Chip processing device

Abstract

The utility model provides a chip processing device. The chip processing device comprises a main body, a moving mechanism and a processing mechanism, the main body comprises a bearing end for bearing a to-be-processed target chip and a mounting end; the machining mechanism comprises a base, a cutting piece and a pressing piece. The moving mechanism is provided with a moving end and is arranged at the mounting end; the moving end of the moving mechanism is connected with the base and is configured to drive the base to approach the bearing end; the pressing pieces are oppositely arranged on the surface, back to the moving mechanism, of the base, the cutting pieces are attached to the surfaces, back to each other, of the pressing pieces and are movably arranged on the base, and the moving directions of the cutting pieces comprise the directions close to and away from the base along the surfaces, back to each other, of the pressing pieces; the processing mechanism is configured to be in contact with a pin of the target chip through a pressing piece under the condition that the base is close to the bearing end so as to press the pin; and the cutting piece moves towards the direction close to the pin along the surface of the pressing piece so as to cut the pin. According to the chip processing device, the pin cutting precision of the target chip is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of target chip production, in particular to a chip processing device. BACKGROUND

[0002] The processing of the target chip usually includes cutting the pin of the target chip, that is, cutting off the pin of the target chip. In the field of target chip production, the quality of the cutting forming is extremely important for subsequent wire bonding and other processes.

[0003] At present, the main way of cutting the pin of the target chip is to cut off the pin manually. During the cutting, due to many human and environmental factors, the pin length of the target chip in the same batch is not the same.

[0004] That is, the main way of cutting the pin of the target chip is not high enough in precision. CONTENT OF THE INVENTION

[0005] The purpose of the present application is to provide a chip processing device which can improve the precision of cutting off the pin of the target chip by pressing the pin on the target chip with a pressing member and moving a cutting member along the surface of the pressing member to cut the pin.

[0006] The chip processing device provided by the present application comprises a main body, a moving mechanism and a processing mechanism; the main body comprises a bearing end for bearing the target chip to be processed and a mounting end; the processing mechanism comprises a base, a cutting member and a pressing member; the moving mechanism has a moving end and is arranged on the mounting end; the moving end of the moving mechanism is connected with the base and is configured to drive the base to approach the bearing end; the pressing member is arranged on the surface of the base opposite to the moving mechanism; the cutting member is movably arranged on the base and is attached to the surface of the pressing member opposite to each other; the movable direction of the cutting member includes the direction of approaching and moving away from the base along the surface of the pressing member opposite to each other; the processing mechanism is configured to contact the pin of the target chip with the pressing member to press the pin when the base approaches the bearing end; and the cutting member moves along the surface of the pressing member to the direction of approaching the pin to cut the pin.

[0007] The chip processing device described above can press the pin on the target chip by the pressing member, and then move the cutting member along the surface of the pressing member to cut the pin on the target chip. Since the pressing member plays a role in fixing the target chip together with its pin, and the cutting member moves along the surface of the pressing member to cut the pin. Therefore, the precision of cutting off the pin of the target chip is improved.

[0008] Optionally, the base is provided with a groove; the groove has side walls; the pressing members include first pressing members, the first pressing members are attached to a group of the side walls opposite to each other; the cutting members are located outside the groove and attached to the first pressing members.

[0009] In the case of horizontally placing the chip, the height of the tube shell of the chip is usually higher than the height of the pins. That is, the tube shell of the chip is more prominent, and it is usually necessary to reserve space for accommodating the tube shell of the chip between the pressing members during the cutting process. If the accommodating space is directly formed by the opposite arrangement of the first pressing members, the fixing of the first pressing members is usually more troublesome, thereby increasing the manufacturing cost of the processing mechanism. Therefore, by providing the groove on the base and attaching the first pressing members to the side walls of the groove, the fixing of the first pressing members is simplified, the manufacturing cost of the processing mechanism is reduced, and the stability of the fixed first pressing members is improved.

[0010] Optionally, the pressing members further include second pressing members; the second pressing members are attached to the side walls of the groove which are not attached to the first pressing members.

[0011] In the above chip processing device, by providing the second pressing members on the side walls of the first pressing members, the pins on the target chip are fixed during the processing of the target chip, which further improves the stability of the target chip during the processing, thereby facilitating more accurate processing of the target chip, that is, further improving the accuracy of processing the target chip.

[0012] Optionally, the groove further has a bottom wall; the side walls attached to the first pressing members are movably connected to the bottom wall, and the movable direction of the side walls is consistent with the arrangement direction of the first pressing members; the movable direction of the cutting members further includes the arrangement direction of the first pressing members.

[0013] In the above chip processing device, the spacing between the first pressing members is adjustable, and the spacing between the cutting members is adjustable, so that the processing mechanism can be applied to more different sizes of target chips, and according to the needs of cutting the pins, by adjusting the spacing between the first pressing members and the spacing between the cutting members, the size of the pins cut off and the size of the remaining pins during the cutting of the pins of the target chip are changed. Therefore, the use convenience and application range of the chip processing device are further improved.

[0014] Optionally, the end of the first pressing member towards the bearing end is provided with a buffer pad.

[0015] The chip processing device has the advantages that the buffering pad is arranged at the end of the first pressing member, so that the rigid contact between the first pressing member and the target chip is avoided during the processing of the target chip, and the target chip is protected. In addition, the contact area between the buffering pad and the target chip is larger, so that the fixing of the target chip by the first pressing member is more stable, and the processing accuracy of the target chip is further improved.

[0016] Optionally, the base has a length direction and a width direction in the plane in which the base is located; the number of the grooves is several; and the grooves are arranged along the length direction and / or the width direction.

[0017] The chip processing device has the advantages that the grooves and the corresponding number of pressing members and cutting members are arranged on the base, so that the chip processing device can process several target chips at the same time, and the processing efficiency is improved.

[0018] Optionally, the moving mechanism comprises a first moving assembly; the first moving assembly has the moving end and is configured to drive the base to move along a first direction to approach or move away from the bearing end.

[0019] The chip processing device has the advantages that the first moving assembly drives the processing mechanism to move along the first direction, so that the processing mechanism approaches or moves away from the target chip along the first direction, that is, the processing mechanism is movable in one dimension.

[0020] Optionally, the first moving assembly comprises a linear driving member and at least three driving rods; one end of the driving rod is connected with the driving output end of the linear driving member, and the other end of the driving rod is connected with the base.

[0021] The chip processing device has the advantages that the linear driving member and the driving rod are combined to drive the movement of the processing mechanism along the first direction, so that the structure of the first moving assembly is simplified in the case that the processing mechanism is movable along the first direction. In addition, the linear driving member and the processing mechanism are connected by the at least three driving rods, based on the theory that three points can determine a plane, the inclination of the plane in which the base is located is better limited, that is, the connection stability between the base and the linear driving member is improved, and the processing accuracy of the target chip is further improved.

[0022] Optionally, the moving mechanism further comprises a second moving assembly and a third moving assembly; the second moving assembly is connected with the first moving assembly and is configured to drive the first moving assembly to move along a second direction; the third moving assembly is arranged at the mounting end and is configured to drive the second moving assembly to move along a third direction; wherein the first direction, the second direction and the third direction are not located in the same plane, and any two of them are not parallel.

[0023] The chip processing device, based on the movable first moving assembly, the second moving assembly and the third moving assembly make the processing mechanism movable in the second direction and the third direction. That is, the processing mechanism is movable in three-dimensional space, which improves the flexibility of the processing mechanism, so that the processing mechanism can be moved to any position within a certain range of space to adapt to different cutting process requirements during the processing of the target chip. Moreover, the position of the processing mechanism can be adjusted to make the processing of the target chip more accurate. That is, the use flexibility of the chip processing device and the accuracy of the processing of the target chip are improved.

[0024] Optionally, the second moving assembly comprises a second base and a second sliding rail; the second sliding rail is arranged on the surface of the second base facing the first moving assembly; the first moving assembly and the second sliding rail are slidably connected; the third moving assembly comprises a third base and a third sliding rail; the third sliding rail is arranged on the surface of the third base facing the second moving assembly; the second moving assembly and the third sliding rail are slidably connected; and the third base is arranged on the mounting end.

[0025] The chip processing device, by arranging the second sliding rail on the second base matching the first moving assembly, and arranging the third sliding rail on the third base matching the second base, makes the processing mechanism movable in the second direction and the third direction, and simplifies the structure of the second moving assembly and the third moving assembly, thereby reducing the cost of the chip processing device.

[0026] In summary, the chip processing apparatus provided in this application improves the accuracy of pin removal by clamping and fixing the pins on the target chip using a clamping member, and then cutting the pins by moving along the surface of the clamping member. By providing a groove on the base and fitting the first clamping member against the sidewall of the groove, the fixing of the first clamping member is simplified, the manufacturing cost of the processing mechanism is reduced, and the stability of the fixed first clamping member is improved. The movement of the processing mechanism in the first direction is driven by a combination of a linear drive member and a drive rod, simplifying the structure of the first moving component while achieving movement of the processing mechanism in the first direction. Furthermore, by using at least three drive rods to connect the linear drive member and the processing mechanism, the connection stability between the base and the linear drive member is improved, thereby further improving the accuracy of processing the target chip. In addition to achieving movement of the processing mechanism in the first direction through the first moving component, the second and third moving components further enable movement of the processing mechanism in the second and third directions. This improves the flexibility of the chip processing apparatus and the accuracy of processing the target chip. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the chip processing apparatus provided in an embodiment of this application;

[0029] Figure 2 This is a schematic diagram of the processing mechanism in the chip processing apparatus provided in the embodiments of this application;

[0030] Figure 3 This is a schematic diagram of the structure of the cutting component and the clamping component in the chip processing apparatus provided in the embodiments of this application;

[0031] Figure 4 This is a schematic diagram of the moving mechanism in the chip processing apparatus provided in the embodiments of this application.

[0032] Icon: 100, chip processing device; 110, main body; 111, bearing end; 112, mounting end; 120, moving mechanism; 121, first moving assembly; 1211, linear driving piece; 1212, three driving rods; 122, second moving assembly; 1221, second base piece; 1222, second sliding rail; 123, third moving assembly; 1231, third base piece; 1232, third sliding rail; 130, processing mechanism; 131, base; 132, cutting piece; 133, pressing piece; 1331, first pressing piece; 1332, second pressing piece; 134, groove; 135, buffer pad. DETAILED DESCRIPTION

[0033] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0035] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0036] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the utility model product is usually placed, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0037] In addition, the terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0038] In the description of the present application, it also needs to be explained that, unless explicitly defined and limited, the terms "set", "install", "connect", "connect" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0039] Please refer to Figures 1 to 3 , Figure 1 is a structural schematic diagram of a chip processing device 100 provided by an embodiment of the present application; Figure 2 is a structural schematic diagram of a processing mechanism 130 in the chip processing device 100 provided by an embodiment of the present application; Figure 3 is a structural schematic diagram of a cutting piece 132 and a pressing piece 133 in the chip processing device 100 provided by an embodiment of the present application. The chip processing device 100 provided by the embodiment of the present application can include a main body 110, a moving mechanism 120 and a processing mechanism 130. The main body 110 can include a bearing end 111 which can be used to bear a target chip to be processed and a mounting end 112. The processing mechanism 130 can include a base 131, a cutting piece 132 and a pressing piece 133. The moving mechanism 120 can have a moving end and can be arranged on the mounting end 112. The moving end of the moving mechanism 120 can be connected with the base 131 and can be configured to drive the base 131 to approach the bearing end 111. The pressing piece 133 can be arranged on the surface of the base 131 opposite to the moving mechanism 120, and the cutting piece 132 can be arranged on the base 131 and can be movable in a direction away from the surface of the pressing piece 133 opposite to each other. The movable direction of the cutting piece 132 can include a direction approaching or away from the base 131 along the surface of the pressing piece 133 opposite to each other. The processing mechanism 130 can be configured to contact the pins of the target chip with the pressing piece 133 to press the pins when the base 131 approaches the bearing end 111. The cutting piece 132 can be moved along the surface of the pressing piece 133 to the direction approaching the pins to cut the pins.

[0040] The moving mechanism 120 can be a connecting mechanism known to those skilled in the art, which can realize the movability of the processing mechanism 130 in at least one direction. As an optional embodiment, the moving mechanism 120 can further be configured with a corresponding driving piece to drive the processing mechanism 130 to move in the at least one direction.

[0041] The base 131 can be a substrate. One side of the substrate facing the mounting end 112 can be connected to the moving mechanism 120. The other side of the substrate facing away from the mounting end 112 can be provided with the cutting member 132 and the pressing member 133. The cutting member 132 can be a cutter. The pressing member 133 can be a presser.

[0042] The plane in which the pressing member 133 is located can be perpendicular to the surface of the base 131. The plane in which the cutting member 132 is located can be parallel to the plane in which the pressing member 133 is located. During the processing of the target chip by the processing mechanism 130, the distance from the end of the cutting member 132 (the end of the cutting member 132 away from the base 131) to the base 131 can be greater than the distance from the end of the pressing member 133 (the end of the pressing member 133 away from the base 131) to the base 131. In other states, the distance from the end of the cutting member 132 to the base 131 can be less than the distance from the end of the pressing member 133 to the base 131. The base 131 can be provided with a linear drive 1211 such as a pneumatic cylinder to drive the cutting member 132 to move along the surface of the pressing member 133.

[0043] During the processing of the target chip, the moving mechanism 120 can drive the processing mechanism 130 to move towards the target chip until the pressing member 133 contacts and presses the pins of the target chip. At this time, the cutting member 132 can move along the surface of the pressing member 133 towards the pins of the target chip and cut the to-be-cut part on the target chip.

[0044] In the above implementation process, the pressing member 133 presses the pins on the target chip, and then the cutting member 132 moves along the surface of the pressing member 133 and cuts the pins on the target chip. Since the pressing member 133 fixes the target chip and its pins, and the cutting member 132 moves along the surface of the pressing member 133 to cut the pins. Therefore, the precision of cutting the pins of the target chip is improved.

[0045] Please continue to refer to Figure 2 In some optional embodiments, the base 131 can be provided with a groove 134. The groove 134 can have side walls. The pressing member 133 can include a first pressing member 1331 abutting a set of side walls opposite to each other. The cutting member 132 can be located outside the groove 134 and abut the first pressing member 1331.

[0046] The shape of the groove 134 can be a cuboid. The first pressing member 1331 can be respectively arranged on two opposite faces of the cuboid.

[0047] In the implementation process, the height of the shell of the chip is usually higher than the height of the pin when the chip is placed horizontally. That is, the shell of the chip is relatively prominent, and a space for accommodating the shell of the chip usually needs to be reserved between the pressing members 133 during the cutting process. If the accommodating space is directly formed by the relative arrangement of the first pressing members 1331, the fixing of the first pressing members 1331 is usually more troublesome, thereby increasing the manufacturing cost of the processing mechanism 130. Therefore, by arranging the recess 134 on the base 131 and arranging the first pressing members 1331 on the side wall of the recess 134, the fixing of the first pressing members 1331 is simplified, the manufacturing cost of the processing mechanism 130 is reduced, and the stability of the fixed first pressing members 1331 is improved.

[0048] Please continue to refer to Figure 2 and Figure 3 In some optional embodiments, the pressing members 133 can further include second pressing members 1332. The second pressing members 1332 can be arranged in the recess 134 and not arranged on the side wall in contact with the first pressing members 1331.

[0049] Taking the shape of the recess 134 as a cuboid as an example, the first pressing members 1331 are arranged on one set of opposite side walls, and the second pressing members 1332 are arranged on the other set of opposite side walls.

[0050] In the implementation process, the second pressing members 1332 are arranged on the side wall of the recess 134 where the first pressing members 1331 are arranged, to fix the pins on the target chip during the processing of the target chip, thereby further improving the stability of the placement of the target chip during the processing, which is conducive to more accurate processing of the target chip, that is, further improving the accuracy of processing of the target chip.

[0051] Please continue to refer to Figure 2 In some optional embodiments, the recess 134 can further have a bottom wall. The side wall in contact with the first pressing members 1331 can be movably connected with the bottom wall, and the movable direction of the side wall can be consistent with the arrangement direction of the first pressing members 1331. The movable direction of the cutting member 132 can further include the arrangement direction of the first pressing members 1331.

[0052] That is, the distance between the opposite side walls in contact with the first pressing members 1331 is adjustable. Accordingly, the distance between the first pressing members 1331 is adjustable, and the distance between the cutting members 132 arranged on the first pressing members 1331 is also adjustable.

[0053] In the above implementation process, the spacing between the first pressing members 1331 and the spacing between the cutting members 132 can be adjusted, so that the processing mechanism 130 can be suitable for more different sizes of target chips, and according to the needs of pin cutting, by adjusting the spacing between the first pressing members 1331 and the spacing between the cutting members 132, the size of the pins cut off and the size of the retained pins during the cutting process of the pins of the target chip can be changed. Thus, the use convenience and application range of the chip processing device 100 are further improved.

[0054] Please continue to refer to Figure 3 In some optional embodiments, the end of the first pressing member 1331 towards the bearing end 111 can be provided with a buffer pad 135.

[0055] The buffer pad 135 can be a silica gel pad or other elastic plastic pad.

[0056] In the above implementation process, by providing the buffer pad 135 at the end of the first pressing member 1331, the rigid contact between the first pressing member 1331 and the target chip during the processing of the target chip is alleviated, thereby playing a role in protecting the target chip. Moreover, the contact area between the buffer pad 135 and the target chip will be larger, so that the fixation of the target chip by the first pressing member 1331 is more stable, and accordingly the processing accuracy of the target chip is further improved.

[0057] Please continue to refer to Figure 2 In some optional embodiments, the base 131 can have a length direction and a width direction in the plane in which it is located. The number of grooves 134 can be several. The grooves 134 are arranged along the length direction and / or the width direction.

[0058] That is, the base 131 is provided with several grooves 134, and correspondingly several sets of pressing members 133 and cutting members 132. The target chips can be placed on the tray and sent into the chip processing device 100 for processing. When the target chips are placed on the tray in a manner corresponding to the arrangement of the grooves 134 on the base 131, simultaneous processing of several target chips can be achieved.

[0059] The grooves 134 can be arranged in a matrix on the base 131.

[0060] In the above implementation process, by providing several grooves 134 on the base 131 and a corresponding number of pressing members 133 and cutting members 132, the chip processing device 100 can simultaneously process several target chips, thereby improving the processing efficiency.

[0061] Please refer to Figure 4 ,Figure 4 is a structural schematic diagram of a moving mechanism 120 in a chip processing device 100 provided by embodiments of the present application. In some alternative embodiments, the moving mechanism 120 can include a first moving assembly 121. The first moving assembly 121 can have a moving end and can be configured to drive a base 131 to move in a first direction to approach or move away from the bearing end 111.

[0062] The first direction can be a vertical direction of the chip processing device 100 in a case where the chip processing device 100 is placed at a target position for use.

[0063] The way in which the first moving assembly 121 drives the processing mechanism 130 to move can be automatic or manual. Exemplarily, the first moving assembly 121 can include an extendable rod connected with the processing mechanism 130. The extendable direction of the extendable rod can be consistent with the first direction.

[0064] In the above implementation process, the first moving assembly 121 drives the processing mechanism 130 to move in the first direction, so as to realize the processing mechanism 130 to approach or move away from the target chip in the first direction. That is, the processing mechanism 130 is movable in one dimension.

[0065] Please continue to refer to Figure 4 In some alternative embodiments, the first moving assembly 121 can include a linear drive 1211 and at least three drive rods 1212. One end of the drive rod 1212 can be connected with the driving output end of the linear drive 1211, and the other end of the drive rod can be connected with the base 131.

[0066] The linear drive 1211 can be a cylinder, or a combination of a motor and a screw nut. The drive rods can be used to connect the driving output end of the linear drive 1211 and the base 131, and the specific number can be four. In a case where the base 131 is in the shape of a cuboid, the drive rods can be connected with the base 131 at the four vertices corresponding to the rectangle.

[0067] In the above implementation process, the linear drive 1211 and the drive rods are combined to drive the movement of the processing mechanism 130 in the first direction, so that the structure of the first moving assembly 121 is simplified in the case of realizing the movement of the processing mechanism 130 in the first direction. In addition, by using at least three drive rods 1212 to connect the linear drive 1211 and the processing mechanism 130, based on the theory that three points can determine a plane, the inclination of the plane in which the base 131 is located is better limited, that is, the connection stability between the base 131 and the linear drive 1211 is improved, and the processing precision of the target chip is further improved accordingly.

[0068] Please continue to refer toFigure 4 In some optional embodiments, the moving mechanism 120 can further include a second moving assembly and a third moving assembly. The second moving assembly can be connected with the first moving assembly 121 and configured to drive the first moving assembly 121 to move in a second direction. The third moving assembly can be arranged on the mounting end 112 and configured to drive the second moving assembly to move in a third direction. The first direction, the second direction and the third direction can not be in the same plane, and any two of them are not parallel.

[0069] The second moving assembly can be slidably connected with the first moving assembly 121, and the sliding direction is the second direction. One end of the third moving assembly can be hard connected with the mounting end 112, and the other end of the third moving assembly can be slidably connected with the second moving assembly, and the sliding direction is the third direction.

[0070] The second direction and the third direction can be perpendicular to the first direction respectively, and the second direction can be perpendicular to the third direction.

[0071] In the above implementation process, on the basis of realizing the movement of the processing mechanism 130 in the first direction through the first moving assembly 121, the movement of the processing mechanism 130 in the second direction and the third direction is further realized through the second moving assembly and the third moving assembly. That is, the movement of the processing mechanism 130 in three-dimensional space is realized, thereby improving the flexibility of the processing mechanism, so that in the process of processing the target chip, the processing mechanism 130 can be moved to any position within a certain space range to adapt to different cutting process requirements. And the position of the processing mechanism can be adjusted to make the processing of the target chip more accurate. That is, the use flexibility of the chip processing device 100 and the accuracy of processing the target chip are improved.

[0072] Please continue to refer to Figure 4 In some optional embodiments, the second moving assembly can include a second base 1221 and a second sliding rail 1222. The second sliding rail 1222 can be arranged on the surface of the second base 1221 facing the first moving assembly 121. The first moving assembly 121 can be slidably connected with the second sliding rail 1222. The third moving assembly can include a third base 1231 and a third sliding rail 1232. The third sliding rail 1232 can be arranged on the surface of the third base 1231 facing the second moving assembly. The second moving assembly and the third sliding rail 1232 are slidably connected. The third base 1231 can be arranged on the mounting end 112.

[0073] The second base member 1221 can be in a long strip shape, and the surface thereof facing the first moving assembly 121 can be provided with at least two second sliding rails 1222. The linear driving member 1211 in the first moving assembly 121 is slidably connected with the second base member 1221 through the second sliding rails 1222.

[0074] The third base member 1231 can be in a long strip shape, and the surface thereof facing the second base member 1221 can be provided with at least two third sliding rails 1232, and the surface of the second base member 1221 facing the third base member 1231 is slidably connected with the third base member 1231 through the third sliding rails 1232. The surface of the third base member 1231 facing the mounting end 112 can be hard connected with the mounting end 112, for example, through bolt connection, welding, clamping, etc.

[0075] To realize the automatic movement of the processing mechanism 130 in the second direction and the third direction, a roller driven by a motor can be arranged on the surface of the linear driving member 1211 facing the second base member 1221, and the roller is adapted to the second sliding rail 1222. Correspondingly, a roller driven by a motor can also be arranged on the surface of the second base member 1221 facing the third base member 1231, and the roller is adapted to the third sliding rail 1232.

[0076] In the above implementation process, by arranging the second sliding rail 1222 adapted to the first moving assembly 121 on the second base member 1221, and arranging the third sliding rail 1232 adapted to the second base member 1221 on the third base member 1231, the movable basis of the processing mechanism 130 in the second direction and the third direction is realized, and the structure of the second moving assembly and the third moving assembly is simplified, thereby reducing the cost of the chip processing device 100.

[0077] In summary, the chip processing device 100 provided by various embodiments of the present application has the following advantages. The pin on the target chip is fixed by the pressing member 133, and then the cutting member 132 moves along the surface of the pressing member 133 to cut the pin, thereby improving the precision of cutting the pin of the target chip. The recess 134 is arranged on the base 131, and the first pressing member 1331 is arranged on the side wall of the recess 134, thereby simplifying the fixation of the first pressing member 1331, reducing the manufacturing cost of the processing mechanism 130, and improving the stability of the fixed first pressing member 1331. The linear driving member 1211 and the driving rod are combined to drive the movement of the processing mechanism 130 in the first direction, so that the structure of the first moving assembly 121 is simplified while the processing mechanism 130 is movable in the first direction. In addition, the linear driving member 1211 and the processing mechanism 130 are connected by at least three driving rods 1212, thereby improving the connection stability between the base 131 and the linear driving member 1211, and further improving the precision of processing the target chip. On the basis of the movable processing mechanism 130 in the first direction by the first moving assembly 121, the movable processing mechanism 130 in the second direction and the third direction is realized by the second moving assembly and the third moving assembly. The use flexibility of the chip processing device 100 and the precision of processing the target chip are improved.

[0078] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Various modifications and changes can be made by those skilled in the art based on the spirit and principles of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A chip processing apparatus, characterized by comprising: The device comprises a main body, a moving mechanism and a processing mechanism; The main body comprises a bearing end for bearing a target chip to be processed and a mounting end; The processing mechanism comprises a base, a cutting piece and a pressing piece; The moving mechanism has a moving end and is arranged on the mounting end; The moving end of the moving mechanism is connected with the base and is configured to drive the base to approach the bearing end; The pressing piece is oppositely arranged on the surface of the base away from the moving mechanism, and the cutting piece is movably arranged on the base and is attached to the surfaces of the pressing piece away from each other, and the movable direction of the cutting piece comprises the direction of approaching and moving away from the base along the surfaces of the pressing piece away from each other; The processing mechanism is configured to, when the base approaches the bearing end, contact the leads of the target chip with the pressing piece to press the leads, and move the cutting piece along the surface of the pressing piece to the direction of approaching the leads to cut the leads.

2. The chip processing apparatus according to claim 1, wherein The base is provided with a groove; The groove has a side wall; The pressing piece comprises a first pressing piece attached to a group of side walls opposite to each other; The cutting piece is located outside the groove and is attached to the first pressing piece.

3. The chip processing apparatus according to claim 2, wherein The pressing piece further comprises a second pressing piece; The second pressing piece is attached to the side walls of the groove which are not attached to the first pressing piece.

4. The chip processing apparatus according to claim 2, wherein The groove further has a bottom wall; The side walls attached to the first pressing piece are movably connected with the bottom wall, and the movable direction of the side walls is consistent with the arrangement direction of the first pressing piece; The movable direction of the cutting piece further comprises the arrangement direction of the first pressing piece.

5. The chip processing apparatus according to claim 2, wherein The end of the first pressing piece towards the bearing end is provided with a buffer pad.

6. The chip processing apparatus according to claim 2, wherein The base has a length direction and a width direction in the plane where it is located; The number of the grooves is several; The grooves are arranged along the length direction and / or the width direction.

7. The chip processing apparatus according to any one of claims 1 to 6, wherein The moving mechanism comprises a first moving assembly; The first moving assembly has the moving end and is configured to drive the base to move along a first direction to approach or move away from the bearing end.

8. The chip processing apparatus according to claim 7, wherein The first moving assembly comprises a linear drive and at least three drive rods; One end of the drive rod is connected with the drive output end of the linear drive, and the other end of the drive rod is connected with the base.

9. The chip processing apparatus according to claim 7, wherein The moving mechanism further comprises a second moving assembly and a third moving assembly; The second moving assembly is connected with the first moving assembly and is configured to drive the first moving assembly to move along a second direction; The third moving assembly is arranged on the mounting end and is configured to drive the second moving assembly to move along a third direction; The first direction, the second direction and the third direction are not located in the same plane, and any two of them are not parallel.

10. The chip processing apparatus according to claim 9, wherein The second moving assembly comprises a second base and a second sliding rail; The second sliding rail is arranged on the surface of the second base towards the first moving assembly; The first moving assembly and the second sliding rail are slidably connected; The third moving assembly comprises a third base and a third sliding rail; The third sliding rail is arranged on the surface of the third base towards the second moving assembly; The second moving assembly is slidably connected with the third slide rail. The third base member is arranged at the mounting end.

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