Semi-automatic wafer film sticking machine

Abstract

The utility model relates to the technical field of wafer production, and discloses a semi-automatic wafer film sticking machine which comprises a machine body, two sliding rails are symmetrically fixed in the machine body, sliding blocks are connected to the sliding rails in a sliding mode, a same placing table is fixed to the upper ends of the multiple sliding blocks, a wafer iron ring is placed at the upper end of the placing table in an inserted and sleeved mode, and a film bonding strip is fixed to the upper end of the placing table. A moving assembly is arranged in the machine body, a turning cover is arranged on the side wall of the machine body, an annular cutting assembly is arranged on the turning cover, a supporting frame is fixed in the machine body, and a film pasting assembly and a cutting assembly are arranged on the supporting frame. The problems that an existing film pasting mode is tedious and low in working efficiency are solved, and the film pasting quality can be guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer production technical field, concretely relates to a kind of semi-automatic wafer film laminator. BACKGROUND

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuit, and its raw material is silicon. High-purity polysilicon is dissolved and incorporated into silicon crystal seed, then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, which is a wafer. Domestic wafer production lines mainly use 8-inch and 12-inch wafers.

[0003] Currently, in the semiconductor processing and packaging industry, it is usually necessary to attach adhesive film to the wafer for wafer transfer, protection or bearing in various processes. Most of the market uses manual film lamination method to manually attach adhesive film to the wafer, then uses a roller to roll back and forth on the wafer to make the adhesive film fully adhere to the wafer surface, and then manually cuts off the excess adhesive film, which completes the wafer film lamination.

[0004] In the above scheme, this film lamination method is more complicated and has low work efficiency, and the quality of film lamination cannot be guaranteed. UTILITY MODEL CONTENT

[0005] The utility model aims to overcome the shortcomings of the prior art and provide a semi-automatic wafer film laminator. By providing a moving assembly, a ring cutting assembly and a film lamination assembly, the wafer can be automatically laminated, solving the problem of complicated film lamination method and low work efficiency, and ensuring the quality of film lamination.

[0006] The utility model solves the technical problem in the following scheme:

[0007] A semi-automatic wafer film laminator includes a body, two symmetrical slide rails are fixed in the body, a slide block is connected to the slide rail, the upper end of the multiple slide blocks is fixed with a same placement table, a wafer iron ring is inserted and sleeved on the upper end of the placement table, a film adhesive strip is fixed on the upper end of the placement table, a moving assembly is provided in the body, a flip cover is provided on the side wall of the body, a ring cutting assembly is provided on the flip cover, a support frame is fixed in the body, a film lamination assembly and a cutting assembly are provided on the support frame.

[0008] When the wafer needs to be laminated, the cover is opened, then the wafer iron ring sleeve is placed on the upper end of the placement table, at the same time, the wafer is placed on the upper end of the placement table and located in the wafer iron ring, then the moving assembly is started to drive the placement table to move, the wafer iron ring and the wafer are moved by the movement of the placement table, so that the film bonding strip is located directly below the laminating assembly, then the laminating assembly is started, the film is laminated on the upper end of the film bonding strip, then the placement table is reset by the moving assembly, so that a layer of film is covered on the upper end of the wafer iron ring and the wafer, then the cover is closed, the ring cutting assembly is started, the film around the wafer iron ring is cut off, the wafer is laminated, then the cover is opened, the cutting assembly is started, the residual film is cut off, so that the wafer is laminated again.

[0009] By being provided with the moving assembly, the ring cutting assembly and the laminating assembly, the wafer can be automatically laminated, the problem that the existing laminating method is complicated and the work efficiency is low is solved, and the quality of the laminating can be ensured.

[0010] The utility model is further provided with: the moving assembly includes the motor fixed in the machine body, the output end of motor is fixed with screw rod, the end of screw rod is rotatably connected on the side wall of machine body, the side wall of screw rod is screwed with driving block, the upper end of driving block is fixed on the lower end of placement table.

[0011] By the above technical scheme, when the placement table needs to be moved, the motor is started to drive the screw rod to rotate, the screw rod drives the driving block to move, so that the placement table can be moved.

[0012] The utility model is further provided with: the ring cutting assembly includes the rotary arm rotatably connected on the inner wall of cover, the lower end of rotary arm is fixed with ring cutting knife, the protruding end of cover is fixed with handle through rotary arm.

[0013] By the above technical scheme, when the film around the wafer iron ring needs to be cut off, the handle is rotated to drive the rotary arm to rotate, the rotary arm drives the ring cutting knife to rotate, so that the film around the wafer iron ring can be cut off.

[0014] The utility model is further provided with: the laminating assembly includes the film placing roller rotatably connected on the side wall of support frame, the side wall of support frame is fixed with film guide rod, the upper end of support frame is fixed with two air cylinders, the protruding end of support frame is fixed with the same pressing plate through two air cylinders, the lower end of pressing plate is fixed with multiple suction cups.

[0015] By the above technical scheme, when the film needs to be pasted on the upper end of the film bonding strip, the film on the film placing roller is first put out and allowed to be located at the lower end of the plurality of suction cups after passing through the film guide rod, the film is sucked by the plurality of suction cups, when the moving assembly drives the film bonding strip to move to the position directly below the plurality of suction cups, the two air cylinders are started at the same time to drive the pressing plate to move downward, the pressing plate moves downward at the same time to drive the plurality of suction cups to move downward, the plurality of suction cups move downward to drive the film to move downward, so that the film can be pasted on the upper end of the film bonding strip, then the plurality of suction cups are controlled to stop adsorbing, and the placing table is driven to reset by the moving assembly, so that a layer of film can be covered on the upper end of the wafer iron ring and the wafer, then the cover is closed, the ring cutting assembly is started, the film around the wafer iron ring is cut off, and the film pasting of the wafer is completed, then the cover is opened, and the plurality of suction cups are controlled to adsorb the film, so that the wafer can be pasted again.

[0016] The utility model is further provided with: cutting assembly includes the guide rail that is fixed on the side wall of support frame, the moving block is connected on the guide rail and slides, the lower extreme of moving block is fixed with the cutting knife, the upper extreme of moving block is fixed with the pull rod.

[0017] By the above technical scheme, when the film needs to be pasted on the upper end of the film bonding strip, the film on the film placing roller is first put out and allowed to be located at the lower end of the plurality of suction cups after passing through the film guide rod, the film is sucked by the plurality of suction cups, when the moving assembly drives the film bonding strip to move to the position directly below the plurality of suction cups, the two air cylinders are started at the same time to drive the pressing plate to move downward, the pressing plate moves downward at the same time to drive the plurality of suction cups to move downward, the plurality of suction cups move downward to drive the film to move downward, so that the film can be pasted on the upper end of the film bonding strip, then the plurality of suction cups are controlled to stop adsorbing, and the placing table is driven to reset by the moving assembly, so that a layer of film can be covered on the upper end of the wafer iron ring and the wafer, then the cover is closed, the cutting assembly is started, the film around the wafer iron ring is cut off, and the film pasting of the wafer is completed, then the cover is opened, and the plurality of suction cups are controlled to adsorb the film, so that the wafer can be pasted again.

[0018] The utility model has the advantages of:

[0019] Compared with the prior art, by being provided with the moving assembly, the ring cutting assembly and the film pasting assembly, the wafer can be automatically pasted with the film, the problem of complicated film pasting mode and low work efficiency is solved, and the quality of film pasting can be ensured. BRIEF DESCRIPTION OF DRAWINGS

[0020] Fig. 1 It is a three-dimensional structure schematic view of the utility model;

[0021] Fig. 2 It is a sectional view of the utility model.

[0022] Reference signs: 1, machine body; 2, placing table; 3, wafer iron ring; 4, film bonding strip; 5, cover; 6, support frame; 7, motor; 8, screw rod; 9, driving block; 10, rotary arm; 11, ring cutter; 12, handle; 13, film placing roller; 14, film guide rod; 15, air cylinder; 16, pressing plate; 17, suction cup; 18, moving block; 19, cutting knife; 20, pull rod. DETAILED DESCRIPTION

[0023] The specific embodiments of the utility model will be further described in detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but not to limit the scope of the utility model.

[0024] The following references Figs. 1-2 The utility model is explained.

[0025] A kind of semi-automatic wafer film sticking machine, including body 1, two symmetrical sliding rails are fixed in body 1, sliding block is slidably connected on sliding rail, the upper end of multiple sliding blocks is fixed with same placement table 2, wafer iron ring 3 is inserted and placed in the upper end of placement table 2, the upper end of placement table 2 is fixed with film adhesive strip 4, moving assembly is equipped in body 1, there is flap 5 on the side wall of body 1, ring cutting assembly is equipped on flap 5, support frame 6 is fixed in body 1, film sticking assembly and cutting assembly are equipped on support frame 6.

[0026] When needing to film wafer, flap 5 is opened, then wafer iron ring 3 is inserted and placed in the upper end of placement table 2, while wafer is placed in the upper end of placement table 2, and wafer is located in wafer iron ring 3, then moving assembly is started, drives placement table 2 to move, placement table 2 moves and drives wafer iron ring 3 and wafer to move, so that film adhesive strip 4 is located directly below film sticking assembly, then film sticking assembly is started, and film is pasted on the upper end of film adhesive strip 4, then placement table 2 is reset by moving assembly, so that a layer of film can be covered on the upper end of wafer iron ring 3 and wafer, then flap 5 is closed, ring cutting assembly is started, and the film around wafer iron ring 3 is cut off, that is, the film sticking of wafer is completed, then flap 5 is opened, and cutting assembly is started, and residual film is cut off, so that wafer can be filmed again.

[0027] By being equipped with moving assembly, ring cutting assembly and film sticking assembly, wafer can be automatically filmed, the problem that existing film sticking mode is more complicated and work efficiency is lower is solved, and the quality of film sticking can be guaranteed.

[0028] Moving assembly includes motor 7 fixed in body 1, screw rod 8 is fixed on the output end of motor 7, the end of screw rod 8 is rotatably connected on the side wall of body 1, driving block 9 is screwed on the side wall of screw rod 8, and the upper end of driving block 9 is fixed on the lower end of placement table 2.

[0029] When needing to drive placement table 2 to move, motor 7 is started, screw rod 8 is rotated, screw rod 8 rotates and drives driving block 9 to move, so that placement table 2 can be driven to move.

[0030] Ring cutting assembly includes rotary arm 10 rotatably connected on the inner wall of flap 5, ring cutting knife 11 is fixed on the lower end of rotary arm 10, handle 12 is fixed on the protruding end of flap 5 through rotary arm 10.

[0031] When the film needs to be cut off around the wafer iron ring 3, the handle 12 is rotated to drive the rotating arm 10 to rotate, and the rotating arm 10 drives the ring cutter 11 to rotate, so that the film around the wafer iron ring 3 can be cut off.

[0032] The film pasting assembly comprises a film placing roller 13 rotatably connected to the side wall of the support frame 6, a film guide rod 14 fixed to the side wall of the support frame 6, two air cylinders 15 fixed symmetrically to the upper end of the support frame 6, and a same pressing plate 16 fixed to the extending end of the support frame 6 and penetrated by the two air cylinders 15, and a plurality of suction cups 17 fixed to the lower end of the pressing plate 16.

[0033] When the film needs to be pasted on the upper end of the film bonding strip 4, the film on the film placing roller 13 is released and passes through the film guide rod 14 and is located at the lower end of the plurality of suction cups 17, and the film is sucked by the plurality of suction cups 17, and when the moving assembly drives the film bonding strip 4 to move directly below the plurality of suction cups 17, the two air cylinders 15 are started at the same time to drive the pressing plate 16 to move downward, and the pressing plate 16 moves downward at the same time to drive the plurality of suction cups 17 to move downward, and the plurality of suction cups 17 move downward to drive the film to move downward, so that the film can be pasted on the upper end of the film bonding strip 4, and then the plurality of suction cups 17 are controlled to stop adsorbing, and the placing table 2 is reset by the moving assembly, so that a layer of film can be covered on the upper end of the wafer iron ring 3 and the wafer, then the flip cover 5 is closed, the ring cutting assembly is started, the film around the wafer iron ring 3 is cut off, and the film pasting of the wafer is completed, then the flip cover 5 is opened, and the plurality of suction cups 17 are controlled to adsorb the film, so that the wafer can be pasted again.

[0034] The cutting assembly comprises a guide rail fixed to the side wall of the support frame 6, a moving block 18 slidably connected to the guide rail, a cutter 19 fixed to the lower end of the moving block 18, and a pull rod 20 fixed to the upper end of the moving block 18.

[0035] When the residual film needs to be cut off, the moving block 18 is moved by the pull rod 20 to drive the cutter 19 to move, so that the residual film can be cut off.

[0036] Working principle:

[0037] When the wafer needs to be laminated, the cover 5 is opened, the wafer iron ring 3 is inserted and placed on the upper end of the placement table 2, the wafer is placed on the upper end of the placement table 2 and located in the wafer iron ring 3, then the motor 7 is started to drive the screw rod 8 to rotate, the screw rod 8 drives the driving block 9 to move, thereby the placement table 2 can be driven to move, the wafer iron ring 3 and the wafer are moved by the movement of the placement table 2, the film bonding strip 4 is located directly below the laminating assembly, then the two air cylinders 15 are started at the same time to drive the pressing plate 16 to move downward, the pressing plate 16 moves downward while driving the plurality of suction cups 17 to move downward, the plurality of suction cups 17 move downward to drive the film to move downward, thereby the film can be pasted on the upper end of the film bonding strip 4, then the plurality of suction cups 17 are controlled to stop adsorbing, and the placement table 2 is driven to reset by the moving assembly, thereby a layer of film can be covered on the upper end of the wafer iron ring 3 and the wafer, then the cover 5 is closed to drive the handle 12 to rotate, the handle 12 drives the rotary arm 10 to rotate, the rotary arm 10 drives the ring cutter 11 to rotate, thereby the film around the wafer iron ring 3 can be cut off, the wafer lamination is completed, then the cover 5 is opened, the film is adsorbed by the plurality of suction cups 17, the moving block 18 is driven to move by the pull rod 20, the moving block 18 drives the cutter 19 to move, thereby the residual film can be cut off, then the pressing plate is reset, thereby the wafer can be laminated again.

[0038] The preferred embodiments of the present application are described above, it should be noted that for those skilled in the art, without departing from the technical principles of the present application, some improvements and modifications can be made, the above-mentioned improvements and modifications are also regarded as the protection scope of the present application.

Claims

1. A semi-automatic wafer laminating machine, comprising a machine body (1), characterized in that: Two slide rails are symmetrically fixed inside the body (1). Sliders are slidably connected on the slide rails. The upper ends of multiple sliders are fixed with the same placement platform (2). Wafer iron rings (3) are inserted into the upper end of the placement platform (2). Film adhesive strips (4) are fixed to the upper end of the placement platform (2). A moving component is provided inside the body (1). A flip cover (5) is on the side wall of the body (1). A ring cutting component is provided on the flip cover (5). A support frame (6) is fixed inside the body (1). A film application component and a cutting component are provided on the support frame (6).

2. The semi-automatic wafer laminating machine according to claim 1, characterized in that: The moving component includes a motor (7) fixed inside the body (1), a screw (8) fixed on the output end of the motor (7), the end of the screw (8) being rotatably connected to the side wall of the body (1), and a drive block (9) screwed onto the side wall of the screw (8), the upper end of the drive block (9) being fixed to the lower end of the placement platform (2).

3. The semi-automatic wafer lamination machine according to claim 1, characterized in that: The ring-cutting assembly includes a rotating arm (10) rotatably connected to the inner wall of the flip cover (5), with a ring-cutting blade (11) fixed at the lower end of the rotating arm (10), and a handle (12) fixed at the extended end of the rotating arm (10) that passes through the flip cover (5).

4. A semi-automatic wafer laminating machine according to claim 1, characterized in that: The film application assembly includes a film-feeding roller (13) rotatably connected to the side wall of the support frame (6), a film guide rod (14) fixed on the side wall of the support frame (6), two cylinders (15) symmetrically fixed at the upper end of the support frame (6), the two cylinders (15) passing through the protruding end of the support frame (6) and a same pressure plate (16) fixed thereon, and multiple suction cups (17) fixed at the lower end of the pressure plate (16).

5. A semi-automatic wafer laminating machine according to claim 1, characterized in that: The cutting assembly includes a guide rail fixed to the side wall of the support frame (6), a movable block (18) slidably connected to the guide rail, a cutter (19) fixed to the lower end of the movable block (18), and a pull rod (20) fixed to the upper end of the movable block (18).

Images