Wafer edge finder

Abstract

The utility model discloses a wafer edge finder, and relates to the technical field of edge finding devices. The wafer supporting frame specifically comprises a supporting frame body, the surface of the supporting frame body is provided with a supporting structure used for containing a material box, a wafer with the edge to be found is placed in the material box, and the wafer is round and has a flat edge; the transmission part is arranged in the middle area of the supporting structure and can abut against the edge of the wafer; the supporting assembly is arranged on one side of the transmission part, and when the flat edge of the wafer right corresponds to the transmission part, the supporting assembly can support the wafer so that the wafer can be separated from the transmission part; the driving assembly is connected to the transmission part; and the adjusting part is arranged on the supporting frame body, and when all the wafers are separated from the transmission part and the flat edge is located at the uppermost part, the adjusting part extends out, so that all the wafers in the material box are in an inclined state. The objective of the utility model is to combine and complete laser number-carving confirmation and edge searching operation in the same equipment so as to reduce the transfer operation of wafers, reduce the risk of wafer breakage and improve the production efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of edge searching device, especially relates to a wafer edge searching device. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafers are the basic materials for chip production, and each process step in the wafer manufacturing process has an important influence on the quality and performance of the product. In the manufacturing process, in order to ensure that each process step can be accurately aligned to the target area on the wafer, the wafer needs to be marked by laser marking, thereby providing a positioning reference for subsequent process steps. Laser marking is the use of laser to engrave unique characters or patterns on the surface of the wafer, which is used to mark and track the position, process state and batch information of the wafer during processing. These markings need to be accurately read in order to confirm the identity and positioning reference of the wafer.

[0003] Manual confirmation of laser markings is commonly used in wafer manufacturing. After picking up the wafer with a vacuum suction pen, the operator uses a special device to observe and confirm. After confirming the laser marking, the wafer is placed on an edge searching device to determine the edge position of the wafer.

[0004] Currently, the confirmation of laser markings and the wafer edge searching operation are carried out on two different jigs respectively. This means that after completing the confirmation of laser markings, the wafer needs to be taken out from one jig and transferred to another jig for edge searching operation. This frequent wafer transfer operation increases the risk of human error and greatly increases the risk of wafer damage.

[0005] Therefore, how to combine the confirmation of laser markings and the edge searching operation in the same device to reduce the transfer operation of the wafer, reduce the risk of wafer breakage and improve production efficiency has become a technical problem to be solved. UTILITY MODEL CONTENTS

[0006] The main purpose of the utility model is to provide a wafer edge searching device, which aims to combine the confirmation of laser markings and the edge searching operation in the same device to reduce the transfer operation of the wafer, reduce the risk of wafer breakage and improve production efficiency.

[0007] In order to achieve the above purpose, the utility model provides a wafer edge searching device, which comprises:

[0008] A support frame body is provided with a support structure for placing a magazine, and the magazine contains a wafer to be searched for an edge, the wafer is circular and the circular edge is flat;

[0009] A transmission member is arranged in the middle region of the support structure and can abut against the edge of the wafer to drive the wafer to rotate;

[0010] A support assembly is arranged at one side of the transmission member, and can support the wafer when the flat edge of the wafer is opposite to the transmission member, so that the wafer is separated from the transmission member;

[0011] A driving assembly is connected to the transmission member, and is used for driving the transmission member to rotate; and

[0012] An adjusting member is arranged on the support frame body, and when each wafer is separated from the transmission member and the flat edge is at the uppermost position, the adjusting member is extended, so that each wafer in the magazine is in an inclined state, thereby facilitating confirmation of the laser marking on each wafer.

[0013] In an embodiment of the present application, the support assembly comprises:

[0014] A rotating seat is sleeved on the transmission member, and can rotate relative to the axis of the transmission member, and the rotating seat is provided with an opening part for contacting the transmission member with the wafer; and

[0015] A support block is arranged at one side of the opening part of the rotating seat, and can rotate with the rotating seat, and when the support block is in an edge searching position, the support block can support the wafer whose flat edge is opposite to the transmission member, so that the wafer is separated from the transmission member; and when the support block is in a rotating position, the support block releases the support on the wafer, so that each wafer can rotate with the transmission member.

[0016] In an embodiment of the present application, the adjusting member is a support plate with an inclined surface, the support plate is connected to one side of the opening part of the rotating seat and is arranged opposite to the support block, and the length direction of the support block is parallel to the axis direction of the transmission member.

[0017] In an embodiment of the present application, a rotating handle is connected to the rotating seat.

[0018] In an embodiment of the present application, the support frame body comprises:

[0019] A base, and the support structure is arranged on the base;

[0020] A first fixed plate is connected to the side wall of the base; and

[0021] A second fixed plate is connected to the side wall of the base and is arranged opposite to the first fixed plate;

[0022] The first end of the transmission member is rotatably connected to the first fixed plate, the second end of the transmission member is rotatably connected to the second fixed plate and extends outwardly from the second fixed plate, and the driving assembly is connected to the second end of the transmission member.

[0023] In an embodiment of the present application, the driving assembly comprises:

[0024] a rotating disc, the second end of the transmission member is connected to the center of the rotating disc; and

[0025] a rotating handle, connected to the side of the rotating disc opposite to the transmission member, the rotating handle does not coincide with the center of the rotating disc.

[0026] In an embodiment of the present application, the first fixed plate is provided with an indicating member for indicating the current position of the rotating handle.

[0027] By using the above technical solution, the flat edge of the wafer is accurately positioned, and the production and detection efficiency is improved. Through the inclination adjustment function of the adjusting member, the manual or automatic reading operation of the laser marking is simplified, the structure is simple, and the implementation is convenient. BRIEF DESCRIPTION OF DRAWINGS

[0028] The utility model will be explained in detail below by combining with specific embodiments and drawings, in which:

[0029] Figure 1 It is structural schematic diagram of first kind of embodiment of the utility model;

[0030] 11, first fixed plate;12, second fixed plate;13, base;20, support structure;30, transmission member;40, support block;50, adjusting member;61, rotating disc;62, rotating handle;70, indicating member. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantage of the utility model more clear, the utility model will be explained in detail below by combining with drawings and embodiments. It should be understood that the following specific embodiments are only used to explain the utility model, and do not constitute the limitation of the utility model.

[0032] As Figure 1 Indicated, in order to realize the above-mentioned purpose, the utility model proposes a wafer edge finder, comprising:

[0033] support frame body, the surface is configured with the support structure 20 for placing the material box, the material box is placed with the wafer to be searched for the edge, the wafer is circular and the circular existence one flat edge;

[0034] transmission member 30, is located in the middle area of the support structure 20, can be abutted to the edge of the wafer, to drive the wafer rotation;

[0035] support assembly, is located in the side of the transmission member 30, when the flat edge of the wafer is directly corresponding the transmission member 30, can support the wafer, to make wafer and the transmission member disengagement contact;

[0036] a driving assembly connected to the transmission member 30 for driving the transmission member 30 to rotate; and

[0037] an adjusting member 50 provided on the support frame body, when each wafer is out of contact with the transmission member 30 and the flat edge is at the uppermost position, the adjusting member 50 is extended to make each wafer in the magazine in an inclined state, so as to facilitate the confirmation of the laser marking on each wafer.

[0038] Specifically, the support frame body is made of metal material (such as aluminum alloy, stainless steel) or high-strength engineering plastic to ensure stability and durability. The support frame body is the basis of the whole device, which supports other components. The support frame surface is provided with a support structure 20 for placing the magazine, which includes a limiting edge and / or a clamping groove. The support structure 20 is made of metal or engineering plastic. These support structures 20 are integrally formed with the support frame body or fixed on the support frame by bolts or welding, which is used to stabilize the magazine and ensure the stable placement of the wafer during the edge finding process.

[0039] The transmission member 30 is used to contact the wafer edge and drive it to rotate, which is made of wear-resistant material, such as rubber-coated metal roller, etc., to ensure sufficient friction and not damage the wafer. The position of the transmission member 30 is located in the middle region of the support structure 20 and directly contacts the wafer edge. The transmission member 30 is connected with the driving assembly through shaft or gear, which is installed by bearing support to ensure smooth rotation.

[0040] The support assembly is used to support the wafer to be out of contact with the transmission member 30 when the flat edge of the wafer is directly opposite the transmission member 30. The support assembly is composed of one or more lifting support blocks 40, which are made of high-hardness engineering plastic or metal, and the surface is covered with flexible material to avoid scratching the wafer. The position of the support assembly is on one side of the transmission member 30, and the support assembly can be lifted by guide rail, spring mechanism or electric drive device.

[0041] The driving assembly is used to provide power to drive the transmission member 30 to rotate. The driving assembly includes a motor (such as a stepper motor or a direct current motor), a speed reduction mechanism and a transmission shaft. The motor is made of metal shell and internal copper coil, which is installed in the inside or side of the support frame body and connected with the support frame body by bolts or other fixing methods. The output end of the motor is connected with the transmission member 30 through a shaft coupling or a gear system to realize power transmission. It is conceivable that in order to improve the application range of the wafer edge finder and avoid the dependence of the wafer edge finder on the power supply, the driving assembly can also be realized by a manual rocker. It can be selected according to the specific needs, which will not be limited here.

[0042] The adjusting member 50 is used to extend to tilt the magazine when the flat edge of the wafer is aligned at the uppermost position, so as to facilitate the identification of the laser mark. The adjusting member 50 can be a support plate with an inclined surface, which supports the magazine by rotating to the bottom of the magazine or lifting to the bottom of the magazine, so as to tilt the magazine. It is conceivable that the adjusting member 50 can also be composed of one or more lifting columns or sliding rail mechanisms, which are internally provided with electric drive or mechanical spring lifting devices. By controlling the lifting of the lifting column, the magazine is tilted to facilitate the observation of the laser mark on the wafer.

[0043] By adopting the above technical solution, the flat edge of the wafer is accurately positioned, the production and detection efficiency is improved, the manual or automatic reading operation of the laser mark is simplified by the tilting adjustment function of the adjusting member 50, the structure is simple, and the implementation is facilitated.

[0044] In an embodiment of the present application, the support assembly comprises:

[0045] A rotating seat is sleeved on the transmission member 30 and can rotate relative to the axis of the transmission member 30. The rotating seat is provided with an opening portion that can make the transmission member 30 contact the wafer.

[0046] A support block 40 is arranged on one side of the opening portion of the rotating seat and can rotate with the rotating seat. When the support block 40 is in the edge searching position, the support block 40 can support the wafer whose flat edge is directly opposite the transmission member 30, so that the wafer is separated from the transmission member. When the support block 40 is in the rotating position, the support block 40 releases the support of the wafer, so that each wafer can rotate with the transmission member 30.

[0047] Specifically, the rotating seat is sleeved on the transmission member 30 and can freely rotate relative to the axis of the transmission member 30. The rotating seat is usually made of metal (such as aluminum alloy, stainless steel) or high-strength engineering plastic to ensure strength and durability while reducing weight. The rotating seat is located at the periphery of the transmission member 30 to form a sleeved structure, which is connected to the transmission member 30 through a bearing or other low-friction components, so that it can move independently when the transmission member 30 rotates. The rotating seat is designed with an opening portion, which allows the transmission member 30 to directly contact the wafer and drive the wafer to rotate. The edge of the opening portion is designed to be smooth or coated with a non-slip coating to ensure that the opening area does not affect the surface quality of the wafer.

[0048] The support block 40 is arranged at one side of the opening of the rotating seat and can rotate with the rotating seat. The material of the support block 40 is high-hardness engineering plastic (such as polyamide or polycarbonate) or metal material, and the surface is covered with a flexible coating or rubber to avoid scratching the wafer. The position of the support block 40 is at one side of the opening and is fixedly connected with the rotating seat to realize synchronous movement with the rotating seat. When the support block 40 is in the edge searching gear position, the support block 40 can support the wafer with the flat edge facing the transmission member 30 to make the wafer disengage from the transmission member; when the support block 40 is in the rotating gear position, the support block 40 releases the support on the wafer to make each wafer rotate with the transmission member 30.

[0049] By the cooperation of the rotating seat and the support block 40, the edge searching of the wafer and the rotation of the flat edge to the top of the magazine after the edge searching are realized. The structure is simple and easy to implement.

[0050] In an embodiment of the present application, the adjusting member 50 is a support plate with an inclined surface, which is connected to one side of the opening of the rotating seat and is arranged opposite to the support block 40, and the length direction of the support block 40 is parallel to the axis direction of the transmission member 30.

[0051] Specifically, the adjusting member 50 is a support plate with an inclined surface, and the support plate is designed with an inclined surface, which is smooth or coated with a non-slip material or a low-friction material according to needs, to ensure that other components or wafers are not damaged during adjustment. The inclined surface design of the support plate can help to raise or lower one side of the magazine to make the magazine in an inclined state and facilitate the identification of the laser marking number.

[0052] The above technical solution has the advantages of simple structure and easy implementation.

[0053] In an embodiment of the present application, a rotating handle is connected to the rotating seat.

[0054] The above technical solution connects a rotating handle to one end of the rotating seat, drives the rotating seat to rotate through the rotating handle, thereby realizing the gear position switching of the support block 40, and also can rotate the adjusting member 50 to the working position or withdraw it from the working position by rotating the rotating handle. When it is necessary to confirm the laser marking number of the wafer, the detailed working process is as follows:

[0055] First, the support block 40 is adjusted to the edge searching position by rotating the handle, and the wafer is searched at this time. After the edge searching is completed, the support block 40 is adjusted to the rotating position by rotating the handle, and all the wafers are synchronously rotated by the transmission member 30 at this time. When the flat edges of the wafers are all located above, the magazine is taken down. At this time, the adjusting member 50 on the rotating seat is rotated to above the transmission member 30 by rotating the handle, and then the magazine is placed on the adjusting member 50, so that the laser marking is observed.

[0056] The above technical solution has simple structure and is easy to implement.

[0057] In an embodiment of the present application, the support frame body comprises:

[0058] The base 13, wherein the support structure 20 is arranged on the base 13;

[0059] The first fixed plate 11 connected to the side wall of the base 13; and

[0060] The second fixed plate 12 connected to the side wall of the base 13 and arranged opposite to the first fixed plate 11;

[0061] The first end of the transmission member 30 is rotatably connected to the first fixed plate 11, and the second end of the transmission member 30 is rotatably connected to the second fixed plate 12 and extends outwardly from the second fixed plate 12, and the driving assembly is connected to the second end of the transmission member 30.

[0062] Specifically, the base 13 is used to provide stable support and ensure the stability of the entire device. The base 13 is located at the lower part of the entire device and is the basis for fixing all other components (such as the support structure 20, the fixed plate and the transmission member 30). The support structure 20 is a platform or frame mounted on the base 13, and the support structure 20 is fixedly connected to the base 13 by bolting or welding. The base 13 provides a solid base to ensure the stability of the transmission member 30, the fixed plate and other important components during operation.

[0063] The first fixed plate 11 is located on the side wall of the base 13 and is fixed to the side of the base 13 by bolting or welding. The first fixed plate 11 serves to provide a support point for the transmission member 30 and ensure that the first end of the transmission member 30 can rotate freely. The first fixed plate 11 is designed with a bearing seat or a hole position connected to the transmission member 30 for rotatably connecting the first end of the transmission member 30.

[0064] The second fixed plate 12 is arranged opposite to the first fixed plate 11 and is installed on the side wall of the base 13. The second fixed plate 12 serves to provide support for the second end of the transmission member 30 and to fix the second end of the transmission member 30 through a rotating connection. The design of the second fixed plate 12 includes a hole passing through the plate body, which is used to accommodate the second end of the transmission member 30 to allow it to rotate freely and extend outward, thereby allowing the transmission member 30 to continue to be connected to other components (such as the driving assembly). Through this structure, the second fixed plate 12 ensures that the transmission member 30 does not displace when rotating, providing stable support.

[0065] By adopting the above technical scheme, through the coordinated design of the base 13, the fixed plate, the transmission member 30 and the driving assembly, an efficient and stable transmission control system is realized. The two ends of the transmission member 30 are connected through the rotating connection of the first fixed plate 11 and the second fixed plate 12, forming a stable support structure between the two, ensuring that the transmission member 30 does not deviate or vibrate during operation. The driving assembly is connected to the first end of the transmission member 30, providing a power source to ensure that the transmission member 30 can operate smoothly and accurately transmit power. The design of the second fixed plate 12 allows the second end of the transmission member 30 to extend freely, which provides additional space and flexibility while ensuring support.

[0066] In an embodiment of the present application, the driving assembly comprises:

[0067] A rotating disc 61, to which the second end of the transmission member 30 is connected at the center of the rotating disc 61; and

[0068] A rotating handle 62 connected to the side of the rotating disc 61 opposite to the transmission member 30, the center of the rotating handle 62 and the center of the rotating disc 61 do not coincide.

[0069] Specifically, the rotating disc 61 is connected to the second end of the transmission member 30, and the connection point is located at the center of the rotating disc 61. This connection ensures that the rotating disc 61 can rotate around the center, thereby driving the rotation of the transmission member 30. The surface of the rotating disc 61 is designed with a smooth outer ring or gear tooth surface to facilitate power transmission.

[0070] The rotating handle 62 is located on the other side of the rotating disc 61 and does not coincide with the center of the rotating disc 61. The rotating handle 62 is fixed to the periphery of the rotating disc 61 through a fixed bearing or directly fixed by welding, bolt connection and other methods. The position of the rotating handle 62 ensures that the operator can change the angle of the rotating disc 61 by rotating the handle 62, thereby providing power to the transmission member 30.

[0071] By means of the design of the rotating disc 61 and the rotating handle 62, the precise control and efficient operation of the transmission member 30 are realized. The rotating disc 61, as a connecting component of the transmission member 30, can effectively transmit the rotating torque and ensure the rotation stability of the transmission member 30. By arranging the rotating handle 62 on the other side of the rotating disc 61 and not coinciding with the center, the force required during operation is reduced, and the convenience and efficiency of operation are improved.

[0072] In an embodiment of the present application, the first fixed plate 11 is provided with an indicating member 70 for indicating the current position of the rotating handle.

[0073] By means of the above technical scheme, the indicating member 70 for indicating the current position of the rotating handle is arranged, which facilitates the operation of the operator and is simple in structure and easy to implement.

[0074] The above description is only preferred embodiments of the present application, and does not limit the patent range of the present application. Any equivalent structural transformation or direct / indirect application in other related technical fields within the scope of the present application is included in the patent protection range of the present application.

Claims

1. A wafer edge finder, comprising: The utility model relates to a wafer edge searching device, which comprises: a support frame body, a support structure for placing a wafer box is arranged on the surface of the support frame body, the wafer box contains wafer pieces to be searched, the wafer pieces are circular and have a flat edge; a transmission member is arranged in the middle region of the support structure and can abut against the edge of the wafer piece to drive the wafer piece to rotate; a support assembly is arranged on one side of the transmission member, when the flat edge of the wafer piece is opposite to the transmission member, the support assembly can support the wafer piece to make the wafer piece not contact the transmission member; a driving assembly is connected to the transmission member to drive the transmission member to rotate; and an adjusting member is arranged on the support frame body, when each wafer piece is not in contact with the transmission member and the flat edge is at the uppermost position, the adjusting member is extended to make each wafer piece in the wafer box be in an inclined state to facilitate the confirmation of the laser mark on each wafer piece. The support assembly comprises: a rotating seat is sleeved on the transmission member and can rotate relative to the axis of the transmission member, the rotating seat has an opening part to make the transmission member contact the wafer piece; and a support block is arranged on one side of the opening part of the rotating seat and can rotate with the rotating seat, when the support block is in an edge searching position, the support block can support the wafer piece whose flat edge is opposite to the transmission member to make the wafer piece not contact the transmission member; when the support block is in a rotating position, the support block releases the support of the wafer piece to make each wafer piece rotate with the transmission member; the adjusting member is a support plate with an inclined surface, the support plate is connected to one side of the opening part of the rotating seat and is arranged opposite to the support block, the length direction of the support block is parallel to the axis direction of the transmission member.

2. The wafer edge finder of claim 1, wherein, A rotating handle is connected to the rotating seat.

3. The wafer edge finder of claim 1, wherein the wafer edge finder is configured to determine the wafer edge based on the first and second wafer edge signals. The support frame body comprises: a base, the support structure is arranged on the base; a first fixed plate is connected to the side wall of the base; and a second fixed plate is connected to the side wall of the base and is arranged opposite to the first fixed plate; a first end of the transmission member is rotatably connected to the first fixed plate, a second end of the transmission member is rotatably connected to the second fixed plate and extends outwardly through the second fixed plate, and the driving assembly is connected to the end of the second end of the transmission member.

4. The wafer edge finder of claim 3, wherein the first and second light sources are configured to emit light having a wavelength of 400 nm to 700 nm. The driving assembly comprises: a rotating disc, the end of the second end of the transmission member is connected to the center of the rotating disc; and a rotating handle is connected to one side of the rotating disc opposite to the transmission member, and the center of the rotating handle and the center of the rotating disc are not coincident.

5. The wafer edge finder of claim 3, wherein the first and second light sources are LEDs. An indicating member is arranged on the first fixed plate to indicate the current position of the rotating handle.

Images