Enhanced aluminum-based copper-clad plate

Abstract

The enhanced aluminum-based copper-clad plate comprises an aluminum substrate, glass fiber cloth and a conductive layer which are sequentially arranged from bottom to top, a first heat-conducting adhesive film and a second heat-conducting adhesive film are arranged on the surfaces of the two sides of the glass fiber cloth respectively, and the first heat-conducting adhesive film and the second heat-conducting adhesive film are semi-cured heat-conducting adhesive films; and the first heat-conducting adhesive film, the glass fiber cloth and the second heat-conducting adhesive film are laminated to form an insulating layer. The glass fiber cloth is used as a reinforcing structure in the insulation structure of the aluminum-based copper-clad plate, and the heat-conducting adhesive films are arranged on the surfaces of the two sides of the glass fiber cloth, so that the aluminum-based copper-clad plate has better heat conductivity while realizing good voltage-resistant insulativity, and meets the requirements of high heat conductivity and high voltage-resistant performance of the reinforced aluminum-based copper-clad plate.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of circuit board, concretely relates to an enhanced type aluminum base copper clad plate. BACKGROUND

[0002] Aluminum base copper clad plate (abbreviation aluminum base plate) is a kind of metal base copper clad plate with good heat dissipation function, is widely used in LED lighting, high-power power supply, TV backlight, automobile electronics, power module and other fields.Single-sided aluminum base copper clad plate is generally composed of three layers of structure, respectively circuit layer (copper foil), insulating layer and metal base layer.In the conventional preparation process of aluminum base copper clad plate, heat-conducting resin glue solution is coated on the surface of copper foil as circuit layer, or heat-conducting resin glue solution is coated on the surface of release film and then dried to form semi-cured state, then through laminating, hot pressing to form glue film type aluminum base copper clad plate.This kind of aluminum base copper clad plate has good heat dissipation performance, but in the production process of aluminum base copper clad plate, air hole, gap and other non-dense positions in the insulating layer are difficult to avoid, which will affect the stability of the high-voltage resistance performance of copper clad plate.If the thickness of insulating layer is increased or double insulating layer structure is used to compensate the air hole and gap in the insulating layer, it will lead to the decrease of heat dissipation performance, and it is difficult to meet the demand of heat dissipation performance and high-voltage resistance performance. CONTENT

[0003] The utility model aims at providing an enhanced type aluminum base copper clad plate with good high-voltage resistance performance stability and heat dissipation performance.

[0004] In order to realize the above-mentioned purpose, the utility model adopts the following technical solutions:

[0005] An enhanced type aluminum base copper clad plate, comprising: aluminum base plate, glass fiber cloth and conductive layer arranged in sequence from bottom to top, the two side surfaces of the glass fiber cloth are respectively provided with first heat-conducting adhesive film and second heat-conducting adhesive film, the first heat-conducting adhesive film and the second heat-conducting adhesive film are semi-cured heat-conducting adhesive film, the first heat-conducting adhesive film, the glass fiber cloth and the second heat-conducting adhesive film are pressed to form an insulating layer.

[0006] In some embodiments, the thickness of the glass fiber cloth is 0.02mm-0.13mm.

[0007] In some embodiments, the thickness of single layer of the heat-conducting adhesive film is 60 μm-150 μm.

[0008] In some embodiments, the conductive layer is electrolytic copper foil or aluminum foil.

[0009] In some embodiments, the thickness of the conductive layer is 10 μm-175 μm.

[0010] In some embodiments, the surface of the aluminum base plate is rough surface.

[0011] In some embodiments, at least one layer of the first heat-conductive adhesive film and at least one layer of the second heat-conductive adhesive film are arranged on two side surfaces of the glass fiber cloth respectively.

[0012] In some embodiments, at least two layers of the glass fiber cloth are included, and the adjacent glass fiber cloths are separated by the heat-conductive adhesive film.

[0013] The above technical solution can be known that the utility model discloses glass fiber cloth as reinforcing structure is arranged in the insulating structure of copper-clad plate, and heat-conductive adhesive film is arranged on two side surfaces of glass fiber cloth, through the high-temperature high-pressure pressing process, the heat-conductive resin glue in the semi-solid state of insulating heat-conductive adhesive film is fused and greatly viscosity minimum point in high-temperature stage, and at the same time, the low-viscosity molten heat-conductive resin glue penetrates to glass fiber cloth under the action of vacuum and high pressure, forms the insulating layer in the plate structure, and the heat-conductive adhesive film can guarantee the heat-conductive performance of copper-clad plate, and the glass fiber cloth can improve the high-voltage electric performance stability of copper-clad plate. Moreover, the semi-solid state of heat-conductive adhesive film and glass fiber cloth forms the insulating structure in the high-temperature high-pressure pressing process, does not need to form semi-solid sheet through the glass fiber cloth that contains immersed heat-conductive resin glue liquid and stoving, does not need to increase the corresponding production equipment, is favorable to simplifying production process, reduces production cost. In some embodiments, can realize good voltage resistance insulation through the arrangement of multiple insulating heat-conductive adhesive films, and also has better heat conductivity, satisfies the demand of high heat-conductive and high voltage resistance performance of reinforced aluminum-based copper-clad plate. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model, the following will be to the embodiment or prior art description needed to use the drawing do simple introduction, obviously, the following description in the drawing is only some embodiments of the utility model, for those skilled in the art, under the premise of not paying creative labor, can also obtain other drawings according to these drawings.

[0015] Figure 1 It is a structural schematic diagram of the copper-clad plate of the utility model;

[0016] Figure 2 It is a structural schematic diagram of another embodiment of the copper-clad plate of the utility model;

[0017] Figure 3 It is a structural schematic diagram of another embodiment of the copper-clad plate of the utility model.

[0018] The specific implementation of the utility model will be further described in detail below in combination with the drawings. SPECIFIC EMBODIMENTS

[0019] The utility model is described below in combination with the drawings, and when the embodiments of the utility model are described in detail, for the convenience of description, the drawings showing the structure of the device will be partially enlarged without the general proportion, and the schematic diagram is only an example, which should not limit the scope of the utility model protection herein. It should be noted that the drawings are simplified and all use non-precise proportions, only for the purpose of convenient and clear auxiliary description of the embodiments of the utility model. Meanwhile, in the description of the present application, the terms "first", "second" and the like are only used for differentiation, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features; the directions or position relations indicated by the terms "positive", "negative", "bottom", "upper", "lower", "front", "rear", "left", "right" and the like are based on the directions or position relations shown in the drawings, only for the convenience of description of the utility model and simplification of the description, and therefore cannot be understood as limiting the utility model.

[0020] In the description of the utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements, it can be wireless connection, or it can be wired connection. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0021] An insulating layer is usually arranged in the aluminum-based copper-clad plate, and the insulating layer is used to ensure the voltage resistance performance of the copper-clad plate. In the manufacturing process of the aluminum-based copper-clad plate, pores, gaps and the like will inevitably appear in the insulating layer, and the pores and gaps in the insulating layer will affect the high-voltage resistance performance of the insulating layer. The thickness of the insulating layer can be increased, or a double-insulating-layer structure can be used to reduce the influence of the pores and gaps in the insulating layer on the voltage resistance performance, however, if the thickness of the insulating layer is too large, the heat conduction performance will be significantly reduced. If the thickness of the insulating layer is reduced in order to improve the heat conduction performance, the pores and gaps in the insulating layer will affect the voltage resistance performance of the insulating layer. Therefore, the high-voltage resistance performance and the heat conduction performance of the copper-clad plate are often difficult to meet simultaneously.

[0022] In order to balance the heat conduction performance and the voltage resistance and insulation performance of the copper-clad plate, the process structure of the aluminum-based copper-clad plate is improved in the utility model, glass fiber cloth is used as a reinforcing structure, heat-conducting adhesive films are arranged on both sides of the glass fiber cloth, a reinforced insulating structure containing the glass fiber cloth is formed, and high heat conduction and high voltage resistance and insulation of the copper-clad plate are realized.

[0023] As Figure 1As shown, the enhanced aluminum-based copper-clad plate of the embodiment includes, from bottom to top, an aluminum substrate 1, a first heat-conductive adhesive film 2, a glass fiber cloth 3, a second heat-conductive adhesive film 4, and a conductive layer 5. The aluminum substrate 1, the first heat-conductive adhesive film 2, the glass fiber cloth 3, the second heat-conductive adhesive film 4, and the conductive layer 5 are formed into the enhanced aluminum-based copper-clad plate through high-temperature and high-pressure pressing.

[0024] The first heat-conductive adhesive film 2 and the second heat-conductive adhesive film 4 are arranged on the two sides of the glass fiber cloth 3, respectively. By arranging the insulating heat-conductive adhesive films on the two side surfaces of the glass fiber cloth 3, the heat-conductive resin adhesive in the semi-cured state of the heat-conductive adhesive films is melted by high temperature and reaches the lowest viscosity point during the high-temperature and high-pressure pressing, and at the same time, penetrates into the glass fiber cloth 3 under the action of vacuum and high pressure to form an insulating layer with the glass fiber cloth as a reinforcing structure. The dense structure of the glass fiber cloth in the insulating layer can overcome the problem of poor high-pressure resistance stability caused by the non-dense positions such as bubbles and gaps in the conventional insulating layer, and the heat-conductive adhesive film itself has good heat conductivity, which can ensure that the copper-clad plate has good heat conductivity.

[0025] The heat-conductive adhesive films (the first heat-conductive adhesive film 2 and the second heat-conductive adhesive film 4) in the embodiment are in a semi-cured state. The heat-conductive adhesive film can be a semi-cured adhesive layer formed by coating a heat-conductive adhesive solution on the rough surface of a metal foil and then high-temperature baking, or can be a semi-cured adhesive layer formed by coating a heat-conductive adhesive solution on the release surface of a high-temperature resistant release film (such as a PET release film) and then high-temperature baking (the release film needs to be torn off when in use). In specific applications, the thickness of the single-layer heat-conductive adhesive film can be 60 μm to 150 μm.

[0026] In specific applications, the conductive layer 5 can be an electrolytic copper foil, an aluminum foil, or other metal foils with conductivity. The thickness of the conductive layer 5 can be 10 μm to 175 μm.

[0027] In specific applications, the aluminum substrate 1 can be an aluminum plate of type 1060, 1100, 3003, 5052, or 6061. Further, the two side surfaces of the aluminum substrate 1 need to be roughened to form a rough surface to improve the interfacial bonding strength.

[0028] In specific applications, the type of the glass fiber cloth 3 can be thin and flat woven glass fiber cloth of type 101, 104, 106, 108, 1070, 1078, 1080, 1652, 1674, 1675, 1678, 2113, 2313, 2116, 2117, 2165, 3070, 3313, 6060, etc. The thickness of the glass fiber cloth 3 can be 0.02 mm to 0.13 mm.

[0029] The aluminum-based copper-clad plate of the embodiment adopts the insulating structure of heat-conducting adhesive film + glass fiber cloth + heat-conducting adhesive film, and in the high-temperature and high-pressure pressing process, the semi-cured heat-conducting adhesive film can penetrate into the glass fiber cloth to form an insulating layer, without the need of dipping the glass fiber cloth in heat-conducting resin glue solution, drying to form a semi-cured sheet, without the need of adding additional dipping and drying processes, and without the need of adding special equipment required by the above steps, thereby reducing the production cost.

[0030] In some embodiments, the heat-conducting adhesive film on both sides of the glass fiber cloth 3 can be more than two layers, such as being formed by stacking multiple heat-conducting adhesive films. Figure 2 Fig. 4 shows a structural schematic diagram of the enhanced aluminum-based copper-clad plate according to another embodiment of the present application. Figure 2 The enhanced aluminum-based copper-clad plate shown in Fig. 4 is different from that shown in Fig. 3 in that the first heat-conducting adhesive film 2 and the second heat-conducting adhesive film 4 on both sides of the glass fiber cloth 3 are each formed by stacking two heat-conducting adhesive films.

[0031] The insulating layer of the enhanced aluminum-based copper-clad plate can also include multiple glass fiber cloths 3. Figure 3 As shown in Fig. 5, the enhanced aluminum-based copper-clad plate is different from that shown in Fig. 4 in that the first heat-conducting adhesive film 2 and the second heat-conducting adhesive film 4 on both sides of the glass fiber cloth 3 are each formed by stacking three heat-conducting adhesive films. Figure 1 、 Figure 2 The enhanced aluminum-based copper-clad plate shown in Fig. 6 is different from that shown in Fig. 5 in that the first heat-conducting adhesive film 2 and the second heat-conducting adhesive film 4 on both sides of the glass fiber cloth 3 are each formed by stacking four heat-conducting adhesive films. Figure 3 The enhanced aluminum-based copper-clad plate shown in Fig. 6 includes two or more glass fiber cloths 3, and the adjacent glass fiber cloths 3 are separated by heat-conducting adhesive films 2', and the layer structure of the aluminum-based copper-clad plate from bottom to top is: aluminum base plate 1, heat-conducting adhesive film 2', glass fiber cloth 3, heat-conducting adhesive film 2', glass fiber cloth 3, heat-conducting adhesive film 2', …, conductive layer 5. The heat-conducting adhesive film 2' can be one layer or multiple layers stacked together.

[0032] The above description of the disclosed embodiments enables those skilled in the art to carry out or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An enhanced aluminum-based copper clad laminate characterized by, The application relates to an aluminum substrate, a glass fiber cloth and a conductive layer arranged from bottom to top, two side surfaces of the glass fiber cloth are respectively provided with a first heat-conducting adhesive film and a second heat-conducting adhesive film, the first heat-conducting adhesive film and the second heat-conducting adhesive film are semi-cured heat-conducting adhesive films, and the first heat-conducting adhesive film, the glass fiber cloth and the second heat-conducting adhesive film are pressed to form an insulation layer. The thickness of the glass fiber cloth is 0.02mm-0.13mm.

2. The reinforced aluminum-based copper-clad plate according to claim 1, wherein: The thickness of the single-layer heat-conducting adhesive film is 60-150mu.

3. The reinforced aluminum-based copper-clad plate according to claim 1, wherein: The conductive layer is electrolytic copper foil or aluminum foil.

4. The reinforced aluminum-based copper-clad plate according to claim 1, wherein: The thickness of the conductive layer is 10-175mu.

5. The reinforced aluminum-based copper-clad sheet of claim 1, wherein: The surface of the aluminum substrate is a rough surface.

6. The reinforced aluminum-based copper-clad sheet of claim 1, wherein: At least one layer of the first heat-conducting adhesive film and at least one layer of the second heat-conducting adhesive film are arranged on the two side surfaces of the glass fiber cloth.

7. The reinforced aluminum-based copper-clad plate according to claim 1, wherein: At least two layers of the glass fiber cloth are arranged, and the adjacent glass fiber cloths are separated by heat-conducting adhesive films.

8. The reinforced aluminum-based copper-clad sheet of claim 1, wherein: ​

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