embodiments of the present application will be described in more detail with reference to the drawings. Although the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to convey the scope of the present application to those skilled in the art.

[0027] In the pretreatment stage of the VCP electroplating line for copper plating, the PCB board after copper deposition needs to be soaked in the cleaning tank and the pre-dipping tank solution. In the existing production process, the copper ions in the solution of the cleaning tank and the pre-dipping tank will continuously accumulate. When the copper ion concentration exceeds a certain limit, or the soaking time of the PCB board in the two tank bodies is too long, the copper deposition layer deposited in the hole in the PCB board in the previous copper deposition process will be eroded by the solution, causing the thickness to become thinner, and eventually resulting in the undesirable phenomenon of no copper in the hole. Therefore, the copper ion concentration of the solution in the cleaning tank and the pre-dipping tank needs to be strictly controlled, such as the copper ion concentration of the solution in the cleaning tank and the pre-dipping tank must be controlled at ≤0.7g / L. Once it exceeds this range, the tank needs to be replaced for processing to ensure the production quality of the PCB.

[0028] However, in the prior art, there is a lack of effective means for monitoring the copper ion concentration of the solution. Based on this, the present application provides a copper ion concentration monitoring device.

[0029] Embodiment 1

[0030] As shown in Figures 1-3 The copper ion concentration monitoring device provided by the present embodiment comprises:

[0031] The monitoring probe 2 and the monitoring main body 1 are electrically connected.

[0032] The monitoring main body 1 is provided with a display screen 11, an alarm 12 and a controller 15, and the controller 15 is electrically connected with the monitoring probe 2, the display screen 11 and the alarm 12.

[0033] The device can be used in the production process of VCP electroplating line to monitor the concentration of the solution in the cleaning tank 100 and the pre-dipping tank 200. Specifically, before the production process starts, the operator can set the upper limit of the copper ion concentration of the cleaning tank 100 and the pre-dipping tank 200 in the controller 15 by monitoring the operation button on the main body 1 according to the current PCB production process requirements and past experience data, for example, the cleaning tank 100 is set to 0.6 g / L and the pre-dipping tank 200 is set to 0.7 g / L. When the VCP electroplating line starts to run, the copper-deposited PCB board enters the cleaning tank 100 and the pre-dipping tank 200 for processing. The monitoring probe 2 detects the copper ion concentration in the solution in real time and transmits the electrical signal to the controller 15 in the monitoring main body 1. The controller 15 analyzes and processes the received signal and displays the processed copper ion concentration value on the display screen 11 for the operator to check at any time.

[0034] Specifically, the working principle of the monitoring probe 2 of the present application is that the monitoring probe 2 contains a sensitive film with specific selectivity to copper ions. This sensitive film is the core component of the probe, and its material has unique chemical properties, allowing only copper ions to pass through or interacting with copper ions. When the monitoring probe 2 is immersed in a solution containing copper ions (such as the solution in the cleaning tank 100 or the pre-dipping tank 200 of the VCP electroplating line), the copper ions in the solution will react with the sensitive film through ion exchange or adsorption. Due to the difference in copper ion activity (effective concentration) inside and outside the sensitive film, a potential difference will be formed on both sides of the film. Different concentrations of copper ions will result in different membrane potentials, and by measuring the membrane potential, the concentration of copper ions in the solution can be indirectly reflected.

[0035] The above-mentioned copper ion concentration monitoring device, in the process of use, installs the monitoring probe 2 in the front processing tank (including the cleaning tank 100 and the pre-dipping tank 200) of the VCP electroplating line, ensures that the probe can fully contact the solution and is in the area where the solution flow is relatively stable, to obtain representative copper ion concentration data. The monitoring probe 2 detects the copper ion concentration in the solution in real time and transmits the electrical signal to the controller 15 in the monitoring main body 1. The controller 15 analyzes and processes the received signal and displays the processed copper ion concentration value on the display screen 11 for the operator to check at any time. When the copper ion concentration in the solution approaches or exceeds the set value, the controller 15 immediately triggers the alarm 12. After hearing the alarm, the operator can quickly take measures such as treating or replacing the solution. By monitoring the copper ion concentration in real time and timely alarming, the problem of no copper in the holes of the PCB caused by excessive copper ions is effectively prevented, the quality stability of the PCB during the pre-treatment process of electroplating is ensured, the production of defective products is reduced, and the yield of products is improved.

[0036] Further, the monitoring body 1 is further provided with a signal processor 14, an input end of the signal processor 14 is electrically connected with the monitoring probe 2, and an output end of the signal processor 14 is electrically connected with the controller 15.

[0037] When the monitoring probe 2 detects the concentration of copper ions in the solution, a relatively weak electric signal is generated. The intensity of the electric signal can be relatively low, which is not conducive to subsequent signal processing and analysis, and even can be distorted by external interference during transmission. The signal processor 14 can amplify the weak electric signal generated by the monitoring probe 2. Through the built-in amplification circuit, it can raise the amplitude of the signal to a suitable level, so that the subsequent processing unit (such as the controller 15) can accurately identify and process. The signal processor 14 can also use a filter circuit to filter the received signal, removing or weakening the interference noise from the original signal. For example, it can use a low-pass filter to remove high-frequency noise, use a high-pass filter to remove low-frequency noise, or use a band-pass filter to only retain the signal in the frequency range related to the measurement of copper ion concentration. Through filtering, the signal transmitted to the controller 15 is more pure and only contains effective information closely related to the measurement of copper ion concentration, just like filtering out clear and useful sound from a pile of noise, ensuring the accuracy and reliability of the measurement data. And the signal processor 14 will convert the amplified and filtered analog signal into a digital signal. This signal conversion is very important for digital signal processing and storage, which makes it more convenient for the controller 15 to process, analyze and store data.

[0038] More preferably, the monitoring body 1 is further provided with a wireless communication module 16, and the wireless communication module 16 is electrically connected with the controller 15.

[0039] The wireless communication module 16 is connected with the controller 15, so that the monitoring device can send the measured copper ion concentration data and other related information (such as the state of the monitoring probe 2, the running state of the equipment, alarm information, etc.) through wireless mode. The wireless communication module 16 can use any one of Wi-Fi, Bluetooth, ZigBee or LoRa communication mode for wireless communication.

[0040] In a more specific embodiment, the monitoring body 1 includes a shell 17, the controller 15 is arranged in the shell 17, and a side wall of the shell 17 is provided with a heat dissipation hole 13.

[0041] The shell 17 is further provided with a heat sink 3, the heat sink 3 includes a refrigeration end and a heating end, the refrigeration end is connected with the controller 15, and the heating end is arranged close to the heat dissipation hole 13.

[0042] The heat dissipation fin 3 adopts semiconductor refrigeration technology. When the controller 15 generates heat during operation, the refrigeration end absorbs the heat of the controller 15, and the heat is transferred to the heating end through the action of the semiconductor refrigeration fin. The heating end is close to the heat dissipation hole 13, so that the heat can be effectively dissipated to the external environment through the heat dissipation hole 13. In the normal production process, the controller 15 continuously receives data from the monitoring probe 2, and also generates a certain amount of heat. Due to the presence of the heat dissipation fin 3, the temperature of the controller 15 can be effectively controlled within a suitable range. For example, when the controller 15 works continuously for several hours in a hot summer environment, its temperature will rise due to continuous operation and signal processing. However, through the action of the heat dissipation fin 3, the temperature of the controller 15 can always be maintained within a suitable temperature range for operation, ensuring the normal and stable operation of the controller 15.

[0043] Embodiment 2

[0044] As shown in Figures 1-4 The present embodiment provides a VCP plating line, which comprises a cleaning tank 100 and a pre-dipping tank 200, and further comprises a copper ion concentration monitoring device as described above, and the monitoring probe 2 is arranged in the cleaning tank 100 and the pre-dipping tank 200.

[0045] Specifically, the VCP plating line clamping jig is used to clamp the product to be processed. The cleaning tank 100 and the pre-dipping tank 200 are provided with a conveying chain 300, and the conveying chain is provided with a clamping jig. The clamping jig comprises a mounting plate 310, an adjusting plate 500 and a plurality of clamping heads 510. The mounting plate 310 is arranged on the conveying chain 300, and the mounting plate 310 is provided with a lifting driving structure 400. The output end of the lifting driving structure 400 is provided with the adjusting plate 500, and the adjusting plate 500 is provided with a plurality of clamping heads 510. Further, the output end of the lifting driving structure 400 is provided with a connecting plate 410, and the connecting plate 410 is provided with an electric sliding block 420. The adjusting plate 500 is fixed on the electric sliding block 420.

[0046] Further, a control system is further included, and the control system is electrically connected with the monitoring body 1, the lifting driving structure 400 and the electric sliding block 420.

[0047] The working process of the VCP plating line is as follows: the clamping jig is used to clamp the PCB product to be processed. The mounting plate 310 is firmly arranged on the conveying chain 300, and the PCB product is sequentially sent into each plating treatment process as the conveying chain 300 operates. The lifting drive structure 400 on the mounting plate 310 provides power for the lifting of the product to be plated, and the lifting drive structure 400 can be an electric push rod, an air cylinder or a linear motor, etc. When the product needs to be immersed or taken out of the plating solution, the lifting drive structure 400 controls the lifting action of the product according to the instruction of the control system. The electric sliding block 420 can move the adjusting plate 500 in the horizontal direction to realize the position adjustment of the product in the horizontal direction. The adjusting plate 500 is provided with a plurality of said clamping heads 510, which can adopt elastic materials or control the clamping force through pressure sensors to ensure that the PCB products of different sizes and shapes can be firmly clamped without causing damage to the products.

[0048] During production, when the PCB product to be processed is sent into the cleaning tank 100, the control system first controls the lifting drive structure 400 to lower the adjusting plate 500 so that the product is immersed in the cleaning solution. At the same time, the electric sliding block 420 can adjust the product to the optimal horizontal position according to the size of the product and the layout of the cleaning tank 100, to ensure that the entire product surface can uniformly receive cleaning treatment.

[0049] The control system operates according to the data feedback from the copper ion concentration monitoring device. When the controller 15 of the monitoring main body 1 detects that the copper ion concentration in the cleaning tank 100 or the pre-dipping tank 200 approaches or exceeds the set threshold value, the control system will receive an alarm signal and take corresponding measures. For example, when the copper ion concentration in the cleaning tank 100 reaches the pre-warning value, the control system can automatically adjust the speed of the conveying chain 300, or notify the operator to perform solution treatment or replace the tank body operation. In different processes, such as transferring the product from the cleaning tank 100 to the pre-dipping tank 200, the control system controls the lifting drive structure 400 to lift the product, and then adjusts the horizontal position of the product through the electric sliding block 420, to ensure that the product can accurately enter the pre-dipping tank 200 for the next process. In addition, the control system can also flexibly adjust the residence time, lifting speed and horizontal moving distance of the product in each tank according to different product types and process requirements, to realize highly automated and personalized production operation.

[0050] In addition, it should be noted that the use of "first", "second" and the like to define parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, and therefore cannot be understood as limiting the scope of protection of the present application.

[0051] The above merely describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A copper ion concentration monitoring device, characterized by, The application relates to a copper ion concentration monitoring device. The monitoring device comprises a monitoring probe and a monitoring main body, and the monitoring probe is electrically connected with the monitoring main body. The monitoring main body is provided with a display screen, an alarm and a controller, and the controller is electrically connected with the monitoring probe, the display screen and the alarm.

2. The copper ion concentration monitoring device according to claim 1, wherein: The monitoring main body is further provided with a signal processor, the input end of the signal processor is electrically connected with the monitoring probe, and the output end of the signal processor is electrically connected with the controller.

3. The copper ion concentration monitoring device according to claim 1, wherein: The monitoring main body is further provided with a wireless communication module, and the wireless communication module is electrically connected with the controller.

4. The copper ion concentration monitoring device according to any one of claims 1-3, wherein: The monitoring main body comprises a shell, the controller is arranged in the shell, and the side wall of the shell is provided with heat dissipation holes; The shell is further provided with a heat dissipation fin, the heat dissipation fin comprises a refrigeration end and a heating end, the refrigeration end is connected with the controller, and the heating end is arranged close to the heat dissipation holes.

5. A VCP plating line comprising a cleaning tank and a pre-dipping tank, characterized in that: The application further relates to the copper ion concentration monitoring device according to any one of claims 1-4, and the monitoring probe is arranged in the cleaning tank and the pre-dipping tank.

6. The VCP electroplating line according to claim 5, wherein: The cleaning tank and the pre-dipping tank are provided with a conveying chain above, the conveying chain is provided with a clamping jig, the clamping jig comprises a mounting plate, an adjusting plate and a plurality of clamping heads, the mounting plate is arranged on the conveying chain, the mounting plate is provided with a lifting driving structure, the output end of the lifting driving structure is provided with the adjusting plate, and the adjusting plate is provided with a plurality of clamping heads.

7. The VCP electroplating line according to claim 6, wherein: The output end of the lifting driving structure is provided with a connecting plate, the connecting plate is provided with an electric sliding block, and the adjusting plate is fixed on the electric sliding block.

8. The VCP electroplating line according to claim 7, wherein: The application further relates to a control system, and the control system is electrically connected with the monitoring main body, the lifting driving structure and the electric sliding block.

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