Control device and processing equipment

Abstract

The utility model discloses a control device and processing equipment, the control device comprises a main body, and an output assembly, a micro control unit MCU and a parameter adjusting assembly which are respectively arranged on the main body, the output assembly, the MCU and the parameter adjusting assembly are connected in sequence, and the output assembly is also connected with a pulse laser. The parameter adjusting assembly comprises a digital input DI signal point for the MCU to send a digital input DI signal. According to the control device, the simple DI signals are input to the MCU through the parameter adjusting assembly, the MCU sends different control signals to the pulse laser through the output assembly, and therefore the working state of the pulse laser is controlled, and compared with the mode that the pulse laser is controlled and adjusted through a scanning galvanometer, the control efficiency is improved. The control mode of the pulse laser is more convenient, and the control cost is lower.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of control device of pulse laser, and particularly relates to a control device and a processing device. BACKGROUND

[0002] Laser technology is widely used in industrial field, and laser becomes an indispensable device in industrial manufacturing. Pulse laser belongs to laser, and in use, in order to effectively control the movement path and scanning path of laser, the laser path emitted by the pulse laser needs to be controlled by a scanning galvanometer, so that the existing control device adopts the host computer software with the function of controlling the scanning galvanometer, so that the control mode of the scanning galvanometer is relatively complex and the cost is high. CONTENT OF THE INVENTION

[0003] Therefore, the present application provides a control device to solve the problems of complex control mode and high control cost of the working state of the pulse laser.

[0004] The present application provides a control device, which comprises a main body, an output component, a micro control unit (MCU) and a parameter adjustment component arranged on the main body respectively, and the output component, the MCU and the parameter adjustment component are electrically connected in sequence. The parameter adjustment component comprises a digital input (DI) signal point, the DI signal point is electrically connected with the MCU, the parameter adjustment component is configured to send a digital input (DI) signal to the MCU, the MCU generates a frequency control signal, a power control signal, a latch signal, an enable modulation signal and / or an out-light modulation signal based on the DI signal, and sends the signals through the output component to control the pulse laser.

[0005] In the above embodiment, the MCU is inputted with a simple DI signal through the parameter adjustment component, and the MCU sends different control signals to the pulse laser through the output component, so as to control the working state of the pulse laser. Compared with the control mode of the pulse laser by the host computer software with the function of controlling the scanning galvanometer, the control mode of the pulse laser is more convenient and the control cost is lower.

[0006] In some embodiments, the MCU comprises at least one output pin and at least one input pin. The output pin is connected with the output component. The parameter adjustment component further comprises at least one button, each button is electrically connected with one input pin and one DI signal point. When the button is closed, the DI signal point outputs a voltage level to the input pin through the button, and the MCU sends different signals to the pulse laser through the output component according to the voltage level received from different input pins.

[0007] In some embodiments, the parameter adjustment assembly further comprises a first button, a second button, a third button, a fourth button and a fifth button respectively electrically connected with different DI signal points. The first button is configured to, when closed, make the corresponding DI signal point output a first level to the corresponding input pin, and the MCU is configured to, according to the first level, send a first frequency control signal to the pulsed laser through the output assembly to control the frequency of the pulsed laser to increase. The second button is configured to, when closed, make the corresponding DI signal point output a second level to the corresponding input pin, and the MCU is configured to, according to the second level, send a second frequency control signal to the pulsed laser through the output assembly to control the frequency of the pulsed laser to decrease. The third button is configured to, when closed, make the corresponding DI signal point output a third level to the corresponding input pin, and the MCU is configured to, according to the third level, send a first power control signal to the pulsed laser through the output assembly to control the power of the pulsed laser to increase. The fourth button is configured to, when closed, make the corresponding DI signal point output a fourth level to the corresponding input pin, and the MCU is configured to, according to the fourth level, send a second power control signal to the pulsed laser through the output assembly to control the power of the pulsed laser to decrease. The fifth button is configured to, when closed, make the corresponding DI signal point output a fifth level to the corresponding input pin, and the MCU is configured to, according to the fifth level, send a latch signal to the pulsed laser through the output assembly.

[0008] In some embodiments, the frequency control signal is a pulse width modulation (PWM) signal. The power control signal is an analog signal or a digital signal. The output assembly comprises a connector.

[0009] In some embodiments, the control device further comprises a display screen disposed on the outside of the main body, the display screen being connected with the MCU, and the display screen being configured to display the running state of the MCU and the working parameters of the pulsed laser.

[0010] In some embodiments, the control device 12 further comprises a power interface electrically connected with the MCU and / or the DI signal points, and the power interface is configured to supply power to the MCU and / or the DI signal points.

[0011] A processing device comprising a processing area, a pulsed laser and the control device described above, one side of the pulsed laser is provided with the processing area, and the processing area is configured to accommodate products. The pulsed laser is connected with the control device, and the pulsed laser is configured to emit laser to the products.

[0012] In some embodiments, the pulsed laser comprises a storage, when the pulsed laser receives the latch signal sent by the MCU through the output assembly, the pulsed laser is configured to store the current working parameters in the storage, the working parameters comprising frequency parameters and / or power parameters, and the pulsed laser is further configured to read the working parameters stored in the storage.

[0013] In some embodiments, the processing device further comprises a first detection assembly configured to detect the product in the processing area. The control device further comprises a signal receiving assembly disposed on the main body and connected to the MCU and the first detection assembly. The first detection assembly is configured to send a first detection signal to the signal receiving assembly when the product is detected, and the signal receiving assembly sends a first feedback signal to the MCU when the feedback signal is received. The MCU is configured to generate an enabling modulation signal according to the received first feedback signal and send the enabling modulation signal to the pulsed laser through the output assembly, so that the pulsed laser is in a standby light-emitting working state.

[0014] In some embodiments, the processing device further comprises a second detection assembly connected to the signal receiving assembly, and the second detection assembly is configured to detect the position state of the pulsed laser or the product in the processing area. The second detection assembly is configured to send a second detection signal to the signal receiving assembly when the relative movement between the product and the pulsed laser is detected, and the signal receiving assembly sends a second feedback signal to the MCU when the second detection signal is received. The MCU is configured to generate a light-emitting modulation signal according to the received second feedback signal and send the light-emitting modulation signal to the pulsed laser through the output assembly, so that the pulsed laser is in a light-emitting working state.

[0015] In some embodiments, the processing device further comprises a moving device located on one side of the processing area. The moving device is configured to drive the product in the processing area or the pulsed laser to move, so that the relative movement between the product and the pulsed laser occurs, and the laser emitted by the pulsed laser irradiates different positions of the product. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A schematic diagram of a processing device according to an embodiment of the present application.

[0017] Figure 2 A side view of a control device according to Figure 1

[0018] Figure 3 A connection diagram of a partial structure of a control device according to Figure 1

[0019] MAIN ELEMENT SYMBOL EXPLANATION

[0020] ​​100, processing device; 11, pulse laser; 110, processing area; 12, control device; 121, main body; 122, output assembly; 123, MCU; 124, parameter adjustment assembly; 1241, first button; 1242, second button; 1243, third button; 1244, fourth button; 1245, fifth button; 125, display screen; 126, signal receiving assembly; 13, moving device; 14, first detection assembly; 15, second detection assembly. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments of the present application.

[0022] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or a middle component can exist at the same time. When a component is considered to be "provided on" another component, it can be directly provided on the other component or a middle component can exist at the same time. The terms "top", "upper", "lower", "front", "back" and similar expressions used herein are for illustrative purposes only.

[0023] The terms "first", "second", and the like are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implying the number, specific order or primary and secondary relationship of the indicated technical features.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments and are not intended to limit the present application.

[0025] Some embodiments of the present application will be described below with reference to the accompanying drawings. The following embodiments and features in the embodiments can be combined with each other without conflict.

[0026] In some embodiments, referring to Figure 1 The present application discloses a processing device 100 comprising: a pulse laser 11 and a control device 12. The control device 12 is electrically connected with the pulse laser 11 to control the working state of the pulse laser 11. One side of the pulse laser 11 is provided with a processing area 110, when the product to be processed (not shown) is placed in the processing area 110, the pulse laser 11 emits laser to the product to realize the function of processing the product.

[0027] In some embodiments, the number of pulse lasers 11 is two or more.

[0028] In some embodiments, the processing device 100 is a welding device or a cutting device, and the pulsed laser 11 cuts or welds the product according to the processing requirement.

[0029] In other embodiments, the processing device 100 can also be a coating device, a polishing device or other surface treatment device.

[0030] In some embodiments, the processing device 100 further comprises a moving device 13, which is arranged at one side of the processing area 110 and mechanically connected with the pulsed laser 11. In operation, the moving device 13 drives the pulsed laser 11 to move relative to the product, so that the laser emitted by the pulsed laser 11 irradiates different positions of the product, thereby achieving the function of processing different positions of the product.

[0031] In some embodiments, the moving device 13 is a mechanical arm or a multi-axis slide rail.

[0032] In other embodiments, the processing area 110 is provided with a carrier (not shown) for carrying the product, and the moving device 13 is mechanically connected with the carrier. By driving the carrier to move through the moving device 13, the product can also be moved synchronously, thereby achieving the effect of moving the pulsed laser 11 relative to the product.

[0033] In some embodiments, referring to Figure 2 and Figure 3 , the control device 12 comprises a main body 121, an output component 122, an MCU 123 and a parameter adjustment component 124 arranged on the main body 121 respectively, and the output component 122, the MCU 123 and the parameter adjustment component 124 are electrically connected in sequence. The output component 122 is also electrically connected with the pulsed laser 11. The parameter adjustment component 124 comprises a DI signal point (not shown) electrically connected with the MCU 123 and sending a DI signal to the MCU 123. The MCU 123 sends a frequency control signal and / or a power control signal to the pulsed laser 11 through the output component 122 based on the DI signal, so as to control the pulsed laser 11.

[0034] When it is necessary to change the working parameters of the pulsed laser 11, a simple DI signal is input to the MCU 123 through the parameter adjustment component 124, and the MCU 123 sends different control signals to the pulsed laser 11 through the output component 122 based on the parameter signal, thereby adjusting the frequency of the pulsed laser 11. Compared with the way of using the upper computer software with the function of controlling the scanning galvanometer to control the pulsed laser 11, the way of controlling the pulsed laser 11 is more convenient, and the control cost is lower.

[0035] Further, the MCU 123 comprises at least one output pin (not shown) and a plurality of input pins (not shown). The parameter adjustment assembly 124 further comprises a first button 1241, a second button 1242, a third button 1243 and a fourth button 1244 disposed on the outside of the main body 121, each of which is electrically connected with a DI signal point and the MCU 123. The user operates all the buttons to control the DI signal point to send a DI signal to the MCU 123. The first button 1241, the second button 1242, the third button 1243 and the fourth button 1244 are respectively connected with an input pin, and the first button 1241, the second button 1242, the third button 1243 and the fourth button 1244 are respectively corresponding to the functions of increasing the frequency of the pulse laser 11, decreasing the frequency of the pulse laser 11, increasing the power of the pulse laser 11 and decreasing the power of the pulse laser 11 controlled by the control device 12.

[0036] When it is necessary to adjust the working parameters of the pulse laser 11, one of the buttons is pressed to make the button generate a level to the input pin. The MCU 123 sends different signals to the pulse laser 11 through the output assembly 122 according to the level received by the corresponding input pin, so as to control the working state of the pulse laser 11. Compared with the mode of controlling the pulse laser 11 by using a scanning galvanometer, the mode of controlling the pulse laser 11 is more convenient, and the control cost is lower.

[0037] Specifically, when the first button 1241 is pressed and closed, the DI signal point corresponding to the first button 1241 outputs a first level to the corresponding input pin. The MCU 123 sends a first frequency control signal to the pulse laser 11 through the output assembly 122 according to the first level, so as to control the pulse laser 11 to increase the frequency.

[0038] When the second button 1242 is pressed and closed, the DI signal point corresponding to the second button 1242 outputs a second level to the corresponding input pin. The MCU 123 sends a second frequency control signal to the pulse laser 11 through the output assembly 122 according to the second level, so as to control the pulse laser 11 to decrease the frequency.

[0039] When the third button 1243 is pressed and closed, the DI signal point corresponding to the third button 1243 outputs a third level to the corresponding input pin. The MCU 123 sends a first power control signal to the pulse laser 11 through the output assembly 122 according to the third level, so as to control the pulse laser 11 to increase the power.

[0040] When the fourth button 1244 is pressed and closed, the DI signal point corresponding to the fourth button 1244 outputs a fourth level to the corresponding input pin, and the MCU 123 sends a second power control signal to the pulse laser 11 through the output assembly 122 according to the fourth level, and controls the power of the pulse laser 11 to decrease.

[0041] In some embodiments, the level generated by the button to the input pin is a high level or a low level.

[0042] In some embodiments, the parameter adjustment assembly 124 further comprises a circuit board (not shown), the DI signal point is located on the circuit board, all the buttons are connected with the circuit board, and the circuit board is arranged in the main body 121.

[0043] In some embodiments, the MCU 123 is a vulnerable component, and is arranged in the main body 121.

[0044] In some embodiments, the power control signal is an analog signal or a digital signal. The analog signal has the characteristics of high precision and strong real-time, so as to improve the precision of the pulse laser 11. The digital signal has the characteristics of anti-interference, strong reliability and strong flexibility, so as to improve the stability of the pulse laser 11 in complex environment or complex processing requirements.

[0045] In some embodiments, the pulse laser 11 has multiple working states such as off, standby and light emission. The standby state is the standby state, and the pulse laser 11 in the standby state can quickly change to the light emission state compared with the pulse laser 11 in the off state, which can shorten the time of the pulse laser 11 emitting laser, reduce the repeated power-on and power-off of each component of the pulse laser 11, prolong the service life of the pulse laser 11 and reduce the energy consumption of the pulse laser 11.

[0046] Further, please refer to Figure 1The processing device 100 further comprises a first detection assembly 14 arranged in the processing area 110. The control device 12 further comprises a signal receiving assembly 126 arranged in the main body 121, the signal receiving assembly 126 is connected with one input pin of the MCU 123, and the first detection assembly 14 is electrically connected with the signal receiving assembly 126. When the first detection assembly 14 detects that there is a product in the processing area 110, the first detection assembly 14 sends a first detection signal to the signal receiving assembly 126, the signal receiving assembly 126 sends a first feedback to the MCU 123 based on the signal of the first detection assembly 14, the MCU 123 generates an enabling modulation signal according to the received first feedback signal, and sends the enabling modulation signal to the pulsed laser 11 through the output assembly 122, so that the pulsed laser 11 is in a standby light-emitting working state when the processing of one product is completed, and the pulsed laser 11 quickly emits light after the product to be processed in the processing area 110 is replaced.

[0047] Further, please refer to Figure 1 The processing device 100 further comprises a second detection assembly 15 arranged in the moving device 13 or the pulsed laser 11, and the second detection assembly 15 is also electrically connected with the signal receiving assembly 126. When the product is processed, the moving device 13 drives the product to move relative to the pulsed laser 11, or the moving device 13 drives the pulsed laser 11 to move relative to the product. When the processing of one product is completed, the moving device 13 and the pulsed laser 11 are both moved to a specified initial position, and the second detection assembly 15 sends a sensing signal to the moving device 13 and the pulsed laser 11 in the initial position. When the moving device 13 and the pulsed laser 11 move, the second detection assembly 15 can detect the moving state of the product driven by the moving device 13 or the pulsed laser 11, and sends a second detection signal to the signal receiving assembly 126, the signal receiving assembly 126 sends a second feedback signal to the MCU 123 based on the signal of the second detection assembly 15, and the MCU 123 generates a light-emitting modulation signal according to the received second feedback signal, and sends the light-emitting modulation signal to the pulsed laser 11 through the output assembly 122, so that the pulsed laser 11 quickly emits light and processes the product, thereby improving the automation function of the processing device 100 for processing the product.

[0048] In some embodiments, the first detection assembly 14 and the second detection assembly 15 are both position detection devices such as photoelectric sensors.

[0049] In other embodiments, the second detection assembly 15 comprises an ammeter, and when the moving device 13 works, the second detection assembly 15 detects the change of the current on the moving device 13, and sends a feedback signal to the signal receiving device.

[0050] In some embodiments, the signal receiving component 126 is electrically connected or signal connected with the first detection component 14 and the second detection component 15 respectively. When the signal receiving component 126 is electrically connected with the first detection component 14 and the second detection component 15 respectively, the signal receiving component 126 is an electrical connector. When the signal receiving component 126 is signal connected with the first detection component 14 and the second detection component 15 respectively, the signal receiving component 126 is a wireless signal receiver.

[0051] In some embodiments, a storage (not shown) is arranged in the pulse laser 11, please refer to Figure 2 and Figure 3 The parameter adjusting component 124 includes a fifth button 1245 arranged on the outside of the main body 121, the fifth button 1245 is connected with one input pin of the MCU 123, when the fifth button 1245 is pressed and the fifth button 1245 is closed, the DI signal corresponding to the fifth button 1245 outputs a fifth level to the corresponding input pin, the MCU 123 sends a latch signal to the pulse laser 11 through the output component 122 according to the fifth level, thereby controlling the pulse laser 11 to store the current working parameter into the storage.

[0052] Further, the parameter adjusting component 124 also includes a sixth button (not shown) arranged on the outside of the main body 121, the sixth button is connected with another input pin of the MCU 123, when the sixth button is pressed and the sixth button is closed, the DI signal corresponding to the sixth button outputs a sixth level to the corresponding input pin, the MCU 123 sends a reading signal to the pulse laser 11 through the output component 122 according to the sixth level, thereby controlling the pulse laser 11 to read the working parameter stored in the storage, so that when the processing equipment 100 processes the same kind of products or similar products, the working parameter of the pulse laser 11 does not need to be repeatedly or greatly adjusted, which helps to improve the convenience of the control device 12 controlling the pulse laser 11.

[0053] Similarly, in other embodiments, the parameter adjusting component also includes a seventh button (not shown), an eighth button (not shown) and more buttons, the seventh button, the eighth button or other buttons respectively correspond to the functions of the control device 12 controlling the pulse laser 11 to enter the working state of waiting for light emission, enter the light emission working state and the like, so that the MCU 123 sends different signals such as enable modulation signal or light emission modulation signal to the pulse laser 11 through the output component 122, to control the pulse laser 11 to enter different working states.

[0054] In other embodiments, the pulse laser 11 can automatically read the working parameters stored in the storage device during the same working cycle or the cycle of processing the same product, so that the pulse laser 11 can quickly emit the same laser and sequentially process multiple products.

[0055] In some embodiments, the frequency control signal sent by the MCU 123 to the pulse laser 11 through the output component 122 is a pulse width modulation (PWM) signal, which is used to adjust the pulse width of the pulse laser 11, so that the pulse laser 11 can emit different lasers according to different processing requirements.

[0056] In some embodiments, the output component 122 includes at least one connector, and one or more pulse lasers 11 are respectively connected to different connectors, so as to realize the function of the MCU 123 sending control signals to multiple pulse lasers 11 at the same time. Specifically, the output component 122 is a DB-9 interface or a DB-25 interface.

[0057] In some embodiments, the control device 12 further includes a display screen 125, which is arranged on the outside of the main body 121 and is connected to the MCU 123. The running state of the MCU 123 and the working parameters of the pulse laser 11 can be displayed in real time through the display screen 125, so that the operator can check the actual state of the pulse laser 11 and control the working state of the pulse laser 11 according to the requirements.

[0058] In some embodiments, the control device 12 further includes a power interface (not labeled), which is electrically connected to at least one of the MCU 123, the display screen 125, and the DI signal point, so that an external power supply or an internal battery can supply power to at least one of the MCU 123, the display screen 125, and the DI signal point through the power interface.

[0059] In some embodiments, the MCU 123 further includes a high-level pin.

[0060] In some embodiments, the DI signal point is a high-level joint that is electrically connected to the power interface or the high-level pin of the MCU 123.

[0061] It can be understood that all electrical components of the control device 12 are powered by the internal battery, so that the control device 12 can process the pulse laser 11 without an external power supply, thereby improving the flexibility and convenience of using the control device 12.

[0062] In some embodiments, all the buttons are mechanical key switches or tactile switches.

[0063] In some embodiments, the control device 12 is not part of the processing equipment 100, and when the control of the pulse laser 11 of the processing equipment 100 is needed, the control device 12 is electrically connected with the pulse laser 11. When the control of the pulse laser 11 of the processing equipment 100 is not needed, the control device 12 is electrically disconnected with the pulse laser 11, so that the MCU 123 of the control device 12 can control the pulse lasers 11 on different processing equipment 100 through the output assembly 122 respectively, and the effect that the control device 12 is suitable for controlling the pulse lasers 11 of various processing equipment 100 is achieved.

[0064] In addition, those skilled in the art of the present technology should recognize that the above embodiments are only used to illustrate the present application, and are not used as a limitation of the present application, and any appropriate changes and variations to the above embodiments within the essential scope of the present application fall within the scope of the present disclosure.

Claims

1. A control device for controlling a pulsed laser, characterized by, The control device comprises: a main body, an output assembly, a micro control unit (MCU) and a parameter adjustment assembly arranged on the main body respectively, the output assembly, the MCU and the parameter adjustment assembly are electrically connected in sequence; the parameter adjustment assembly comprises a digital input (DI) signal point, the DI signal point is electrically connected with the MCU, the parameter adjustment assembly is configured to send a digital input (DI) signal to the MCU, the MCU generates a frequency control signal, a power control signal, a latch signal, an enable modulation signal and / or an out-light modulation signal based on the DI signal, and sends them through the output assembly to control the pulse laser.

2. The control device according to claim 1, characterized by The MCU comprises at least one output pin and at least one input pin; the output pin is electrically connected with the output assembly; the parameter adjustment assembly further comprises at least one button, each button is electrically connected with one input pin and one DI signal point respectively; when the button is closed, the DI signal point outputs a voltage level to the input pin through the button, and the MCU sends different signals to the pulse laser through the output assembly according to the voltage level received from different input pins.

3. The control device of claim 2, wherein The parameter adjustment assembly comprises a first button, a second button, a third button, a fourth button and a fifth button which are electrically connected with different DI signal points respectively; when the first button is closed, the corresponding DI signal point outputs a first voltage level to the corresponding input pin, and the MCU sends a first frequency control signal to the pulse laser through the output assembly according to the first voltage level, so as to increase the frequency of the pulse laser; when the second button is closed, the corresponding DI signal point outputs a second voltage level to the corresponding input pin, and the MCU sends a second frequency control signal to the pulse laser through the output assembly according to the second voltage level, so as to decrease the frequency of the pulse laser; when the third button is closed, the corresponding DI signal point outputs a third voltage level to the corresponding input pin, and the MCU sends a first power control signal to the pulse laser through the output assembly according to the third voltage level, so as to increase the power of the pulse laser; when the fourth button is closed, the corresponding DI signal point outputs a fourth voltage level to the corresponding input pin, and the MCU sends a second power control signal to the pulse laser through the output assembly according to the fourth voltage level, so as to decrease the power of the pulse laser; when the fifth button is closed, the corresponding DI signal point outputs a fifth voltage level to the corresponding input pin, and the MCU sends the latch signal to the pulse laser through the output assembly according to the fifth voltage level.

4. The control device of claim 1, wherein The frequency control signal is a pulse width modulation (PWM) signal; The power control signal is an analog signal or a digital signal; The output assembly comprises a connector.

5. The control device of claim 1, wherein The control device further comprises a display screen arranged outside the main body, the display screen being electrically connected to the MCU, and the display screen being used to display the running state of the MCU and the working parameters of the pulse laser.

6. A processing apparatus for processing a product, characterized by The control device is connected to a pulse laser, and the pulse laser is used to emit laser to the product.

7. The processing apparatus of claim 6, wherein The pulse laser comprises a storage device; When the pulse laser receives the latch signal sent by the MCU through the output component, the pulse laser is configured to store the current working parameters, including the frequency parameter and / or the power parameter, into the storage device. The pulse laser is further configured to read the working parameters stored in the storage device.

8. The processing apparatus of claim 6, wherein, The processing device further comprises a first detection component used to detect the product in the processing area; The control device further comprises a signal receiving component arranged in the main body, and the signal receiving component is electrically connected to the MCU and the first detection component respectively; The first detection component is configured to send a first detection signal to the signal receiving component when detecting the product, and the signal receiving component is configured to send a first feedback signal to the MCU according to the received first detection signal, and the MCU is configured to generate an enable modulation signal according to the received first feedback signal and send the enable modulation signal to the pulse laser through the output component, so that the pulse laser is in a working state of waiting for light emission.

9. The processing apparatus of claim 8, wherein, The processing device further comprises a second detection component used to detect the position state of the product in the processing area or the pulse laser; The second detection component is configured to send a second detection signal to the signal receiving component when detecting the relative movement between the product and the pulse laser, and the signal receiving component is configured to send a second feedback signal to the MCU according to the received second detection signal, and the MCU is configured to generate a light emission modulation signal according to the received second feedback signal and send the light emission modulation signal to the pulse laser through the output component, so that the pulse laser is in a working state of light emission.

10. The processing apparatus of claim 6, wherein, The processing device further comprises a moving device arranged on one side of the processing area, and the moving device is configured to drive the product in the processing area or the pulse laser to move, so that the pulse laser and the product move relatively, and the laser emitted by the pulse laser irradiates different positions of the product.

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