Aramid fiber reinforced bamboo-wood-based composite material plate
By using aramid fiber-reinforced bamboo-wood composite panels with thermoplastic resin and modified polyethylene resin film layers, the problems of formaldehyde release and high cost of existing bamboo-wood adhesives have been solved, achieving low-cost and environmentally friendly indoor use.
Patent Information
- Application Number
- CN202520101756.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-01-16
AI Technical Summary
Existing bamboo and wood adhesives such as urea-formaldehyde resin, phenolic resin and epoxy resin have problems with formaldehyde release and high cost, and existing aramid fiber reinforced bamboo and wood composites are not suitable for indoor environments.
A thermoplastic resin is used as an adhesive to combine aramid fiber cloth and modified polyethylene resin film layer. Aramid fiber reinforced bamboo and wood matrix composite board is prepared by hot pressing process. The middle substrate layer is bamboo or wood material, the surface layer is wood veneer, and the middle layer is bonded to the aramid fiber cloth with modified polyethylene resin film.
A low-cost, environmentally friendly aramid fiber reinforced bamboo-wood composite material has been developed, which has good peel resistance and static bending strength, is suitable for indoor environments, and avoids formaldehyde release.
Smart Images

Figure CN223961429U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of bamboo and wood-based composite materials, and relates to an aramid fiber reinforced bamboo and wood-based material that can be used in indoor load-bearing environments without formaldehyde release. Background Technology
[0002] Currently, commonly used bamboo and wood adhesives include urea-formaldehyde resin and its modified forms, phenolic resin adhesives, and epoxy resin adhesives are mainly used for bonding aramid fibers. Urea-formaldehyde resin adhesives cannot bond aramid fibers, phenolic resin adhesives contain formaldehyde and free phenol, and epoxy resin adhesives release large amounts of volatile organic compounds during use, causing significant environmental pollution and are also relatively expensive.
[0003] Currently, a Chinese patent, CN101824205A, entitled "Integrated Molded Article, Aramid Fiber Reinforced Bamboo-Wood Matrix Composite Board and Housing for Electrical and Electronic Equipment," has been found. The integrated molded article is formed by connecting a component (I) containing an aramid fiber reinforced bamboo-wood matrix composite board and other components (II). The aramid fiber reinforced bamboo-wood matrix composite board is formed by (a) continuous reinforcing fibers, (b) a matrix resin with thermosetting resin as the main component, and (c) a flame retardant. The characteristic feature is that the flame retardancy of the component (I) based on UL-94 is V-1 or V-0 as determined by a test piece of substantial thickness. The aramid fiber reinforced bamboo-wood matrix composite board of this patent is not suitable for indoor flooring or decorative panels.
[0004] The search also yielded a Chinese patent, "Aramid Fiber Reinforced Bamboo-Wood Matrix Composite Board and Steel Plate Combination Structure for Reinforcing Concrete Beams," publication number CN106337567B. This patent comprises multiple aramid fiber reinforced bamboo-wood matrix composite boards and multiple steel plates. Based on the stress characteristics of the concrete beam to be reinforced, the aramid fiber reinforced bamboo-wood matrix composite boards are discontinuously adhered to the bottom of the beam, with adjacent boards spaced at appropriate intervals. Two spaced boards are then fixedly connected by a steel plate. This invention utilizes external bonding high-strength... The aramid fiber reinforced bamboo-wood composite board, while relatively brittle, improves the stiffness and load-bearing capacity of concrete beams. The use of a steel plate with good ductility enhances the deformation capacity of the concrete beam near the mid-span, preventing continuous brittle failure of the concrete beam reinforced with the aramid fiber reinforced bamboo-wood composite board. Furthermore, it helps reduce stress in the mid-span concrete and the aramid fiber reinforced bamboo-wood composite board, delaying the peeling failure of the aramid fiber reinforced bamboo-wood composite board, improving the utilization rate of fiber-reinforced composite materials, and increasing the load-bearing capacity of the concrete beam. This patent is not applicable to indoor flooring or decorative panels. Summary of the Invention
[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of this utility model is to provide an aramid fiber reinforced bamboo-wood matrix composite material made of thermoplastic resin as adhesive. This aramid fiber reinforced bamboo-wood matrix composite material has low cost, is environmentally friendly, and can improve the application range of fast-growing and low-quality wood.
[0006] The present invention relates to an aramid fiber reinforced bamboo-wood composite material board, characterized in that it comprises an intermediate substrate layer and a first grafted modified polyethylene resin film layer, a fiber cloth layer, a second grafted modified polyethylene resin film layer, and a surface veneer layer, all disposed sequentially on the upper and lower sides of the intermediate substrate layer, wherein the fiber cloth layer is aramid fiber cloth.
[0007] Preferably, the intermediate substrate layer is a wood-based material or a bamboo-based material, and the moisture content of the intermediate substrate layer is 8-12%.
[0008] Preferably, the wood-based material is 9mm thick plywood, and the bamboo-based material is 28mm thick container flooring.
[0009] Preferably, the specifications of the above-mentioned aramid fiber cloth are 200D60G-3000D400G.
[0010] Preferably, the thickness of the first grafted modified polyethylene resin film layer and the second grafted modified polyethylene resin film layer is 0.04 mm.
[0011] Preferably, the surface veneer layer is a 1.4mm thick wood veneer.
[0012] The manufacturing process of this utility model of aramid fiber reinforced bamboo-wood matrix composite board.
[0013] Step (1). Raw material preparation
[0014] (1.1) Bamboo-based material: 28mm container flooring, 60cm×60cm in size, dried to a moisture content of 8%-12%;
[0015] (1.2) Wood-based materials: 9mm plywood, 30cm×30cm in size, dried to a moisture content of 8%-12%;
[0016] (1.3) Reinforcing material: aramid fiber cloth with specifications of 200D60G-3000D400G is selected;
[0017] (1.4) Adhesive material: Grafted modified polyethylene resin film is used, with a single layer film thickness of 0.04 mm;
[0018] (1.5) Surface wood veneer: 1.4mm thick wood veneer;
[0019] Step (2). Assembly of blanks
[0020] Aramid fiber cloth is laid on the bamboo or wood base material as the intermediate substrate layer, and the outermost layer is wood veneer. Grafted modified polyethylene resin film is used as an adhesive between the intermediate substrate layer and the aramid fiber cloth, and between the aramid fiber cloth and the wood veneer.
[0021] Step (3). Pressure plate
[0022] One-time hot pressing or hot pressing followed by cold pressing:
[0023] (3.1) The one-time hot pressing process is as follows: hot pressing temperature 140-160℃, hot pressing pressure 0.8-1.2MPa, hot pressing time: 250-420s;
[0024] (3.2) The hot-pressing followed by cold-pressing process is as follows: hot pressing temperature 140-160℃, hot pressing pressure 0.8-1.2MPa, hot pressing time: 250-420s; cold pressing pressure 1.0-2.0MPa, cold pressing time: 30s-300s;
[0025] (4) Trimming and inspection
[0026] After pressing, the formed board is placed in a constant temperature and humidity environment for 48 hours before edge trimming. After inspection, the composite material board product is obtained.
[0027] This application utilizes grafted modified polyethylene resin adhesive and aramid fiber cloth to give bamboo-based products good peel resistance and static bending strength, thereby increasing the load-bearing capacity of the product compared to bamboo-based materials without surface reinforcement; and compared to traditional phenolic adhesives or epoxy resin adhesives, the product releases no free formaldehyde or organic solvents, making it greener and more environmentally friendly, and suitable for use in interior structural materials. Attached Figure Description
[0028] Figure 1 This is a cross-sectional structural diagram of the present invention. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0030] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0031] The present invention relates to an aramid fiber reinforced bamboo-wood composite material board, comprising an intermediate substrate layer 1 and a first grafted modified polyethylene resin film layer 2, a fiber cloth layer 3, a second grafted modified polyethylene resin film layer 4, and a surface veneer layer 5, all disposed sequentially on the upper and lower sides of the intermediate substrate layer.
[0032] The first grafted modified polyethylene resin film layer and the second grafted modified polyethylene resin film layer can be the formaldehyde-free film-like wood adhesive of the invention titled "A formaldehyde-free film-like wood adhesive and its preparation and use method" in patent number "201310443412.8".
[0033] The intermediate substrate layer can be made of wood or bamboo, with a moisture content of 8-12%. The wood-based material can be 9mm thick plywood, and the bamboo-based material can be 28mm thick container flooring. Plywood is a mature product available on the market, with various specifications, commonly 2440×1220 or 1830×915 mm in size. Container flooring is also available on the market. Plywood and container flooring are used for load-bearing, and this application provides relevant examples, but is not limited to these two. Other materials such as bamboo, wood, particleboard, and fiberboard can also be used.
[0034] The fiber cloth layer is made of aramid fiber cloth, and the specifications of the aramid fiber cloth are 200D60G-3000D400G.
[0035] The thickness of the first grafted modified polyethylene resin film layer and the second grafted modified polyethylene resin film layer is 0.04 mm.
[0036] The aforementioned surface veneer layer can be a 1.4mm thick wood veneer.
[0037] Example 1
[0038] 1. Raw material preparation
[0039] 1.1 Bamboo-based material: 28mm container flooring, 60cm×60cm in size, dried to a moisture content of 8%;
[0040] 1.2 Reinforcing material: Aramid fiber cloth, specification 3000D 400G;
[0041] 1.3 Adhesive material: Graft-modified polyethylene resin film, single-layer film thickness 0.04mm;
[0042] 1.4 Surface wood veneer: 1.4mm thick wood veneer.
[0043] 2. Billet assembly
[0044] The substrate (bamboo-based material) is covered with aramid fiber cloth on both sides, and the outermost layer is wood veneer. Modified polyethylene resin film is used as an adhesive between each unit.
[0045] 3. Pressure plate
[0046] The hot-pressing followed by cold-pressing method is adopted: hot pressing temperature 160℃, hot pressing pressure 1.0 MPa, hot pressing time: 420s; cold pressing pressure 1.5MPa, cold pressing time: 60s.
[0047] 4. Trimming and Inspection
[0048] After pressing, the formed board is placed in a constant temperature and humidity environment for 48 hours before edge trimming. After inspection, the product, aramid fiber reinforced bamboo-based composite material board, is obtained.
[0049] Example 2
[0050] 1. Raw material preparation
[0051] 1.1 Wood-based materials: 9mm plywood, 30cm×30cm in size, dried to a moisture content of 10%;
[0052] 1.2 Reinforcing material: Aramid fiber cloth, specification 1000D 200G.
[0053] 1.3 Adhesive material: Graft-modified polyethylene resin film, single-layer film thickness 0.04mm;
[0054] 1.4 Surface wood veneer: 1.4mm thick wood veneer.
[0055] 2. Billet assembly
[0056] The substrate (bamboo-based material) is covered with aramid fiber cloth on both sides, and the outermost layer is wood veneer. Modified polyethylene resin film is used as an adhesive between each unit.
[0057] 3. Pressure plate
[0058] The hot-pressing followed by cold-pressing method is adopted: hot pressing temperature 150℃, hot pressing pressure 0.8MPa, hot pressing time: 300s; cold pressing pressure 1.2MPa, cold pressing time: 50s.
[0059] 4. Trimming and Inspection
[0060] After pressing, the formed board is placed in a constant temperature and humidity environment for 48 hours before edge trimming. After inspection, the product, aramid fiber reinforced bamboo-based composite material board, is obtained.
[0061] Comparison Standard: The physical and mechanical properties of the product are listed in Table 1, compared with the mechanical properties of the substrate without surface reinforcement.
[0062] Compare implementation cases 1 and 2.
[0063]
[0064] This application utilizes grafted modified polyethylene resin adhesive and aramid fiber cloth to give bamboo-based products good peel resistance and static bending strength, thereby increasing the load-bearing capacity of the product compared to bamboo-based materials without surface reinforcement; and compared to traditional phenolic adhesives or epoxy resin adhesives, the product releases no free formaldehyde or organic solvents, making it greener and more environmentally friendly, and suitable for use in interior structural materials.
[0065] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model are permitted.
Claims
1. An aramid fiber reinforced bamboo-wood composite material board, characterized in that: It includes an intermediate substrate layer and a first grafted modified polyethylene resin film layer, a fiber cloth layer, a second grafted modified polyethylene resin film layer, and a surface veneer layer, all sequentially disposed on the upper and lower sides of the intermediate substrate layer, wherein the fiber cloth layer is aramid fiber cloth.
2. The aramid fiber reinforced bamboo-wood composite material board according to claim 1, characterized in that: The intermediate substrate layer is made of wood or bamboo, and the moisture content of the intermediate substrate layer is 8-12%.
3. The aramid fiber reinforced bamboo-wood composite material board according to claim 2, characterized in that: The wood-based material is 9mm thick plywood, and the bamboo-based material is 28mm thick container flooring.
4. The aramid fiber reinforced bamboo-wood composite material board according to claim 1, characterized in that: The specifications of the aramid fiber cloth are 200D60G-3000D400G.
5. The aramid fiber reinforced bamboo-wood composite material board according to claim 1, characterized in that: The thickness of the first grafted modified polyethylene resin film layer and the second grafted modified polyethylene resin film layer is 0.04 mm.
6. The aramid fiber reinforced bamboo-wood composite material board according to claim 1, characterized in that: The surface veneer layer is a 1.4mm thick wood veneer.
Citation Information
Patent Citations
Integrated molding, fiber-reinforced composite material board and housing for electric / electronic device
CN101824205A
Formaldehyde-free membranous wood adhesive and preparation and using methods thereof
CN103467769B
Fiber-reinforced composite plate and steel plate composite structure for strengthening concrete beams
CN106337567B