Hidden cutting adsorption carrying table device

Abstract

The utility model relates to a hidden cutting adsorption platform deck device which comprises a base, a torque motor and an adsorption platform deck assembly, and the torque motor installed on the base drives the adsorption platform deck assembly above the torque motor to rotate. The adsorption carrying table assembly comprises an adsorption table, and a plurality of vacuum suction cups used for adsorbing the steel rings are evenly installed on the edge of the outer side of the adsorption table in the circumferential direction. A plurality of adsorption bosses used for adsorbing wafers are arranged on the top of the adsorption table in the circumferential direction. The utility model provides a vacuum adsorption carrying platform which can avoid a front bonding light window to realize laser cutting.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer processing, and in particular to a hidden-cut adsorption stage device. Background Technology

[0002] With the development of the semiconductor industry, especially some advanced wafer packaging processes, traditional cutting tools can cause problems such as edge chipping. Wafers with optical windows bonded on the front side are attached to a designated hidden cleaving film. During the laser cutting process of wafers with optical windows bonded on the front side, the existing adsorption stage can no longer meet the requirements. On the one hand, it cannot avoid the optical windows bonded on the front side. On the other hand, since it is a back-side laser hidden cleaving, the existing stage will also have a film attached, which will result in the wafer not being able to be removed after cutting or the entire wafer being damaged during the removal process. Moreover, the current stage will sink in the middle during the cutting process.

[0003] In view of the above-mentioned shortcomings, the designer has actively researched and innovated in order to create a hidden adsorption platform device that has greater industrial application value. Utility Model Content

[0004] To solve any of the above-mentioned technical problems, the purpose of this utility model is to provide a hidden-cut adsorption platform device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] The hidden adsorption platform device includes a base, a torque motor and an adsorption platform assembly. The torque motor mounted on the base drives the adsorption platform assembly above to rotate.

[0007] The adsorption stage assembly includes an adsorption stage, on which several vacuum suction cups for adsorbing steel rings are evenly installed along the circumferential direction at the outer edge of the adsorption stage.

[0008] Several adsorption protrusions for adsorbing wafers are arranged along the circumferential direction on the top of the adsorption stage. The adsorption stage inside the several adsorption protrusions forms an upper clearance groove. A lower adsorption groove is opened at the bottom of the adsorption stage below the adsorption protrusions. A sealing plate is installed on the adsorption stage at the bottom of the lower adsorption groove.

[0009] Several vacuum holes are provided on the adsorption protrusion, and all of the vacuum holes are connected to the lower adsorption groove below. The air inlet located in the middle of the bottom of the adsorption platform is connected to the lower adsorption groove, and several inner support blocks are evenly installed in the lower adsorption groove along the circumferential direction.

[0010] As a further improvement of this utility model, at least one first adsorption pipe is provided inside the adsorption stage, which is connected to the air inlet at the bottom of the adsorption stage, and the first adsorption pipe penetrates the adsorption stage radially.

[0011] As a further improvement of this utility model, a number of positive pressure holes are provided in the upper recessed groove, and a second adsorption pipe connected to the positive pressure holes is provided in the adsorption platform.

[0012] As a further improvement of this utility model, a ventilation groove is provided between two adjacent adsorption protrusions.

[0013] As a further improvement of this utility model, the vacuum suction cup is mounted on the adsorption stage via a suction cup mounting block, and at least one suction cup air pipe connector connected to the vacuum suction cup is mounted on the suction cup mounting block. Furthermore, several outer support blocks for supporting the steel ring are evenly installed along the circumferential direction at the outer edge of the adsorption stage.

[0014] As a further improvement of this utility model, a limiting block is installed on one side of the adsorption stage by a limiting block mounting bracket, a positioning pin is installed at the bottom of the limiting block, and a limiting assembly component adapted to the positioning pin is installed on the base.

[0015] As a further improvement of this utility model, the limiting assembly includes a limiting base plate installed on the base, a guide rail installed on the limiting base plate, the bottom of the limiting fixing sensor block being slidably installed on the guide rail by a slider, and limiting posts being installed on the limiting base plates on both sides of the guide rail by limiting baffles.

[0016] As a further improvement of this utility model, the two sides of the limiting and fixing sensing block are respectively connected to the support column installed on the limiting base plate near the limiting column by springs.

[0017] As a further improvement of this utility model, a sensing plate is installed on one side of the bottom of the limiting and fixing sensing block, and sensors adapted to the aforementioned sensing plate are respectively installed on the limiting base plates on both sides of the sensing plate.

[0018] As a further improvement of this utility model, several platform adjustment components are installed on the outer edge of the base.

[0019] By means of the above solution, this utility model has at least the following advantages:

[0020] This invention provides a vacuum adsorption stage that avoids the front bonding light window, enabling laser cutting.

[0021] The upper clearance groove of this invention can avoid the wafer light window. The upper clearance groove contains positive pressure air and is connected to the atmosphere, which can prevent the collapse of vacuum adsorption.

[0022] The adsorption protrusions on the adsorption stage of this invention have vacuum holes for vacuum adsorption, which can adsorb wafers. At the same time, ventilating grooves are opened between adjacent adsorption protrusions to guide away the overflowing vacuum and avoid collapse during the wafer dicing process.

[0023] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a hidden-cut adsorption platform device according to the present invention;

[0026] Figure 2 yes Figure 1 Schematic diagram of the structure of the adsorption stage assembly;

[0027] Figure 3 yes Figure 2 A schematic diagram of the structure on the back;

[0028] Figure 4 yes Figure 3 A schematic diagram of the structure after removing the sealing plate;

[0029] Figure 5 yes Figure 1 A schematic diagram of the middle limit assembly component.

[0030] The meanings of the labels in the figures are as follows.

[0031] 1. Base; 2. Limiting block; 3. Positioning pin; 4. Limiting block mounting bracket; 5. Torque motor; 6. Adsorption platform assembly; 7. Limiting assembly assembly; 8. Platform adjustment assembly.

[0032] Adsorption platform 601, suction cup air pipe connector 602, vacuum suction cup 603, suction cup mounting block 604, sealing plate 605, upper clearance groove 606, adsorption boss 607, outer support block 608, positive pressure hole 609, ventilation groove 610, vacuum hole 611, lower adsorption groove 612, inner support block 613, first adsorption pipe 614, second adsorption pipe 615;

[0033] Limiting post 701, guide rail 702, limiting base plate 703, sensor 704, slider 705, sensing plate 706, limiting fixing sensing block 707, spring 708, support post 709, limiting baffle 710. Detailed Implementation

[0034] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0035] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0036] Example

[0037] like Figure 1 A hidden adsorption platform device includes a base 1, a torque motor 5, an adsorption platform assembly 6 and a limiting assembly 7. The torque motor 5, mounted on the base 1, drives the adsorption platform assembly 6 above to rotate.

[0038] like Figures 1-4 The adsorption platform assembly 6 includes an adsorption platform 601, with a plurality of vacuum suction cups 603 for adsorbing steel rings evenly installed along the circumferential direction at the outer edge of the adsorption platform 601. The vacuum suction cups 603 are mounted on the adsorption platform 601 via suction cup mounting blocks 604, and at least one suction cup air pipe connector 602 communicating with the vacuum suction cups 603 is installed on the suction cup mounting blocks 604. Furthermore, a plurality of outer support blocks 608 for supporting the steel rings are evenly installed along the circumferential direction at the outer edge of the adsorption platform 601.

[0039] The vacuum suction cup 603 and the outer support block 608 work together to adsorb and support the steel ring.

[0040] Several adsorption protrusions 607 for adsorbing wafers are arranged circumferentially on the top of the adsorption stage 601. The adsorption stage 601 inside the adsorption protrusions 607 forms an upper clearance groove 606. A lower adsorption groove 612 is formed at the bottom of the adsorption stage 601 below the adsorption protrusions 607. A sealing plate 605 is installed on the adsorption stage 601 at the bottom of the lower adsorption groove 612. Several vacuum holes 611 are formed on the adsorption protrusions 607, and all vacuum holes 611 are connected to the lower adsorption groove 612 below. An air inlet located in the middle of the bottom of the adsorption stage 601 is connected to the lower adsorption groove 612. Several inner support blocks 613 are evenly installed circumferentially inside the lower adsorption groove 612.

[0041] The wafer is placed on the adsorption stage 601 and adsorbed by the adsorption protrusions 607.

[0042] At least one first adsorption pipe 614 is provided inside the adsorption stage 601, which is connected to the air inlet at the bottom of the adsorption stage 601, and the first adsorption pipe 614 extends through the adsorption stage 601 radially. During the dicing process, air can be introduced through the first adsorption pipe 614 of the adsorption stage 601 and discharged through the first adsorption pipe 614 on the other side, ensuring that there is no adsorption force on the wafer on the inner side of the adsorption stage 601 (i.e., the upper clearance groove 606).

[0043] In addition, several positive pressure holes 609 are provided in the upper clearance groove 606, and a second adsorption channel 615 connected to the positive pressure holes 609 is provided in the adsorption stage 601. A ventilation groove 610 is provided between two adjacent adsorption protrusions 607, which can further prevent the inner wafer from being adsorbed.

[0044] like Figure 1 and Figure 5 A limiting block 2 is mounted on one side of the adsorption stage 601 via a limiting block mounting bracket 4. A positioning pin 3 is mounted on the bottom of the limiting block 2. A limiting assembly 7 that matches the positioning pin 3 is mounted on the base 1. The rotation range of the adsorption stage 601 can be limited by the matching of the positioning pin 3 and the limiting assembly 7.

[0045] The limiting assembly 7 includes a limiting base plate 703 mounted on the base 1. A guide rail 702 is mounted on the limiting base plate 703. The bottom of the limiting fixing sensor block 707 is slidably mounted on the guide rail 702 via a slider 705. Both sides of the limiting fixing sensor block 707 are connected to support columns 709 mounted on the limiting base plate 703 near the limiting post 701 via springs 708. Limiting posts 701 are mounted on the limiting base plate 703 on both sides of the guide rail 702 via limiting baffles 710.

[0046] In addition, a sensor 706 is installed on one side of the bottom of the limiting and fixing sensor block 707, and sensors 704 adapted to the aforementioned sensor 706 are respectively installed on the limiting base plates 703 on both sides of the sensor 706.

[0047] Several platform adjustment components 8 are installed on the outer edge of the base 1. The platform adjustment components 8 are composed of bolts, nuts, locking parts, etc., and can be used to adjust the installation position of the base 1.

[0048] Brief description of the working process of this utility model:

[0049] During the back-side dicing process, the wafer is first placed on the adsorption stage 601 of the adsorption platform assembly 6. After placement, the wafer's optical window is inside the upper clearance groove 606 to avoid contact. The vacuum is activated, and the wafer is adsorbed through the vacuum hole 611 on the adsorption stage 601. During the dicing process, air can be introduced through the first adsorption pipe 614 of the adsorption stage 601 and discharged through the first adsorption pipe 614 on the other side, ensuring that there is no adsorption force on the inner side of the adsorption stage 601 for the wafer. During the dicing process, the torque motor 1 rotates, driving the base 5 to rotate, which in turn drives the adsorption platform assembly 6 to rotate, completing the dicing in different directions. At the same time, the vacuum suction cup 603 on the adsorption platform assembly 6 adsorbs the steel ring, completing the back-side dicing of the wafer with the optical window.

[0050] This invention provides a vacuum adsorption stage that avoids the front bonding light window, enabling laser cutting.

[0051] The upper clearance groove opened on the upper part of the adsorption stage can avoid the wafer light window. The upper clearance groove contains positive pressure air and is connected to the atmosphere, which can prevent the collapse of vacuum adsorption.

[0052] The adsorption protrusions on the adsorption stage contain vacuum holes for vacuum adsorption, which can adsorb wafers. At the same time, venting grooves are opened between adjacent adsorption protrusions to guide away the overflowing vacuum and prevent collapse during the wafer dicing process.

[0053] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0054] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0055] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A hidden cutting adsorption stage device, comprising a base (1), a torque motor (5) and an adsorption stage assembly (6), the torque motor (5) installed on the base (1) drives the adsorption stage assembly (6) above to rotate; characterized in that The adsorption stage assembly (6) comprises an adsorption table (601), a plurality of vacuum chucks (603) for adsorbing steel rings are uniformly installed at the outer edge of the adsorption table (601) in the circumferential direction; A plurality of adsorption bosses (607) for adsorbing wafers are arranged on the top of the adsorption table (601) in the circumferential direction, the inner side of the adsorption bosses (607) forms an upper clearance groove (606), a lower adsorption groove (612) is opened in the bottom of the adsorption table (601) below the adsorption bosses (607), and an enclosing plate (605) is installed on the adsorption table (601) at the bottom of the lower adsorption groove (612). A plurality of vacuum holes (611) are opened in the adsorption bosses (607), the vacuum holes (611) are in communication with the lower adsorption groove (612) below, an air inlet in the middle of the bottom of the adsorption table (601) is in communication with the lower adsorption groove (612), and a plurality of inner support blocks (613) are uniformly installed in the lower adsorption groove (612) in the circumferential direction.

2. The hidden-cut wafer chucking station apparatus of claim 1, wherein, At least one first adsorption pipeline (614) is opened in the adsorption table (601) and in communication with the air inlet at the bottom of the adsorption table (601), and the first adsorption pipeline (614) penetrates the adsorption table (601) in the radial direction of the adsorption table (601).

3. The hidden-cut wafer chucking station apparatus of claim 1, wherein, A plurality of positive pressure holes (609) are opened in the upper clearance groove (606), and a second adsorption pipeline (615) is opened in the adsorption table (601) and in communication with the positive pressure holes (609).

4. The hidden-cut wafer chucking station apparatus of claim 1, wherein, An air passage (610) is opened between two adjacent adsorption bosses (607).

5. The hidden-cut wafer chucking station apparatus of claim 1, wherein, The vacuum chuck (603) is installed on the adsorption table (601) through a chuck mounting block (604), at least one chuck air pipe joint (602) in communication with the vacuum chuck (603) is installed on the chuck mounting block (604), and a plurality of outer support blocks (608) for supporting steel rings are uniformly installed at the outer edge of the adsorption table (601) in the circumferential direction.

6. The hidden-cut wafer chucking station apparatus of claim 1, wherein, A limiting block (2) is installed on one side of the adsorption table (601) through a limiting block mounting frame (4), a positioning pin (3) is installed at the bottom of the limiting block (2), and a limiting assembly component (7) matched with the positioning pin (3) is installed on the base (1).

7. The hidden-cut wafer chucking station apparatus of claim 6, wherein, The limiting assembly component (7) comprises a limiting bottom plate (703) installed on the base (1), a guide rail (702) is installed on the limiting bottom plate (703), the bottom of a limiting fixed sensing block (707) is slidably installed on the guide rail (702) through a sliding block (705), and a limiting column (701) is installed on the limiting bottom plate (703) on both sides of the guide rail (702) through a limiting baffle (710).

8. The hidden-cut wafer chucking station apparatus of claim 7, wherein, The two sides of the limiting fixed induction block (707) are connected with the support column (709) installed on the limiting bottom plate (703) near one side of the limiting column (701) through springs (708).

9. The hidden-cut wafer chucking station apparatus of claim 7, wherein, An induction sheet (706) is installed on one side of the bottom of the limiting fixed induction block (707), and sensors (704) matched with the induction sheet (706) are installed on the limiting bottom plate (703) on the two sides of the induction sheet (706).

10. The hidden-cut wafer chucking station apparatus of claim 1, wherein, Several stage adjusting assemblies (8) are installed on the outer side edges of the base (1).

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