Heat dissipation device for high-precision mold machining

Abstract

The utility model relates to the technical field of die machining, and discloses a high-precision heat dissipation device for die machining, which comprises a machining bin, an air cylinder is fixedly arranged on the top surface of the machining bin, an output shaft of the air cylinder penetrates through the machining bin and extends into the machining bin, and an upper die is fixedly arranged on the bottom surface of the output shaft of the air cylinder. A lower mold is fixedly arranged on the inner wall of the machining bin, and a cooling mechanism is arranged above the upper mold. A cleaning brush in a cleaning frame is used for cleaning the surface of the upper mold, the cleanliness of the upper mold is ensured, follow-up machining is facilitated, a water pump enables cooling liquid in a cooling pipe to flow, the cooling liquid in the cooling pipe firstly enters a condenser from a water inlet pipe, the condenser cools the cooling liquid, and then the cooling liquid returns to the cooling pipe from a water outlet pipe. And circulation of the cooling liquid is completed, the temperature in the cooling bin is reduced through the cooled cooling liquid, then the upper mold in the cooling bin is cooled, and the service life of the upper mold is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of mold processing technology, specifically a heat dissipation device for high-precision mold processing. Background Technology

[0002] A mold is a tool used to make shaped objects. This tool is composed of various parts, and different molds are composed of different parts. It mainly achieves the processing of the shape of the object by changing the physical state of the material being molded. It is known as the "mother of industry". A mold has a specific contour or internal cavity shape. By using the contour shape with a cutting edge, the blank can be separated according to the contour shape (punching). By using the internal cavity shape, the blank can obtain the corresponding three-dimensional shape. A mold generally includes two parts: a moving mold and a fixed mold (or a punch and a die). The two can be separated and joined together. When separated, the part is taken out. When joined together, the blank is injected into the mold cavity to form the shape.

[0003] After a mold completes its processing task, its surface temperature will rise significantly. If the mold is in operation for a long time and is continuously affected by high temperatures, it will inevitably have a negative impact on its service life. Specifically, high temperatures can cause problems such as thermal expansion, increased thermal stress, and thermal fatigue in the mold material, which can lead to mold deformation, accelerated wear, and even cracking. These failures will not only reduce the processing accuracy and product quality of the mold, but also significantly increase the mold's maintenance costs and production downtime.

[0004] Therefore, a heat dissipation device for high-precision mold processing is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation device for high-precision mold processing, which solves the technical problem of the surface temperature of mold materials rising after processing, reducing the service life of the mold, and achieves the purpose of cooling the mold and extending its service life.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation device for high-precision mold processing, comprising a processing chamber, a cylinder fixedly mounted on the top surface of the processing chamber, an output shaft of the cylinder extending through the processing chamber into the interior of the processing chamber, an upper mold fixedly mounted on the bottom surface of the cylinder output shaft, a lower mold fixedly mounted on the inner wall of the processing chamber, a cooling mechanism mounted above the upper mold, and a heat dissipation mechanism mounted below the processing chamber;

[0007] The cooling mechanism includes a connecting part and a cooling part;

[0008] The heat dissipation mechanism includes a heat dissipation section and a collection section.

[0009] Preferably, the connecting part includes a cooling chamber, the top surface of which is fixedly connected to the processing chamber, a placement slot is provided inside the cooling chamber, and a cooling chamber is fixedly installed inside the cooling chamber.

[0010] Preferably, a cooling pipe is fixedly sleeved on the outer side of the cooling chamber, the cooling pipe is located inside the placement groove, a cleaning frame is fixedly installed on the bottom surface of the cooling chamber, a cleaning brush is fixedly installed inside the cleaning frame, the internal shape of the cooling chamber and the internal shape of the cleaning frame are consistent with the shape of the upper mold, and the cleaning brush inside the cleaning frame cleans the surface of the upper mold to ensure the cleanliness of the upper mold and facilitate subsequent processing.

[0011] Preferably, the cooling unit includes a condenser, the side of which is fixedly connected to the processing chamber, and a water inlet pipe is fixedly installed on the top surface of the condenser. The upper end of the water inlet pipe passes through the cooling chamber and is fixedly connected to the cooling pipe.

[0012] Preferably, a water pump is fixedly installed on the bottom surface of the condenser, the water pump is connected to the inlet pipe, and an outlet pipe is fixedly installed on the bottom surface of the water pump. The lower end of the outlet pipe passes through the cooling chamber and is fixedly connected to the cooling pipe.

[0013] Preferably, the heat dissipation part includes a fixing plate, two fixing plates are arranged on the left and right sides, the fixing plates are fixedly connected to the inside of the processing chamber, and a mounting frame is arranged between the two fixing plates. A cooling fan is fixedly installed inside the mounting frame. The cooling fan dissipates heat to the surface of the upper or lower mold facing it, effectively reducing the mold temperature.

[0014] Preferably, a fixing block is hinged to the outer side of the mounting bracket, and two fixing blocks are arranged at the front and rear. The other end of the fixing block is fixedly connected to the adjacent fixing plate. A fixing seat is fixedly arranged on the side of the fixing plate. An electric telescopic rod is hinged to the front and rear of the fixing seat. The telescopic end of the electric telescopic rod is hinged to the adjacent mounting bracket. When the electric telescopic rod extends or retracts, it drives the mounting bracket to deflect, thereby adjusting the orientation of the cooling fan.

[0015] Preferably, the collection unit includes a suction fan, with two suction fans arranged on the left and right sides. The lower end of the suction fan passes through the processing chamber and is fixedly connected to the processing chamber. A collection chamber is arranged below the suction fan and is fixedly connected to the processing chamber. The suction fan draws the dust and hot air cleaned by the cleaning rack into the collection chamber, thus preventing the spread of dust and hot air.

[0016] Compared with the prior art, the beneficial effects of this utility model are: a heat dissipation device for high-precision mold processing,

[0017] 1) The cleaning brush inside the cleaning rack cleans the surface of the upper mold to ensure its cleanliness and facilitate subsequent processing. The water pump circulates the coolant inside the cooling pipe. The coolant first enters the condenser through the inlet pipe, where it is cooled. Then, the coolant returns to the cooling pipe through the outlet pipe, completing the coolant circulation. The cooled coolant lowers the temperature inside the cooling chamber, thereby cooling the upper mold inside the cooling chamber and extending its service life.

[0018] 2) The cooling fan dissipates heat from the surface of the upper or lower mold facing the direction it is facing, effectively reducing the mold temperature and preventing the mold from deforming or being damaged due to overheating. When the electric telescopic rod extends or retracts, it drives the mounting bracket to deflect, thereby adjusting the direction of the cooling fan. This allows the cooling fan to dissipate heat from different parts of the mold as needed, improving the targeted nature of the heat dissipation. The suction fan sucks the dust and hot air cleaned by the cleaning rack into the collection chamber, preventing the spread of dust and hot air and maintaining a clean and tidy working environment. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present utility model;

[0020] Figure 2 This is a three-dimensional view of the internal structure of the processing chamber of this utility model;

[0021] Figure 3 This is a partial perspective view of the cooling mechanism of this utility model;

[0022] Figure 4 This is a partial perspective view of the heat dissipation mechanism of this utility model.

[0023] In the diagram: 1. Processing chamber, 2. Cylinder, 3. Upper mold, 4. Lower mold, 5. Cooling mechanism, 51. Cooling chamber, 52. Cooling chamber, 53. Cooling pipe, 54. Cleaning rack, 55. Condenser, 56. Water pump, 57. Inlet pipe, 58. Outlet pipe, 6. Heat dissipation mechanism, 61. Fixing plate, 62. Mounting bracket, 63. Cooling fan, 64. Fixing block, 65. Electric telescopic rod, 66. Fixing base, 67. Suction fan, 68. Collection chamber. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example 1:

[0026] Based on the existing problem of increased surface temperature after mold material processing reducing mold lifespan, please refer to... Figures 1-4 This utility model provides a technical solution: a heat dissipation device for high-precision mold processing, including a processing chamber 1, a cylinder 2 fixedly installed on the top surface of the processing chamber 1, the output shaft of the cylinder 2 extending through the processing chamber 1 into the interior of the processing chamber 1, an upper mold 3 fixedly installed on the bottom surface of the output shaft of the cylinder 2, a lower mold 4 fixedly installed on the inner wall of the processing chamber 1, a cooling mechanism 5 installed above the upper mold 3, and a heat dissipation mechanism 6 installed below the processing chamber 1;

[0027] Cooling mechanism 5 includes a connecting part and a cooling part;

[0028] The heat dissipation mechanism 6 includes a heat dissipation section and a collection section.

[0029] The connecting part includes a cooling chamber 51, the top surface of which is fixedly connected to the processing chamber 1. A placement slot is provided inside the cooling chamber 51, and a cooling chamber 52 is fixedly installed inside the cooling chamber 51.

[0030] Cooling tube 53 is fixedly sleeved on the outer side of cooling chamber 52. Cooling tube 53 is located inside the placement groove. Cleaning rack 54 is fixedly installed on the bottom surface of cooling chamber 51. Cleaning brush is fixedly installed inside cleaning rack 54. The internal shape of cooling chamber 52 and cleaning rack 54 are consistent with the shape of upper mold 3.

[0031] The cooling unit includes a condenser 55, which is fixedly connected to the processing chamber 1 on its side. A water inlet pipe 57 is fixedly installed on the top surface of the condenser 55, and the upper end of the water inlet pipe 57 passes through the cooling chamber 51 and is fixedly connected to the cooling pipe 53.

[0032] A water pump 56 is fixedly installed on the bottom surface of the condenser 55. The water pump 56 is connected to the inlet pipe 57. An outlet pipe 58 is fixedly installed on the bottom surface of the water pump 56. The lower end of the outlet pipe 58 passes through the cooling chamber 51 and is fixedly connected to the cooling pipe 53.

[0033] Furthermore, in this embodiment, the cylinder 2 drives the upper mold 3 to move upward. When the upper mold 3 moves upward, it first passes through the cleaning frame 54. The cleaning brush inside the cleaning frame 54 cleans the surface of the upper mold 3. Then, the upper mold 3 enters the cooling chamber 52. The water pump 56 is started, and the water pump 56 causes the coolant inside the cooling pipe 53 to flow. The coolant in the cooling pipe 53 first enters the condenser 55 from the inlet pipe 57. The condenser 55 cools the coolant. Then, the coolant returns to the cooling pipe 53 from the outlet pipe 58, completing the circulation of the coolant. The cooled coolant lowers the temperature inside the cooling chamber 52, thereby cooling the upper mold 3 inside the cooling chamber 52.

[0034] Furthermore, in this embodiment, the surface of the upper mold 3 is cleaned by the cleaning brush inside the cleaning frame 54 to ensure the cleanliness of the upper mold 3 and facilitate subsequent processing. The water pump 56 causes the coolant inside the cooling pipe 53 to flow. The coolant in the cooling pipe 53 first enters the condenser 55 from the water inlet pipe 57. The condenser 55 cools the coolant. Then the coolant returns to the cooling pipe 53 from the water outlet pipe 58 to complete the circulation of the coolant. The cooled coolant lowers the temperature inside the cooling chamber 52, thereby cooling the upper mold 3 inside the cooling chamber 52 and extending the service life of the upper mold 3.

[0035] Example 2:

[0036] Please see Figures 1-4 Furthermore, based on Embodiment 1, the heat dissipation part includes a fixing plate 61, two fixing plates 61 are arranged on the left and right sides, the fixing plates 61 are fixedly connected to the inside of the processing chamber 1, and a mounting bracket 62 is arranged between the two fixing plates 61 on the left and right sides, and a cooling fan 63 is fixedly installed inside the mounting bracket 62.

[0037] A fixing block 64 is hinged to the outer side of the mounting bracket 62. There are two fixing blocks 64 at the front and back. The other end of the fixing block 64 is fixedly connected to the adjacent fixing plate 61. A fixing seat 66 is fixedly installed on the side of the fixing plate 61. An electric telescopic rod 65 is hinged to the front and back of the fixing seat 66. The telescopic end of the electric telescopic rod 65 is hinged to the adjacent mounting bracket 62.

[0038] The collection section includes a suction fan 67, with two suction fans 67 arranged on the left and right sides. The lower end of the suction fan 67 passes through the processing chamber 1 and is fixedly connected to the processing chamber 1. A collection chamber 68 is arranged below the suction fan 67 and is fixedly connected to the processing chamber 1.

[0039] Furthermore, in this embodiment, the cooling fan 63 dissipates heat to the surface of the upper mold 3 or lower mold 4 it faces. The electric telescopic rod 65 is activated. When the electric telescopic rod 65 extends and retracts, it drives the mounting frame 62 to deflect. The mounting frame 62 drives the cooling fan 63 to deflect synchronously, thereby adjusting the orientation of the cooling fan 63. The suction fan 67 is activated. The suction fan 67 sucks the dust and hot air cleaned by the cleaning frame 54 into the collection chamber 68.

[0040] Furthermore, in this embodiment, the cooling fan 63 dissipates heat to the surface of the upper mold 3 or lower mold 4 facing the direction, effectively reducing the mold temperature and preventing the mold from deforming or being damaged due to overheating. When the electric telescopic rod 65 extends or retracts, it drives the mounting bracket 62 to deflect, thereby adjusting the orientation of the cooling fan 63, so that the cooling fan 63 can dissipate heat to different parts of the mold as needed, improving the targeted nature of heat dissipation. The suction fan 67 sucks the dust and hot air cleaned by the cleaning rack 54 into the collection chamber 68, avoiding the spread of dust and hot air and maintaining a clean and tidy working environment.

[0041] In operation, cylinder 2 drives the upper mold 3 to move upward. As the upper mold 3 moves upward, it first passes through the cleaning frame 54, where cleaning brushes clean the surface of the upper mold 3. Then, the upper mold 3 enters the cooling chamber 52, and the water pump 56 is activated. The water pump 56 causes the coolant inside the cooling pipe 53 to circulate. The coolant in the cooling pipe 53 first enters the condenser 55 through the inlet pipe 57, where the condenser 55 cools the coolant. Then, the coolant returns to the cooling pipe 53 through the outlet pipe 58, completing the coolant circulation and cooling process. The coolant lowers the internal temperature of the cooling chamber 52, thereby cooling the upper mold 3 inside the cooling chamber 52. The cooling fan 63 is activated, and the cooling fan 63 dissipates heat to the surface of the upper mold 3 or lower mold 4 it faces. The electric telescopic rod 65 is activated, and when the electric telescopic rod 65 extends or retracts, it drives the mounting frame 62 to deflect. The mounting frame 62 drives the cooling fan 63 to deflect synchronously, thereby adjusting the orientation of the cooling fan 63. The suction fan 67 is activated, and the suction fan 67 sucks the dust and hot air cleaned by the cleaning frame 54 into the collection chamber 68.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for high-precision mold processing, comprising a processing chamber (1), characterized in that: A cylinder (2) is fixedly installed on the top surface of the processing chamber (1). The output shaft of the cylinder (2) extends through the processing chamber (1) and into the interior of the processing chamber (1). An upper mold (3) is fixedly installed on the bottom surface of the output shaft of the cylinder (2). A lower mold (4) is fixedly installed on the inner wall of the processing chamber (1). A cooling mechanism (5) is installed above the upper mold (3). A heat dissipation mechanism (6) is installed below the processing chamber (1). The cooling mechanism (5) includes a connecting part and a cooling part; The heat dissipation mechanism (6) includes a heat dissipation section and a collection section.

2. The heat dissipation device for high-precision mold processing according to claim 1, characterized in that: The connecting part includes a cooling chamber (51), the top surface of which is fixedly connected to the processing chamber (1), a placement slot is provided inside the cooling chamber (51), and a cooling chamber (52) is fixedly installed inside the cooling chamber (51).

3. The heat dissipation device for high-precision mold processing according to claim 2, characterized in that: Cooling tube (53) is fixedly sleeved on the outer side of the cooling chamber (52). The cooling tube (53) is located inside the placement groove. A cleaning rack (54) is fixedly installed on the bottom surface of the cooling chamber (51). A cleaning brush is fixedly installed inside the cleaning rack (54). The internal shape of the cooling chamber (52) and the internal shape of the cleaning rack (54) are consistent with the shape of the upper mold (3).

4. A heat dissipation device for high-precision mold processing according to claim 3, characterized in that: The cooling unit includes a condenser (55), the side of which is fixedly connected to the processing chamber (1), and a water inlet pipe (57) is fixedly installed on the top surface of the condenser (55). The upper end of the water inlet pipe (57) passes through the cooling chamber (51) and is fixedly connected to the cooling pipe (53).

5. A heat dissipation device for high-precision mold processing according to claim 4, characterized in that: A water pump (56) is fixedly installed on the bottom surface of the condenser (55). The water pump (56) is connected to the inlet pipe (57). An outlet pipe (58) is fixedly installed on the bottom surface of the water pump (56). The lower end of the outlet pipe (58) passes through the cooling chamber (51) and is fixedly connected to the cooling pipe (53).

6. A heat dissipation device for high-precision mold processing according to claim 1, characterized in that: The heat dissipation unit includes a fixing plate (61), two fixing plates (61) are arranged on the left and right sides, the fixing plates (61) are fixedly connected to the inside of the processing chamber (1), and a mounting bracket (62) is arranged between the two fixing plates (61) on the left and right sides, and a cooling fan (63) is fixedly installed inside the mounting bracket (62).

7. A heat dissipation device for high-precision mold processing according to claim 6, characterized in that: The mounting bracket (62) has a fixing block (64) hinged to its outer side. There are two fixing blocks (64) at the front and back. The other end of the fixing block (64) is fixedly connected to the adjacent fixing plate (61). The fixing plate (61) has a fixing seat (66) fixedly installed on its side. The fixing seat (66) has an electric telescopic rod (65) hinged to its front and back. The telescopic end of the electric telescopic rod (65) is hinged to the adjacent mounting bracket (62).

8. A heat dissipation device for high-precision mold processing according to claim 7, characterized in that: The collection unit includes a suction fan (67), two suction fans (67) are arranged on the left and right sides. The lower end of the suction fan (67) passes through the processing chamber (1) and is fixedly connected to the processing chamber (1). A collection chamber (68) is arranged below the suction fan (67), and the collection chamber (68) is fixedly connected to the processing chamber (1).

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