Bendable circuit board
By designing the embedded wire section and splicing section structure of the flexible circuit board, and utilizing flexible materials and buffer layers, the problem of the existing circuit boards being difficult to bend has been solved, realizing flexible connection and diversified applications of the circuit board.
Patent Information
- Application Number
- CN202423268057.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing circuit boards are difficult to bend and cannot meet the development needs of electronic devices that are becoming more flexible and deformable.
A flexible circuit board was designed. By combining embedded wires and splicing parts, flexible materials and buffer layers are used to achieve elastic connection of the circuit board. A snap-fit structure with pins and sockets is adopted to achieve detachable splicing of the circuit board.
It enables flexible connection and diversified application of circuit boards, adapts to changes in circuit board position, and improves the adaptability and detachability of circuit boards.
Smart Images

Figure CN223957700U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit board technical field especially is related to a kind of bendable circuit board. BACKGROUND
[0002] It is known that printed circuit board is the provider of electrical connection of electronic components, and its design is mainly layout design; the main advantage of using circuit board is to greatly reduce wiring and assembly errors, and improve automation level and production efficiency. Electronic components are connected and fixed on the substrate by printed circuit, and the substrate is generally classified as the insulating part of the substrate, and the common raw material is bakelite, glass fiber board and various plastic boards. The existing substrate is usually hard board, which is not easy to bend. With the development of science and technology, electronic devices develop towards bending and deformation, and the existing technology urgently needs a bendable circuit board. SUMMARY
[0003] (I) technical problem solved
[0004] In view of the deficiencies of the prior art, the utility model provides a bendable circuit board to solve the problems mentioned in the background art.
[0005] (II) technical scheme
[0006] To achieve the above purpose, the utility model provides the following technical scheme: a bendable circuit board, comprising a plurality of circuit boards and a connecting part, the connecting part is used for connecting two blocks of circuit boards, the connecting part comprises a buried wire part and a splicing part arranged at both ends of the buried wire part, the splicing part is connected with the circuit board, the buried wire part is used for sealing connection of the conductive body, the splicing part is provided with a splicing groove, the top of the splicing groove is fixedly connected with a bolt, and the bottom of the splicing groove is provided with a socket.
[0007] Preferably, the buried wire part comprises a main body shell, the main body shell is provided with a buried wire groove, and the buried wire groove is provided with a buffer layer.
[0008] Preferably, the buffer layer is made of high-density polyethylene material.
[0009] Preferably, the main body shell is FPC soft board.
[0010] Preferably, the two splicing parts are horizontally arranged at the left and right ends of the buried wire part.
[0011] Preferably, the two splicing parts are horizontally arranged at the upper and lower ends of the buried wire part.
[0012] Preferably, the two splicing parts are vertically arranged at the upper and lower ends of the buried wire part.
[0013] Advantages
[0014] The utility model provides a kind of bendable circuit board, with following beneficial effects: wire-embedding portion has the performance of flexibility, certain elastic deformation can occur, and buffer layer can be sealed copper piece simultaneously, with elastic deformation capacity, i.e. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is whole three-dimensional structure schematic diagram for example one;
[0016] Figure 2 It is whole overhead schematic diagram for example one;
[0017] Figure 3 It is wire-embedding portion sectional view schematic diagram for example one;
[0018] Figure 4 It is wire-embedding portion plane schematic diagram for example two;
[0019] Figure 5 It is wire-embedding portion side schematic diagram for example three.
[0020] In the drawing: 1, circuit board;2, wire-embedding portion;201, wire-embedding groove;202, buffer layer;3, splicing portion;301, splicing groove;302, bolt;303, socket. DETAILED DESCRIPTION
[0021] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.
[0022] In the description of the utility model, it needs to be understood that the orientation or positional relationship indicated by terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, so it cannot be understood as a limitation on the utility model.
[0023] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features, so that the features limited by "first", "second" can explicitly or implicitly include one or more features, and in the description of the utility model, the meaning of "multiple" is two or more than two, unless there is a clear specific limitation.
[0024] Embodiment one
[0025] As Figures 1-3 shown, the utility model provides a kind of bendable circuit board, including multiple circuit board 1 and connecting portion, connecting portion is used to connect two blocks circuit board 1, connecting portion includes buried wire portion 2 and the splicing portion 3 being arranged at the two ends of buried wire portion 2, splicing portion 3 is connected with circuit board 1, buried wire portion 2 is used to seal the connecting conductor, splicing groove 301 is set up on splicing portion 3, splicing groove 301 top is fixedly connected with latch 302, splicing groove 301 bottom is provided with spigot 303.
[0026] Specifically: splicing groove 301 is attached with the clamping of circuit board 1, and latch 302 penetrates the hole on circuit board 1 and is clamped with spigot 303, latch 302 and spigot 303 are colloid material, with the effect of friction clamping, i.e. two splicing grooves 301 are connected with two circuit boards 1 respectively, realize the splicing of two circuit boards 1, the conductor in buried wire portion 2 is copper sheet, and copper sheet is used for the communication connection of two circuit boards 1.
[0027] Buried wire portion 2 includes main body shell, main body shell is provided with buried wire groove 201, and buffer layer 202 is arranged in buried wire groove 201.
[0028] Buffer layer 202 is high-density polyethylene material.
[0029] Main body shell is FPC soft board.
[0030] Specifically: buried wire portion 2 has the performance of flexibility, can have certain elastic deformation, and buffer layer 202 can seal copper sheet while having elastic deformation capacity, i.e. through connecting portion, the elastic connection of two circuit boards 1 can be realized.
[0031] Two splicing portions 3 are horizontally arranged at the left and right ends of buried wire portion 2, and are applied to the splicing when two circuit boards 1 are horizontally placed.
[0032] Embodiment two
[0033] Referring to Figure 4 , two splicing portions 3 are horizontally arranged at the upper and lower ends of buried wire portion 2, and are applied to the splicing when two circuit boards 1 are placed in parallel.
[0034] Embodiment three
[0035] Referring toFigure 5 Two splicing parts 3 are vertically arranged at the upper and lower ends of the wire embedding part 2, and are applied to the splicing of the two circuit boards 1 when the two circuit boards 1 are vertically placed.
[0036] The utility model works as follows: the splicing groove 301 is attached to the circuit board 1, and the bolt 302 penetrates the hole on the circuit board 1 and is attached to the socket 303, the bolt 302 and the socket 303 are of colloidal material, and have the effect of frictional attachment, that is, the two splicing grooves 301 are connected to the two circuit boards 1 respectively, the splicing of the two circuit boards 1 is realized, the conductive body arranged in the wire embedding part 2 is a copper sheet, and the copper sheet is used for the communication connection of the two circuit boards 1.
[0037] The wire embedding part 2 has the performance of flexibility and can be elastically deformed, and the buffer layer 202 can seal the copper sheet while having the ability of elastic deformation, that is, the elastic connection of the two circuit boards 1 can be realized through the connecting part.
[0038] It should be noted that, in this text, relational terms such as first and second and the like can merely be used to distinguish one entity or action from another, without necessarily requiring or implying that there is any such actual relationship or order between or among the entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover non-exclusive inclusions, so that a process, method, article, or apparatus that includes a list of elements does not only include those elements, but also includes other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0039] Although the embodiments of the utility model have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A flexible circuit board, comprising multiple circuit boards (1) and a connecting portion, characterized in that: The connecting part is used to connect two circuit boards (1). The connecting part includes a buried wire part (2) and splicing parts (3) set at both ends of the buried wire part (2). The splicing parts (3) are connected to the circuit board (1). The buried wire part (2) is used to seal and connect the conductor. The splicing part (3) is provided with a splicing groove (301). The top of the splicing groove (301) is fixedly connected with a pin (302). The bottom of the splicing groove (301) is provided with a socket (303).
2. A flexible circuit board according to claim 1, characterized in that: The buried wire part (2) includes a main shell, and a buried wire groove (201) is provided inside the main shell. A buffer layer (202) is provided inside the buried wire groove (201).
3. A flexible circuit board according to claim 2, characterized in that: The buffer layer (202) is made of high-density polyethylene.
4. A flexible circuit board according to claim 2, characterized in that: The main shell is an FPC flexible board.
5. A flexible circuit board according to claim 1, characterized in that: The two splicing parts (3) are horizontally arranged at the left and right ends of the buried wire part (2).
6. A flexible circuit board according to claim 1, characterized in that: The two splicing parts (3) are horizontally arranged at the top and bottom of the buried wire part (2).
7. A flexible circuit board according to claim 1, characterized in that: The two splicing parts (3) are vertically arranged at the upper and lower ends of the buried wire part (2).