Auxiliary pressurizing device for normal-temperature bonding of chip

Abstract

The utility model relates to the technical field of chip processing, and discloses a chip normal-temperature bonding auxiliary pressurizing device which comprises an equipment box body, the bottom of the equipment box body is fixedly connected with supporting legs, a closing door is arranged in the front side of the equipment box body, the bottom in the equipment box body is fixedly connected with a discharging table, and the discharging table is fixedly connected with a pressure sensor. A pressurizing mechanism is arranged at the top of the equipment box body, and a pressure stabilizing mechanism is arranged in the top of the equipment box body and located on the front side of the pressurizing mechanism. According to the chip normal-temperature bonding auxiliary pressurizing device, through the arranged pressurizing mechanism, a worker only needs to press a pull rod downwards to drive a sealing sliding sheet to move downwards, gas is pushed through the sealing sliding sheet to enter a telescopic cylinder to drive the telescopic cylinder to extend downwards, and a lower pressing block is driven to press a bonding chip at the top of a discharging table downwards; the operation is simple, the use by a worker is convenient, and meanwhile, the worker can obtain the specific downward moving distance of the downward pressing block only through the scale number displayed by the embedded volume scale in the notch in the front side of the lantern ring.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip processing technical field, concretely is a kind of chip normal temperature bonding auxiliary pressurizing device. BACKGROUND

[0002] Chip bonding is the technology that chip and packaging carrier (such as substrate, lead frame, etc.) or other chips are connected to realize electrical and mechanical connection, mainly including lead bonding, flip chip bonding, tape automated bonding and other ways. Taking lead bonding as an example, it is connected by metal wire (such as gold wire, aluminum wire) between the pad on chip and the pin on packaging carrier;Flip chip bonding is to connect the active surface of chip downward with the pad on substrate through the bump on chip.

[0003] If chip bonding is not pressurized, the atomic spacing of bonding interface is large, the binding force is weak, the mechanical stability is poor, and the connection is easy to fail;Surface is not close, contact resistance is large, and electrical performance is affected;Solder and the like cannot flow well, and the bonding effect is poor. Pressurization can reduce atomic spacing, enhance connection strength, reduce contact resistance, promote material flow reaction, and realize high-quality bonding.

[0004] The existing chip normal temperature bonding auxiliary pressurizing device has many deficiencies when in use. In operation, the steps are tedious, and the adjustment is not intuitive, so the staff cannot adjust as needed;The lower pressing part may not have an automatic reset function, and may naturally fall to affect the placement of materials, and the position of the pressure plate needs to be fixed by a locking structure when in use, so it cannot maintain stable pressurization without external force. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of chip normal temperature bonding auxiliary pressurizing device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of chip normal temperature bonding auxiliary pressurizing device, including equipment box body, the bottom of the equipment box body is fixedly connected with supporting leg, the front side in the equipment box body is provided with closed door, the bottom in the equipment box body is fixedly connected with discharging table, the top of the equipment box body is provided with pressurizing mechanism, the top in the equipment box body is located pressurizing mechanism front side and is provided with pressure stabilizing mechanism.

[0007] The pressurizing mechanism includes air pressure assembly, quantity control assembly and lower pressing assembly, the air pressure assembly is set to the top of equipment box body, the quantity control assembly is set to the outer ring of air pressure assembly, and the lower pressing assembly is set below air pressure assembly.

[0008] The pressure stabilizing mechanism includes communication assembly and reset assembly, the communication assembly is set to the top in the equipment box body and is located the front side position of air pressure assembly, and the reset assembly is set to the top in the equipment box body and is located the front and back two sides of air pressure assembly.

[0009] Preferably, the air pressure assembly includes an air cylinder fixedly connected to the top of the equipment box, a through hole is formed in the air cylinder, a sealing sliding plate is slidably connected to the inner ring of the air cylinder, an extension sliding rod is fixedly connected to the top of the sealing sliding plate, the extension sliding rod is slidably connected to the top of the air cylinder, a compression spring is fixedly connected to the top of the sealing sliding plate, the compression spring is sleeved on the outer ring of the extension sliding rod, the compression spring is fixedly connected to the inner top of the air cylinder, and a pull rod is fixedly connected to the left top of the extension sliding rod.

[0010] Preferably, the air pressure assembly includes an air cylinder fixedly connected to the top of the equipment box, a through hole is formed in the air cylinder, a sealing sliding plate is slidably connected to the inner ring of the air cylinder, an extension sliding rod is fixedly connected to the top of the sealing sliding plate, the extension sliding rod is slidably connected to the top of the air cylinder, a compression spring is fixedly connected to the top of the sealing sliding plate, the compression spring is sleeved on the outer ring of the extension sliding rod, the compression spring is fixedly connected to the inner top of the air cylinder, and a pull rod is fixedly connected to the left top of the extension sliding rod.

[0011] Preferably, the air pressure assembly includes an air cylinder fixedly connected to the top of the equipment box, a through hole is formed in the air cylinder, a sealing sliding plate is slidably connected to the inner ring of the air cylinder, an extension sliding rod is fixedly connected to the top of the sealing sliding plate, the extension sliding rod is slidably connected to the top of the air cylinder, a compression spring is fixedly connected to the top of the sealing sliding plate, the compression spring is sleeved on the outer ring of the extension sliding rod, the compression spring is fixedly connected to the inner top of the air cylinder, and a pull rod is fixedly connected to the left top of the extension sliding rod.

[0012] Preferably, the air pressure assembly includes an air cylinder fixedly connected to the top of the equipment box, a through hole is formed in the air cylinder, a sealing sliding plate is slidably connected to the inner ring of the air cylinder, an extension sliding rod is fixedly connected to the top of the sealing sliding plate, the extension sliding rod is slidably connected to the top of the air cylinder, a compression spring is fixedly connected to the top of the sealing sliding plate, the compression spring is sleeved on the outer ring of the extension sliding rod, the compression spring is fixedly connected to the inner top of the air cylinder, and a pull rod is fixedly connected to the left top of the extension sliding rod.

[0013] Preferably, the air pressure assembly includes an air cylinder fixedly connected to the top of the equipment box, a through hole is formed in the air cylinder, a sealing sliding plate is slidably connected to the inner ring of the air cylinder, an extension sliding rod is fixedly connected to the top of the sealing sliding plate, the extension sliding rod is slidably connected to the top of the air cylinder, a compression spring is fixedly connected to the top of the sealing sliding plate, the compression spring is sleeved on the outer ring of the extension sliding rod, the compression spring is fixedly connected to the inner top of the air cylinder, and a pull rod is fixedly connected to the left top of the extension sliding rod.

[0014] Compared with the prior art, the chip normal temperature bonding auxiliary pressurizing device has the following beneficial effects:

[0015] 1. The chip room temperature bonding auxiliary pressure device, through the setting of the pressure mechanism, the staff only needs to press the pull rod downward to drive the sealing sliding vane downward, the sealing sliding vane pushes the gas into the telescopic cylinder to drive the telescopic cylinder to extend downward, drives the lower pressing block to complete the pressure on the top of the chip bonding material platform, simple operation is convenient for the staff to use, at the same time, the staff only needs to get the specific distance of the lower pressing block through the number displayed by the inlaid volume scale in the front side slot of the sleeve ring, so that the staff can adjust the pressure according to the required pressure and material height, simple operation is convenient for the staff to use.

[0016] 2. The chip room temperature bonding auxiliary pressure device, through the setting of the pressure mechanism, the sealing sliding vane is slidably connected to the top of the equipment box to block the front side opening of the communication pipe, so that the air in the air cylinder cannot be discharged through the communication pipe again in the process of being pushed downward by the sealing sliding vane, ensuring that the telescopic cylinder can fully relax in the process of the sealing sliding vane sliding downward, ensuring the auxiliary pressure effect of the lower pressing block on the chip material when moving downward, and the staff only needs to move the pull rod to the left to drive the closing slide plate to the left to remove the closure of the communication pipe, so that the inside of the air cylinder is connected with the outside, so that the air in the inside can be discharged upward with the lower pressing block and the limiting block, balancing the air pressure on the inside and the outside, simple operation is convenient for the staff to use. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating labor intensity:

[0018] Figure 1 It is a front view of the present application;

[0019] Figure 2 It is a schematic view of the opening and closing state of the present application;

[0020] Figure 3 It is a side view of the present application;

[0021] Figure 4 It is Figure 3 It is an enlarged schematic view of structure A in the present application;

[0022] Figure 5 It is a sectional view of the pressure mechanism part structure;

[0023] Figure 6 It is a separate view of the pressure stabilizing mechanism part structure;

[0024] Figure 7 It is a schematic view of the pressure stabilizing mechanism part structure.

[0025] In the diagram: 1. Pressurization mechanism; 11. Pneumatic assembly; 1101. Air cylinder; 1102. Through hole; 1103. Sealing slide; 1104. Telescopic slide rod; 1105. Compression spring; 1106. Pull rod; 12. Volume control assembly; 1201. Fixed rod; 1202. Collar; 1203. Limiting block; 1204. Embedded volume scale; 13. Pressing assembly; 1301. Telescopic cylinder; 1302. Pressing block; 1303. Return spring one; 2. Pressure stabilizing mechanism; 21. Connecting assembly; 2101. Connecting pipe; 2102. Closing slide plate; 2103. Toggle lever; 22. Returning assembly; 2201. Fixed cylinder; 2202. Slide cylinder; 2203. Connecting slide rod; 2204. Return spring two; 3. Equipment housing; 31. Closing door; 32. Discharge platform; 4. Support leg. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] This utility model provides a technical solution:

[0029] Example 1

[0030] Combination Figures 1 to 5 A chip room temperature bonding auxiliary pressurization device includes a device housing 3, a support leg 4 fixedly connected to the bottom of the device housing 3, a closed door 31 provided inside the front side of the device housing 3, a feeding platform 32 fixedly connected to the bottom inside the device housing 3, a pressurization mechanism 1 provided at the top of the device housing 3, and a pressure stabilizing mechanism 2 provided inside the top of the device housing 3 in front of the pressurization mechanism 1.

[0031] The pressing mechanism 1 comprises a gas pressure assembly 11, a quantity control assembly 12 and a pressing-down assembly 13. The gas pressure assembly 11 is arranged on the top of the equipment box 3, the quantity control assembly 12 is arranged on the outer ring of the gas pressure assembly 11, and the pressing-down assembly 13 is arranged below the gas pressure assembly 11.

[0032] The gas pressure assembly 11 comprises a gas cylinder 1101 fixedly connected to the top of the equipment box 3. A through hole 1102 is formed in the gas cylinder 1101. A sealing sliding sheet 1103 is slidably connected to the inner ring of the gas cylinder 1101. A telescopic sliding rod 1104 is fixedly connected to the top of the gas cylinder 1101. A compression spring 1105 is fixedly connected to the inner top of the gas cylinder 1101. A pull rod 1106 is fixedly connected to the left top of the telescopic sliding rod 1104. The quantity control assembly 12 comprises a fixed rod 1201 fixedly connected to the right top of the telescopic sliding rod 1104. A sleeve ring 1202 is slidably connected to the outer ring of the gas cylinder 1101. A limiting block 1203 is arranged above the sleeve ring 1202. The limiting block 1203 is fixedly connected to the outer ring top of the gas cylinder 1101. A slot is formed in the front side of the sleeve ring 1202. An embedded volume scale 1204 is arranged in the slot of the sleeve ring 1202. The embedded volume scale 1204 is fixedly connected to the front side of the gas cylinder 1101. The pressing-down assembly 13 comprises a telescopic cylinder 1301 fixedly connected to the inner top of the equipment box 3 below the gas cylinder 1101. The telescopic cylinder 1301 is sleeved on the outer ring of the through hole 1102. A pressing-down block 1302 is fixedly connected to the bottom of the telescopic cylinder 1301. A reset spring 1303 is fixedly connected to the inner top of the equipment box 3.

[0033] Further, the reset spring 1303 is arranged to drive the pressing-down block 1302 to move upward by itself when the gas pressure is lost, so that the bottom of the pressing-down block 1302 does not naturally fall to the top of the material placing table 32, which facilitates the workers to place the materials on the top of the material placing table 32 and is simple in operation and convenient for workers to use.

[0034] And the compression spring 1105 is arranged to make the air cylinder 1101 closed to the outside, and the sealing sliding plate 1103 is pushed down into the air cylinder 1101, the air in the air cylinder 1101 is pushed down into the telescopic cylinder 1301, and the telescopic cylinder 1301 is stretched down, and the compression spring 1105 and the reset spring 1303 are balanced to make the lower pressing block 1302 keep hovering, and the lower pressing block 1302 can keep the position stable after the chip material is pressed, and the lower pressing block 1302 can keep pressing the material without external force, and the reset spring 1303 is actively balanced when the pull rod 1106 is manually pulled down, which reduces the force required when the sealing sliding plate 1103 moves down, and is convenient for the staff to use.

[0035] Embodiment two

[0036] Reference Figures 1 to 7 And on the basis of embodiment one, it is further obtained that the pressure stabilizing mechanism 2 comprises a communication assembly 21 and a reset assembly 22, the communication assembly 21 is arranged at the top of the equipment box 3 and located at the front side of the air pressure assembly 11, and the reset assembly 22 is arranged at the top of the equipment box 3 and located at the front and rear sides of the air pressure assembly 11.

[0037] The communication assembly 21 comprises a communication pipe 2101, the communication pipe 2101 is fixedly connected to the top of the equipment box 3, the rear side of the communication pipe 2101 is open and located between the air cylinder 1101 and the through hole 1102, the communication pipe 2101 is arranged at the front side of the telescopic cylinder 1301, the front side of the communication pipe 2101 is provided with a closing sliding plate 2102 at the top of the opening, the closing sliding plate 2102 is slidingly connected to the top of the equipment box 3, a pull rod 2103 is fixedly connected to the top of the closing sliding plate 2102, the pull rod 2103 is slidingly connected to the top of the equipment box 3, the pressure stabilizing mechanism 2 comprises a fixed cylinder 2201, the fixed cylinder 2201 is arranged at the front and rear sides of the closing sliding plate 2102, the fixed cylinder 2201 is fixedly connected to the top of the equipment box 3, a sliding cylinder 2202 is slidingly connected in the fixed cylinder 2201, a connecting sliding rod 2203 is fixedly connected to the inner side of the outer ring of the sliding cylinder 2202, the connecting sliding rod 2203 is fixedly connected to the front and rear sides of the closing sliding plate 2102, the connecting sliding rod 2203 is slidingly connected to the top of the equipment box 3, a reset spring two 2204 is fixedly connected to the left side in the sliding cylinder 2202, and the reset spring two 2204 is fixedly connected to the left side in the fixed cylinder 2201.

[0038] Further: the closing slide plate 2102 is slidingly connected to the top of the equipment box 3 to block the opening of the communication pipe 2101, so that the air entering the air cylinder 1101 cannot be discharged through the communication pipe 2101 again during the downward pushing of the sealing slide 1103, ensuring that the telescopic cylinder 1301 can be fully relaxed during the downward sliding of the sealing slide 1103, and ensuring the auxiliary pressurizing effect of the lower pressing block 1302 on the chip material during the downward movement of the lower pressing block 1302, and the staff only needs to move the lever 2103 to the left to drive the closing slide plate 2102 to move to the left to unblock the communication pipe 2101, so that the inside of the air cylinder 1101 is in communication with the outside, and the air inside can be discharged upward with the lower pressing block 1302 and the limiting block 1203, balancing the air pressure on both sides.

[0039] In actual operation, when the device is used, when the chip material on the top of the discharging table 32 needs to be pressurized, the staff first moves the lever 2103 to the left, which drives the closing slide plate 2102 to move to the left, unblocking the communication pipe 2101, and then the staff pulls the pull rod 1106 upward, which moves the pull rod 1106 upward to draw external air into the air cylinder 1101 through the communication pipe 2101. During the upward pulling of the pull rod 1106 by the staff, the staff can obtain the distance of the lower pressing block 1302 after being pressed downward by observing the indication between the sleeve ring 1202 and the embedded volume scale 1204. At this time, the staff needs to control the upward pulling distance of the pull rod 1106 according to the specific use requirements, and then waits for a moment until the telescopic cylinder 1301 is fully relaxed. Then, the lever 2103 is released, and at this time the slide cylinder 2202 drives the closing slide plate 2102 to move to the right under the action of the return spring two 2204 through the connecting slide rod 2203, and the closing slide plate 2102 moves to the right to block the communication pipe 2101 at the top of the communication pipe 2101;

[0040] Then the staff presses the pull rod 1106 downward, and the pull rod 1106 moves downward to drive the sealing slide 1103 to move downward through the telescopic slide rod 1104, and the sealing slide 1103 moves downward to push the air in the air cylinder 1101 downward into the telescopic cylinder 1301 through the through hole 1102. At this time, the telescopic cylinder 1301 is relaxed downward due to the entry of excess air, driving the lower pressing block 1302 to move downward, and stopping when the pull rod 1106 is pressed downward to the bottom. At this time, the downward force of the compression spring 1105 and the upward force of the return spring one 1303 driving the lower pressing block 1302 cancel each other out, so that the lower pressing block 1302 remains in place to pressurize the chip material on the top of the discharging table 32.

[0041] It is to be noted that, as used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component" can include a combination of two or more components. Additionally, the terms "comprise," "comprises," and "comprising," or any variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Furthermore, unless otherwise indicated herein, the terms "first," "second," "third," etc., are not intended to denote a physical order, quantity, or importance, but rather are used for the purpose of nomenclature.

Claims

1. A chip room temperature bonding auxiliary pressurizing device comprising a device box (3), characterized in that: The equipment box (3) bottom fixedly connected with the leg (4), the equipment box (3) front side is provided with the closed door (31), the equipment box (3) inner bottom fixedly connected with the discharge table (32), the equipment box (3) top is provided with the pressurizing mechanism (1), the equipment box (3) top inside is located the pressurizing mechanism (1) front side and is provided with the stabilizing mechanism (2); The pressurizing mechanism (1) includes gas pressure assembly (11), control assembly (12) and lower pressure assembly (13), the gas pressure assembly (11) is set up in the equipment box (3) top, the control assembly (12) is set up in the gas pressure assembly (11) outer ring, the lower pressure assembly (13) is set up below the gas pressure assembly (11); The stabilizing mechanism (2) includes communication assembly (21) and reset assembly (22), the communication assembly (21) is set up in the equipment box (3) top inside and is located the gas pressure assembly (11) front side position, the reset assembly (22) is set up in the equipment box (3) top inside and is located the gas pressure assembly (11) front and back two sides.

2. The chip room temperature bonding auxiliary pressurizing device according to claim 1, characterized in that: The gas pressure assembly (11) includes air cylinder (1101), the air cylinder (1101) fixedly connected with the equipment box (3) top, the equipment box (3) top is located in the air cylinder (1101) and is set up with through-hole (1102), the air cylinder (1101) inner ring is slidably connected with sealing sliding vane (1103), the sealing sliding vane (1103) top fixedly connected with telescopic slide bar (1104), the telescopic slide bar (1104) is slidably connected in the air cylinder (1101) top.

3. The chip room temperature bonding auxiliary pressurizing device according to claim 2, characterized in that: The sealing sliding vane (1103) top fixedly connected with compression spring (1105), the compression spring (1105) is sleeved on the telescopic slide bar (1104) outer ring, the compression spring (1105) is fixedly connected with the air cylinder (1101) inner top, the telescopic slide bar (1104) left side top fixedly connected with pull rod (1106).

4. The chip room temperature bonding auxiliary pressurizing device according to claim 1, characterized in that: The control assembly (12) includes fixed rod (1201), the fixed rod (1201) fixedly connected with the telescopic slide bar (1104) right side top, the fixed rod (1201) bottom left side fixedly connected with the thimble (1202), the thimble (1202) is slidably connected with the air cylinder (1101) outer ring, the thimble (1202) above is provided with the limit block (1203).

5. The chip room temperature bonding auxiliary pressurizing device according to claim 4, characterized in that: The limit block (1203) is fixedly connected with the air cylinder (1101) outer ring top, the thimble (1202) front side is set up with notch, the thimble (1202) front side notch inside is provided with the embedded volume scale (1204), the embedded volume scale (1204) is fixedly connected with the air cylinder (1101) front side.

6. The chip room temperature bonding auxiliary pressurization device according to claim 1, characterized in that: The lower pressing assembly (13) comprises a telescopic cylinder (1301) fixedly connected to the inner top of the equipment box (3) below the air cylinder (1101), the telescopic cylinder (1301) is sleeved on the outer ring of the through hole (1102), the bottom of the telescopic cylinder (1301) is fixedly connected with a lower pressing block (1302), the top of the lower pressing block (1302) is fixedly connected with a reset spring I (1303), and the reset spring I (1303) is fixedly connected to the inner top of the equipment box (3).

7. The chip room temperature bonding auxiliary pressurization device according to claim 1, characterized in that: The communication assembly (21) comprises a communication pipe (2101) fixedly connected to the inner top of the equipment box (3), the rear opening of the communication pipe (2101) is located between the air cylinder (1101) and the through hole (1102), the communication pipe (2101) is arranged on the front side of the telescopic cylinder (1301), the front opening of the communication pipe (2101) is provided with a closing slide plate (2102) arranged on the top, the closing slide plate (2102) is slidingly connected to the top of the equipment box (3), the top of the closing slide plate (2102) is fixedly connected with a pull rod (2103), and the pull rod (2103) is slidingly connected to the top of the equipment box (3).

8. The chip room temperature bonding auxiliary pressurization device according to claim 1, characterized in that: The pressure stabilizing mechanism (2) comprises a fixed cylinder (2201) arranged on the front and back of the closing slide plate (2102), the fixed cylinder (2201) is fixedly connected to the top of the equipment box (3), the fixed cylinder (2201) is slidingly connected with a sliding cylinder (2202), and the outer ring of the sliding cylinder (2202) is fixedly connected with a connecting sliding rod (2203).

9. The chip room temperature bonding auxiliary pressurizing device according to claim 8, characterized in that: The connecting sliding rod (2203) is fixedly connected to the front and back of the closing slide plate (2102), the connecting sliding rod (2203) is slidingly connected to the top of the equipment box (3), the left side of the sliding cylinder (2202) is fixedly connected with a reset spring II (2204), and the reset spring II (2204) is fixedly connected to the left side of the fixed cylinder (2201).

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