Electronic device heat dissipation device

Abstract

The utility model discloses an electronic device heat dissipation device which comprises a heat conduction plate, the top of the heat conduction plate is fixedly connected with two heat conduction rods, the side walls of the outer rings of the two heat conduction rods are fixedly connected with a plurality of heat dissipation fins, and the heat dissipation fins on the side walls of the outer rings of the two heat conduction rods are arranged in an annular array. The bottoms of the multiple cooling fins are fixedly connected to the side wall of the top of a heat conduction plate, the tops of the multiple cooling fins are jointly and fixedly connected with a top plate, the tops of the two heat conduction rods are fixedly connected to the side wall of the bottom of the top plate, and a cleaning structure is arranged at the top of the heat conduction plate. Through mutual cooperation of the heat conducting plate, the cleaning plate, the cooling fins, the heat conducting rod and other components, the surfaces of the multiple cooling fins and the surface of the heat conducting rod can be cleaned, dust is prevented from being accumulated on the surfaces of the multiple cooling fins, the cooling efficiency of the cooling fins is prevented from being affected, the structure is simple, the design is ingenious, and practicability is high.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a heat dissipation device for electronic devices. Background Technology

[0002] With the rapid development of high-frequency, high-speed and integrated circuit technologies in electronic devices, the total power density of electronic components has increased significantly while their physical size has become smaller and smaller, and the heat flux density has also increased. Therefore, high-temperature environments will inevitably affect the performance of electronic components, which requires more efficient thermal control. How to solve the heat dissipation problem of electronic components is the current focus.

[0003] For example, Chinese Patent Publication No. CN212164021U discloses a heat dissipation device and a radiator. The heat dissipation device includes a heat dissipation body with a through groove in the middle. Heat dissipation fins are disposed within the through groove. The first end of each heat dissipation fin is fixedly connected to the inner side wall of the heat dissipation body, and the second end of each heat dissipation fin is suspended within the through groove. At least the gap between the heat dissipation fins and the back surface of the heat dissipation body forms a heat dissipation airflow channel. The radiator includes the aforementioned heat dissipation device. When the heat dissipation fins are heated, they expand. The fins extend through the second end suspended within the through groove, reducing the expansion stress on the heat dissipation fins.

[0004] However, in the above solution, it is not convenient to clean the surface of the heat sink during use, which makes it easy for dust to accumulate on the surface of the heat sink, thereby affecting the heat dissipation efficiency of the heat sink and making it inconvenient. Utility Model Content

[0005] This invention provides a heat dissipation device for electronic devices to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A heat dissipation device for electronic devices includes a heat-conducting plate. Two heat-conducting rods are fixedly connected to the top of the heat-conducting plate. Multiple heat sinks are fixedly connected to the outer sidewalls of the two heat-conducting rods. The multiple heat sinks on the outer sidewalls of the two heat-conducting rods are arranged in a ring array. The bottoms of the multiple heat sinks are fixedly connected to the top sidewall of the heat-conducting plate. A top plate is fixedly connected to the top of the multiple heat sinks. The tops of the two heat-conducting rods are fixedly connected to the bottom sidewall of the top plate. A cleaning structure is provided on the top of the heat-conducting plate.

[0008] As a further improvement of the technical solution, the cleaning structure comprises a motor, the motor is fixedly connected to the bottom side wall of the top plate, one end of the output shaft of the motor is fixedly connected with a threaded rod, the threaded rod is rotatably connected to the top side wall of the heat conduction plate, the outer wall of the threaded rod is threadedly connected with a cleaning plate, two cleaning grooves are formed in the side wall of the cleaning plate, two heat conduction rods are slidably connected in the two cleaning grooves respectively, and cleaning pads are arranged on the side walls of the two cleaning grooves.

[0009] As a further improvement of the technical solution, the cleaning plate is provided with three heat dissipation fans, and the three heat dissipation fans are arranged beside the two cleaning grooves respectively.

[0010] As a further improvement of the technical solution, the cleaning plate and the top plate are both made of copper.

[0011] As a further improvement of the technical solution, the threaded rod is made of stainless steel.

[0012] Compared with the prior art, the device has the advantages that the heat conduction plate, the cleaning plate, the heat dissipation fins, the heat conduction rods and other components are matched with each other, the surfaces of the heat dissipation fins and the heat conduction rods can be cleaned, dust accumulation on the surfaces of the heat dissipation fins is prevented, the heat dissipation efficiency of the heat dissipation fins is improved, the structure is simple, the design is ingenious, and the practicability is high.

[0013] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, and the content of the specification can be implemented, the following is the preferred embodiment of the utility model and the detailed description of the drawings. The specific implementation of the utility model is given in detail by the following examples and their drawings. BRIEF DESCRIPTION OF DRAWINGS

[0014] The drawings described herein are used to provide further understanding of the utility model, constitute a part of the present application, the schematic embodiment of the utility model and its explanation are used to explain the utility model, and do not constitute improper limitation on the utility model. In the drawings:

[0015] Figure 1 It is a front view structural schematic diagram of an electronic device heat dissipation device proposed by the utility model;

[0016] Figure 2 It is a front view split structural schematic diagram of an electronic device heat dissipation device proposed by the utility model;

[0017] Figure 3 It is a bottom view structural schematic diagram of an electronic device heat dissipation device proposed by the utility model.

[0018] In the drawings, the component list represented by each mark is as follows:

[0019] 1, heat-conducting plate; 2, cleaning plate; 3, heat dissipation fan; 4, heat dissipation fin; 5, top plate; 6, heat-conducting rod; 7, threaded rod; 8, motor; 9, cleaning groove. DETAILED DESCRIPTION

[0020] The principles and features of the present application are described below in connection with the accompanying drawings, in which the examples are presented only for the purpose of explanation and are not intended to limit the scope of the present application. In the following paragraphs, the present application is described in more detail with reference to the accompanying drawings. It should be noted that the drawings are very simplified and all use non-precise proportions, only for the purpose of facilitating and clarifying the purpose of assisting the description of the embodiments of the present application.

[0021] It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there can be a middle component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there can be a middle component. When a component is referred to as being "disposed on" another component, it can be directly disposed on the other component or there can be a middle component. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is only for the purpose of describing specific embodiments and is not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0023] Please refer to Figures 1-3 In the embodiments of the present application, an electronic device heat dissipation device includes a heat-conducting plate 1, two heat-conducting rods 6 are fixedly connected to the top of the heat-conducting plate 1, the outer circumferential sidewalls of the two heat-conducting rods 6 are fixedly connected with a plurality of heat dissipation fins 4, the plurality of heat dissipation fins 4 on the outer circumferential sidewalls of the two heat-conducting rods 6 are arranged in a ring array, the plurality of heat dissipation fins 4 are fixedly connected to the top sidewall of the heat-conducting plate 1, a top plate 5 is fixedly connected to the top of the plurality of heat dissipation fins 4, the top sidewalls of the two heat-conducting rods 6 are fixedly connected to the bottom of the top plate 5, and a cleaning structure is arranged on the top of the heat-conducting plate 1.

[0024] Please refer to Figure 1, the cleaning structure comprises a motor 8, the motor 8 is fixedly connected on the bottom side wall of the top plate 5, one end of the output shaft of the motor 8 is fixedly connected with a threaded rod 7, the threaded rod 7 is made of stainless steel material, the bottom of the threaded rod 7 is rotatably connected on the top side wall of the heat conduction plate 1, the outer circle side wall of the threaded rod 7 is threadedly connected with a cleaning plate 2, the cleaning plate 2 and the top plate 5 are made of copper material, two cleaning grooves 9 are formed in the side wall of the cleaning plate 2, two heat conduction rods 6 and a plurality of radiating fins 4 are slidably connected in the two cleaning grooves 9 respectively, the side wall of the two cleaning grooves 9 is provided with a cleaning pad, the motor 8 is started, the output shaft of the motor 8 drives the threaded rod 7 to rotate, the threaded rod 7 can drive the cleaning plate 2 to move when rotating, the threaded rod 7 is driven to rotate clockwise or counterclockwise by the forward and reverse rotation of the motor 8, so that the cleaning plate 2 moves up and down, the two cleaning grooves 9 can clean the surfaces of the two heat conduction rods 6 and the plurality of radiating fins 4 when the cleaning plate 2 moves, so that the dust accumulated on the surfaces of the two heat conduction rods 6 and the plurality of radiating fins 4 does not affect the heat dissipation efficiency of the plurality of radiating fins 4.

[0025] Please refer to Figures 1-2 The top of the cleaning plate 2 is provided with three heat dissipation fans 3, the three heat dissipation fans 3 are located beside the two cleaning grooves 9 respectively, the three heat dissipation fans 3 can blow the surfaces of the radiating fins 4, so that the heat dissipation efficiency of the radiating fins 4 is improved.

[0026] The working principle of the utility model is: the heat conduction plate 1 is installed on the surface of electronic device, the heat conduction plate 1 can guide the heat generated when the electronic device is used to export, then conveys to a plurality of radiating fins 4, the plurality of radiating fins 4 are contacted with air to dissipate heat, the motor 8 is started, the output shaft of the motor 8 drives the threaded rod 7 to rotate, the threaded rod 7 can drive the cleaning plate 2 to move when rotating, the threaded rod 7 is driven to rotate clockwise or counterclockwise by the forward and reverse rotation of the motor 8, so that the cleaning plate 2 moves up and down, the two cleaning grooves 9 can clean the surfaces of the two heat conduction rods 6 and the plurality of radiating fins 4 when the cleaning plate 2 moves, so that the dust accumulated on the surfaces of the two heat conduction rods 6 and the plurality of radiating fins 4 does not affect the heat dissipation efficiency of the plurality of radiating fins 4.

[0027] The above, only for the preferred embodiment of the utility model has, and does not make any form on the utility model limit;Ordinary technical personnel in this industry can be shown in the drawings and the above-mentioned and smoothly implement the utility model;However, the technical personnel familiar with this profession within the scope of the technical scheme of the utility model, utilize the technical contents disclosed above and make some changes, modifications and equivalent changes, etc. of the utility model, all are equivalent embodiments of the utility model;At the same time, any equivalent change of the above-mentioned embodiment according to the essential technology of the utility model is still within the protection scope of the technical scheme of the utility model.

Claims

1. An electronic device heat dissipating device comprising a heat conducting plate (1), characterized in that, The top of the heat-conducting plate (1) is fixedly connected with two heat-conducting rods (6), the outer wall of each of the two heat-conducting rods (6) is fixedly connected with a plurality of heat-dissipating fins (4), the plurality of heat-dissipating fins (4) on the outer wall of each of the two heat-conducting rods (6) are arranged in a ring array, the bottom of each of the plurality of heat-dissipating fins (4) is fixedly connected to the top side wall of the heat-conducting plate (1), the top of each of the plurality of heat-dissipating fins (4) is fixedly connected to the bottom side wall of the top plate (5), and the top of the heat-conducting plate (1) is provided with a cleaning structure.

2. The electronic device heat dissipating device of claim 1, wherein, The cleaning structure comprises a motor (8) fixedly connected to the bottom side wall of the top plate (5), one end of the output shaft of the motor (8) is fixedly connected with a threaded rod (7), the bottom of the threaded rod (7) is rotatably connected to the top side wall of the heat-conducting plate (1), the outer wall of the threaded rod (7) is threadedly connected with a cleaning plate (2), the side wall of the cleaning plate (2) is provided with two cleaning grooves (9), the two heat-conducting rods (6) and the plurality of heat-dissipating fins (4) are respectively slidably connected in the two cleaning grooves (9), and the side wall of each of the two cleaning grooves (9) is provided with a cleaning pad.

3. The electronic device heat dissipating device of claim 2, wherein, The top of the cleaning plate (2) is provided with three heat-dissipating fans (3), and each of the three heat-dissipating fans (3) is located beside the two cleaning grooves (9).

4. The electronic device heat dissipating device of claim 2, wherein, The cleaning plate (2) and the top plate (5) are both made of copper.

5. The electronic device heat dissipating device of claim 2, wherein the heat dissipating device is a heat sink. The threaded rod (7) is made of stainless steel.

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