Cleaning device for semiconductor parts
By incorporating spraying components and a turning mechanism into the semiconductor component cleaning device, the problems of cleaning dead corners and cleaning fluid residue are solved, achieving all-round cleaning and automatic cleaning fluid removal, thus improving cleaning effect and efficiency.
Patent Information
- Application Number
- CN202520466963.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-03-17
AI Technical Summary
Existing semiconductor component cleaning equipment has dead zones during the cleaning process, resulting in incomplete cleaning and difficulty in removing cleaning fluid residue, which affects the cleaning effect.
The design incorporates a cleaning mechanism and a turning mechanism. Initial cleaning is achieved by spraying water through a spray nozzle. After ultrasonic cleaning, the turning and stirring rods turn the parts to ensure full contact between the parts and the cleaning solution, avoiding dead corners. The cleaning solution is then automatically removed.
It enables comprehensive cleaning of semiconductor components, ensuring thorough cleaning and complete removal of cleaning solution, thus improving cleaning effectiveness and efficiency.
Smart Images
Figure CN223960210U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor cleaning technology, specifically a cleaning device for semiconductor components. Background Technology
[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductors have wide applications in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. Semiconductors are materials whose conductivity can be controlled, ranging from that of insulators to conductors. Semiconductor components often have high requirements for cleanliness, surface uniformity, and process stability. Tiny impurities and dust, as well as uneven particle sizes, can affect the performance of semiconductors. Therefore, semiconductors need to be cleaned frequently. The most common method is to place the components in a cleaning solution and then perform ultrasonic cleaning.
[0003] During the cleaning process, the aforementioned cleaning device may have dead zones in contact between the accumulated parts and the cleaning fluid, resulting in incomplete cleaning. This requires staff to manually turn the parts over, which is time-consuming and labor-intensive. Furthermore, it cannot automatically clean the cleaning fluid off the surface of the parts after cleaning, thus reducing the cleaning effect.
[0004] Therefore, those skilled in the art have provided a cleaning apparatus for semiconductor components to solve the problems mentioned in the background art. Utility Model Content
[0005] To overcome the aforementioned deficiencies of the prior art, embodiments of this utility model provide a cleaning device for semiconductor components. By setting a cleaning mechanism, preliminary cleaning of surface impurities can be achieved before ultrasonic cleaning. After ultrasonic cleaning, the cleaning fluid on the surface can be cleaned to ensure a good cleaning effect on the components. Furthermore, by setting a flipping mechanism, the components inside the placement frame can be flipped so that the components can fully contact the cleaning fluid and avoid dead corners, further ensuring the cleaning effect of the device and solving the problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A cleaning device for semiconductor components includes a main body, a placement frame slidably connected inside the main body, a cleaning mechanism on the main body, and a rotating tube rotatably connected to the main body. A spraying element is connected to the rotating tube, and connecting posts are fixedly connected to both ends of the rotating tube. A first gear is fixedly connected to each connecting post. A limiting groove is formed on the main body, and the first gear is located inside the limiting groove. A limiting strip is fixedly connected to the outer wall of the placement frame, the limiting strip being adapted to the limiting groove, and the limiting strip having a toothed groove adapted to the first gear.
[0008] As a further embodiment of this utility model, a movable plate is fixedly connected to the outer wall of the rotating tube, and the movable plate is connected to the main body of the cleaning device through a spring column.
[0009] As a further embodiment of this utility model, the placement frame is provided with a flipping mechanism, the flipping mechanism including a second reciprocating screw rotatably connected to the placement frame, a second gear fixedly connected to one end of the second reciprocating screw located outside the placement frame, the second reciprocating screw being drivenly connected to a moving bar through a threaded sleeve, and a stirring rod fixedly connected to the lower end of the moving bar.
[0010] As a further embodiment of this utility model, a vertical groove is provided on the inner wall of the main body of the cleaning device, and a tooth groove that meshes with the second gear is provided on the vertical groove.
[0011] As a further embodiment of this utility model, the placement frame is provided with a first notch and a second notch, and a filter screen is provided on both the first notch and the second notch.
[0012] As a further embodiment of this utility model, a U-shaped rod is fixedly connected to the main body of the cleaning device, a drive motor is provided on the U-shaped rod, a first reciprocating screw is rotatably connected to the U-shaped rod, the output shaft of the drive motor is connected to the first reciprocating screw, a sleeve is fixedly connected inside the placement frame, and the sleeve and the first reciprocating screw are connected by a threaded sleeve transmission.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] By setting up a cleaning mechanism, preliminary cleaning of surface impurities can be achieved before ultrasonic cleaning. After ultrasonic cleaning, the cleaning fluid on the surface can be cleaned to ensure a good cleaning effect on the parts. Secondly, by setting up a flipping mechanism, the parts inside the placement frame can be flipped so that the parts can fully contact the cleaning fluid and avoid dead corners, further ensuring the cleaning effect of the device. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of a cleaning device for semiconductor components;
[0016] Figure 2 for Figure 1 A schematic diagram of the internal structure of the main body of the cleaning device;
[0017] Figure 3 for Figure 1 A schematic diagram of the three-dimensional structure at the placement frame;
[0018] Figure 4 for Figure 2 A magnified structural diagram at point A;
[0019] Figure 5 for Figure 4 A three-dimensional structural diagram of the rotating tube.
[0020] In the diagram: 1. Main body of the cleaning device; 2. U-shaped rod; 3. Drive motor; 4. First reciprocating screw; 5. Sleeve column; 6. Placement frame; 7. First notch; 8. Second notch; 9. Limiting strip; 10. Limiting groove; 11. Rotating tube; 12. Connecting column; 13. First gear; 14. Spraying component; 15. Moving plate; 16. Spring column; 17. Vertical groove; 18. Second gear; 19. Second reciprocating screw; 20. Moving strip; 21. Stirring rod. Detailed Implementation
[0021] Please see Figures 1-5In this embodiment of the present invention, a cleaning device for semiconductor components includes a cleaning device body 1. The interior of the cleaning device body 1 is used to hold a cleaning liquid. An ultrasonic generator (an existing technology, not shown in the figure, whose working principle is that the ultrasonic generator generates high-frequency vibrations, which are converted into mechanical vibrations by a transducer and propagated into the cleaning liquid, causing the liquid to generate a large number of microbubbles. These bubbles vibrate continuously under the action of the sound field, and when the sound pressure reaches a certain value, they rapidly expand and close, generating powerful shock waves and microjets, thereby peeling off the dirt layer on the surface of the object and achieving the cleaning purpose) is provided. A U-shaped rod 2 is fixedly connected to the upper end of the cleaning device body 1. A drive motor 3 is provided on the U-shaped rod 2, and a rotating connection is provided on the U-shaped rod 2. A first reciprocating lead screw 4 is connected to the output shaft of a drive motor 3. When the drive motor 3 is working, it will drive the first reciprocating lead screw 4 to rotate. A placement frame 6 is slidably connected inside the main body 1 of the cleaning device. The interior of the placement frame 6 is used to place semiconductor components. A sleeve 5 is fixedly connected inside the placement frame 6. The first reciprocating lead screw 4 and the sleeve 5 are connected by a threaded sleeve. When the first reciprocating lead screw 4 rotates, the placement frame 6 can be moved up and down through the sleeve 5. The placement frame 6 has a first notch 7 and a second notch 8. Both the first notch 7 and the second notch 8 are equipped with a filter screen (the filter screen is existing technology and is not shown in the figure). The filter screen ensures that the cleaning fluid can enter the interior of the placement frame 6 and contact the components, while also preventing the components from falling out of the placement frame 6.
[0022] A rotating tube 11 is rotatably connected to the inner wall of the main body 1 of the cleaning device. A spraying element 14 is fixedly connected to the rotating tube 11. The spraying element 14 can spray water to clean the parts and wash away the residual cleaning liquid on the surface. A connecting column 12 is fixedly connected to both ends of the rotating tube 11. A first gear 13 is fixedly connected to the connecting column 12. A limiting groove 10 is opened on the inner wall of the main body 1 of the cleaning device. The first gear 13 is located inside the limiting groove 10. A limiting strip 9 that is adapted to the limiting groove 10 is fixedly connected to the placement frame 6. The limiting strip 9 has a toothed groove that meshes with the first gear 13. When the placement frame 6 moves the limiting strip 9 inside the limiting groove 10, the toothed groove will drive the first gear 13 to rotate. When the first gear 13 rotates, it will drive the rotating tube 11 and the spraying element 14 to rotate through the connecting column 12. When the spraying element 14 rotates, the parts can be thoroughly cleaned.
[0023] A movable plate 15 is fixedly connected to the outer wall of the rotating tube 11. The movable plate 15 is connected to the placement frame 6 through a spring column 16. When the rotating tube 11 moves and rotates, it will drive the movable plate 15 to rotate and squeeze the spring column 16. The toothed groove on the limiting strip 9 is designed in multiple segments, which can push the rotating tube 11 to rotate at intervals. When the toothed groove is no longer in contact with the first gear 13, under the action of the spring column 16, the rotating tube 11 and the spraying part 14 return to their original positions until the next toothed groove contacts the first gear 13, thereby realizing the back-and-forth rotation of the spraying part 14. The working principle when pulling the spring column 16 is the same as when squeezing.
[0024] A second reciprocating screw 19 is rotatably connected to the placement frame 6. A second gear 18 is fixedly connected to one end of the second reciprocating screw 19 located outside the placement frame 6. A vertical groove 17 is provided on the main body 1 of the cleaning device. A toothed groove that meshes with the second gear 18 is provided inside the vertical groove 17. When the placement frame 6 drives the second gear 18 to move inside the vertical groove 17, the toothed groove will push the second gear 18 to rotate, thereby driving the second reciprocating screw 19 to rotate. The second reciprocating screw 19 is connected to the moving bar 20 through a threaded sleeve. When the second reciprocating screw 19 rotates, it will drive the moving bar 20 to move back and forth inside the placement frame 6. A stirring rod 21 is fixedly connected to the lower end of the moving bar 20. The stirring rod 21 can flip the parts of the placement frame 6.
[0025] The working principle of this utility model is as follows: When it is necessary to clean semiconductor components, firstly, an appropriate amount of cleaning fluid is poured into the interior of the main body 1 of the cleaning device. At this time, the placement frame 6 is at the top. Then, the components to be cleaned are placed inside the placement frame 6. Then, the drive motor 3 starts to work, thereby driving the first reciprocating lead screw 4 to rotate. Under the action of the sleeve column 5, the placement frame 6 is driven to move downward. When the placement frame 6 moves downward, the synchronous spraying component 14 sprays water. When the placement frame 6 moves, it will drive the limiting strip 9 to move. When the limiting strip 9 moves to contact the first gear 13, it will push the first gear 13 to rotate. Thus, the spraying component 14 is rotated through the connecting column 12 and the rotating tube 11. When the rotating tube 11 rotates, it will squeeze the spring column 16 through the moving plate 15, so that it can spray water onto the components inside the placement frame 6, achieving preliminary cleaning of their surfaces. During the cleaning process, after a section of the toothed groove on the limiting strip 9 separates from the first gear 13, the spraying component 14 returns to its original angle under the action of the spring column 16 until the next section of the toothed groove on the limiting strip 9 contacts the first gear 13 again, thereby realizing the back-and-forth swing of the spraying component 14 and improving the cleaning effect. When the placement frame 6 moves into the cleaning liquid, the second gear 18 rotates under the action of the toothed groove inside the vertical groove 17, thereby driving the second reciprocating screw 19 to rotate. When the second reciprocating screw 19 rotates, it will drive the stirring rod 21 through the moving strip 20 to turn the parts over, so that they can fully contact the cleaning liquid and avoid cleaning dead corners. Finally, ultrasonic cleaning is performed. After cleaning, the drive motor 3 will drive the placement frame 6 to move upward. During the upward movement, the stirring rod 21 will also turn over, and the spraying component 14 will also spray and clean, realizing the cleaning of the cleaning liquid on the surface of the parts.
[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A cleaning apparatus for semiconductor components, comprising a cleaning apparatus body (1), wherein a placement frame (6) is slidably connected inside the cleaning apparatus body (1), characterized in that: The main body (1) of the cleaning device is provided with a cleaning mechanism, which includes a rotating tube (11) rotatably connected to the main body (1) of the cleaning device. A spraying component (14) is connected to the rotating tube (11). Both ends of the rotating tube (11) are fixedly connected to a connecting column (12). A first gear (13) is fixedly connected to the connecting column (12). A limiting groove (10) is opened on the main body (1) of the cleaning device. The first gear (13) is located inside the limiting groove (10). A limiting strip (9) is fixedly connected to the outer wall of the placement frame (6). The limiting strip (9) is adapted to the limiting groove (10). A tooth groove adapted to the first gear (13) is opened on the limiting strip (9).
2. The semiconductor component cleaning apparatus according to claim 1, characterized in that, A movable plate (15) is fixedly connected to the outer wall of the rotating tube (11), and the movable plate (15) is connected to the main body (1) of the cleaning device through a spring column (16).
3. The cleaning apparatus for semiconductor components according to claim 2, characterized in that, The placement frame (6) is provided with a flipping mechanism, which includes a second reciprocating screw (19) rotatably connected to the placement frame (6). A second gear (18) is fixedly connected to one end of the second reciprocating screw (19) located outside the placement frame (6). The second reciprocating screw (19) is connected to a moving bar (20) via a threaded sleeve. A stirring rod (21) is fixedly connected to the lower end of the moving bar (20).
4. The semiconductor component cleaning apparatus according to claim 3, characterized in that, The inner wall of the main body (1) of the cleaning device is provided with a vertical groove (17), and the vertical groove (17) is provided with a tooth groove that meshes with the second gear (18).
5. The cleaning apparatus for semiconductor components according to claim 3, characterized in that, The placement frame (6) has a first notch (7) and a second notch (8), and both the first notch (7) and the second notch (8) are provided with filters.
6. The cleaning apparatus for semiconductor components according to claim 1, characterized in that, A U-shaped rod (2) is fixedly connected to the main body (1) of the cleaning device. A drive motor (3) is installed on the U-shaped rod (2). A first reciprocating screw (4) is rotatably connected to the U-shaped rod (2). The output shaft of the drive motor (3) is connected to the first reciprocating screw (4). A sleeve (5) is fixedly connected inside the placement frame (6). The sleeve (5) and the first reciprocating screw (4) are connected by a threaded sleeve transmission.