Optical sensor

Abstract

The utility model relates to semiconductor design and manufacture, and discloses an optical sensor, comprising: a substrate; the wafer is pasted on the substrate; the light blocking rubber ring is arranged on the periphery of the wafer in a surrounding manner; the lead is used for conducting the top of the wafer and the substrate; and the transparent insulating layer covers the substrate, the wafer and the lead, and the thickness of the transparent insulating layer is greater than the height of the wafer or the lead. The wafer adopts the light-blocking rubber ring as a light-blocking structure, compared with the light-blocking structure arranged on the shell, the light-blocking rubber ring can be arranged when the wafer is cut, the design of the light-blocking rubber ring does not increase additional processing steps for the wafer, the wafer can be cut along with the wafer, and the wafer is directly improved, so that the light-blocking rubber ring is more tightly attached to the wafer, and the light-blocking rubber ring can be more tightly attached to the wafer. And the components can be packaged in the transparent insulating layer together, so that assembly gaps are difficult to generate, and the yield is higher.

Description

TECHNICAL FIELD

[0001] The present application relates to semiconductor design and manufacturing, and in particular, to an optical sensor. BACKGROUND

[0002] Currently, in a sensor, especially an optical sensor, it is necessary to reduce stray light from other directions except the direction to be collected as much as possible to reduce the interference of stray light on the optical sensor.

[0003] In a conventional technical solution, an outer shell is usually arranged outside the sensor to shield the interfering light, such as from the side. However, since there is a large assembly gap between the outer shell and the wafer inside the sensor, such a non-fitting structure has serious deficiencies in shielding function and yield.

[0004] Therefore, it is necessary to provide an optical sensor structure with better anti-interference performance. CONTENT OF THE UTILITY MODEL

[0005] The purpose to be achieved by the present application is to improve the anti-interference performance inside the optical sensor.

[0006] In order to achieve the above-mentioned purpose, the present application provides an optical sensor, which comprises: a substrate; a wafer arranged on the substrate; a light-blocking rubber ring arranged around the wafer; a lead wire for connecting the top of the wafer and the substrate; and a transparent insulating layer covering the substrate, the wafer and the lead wire, wherein the thickness of the transparent insulating layer is greater than the height of the wafer or the lead wire.

[0007] In an embodiment, the light-blocking rubber ring is dark liquid glue.

[0008] In an embodiment, the light-blocking rubber ring is at least one of the following: hot melt adhesive, resin, silicone, pitch-based glue, and light-cured glue.

[0009] In an embodiment, the outer surface of the transparent insulating layer is coated with a self-cleaning material.

[0010] In an embodiment, the transparent insulating layer is at least one of the following: epoxy resin, organic silicon material, polycarbonate, and polymethyl methacrylate.

[0011] In an embodiment, the optical sensor further comprises an outer shell, wherein the outer shell comprises at least one opening, the opening is arranged at the wafer, and the diameter of the opening is greater than the diagonal length of the wafer.

[0012] In an embodiment, the inner side of the outer shell is coated with a light-absorbing material.

[0013] In an embodiment, the optical sensor further comprises a light shield, wherein the light shield is arranged around the substrate, and the height of the light shield is greater than the thickness of the transparent insulating layer.

[0014] In one embodiment, the optical sensor further comprises a polarizer, the polarizer is mounted on the transparent insulating layer close to the side where the light enters, and the polarizer is mounted parallel to the wafer surface.

[0015] In one embodiment, the optical sensor is at least one of the following: an ambient light sensor, a spectral light sensor, a proximity sensor, an image sensor.

[0016] Compared with the prior art, the wafer and the optical sensor according to the embodiments of the present application have the following beneficial effects:

[0017] The light-blocking rubber ring is used as the light-blocking structure in the wafer according to the embodiments of the present application. Compared with the light-blocking structure arranged on the shell, the light-blocking rubber ring can be arranged when the wafer is cut. The design of the light-blocking rubber ring does not increase the additional processing steps for the wafer. The light-blocking rubber ring can be cut together with the wafer. Since the light-blocking rubber ring is directly improved for the wafer, the light-blocking rubber ring is more closely attached to the wafer and can be packaged in the transparent insulating layer together. It is difficult to produce assembly gaps, and the yield is higher. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 FIG. 1 is a structural schematic diagram of an optical sensor according to an embodiment of the present application.

[0019] Figure 2 FIG. 3 is a production process schematic diagram of a wafer according to an embodiment of the present application.

[0020] Figure 3 FIG. 4 is a structural schematic diagram of a wafer according to an embodiment of the present application.

[0021] REFERENCE SIGNS

[0022] 1, optical sensor, 10, wafer, 11, light-blocking rubber ring, 12, substrate, 13, lead, 14, transparent insulating layer, 2, wafer, 3, light-blocking glue. DETAILED DESCRIPTION

[0023] The specific embodiments of the present application will be further described in detail below with reference to the accompanying drawings and embodiments. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0024] In the description of the present application, “including”, “having” and any variations thereof are intended to cover non-exclusive inclusion. For example, a system, product or device including a series of components or units does not have to be limited to only those components or units explicitly listed, but can also include other components or units that are not explicitly listed but are inherent to these products or devices.

[0025] When optical sensors are operating, it is crucial to minimize stray light interference from directions other than the target light source. Stray light interference can affect the sensor's accurate acquisition and processing of the target light signal, thereby reducing the sensor's performance and measurement accuracy. Therefore, reducing stray light interference is essential for improving the reliability and accuracy of optical sensors.

[0026] The conventional approach is to use an outer casing to shield the sensor from interfering light from the sides and other directions. However, there is a significant assembly gap between the casing and the internal chip of the sensor. From a shielding perspective, this gap allows some stray light to bypass the casing and enter the sensor, weakening the casing's shielding effect. In terms of yield, the presence of this assembly gap increases uncertainty during assembly. Excessive or uneven gaps may lead to inconsistent product performance, thus reducing the yield rate. This can result in significant cost losses in mass production.

[0027] Furthermore, due to the smooth edges of the chip, the reflection of light at this interface is relatively regular, resulting in strong reflected light. This reflected light interferes with the target light that should be detected by the sensor, disrupting the normal propagation path of the light signal and thus interfering with the sensor's detection. This technical problem is unsolvable by existing solutions.

[0028] Given the significant shortcomings of conventional solutions in terms of shielding functionality and yield, there is an urgent need to develop an optical sensor structure with better anti-interference performance. The new structure should effectively address the problems caused by gaps in the housing and wafer assembly, more effectively shield stray light, and simultaneously improve product yield and stability to meet market demand for high-performance optical sensors.

[0029] Based on this, such as Figure 1 As shown in the preferred embodiment of this application, an optical sensor 1 may include: a substrate 12, a wafer 10, a light-blocking rubber ring 11, a lead wire 13, and a transparent insulating layer 14.

[0030] The chip 10 is placed on the substrate 12, the light-blocking rubber ring 11 is surrounded around the chip 10, the lead wire 13 is used to conduct the connection between the top of the chip 10 and the substrate 12, and the transparent insulating layer 14 covers the substrate 12, the chip 10 and the lead wire 13. The thickness of the transparent insulating layer 14 is greater than the height of the chip 10 or the lead wire 13.

[0031] The optical sensor 1, constructed from a chip 10 based on an innovative light-blocking adhesive ring 11 design, offers significant advantages. The substrate 12 provides stable support for the sensor, upon which the chip 10 is securely mounted, laying the foundation for signal transmission and optical detection. Leads 13 enable electrical conductivity between the chip 10 and the substrate 12, ensuring that optical signals can be transmitted to the substrate 12 for processing.

[0032] The light blocking glue ring 11 is arranged around the wafer 10, and can effectively block the light reflected from the edge of the wafer 10, so as to avoid the interference of the reflected light in the sensor. When the light propagates to the edge of the wafer 10, the light blocking glue ring 11 can absorb or block the light, reduce the reflection of the light, and thus reduce the influence of the reflected light on the normal operation of the sensor, and improve the anti-interference capability of the sensor.

[0033] Compared with adding a complex light blocking structure in the sensor, the unique structure of the wafer 2 is improved, which embodies the technical content different from the conventional production. The light blocking glue 3 is filled into the segmentation gap of the wafer 2 to form the light blocking glue ring 11, which simplifies the manufacturing process and improves the assembly precision.

[0034] The transparent insulation layer 14 is very important, which wraps the substrate 12, the wafer 10 and the lead wire 13, and plays the role of insulation, dust prevention and moisture prevention, which not only avoids short circuit, but also prolongs the service life. The transparent property does not affect the light collection, and cooperates with the light blocking glue ring 11 of the wafer 10 to enhance the stray light shielding, so that the sensor can also accurately collect signals in a complex light environment, and greatly improves the measurement accuracy and stability.

[0035] It should be pointed out that the optical sensor 1 of the present application is provided with the wafer 10 with the unique light blocking glue ring 11 design as described above, so all the embodiments of the wafer 10 and the beneficial effects thereof are applicable to the optical sensor 1 without reservation.

[0036] From the embodiments, the wafer 10 is provided with the light blocking glue ring 11 in the wafer cutting stage, and no matter whether the hot melt glue, resin, silicone, asphalt-based glue or light curing glue is selected as the light blocking glue 3, the series of implementation methods can also be embodied in the optical sensor 1. In terms of beneficial effects, the light blocking glue ring 11 of the wafer 10 effectively blocks stray light, closely adheres to the wafer 10, simplifies the processing flow and improves the yield, and the advantages are directly applied to the optical sensor 1.

[0037] This makes the optical sensor 1 more accurately collect target light signals in a complex light environment, greatly improves the measurement accuracy and stability, and also benefits from the design advantages of the wafer 10 in the production and manufacturing link, ensuring product quality and production efficiency.

[0038] Specifically, as shown in Figure 2 and Figure 3 , the wafer 10 is obtained by cutting the wafer 2, the light blocking glue ring 11 is arranged around the wafer 10, and the light blocking glue ring 11 can be obtained by cutting the light blocking glue 3 filled into the segmentation gap of the wafer 2.

[0039] The chip 10 in this embodiment exhibits significant advantages in light-shielding design. Unlike the common practice of setting a light-shielding structure on the casing, this solution chooses to... Figure 2 In the illustrated process flow, light-blocking adhesive 3 is applied after wafer 2 is cut in step ② to obtain light-blocking adhesive rings 11, a highly innovative design. From a processing perspective, traditionally, setting a light-blocking structure on the outer casing requires not only additional design and manufacturing of the casing but also precise installation during assembly, making the process cumbersome and complex. In this solution, the light-blocking adhesive rings 11 cleverly utilize the wafer 2 cutting process, eliminating the need for additional processing steps on the wafers 10. Before wafer 2 is diced, the light-blocking adhesive 3 is filled into the dicing gaps. As wafer 2 is diced, the light-blocking adhesive rings 11 naturally form around each wafer 10, greatly simplifying the production process and reducing time costs and equipment wear.

[0040] Regarding fit, the light-blocking rubber ring 11 adheres more tightly to the chip 10 because it directly operates on the chip 10. In traditional housing light-blocking structures, the housing and the chip 10 are two independent components, and even with precise assembly, gaps are unavoidable. In this solution, the light-blocking rubber ring 11 is tightly connected to the chip 10, and both can be encapsulated together in the transparent insulating layer 14. This tight fit effectively reduces the possibility of light entering through gaps, especially providing excellent suppression of reflected light interference caused by the smooth edges of the chip. In practical applications, such as in the optical sensor 1, this significantly improves the ability to block stray light, ensuring the sensor more accurately acquires the target light signal.

[0041] From a yield perspective, traditional methods of incorporating light-shielding structures in the casing are prone to product defects due to complex assembly processes and even slight deviations. This solution simplifies the process, relying on the adhesion properties of the light-shielding adhesive 3 and the fixing and encapsulating properties of the transparent insulating layer 14 to reduce the probability of errors and significantly improve the yield. In mass production, a stable yield translates to higher production efficiency and lower costs, enabling the rapid and stable production of chips 10 with consistent performance, meeting the market's substantial demand for high-quality optical sensors 1.

[0042] A process flow for obtaining the wafer 10 with the structure described in this application is as follows: Figure 2 As shown: Step ①, the wafer 2 is ground to achieve the required thickness for packaging. Step ②, the complete wafer 2 is diced into wafers 10 of suitable packaging size. Step ③, black light-blocking adhesive 3 is filled into the dicing marks. Step ④, the dicing operation is performed again to further dice the wafer 2 into wafers 10 of suitable packaging size. After completing Step ④, each wafer 10 is now surrounded by light-blocking adhesive 3, thus successfully forming a light-blocking adhesive ring 11.

[0043] Therefore, in order to improve the light blocking effect, the light blocking glue ring 11 can be obtained by using the light blocking glue 3 added with specific pigments. In an embodiment, the light blocking glue 3 or the light blocking glue ring 11 is dark liquid glue. The specific pigments can enhance the light absorption capacity, and compared with the ordinary light blocking glue 3, the light blocking glue ring 11 can more effectively reduce the penetration of light.

[0044] The dark color can refer to any color capable of blocking stray light, including but not limited to black, dark gray, dark blue, dark green, etc. Black has strong light absorption capacity and can absorb almost all visible light, and has excellent light blocking effect. Although the dark gray is slightly inferior to the black, it can also absorb a large amount of light. The spectral absorption characteristics of the dark blue and the dark green make them have good blocking effect on part of the stray light. In different optical environments, the dark blue and the dark green can improve the comprehensive blocking capacity of the stray light and strengthen the light blocking effect of the wafer 10 by relying on their own color characteristics and the structure of the light blocking glue ring 11.

[0045] In an embodiment, the light blocking glue 3 or the light blocking glue ring 11 is at least one of the following: hot melt glue, resin, silicone, asphalt-based glue, and light-cured glue.

[0046] The hot melt glue has good adhesion and sealing properties, can be quickly cured, and can be quickly formed into a light blocking glue ring 11 during the wafer 2 cutting process, thereby improving the production efficiency.

[0047] The resin has high hardness and strong stability, and the formed light blocking glue ring 11 can effectively protect the wafer 10 and has a lasting light blocking effect that is not easily affected by the external environment.

[0048] The silicone has good flexibility and can adapt to the slight deformation of the wafer 10 in different environments, and has good weather resistance and insulation, and is better matched with the transparent insulating layer 14.

[0049] The asphalt-based glue has excellent light blocking performance, and its components can effectively absorb and scatter light and have good waterproofness, thereby protecting the wafer 10 from water vapor erosion.

[0050] The light-cured glue is quickly cured by light, has high precision, can form a uniform and dense light blocking glue ring 11, and can accurately control the shape and thickness of the light blocking glue ring 11, thereby improving the light blocking effect.

[0051] The specific light blocking glue 3, such as hot melt glue, resin, silicone, asphalt-based glue, and light-cured glue, needs to be determined according to the actual product design, production process, and cost requirements. No matter what the selection is based on actual considerations, as long as it is implemented within the technical principles and scheme framework described in the present application, it falls within the protection scope of the present application.

[0052] Optionally, in the present application, the transparent insulating layer 14 can be at least one of the following: epoxy resin, organic silicon material, polycarbonate, and polymethyl methacrylate.

[0053] In an embodiment of the present application, the optical sensor 1 can further comprise a housing. The housing comprises at least one opening, which is arranged at the wafer 10 and has a diameter greater than the diagonal length of the wafer 10.

[0054] The housing provides physical protection and reduces collision damage. The opening has a diameter greater than the diagonal length of the wafer 10, which facilitates the installation and maintenance of the wafer 10, improves the operation convenience, and does not affect the entry of light, thereby ensuring the normal operation of the optical sensor 1.

[0055] In an embodiment, the inner side of the housing is coated with a light-absorbing material. The inner side of the housing coated with the light-absorbing material can absorb stray light entering the housing, reduce the interference of stray light reflection, and cooperate with the light-blocking rubber ring 11 of the wafer 10 to further improve the measurement accuracy of the optical sensor 1 in a complex light environment.

[0056] In order to simultaneously improve the light-blocking effect, in an embodiment, the optical sensor 1 further comprises a light-blocking cover, which surrounds the periphery of the substrate 12 and has a height greater than the thickness of the transparent insulating layer 14. The light-blocking cover serves as a light-blocking means, although its light-blocking accuracy is not as high as that of the wafer 10 in the present application, but the two do not conflict, and thus can be used together. The light-blocking cover surrounds the periphery of the substrate 12 and is higher than the transparent insulating layer 14, which can block stray light from the side and cooperate with the internal structure to enhance the anti-interference ability, thereby creating a better internal environment for the optical sensor 1 to accurately collect light signals.

[0057] In order to further reduce stray light before entering the sensor, in another embodiment of the present application, the optical sensor 1 further comprises a polarizer, which is installed on the side of the transparent insulating layer 14 close to the light incidence and is installed parallel to the surface of the wafer 10. The polarizer is installed on the light incidence side of the transparent insulating layer 14 and parallel to the wafer 10, which can filter light in a specific direction, reduce the interference of reflected light and scattered light, make the light signal collected by the optical sensor 1 more pure, and improve the measurement stability.

[0058] In the present application, the optical sensor 1 can be at least one of the following: an ambient light sensor, a spectral light sensor, a proximity sensor, and an image sensor. The ambient light sensor, the spectral light sensor, the proximity sensor, and the image sensor can accurately perceive light in their respective application scenarios, such as environmental monitoring and imaging, and exhibit better performance advantages.

[0059] Further, a self-cleaning material, such as a nano-titanium dioxide coating, can be coated on the outer surface of the transparent insulating layer 14. This coating can decompose dust, oil stains and other impurities attached to the surface through a photocatalytic reaction under light irradiation, reduce the blocking and scattering of light by impurities, maintain the long-term stable light collection performance of the optical sensor 1, and reduce the maintenance cost.

[0060] The wafer 10 of the embodiment of the present application adopts the light blocking glue ring 11 as the light shielding structure. Compared with setting the light shielding structure on the shell, the light blocking glue ring 11 is set when the wafer 2 is cut. The design of the light blocking glue ring 11 does not increase the additional processing steps for the wafer 10. The light blocking glue ring 11 can be cut together with the wafer 2. Since the wafer 10 is directly operated, the light blocking glue ring 11 is more closely attached to the wafer 10. The light blocking glue ring 11 can be packaged in the transparent insulating layer 14 together. It is difficult to produce assembly gaps. The yield is higher.

[0061] The sensor in the present application contains all the technical contents of the wafer 10. Therefore, it also has the beneficial effects described above.

[0062] All kinds of embodiments covered by the present application, including but not limited to the embodiment content described above, can be freely combined by those skilled in the art according to the actual application requirements. No matter what kind of combination is adopted, as long as it is based on the technical principles and innovative ideas described in the present application, the new scheme formed belongs to the protection scope of the present application without any doubt.

[0063] The above is only the preferred embodiment of the present application. It should be pointed out that for ordinary technical personnel in the technical field, several improvements and replacements can be made without departing from the technical principles of the present application. These improvements and replacements should also be considered as the protection scope of the present application.

Claims

1. An optical sensor, characterized by The optical sensor (1) comprises: a substrate (12); a wafer (10) attached to the substrate (12); a light-blocking ring (11) surrounding the wafer (10); a lead wire (13) for connecting the top of the wafer (10) to the substrate (12); a transparent insulating layer (14) covering the substrate (12), the wafer (10) and the lead wire (13), the thickness of the transparent insulating layer (14) being greater than the height of the wafer (10) or the lead wire (13).

2. The optical sensor of claim 1, wherein, The light-blocking ring (11) is dark liquid glue.

3. The optical sensor of claim 2, wherein, The light-blocking ring (11) is at least one of: hot melt glue, resin, silicone, pitch-based glue, light-cured glue.

4. The optical sensor of claim 1, wherein, The outer surface of the transparent insulating layer (14) is coated with a self-cleaning material.

5. The optical sensor of claim 1, wherein, The transparent insulating layer (14) is at least one of: epoxy resin, silicone material, polycarbonate, polymethyl methacrylate.

6. The optical sensor of claim 1, wherein, The optical sensor (1) further comprises: a housing comprising at least one opening, the opening being located at the wafer (10), the diameter of the opening being greater than the diagonal length of the wafer (10).

7. The optical sensor of claim 6, wherein, The inner side of the housing is coated with a light-absorbing material.

8. The optical sensor of claim 4, wherein, The optical sensor (1) further comprises a light shield surrounding the substrate (12), the height of the light shield being greater than the thickness of the transparent insulating layer (14).

9. The optical sensor of claim 4, wherein, The optical sensor (1) further comprises a polarizer installed on the side of the transparent insulating layer (14) close to the light incident, the polarizer being installed parallel to the surface of the wafer (10).

10. The optical sensor of claim 4, wherein, The optical sensor (1) is at least one of: ambient light sensor, spectral light sensor, proximity sensor, image sensor.

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