Vapor chamber and radiator
By setting connection holes on the heat spreader and using heat pipes as liquid injection pipes, the problems of high production difficulty and high cost in the existing technology are solved, achieving more efficient production and better heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-10
- Publication Date
- 2026-03-03
AI Technical Summary
The manufacturing process of existing 3DVC heat sinks has increased production difficulty and cost due to the V-shaped notch and the liquid injection tube, which reduces the heat conduction area and makes it difficult to seal the liquid injection tube.
Connection holes are set on the top and bottom plates of the heat spreader, and heat pipes are used as liquid injection pipes, eliminating the need for the liquid injection pipe mounting groove, simplifying the production process, improving production efficiency, and increasing the heat conduction area.
The production process of the vapor chamber has been simplified, production costs have been reduced, production efficiency and thermal conductivity have been improved, heat dissipation capacity has been enhanced, and the high-efficiency heat dissipation requirements in small spaces have been met.
Smart Images
Figure CN223965938U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation device technology, and in particular to a heat exchanger and a heat sink. Background Technology
[0002] Most 3DVC heat sinks connect the VC (vapor chamber) cavity to the heat pipes using a welding process, forming a single integrated cavity. The cavity is filled with liquid working fluid and then evacuated. The working fluid evaporates on the substrate surface near the heat source and condenses at the far end, achieving a two-phase gas-liquid circulation driven by capillary force, thus achieving ideal uniform temperature dissipation.
[0003] In the process of developing this application, the inventors discovered at least the following problems in the prior art: Most existing 3DVC heat sinks' vapor chambers 1 are like... Figure 1 As shown, a V-shaped notch (mounting groove 11) is provided on one side of the heat spreader 1, and an injection pipe 3 is welded at the notch. The setting of the V-shaped notch and the injection pipe 3 will increase the manufacturing difficulty of the heat spreader 1, reduce production efficiency, and reduce the heat conduction area of the heat spreader 1. Furthermore, the interference of the V-shaped notch will also increase the difficulty of sealing the injection pipe 3. Summary of the Invention
[0004] Based on this, this application provides a vapor chamber and a radiator to improve the problems of complex manufacturing process and high production cost of vapor chambers in the prior art.
[0005] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:
[0006] On one hand, this application provides a heat spreader, including a top plate and a bottom plate, the top plate and the bottom plate being fixedly connected, and a cavity being formed between the top plate and the bottom plate. The cavity is used to fill with a cooling medium and to form a vacuum environment. The top plate and / or the bottom plate are provided with at least one connecting hole, the connecting hole communicating with the cavity. The connecting hole is used to connect a heat pipe, and at least one heat pipe is used to inject liquid into the cavity.
[0007] In one embodiment, the heat spreader is characterized by comprising a top plate and a bottom plate, the top plate and the bottom plate being fixedly connected, and forming a cavity between the top plate and the bottom plate, the cavity being used to fill with a cooling medium and to form a vacuum environment; the top plate and / or the bottom plate are provided with at least one connecting hole, the connecting hole being used to connect a heat pipe, the heat pipe serving as a liquid injection pipe for the heat spreader.
[0008] In one embodiment, the top plate and the bottom plate are both copper plates.
[0009] In one embodiment, the connecting hole is located on the side wall of the groove, or the connecting hole is located on the top plate.
[0010] In one embodiment, the temperature distribution plate further includes a capillary layer and copper pillars disposed in the cavity. The capillary layer is disposed on the inner wall of the top plate and / or the bottom plate, and the two ends of the copper pillars abut against the top plate, the bottom plate and the capillary layer, respectively.
[0011] On the other hand, embodiments of this application provide a heat sink, including at least one heat pipe and a vapor chamber as described above, wherein the evaporation end of the heat pipe is connected to the connection hole, and at least one condensation end of the heat pipe serves as the liquid injection port of the vapor chamber.
[0012] In one embodiment, the base plate has connection holes on its four sides, and each connection hole is connected to a heat pipe.
[0013] In one embodiment, a plurality of connection holes are provided on both sides of the cavity along its length, and a heat pipe is connected to each of the connection holes.
[0014] In one embodiment, at least one of the heat pipes located on the same side of the cavity along its length serves as a liquid injection pipe.
[0015] In one embodiment, the radiator further includes heat sinks and a cold source, the heat sinks being disposed on the vapor chamber and / or the heat pipe, and the cold source being used for heat exchange with the vapor chamber.
[0016] This application has at least the following beneficial effects: The vapor chamber and radiator provided in this application have connection holes on the top and / or bottom plates of the vapor chamber, through which heat pipes are connected, serving as the liquid injection pipes for the vapor chamber. This eliminates the need for additional liquid injection pipes in the structure of the vapor chamber itself, and avoids the need for grooving, simplifying the overall structure, making manufacturing easier, and improving production efficiency. Furthermore, the elimination of the need for additional welding or use of liquid injection pipes not only simplifies the production process and improves production efficiency but also reduces the number of components used, effectively lowering costs. Moreover, since no grooving is required on the vapor chamber, the overall heat conduction area is increased without changing the external dimensions of the vapor chamber. This improves the heat dissipation capacity within a limited space, meeting higher heat dissipation requirements in small spaces. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of a conventional heat exchanger.
[0018] Figure 2This is a three-dimensional structural diagram of the heat sink according to an embodiment of this application.
[0019] Figure 3 This is a front view structural diagram of the heat sink according to an embodiment of this application.
[0020] Figure 4 This is a cross-sectional view of the heat sink according to an embodiment of this application.
[0021] Figure 5 for Figure 4 An enlarged schematic diagram of the structure at point A.
[0022] The meanings of the labels in the attached diagram are as follows:
[0023] 1. Heat spreader; 11. Mounting slot; 12. Base plate; 13. Top plate; 14. Cavity; 15. Copper column; 16. Capillary layer; 2. Heat pipe; 21. Liquid injection port; 3. Liquid injection pipe. Detailed Implementation
[0024] The technical solution of this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to limit the ways in which this application may be implemented. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0026] In the description of this application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0028] Please see Figure 1 and Figure 2 The heat spreader 1 in this embodiment includes a top plate 13 and a bottom plate 12, which are fixedly connected and form a cavity 14 between them. The cavity 14 is used to fill with cooling medium and to create a vacuum environment. The top plate 13 and / or the bottom plate 12 are provided with at least one connection hole (not shown), which communicates with the cavity 14 and is used to connect a heat pipe 2. The heat pipe 2 can be used as a liquid injection pipe 3 for the heat spreader 1 to fill the cavity 14 with cooling medium.
[0029] In this embodiment, the overall shape of the heat spreader 1 is rectangular. Since there is no need to install a separate injection pipe 3 on the heat spreader 1, the installation process of the injection pipe 3 is eliminated, and the use of injection pipe assemblies is reduced, making the manufacturing of the heat spreader 1 simpler, improving production efficiency, and reducing production costs. At the same time, since there is no need to install the injection pipe 3 on the body of the heat spreader 1, there is no need to open the mounting groove 11 for installing the injection pipe 3 on the heat spreader 1. When producing and processing the top plate 13 and the bottom plate 12, there is no need to add a grooving process, which improves processing efficiency and reduces processing difficulty. In addition, the utilization of the area of the original grooving can increase the heat conduction area of the heat spreader 1, so that the heat spreader 1 has a better heat conduction effect.
[0030] Specifically, both the top plate 13 and the bottom plate 12 are made of copper. The top plate 13 is a flat plate, and the inner side of the bottom plate 12 has a groove, forming a cavity 14 between the groove and the top plate 13. The top plate 13 is used for heat exchange with a cold source (such as a fan or liquid cooling device), and the bottom plate 12 is used for heat exchange with a heat source (such as a server). Generally, when installing and fixing it to the device to be cooled, the bottom plate 12 can be in direct or indirect contact with the device to be cooled, with the bottom plate 12 facing downwards and the top plate 13 facing upwards.
[0031] The connection hole can be located on the side wall of the groove, or it can be located on the top plate 13. For example, when the connection hole is located on the peripheral side wall of the bottom plate 12, the central axis of the heat pipe 2 after connection is parallel to the bottom plate 12. When the connection hole is located on the top plate 13, the central axis of the heat pipe 2 after connection is perpendicular to the bottom plate 12. Preferably, the connection hole is located on the side wall of the groove.
[0032] like Figure 4 and Figure 5 As shown, to enhance the heat conduction and heat dissipation of the heat exchanger 1, a capillary layer 16 and copper pillars 15 can be provided inside the cavity 14 of the heat exchanger 1. The capillary layer 16 is located on the inner wall of the top plate 13 and / or the bottom plate 12, and the two ends of the copper pillars 15 abut against the top plate 13, the bottom plate 12, and the capillary layer 16, respectively. The capillary layer 16 can be provided only on the inner wall of the top plate 13 or the inner wall of the bottom plate 12, or it can be provided on both the inner wall of the top plate 13 and the inner wall of the bottom plate 12. The capillary layer 16 can be, for example, a copper mesh.
[0033] During use, the cooling medium in the heat exchange plate 1 exchanges heat with the heat source at the evaporation end (one side of the bottom plate 12). After being heated and vaporized, it exchanges heat with the cold source at the condensation end (one side of the top plate 13) and is cooled and liquefied. The liquefied cooling medium flows back to the evaporation end through the capillary layer 16. In this way, the cooling medium continuously liquefies and vaporizes in the cavity 14, carrying away the heat from the heat source and thus cooling the heat source.
[0034] like Figure 2 and Figure 3 As shown, this application embodiment also provides a heat sink, including a heat pipe 2 and a heat spreader 1 as described in the above embodiment. The evaporation end of the heat pipe 2 is connected to a connection hole, and at least one condensation end of the heat pipe 2 serves as a liquid injection port 21 for the heat spreader 1.
[0035] Specifically, before the cooling medium is filled into the heat pipe 2 used as the injection pipe 3, its condensing end (the end away from the heat pipe 1) is not sealed. After the cooling medium is filled and the heat pipe 1 is evacuated, the heat pipe 2 is then sealed. To facilitate the sealing operation of the heat pipe 2, the length of the injection port 21 of the heat pipe 2 used as the injection pipe can be appropriately extended. In this embodiment, there are no obstructions at the end of the heat pipe 2 to be sealed, and the sealing operation is not limited by the space of other components, reducing the difficulty of sealing. Moreover, the inner diameter of the heat pipe 2 is larger than that of the traditional injection pipe 3, which enhances the evacuation effect of the cavity 14 of the heat pipe 1, making it easier to extract the non-condensable gas in the cavity 14. The cross-sectional shape of the heat pipe 2 can be selected according to specific needs, such as... Figure 2 As shown, heat pipe 2 is connected to the side wall of the heat spreader 1. Since the heat spreader 1 is relatively thin, to increase the cross-sectional area of heat pipe 2, it can be made into a rectangular cross-section. In other embodiments, heat pipe structures of other shapes, such as circular cross-sections, can also be selected. Heat pipe 2 can be made of oxygen-free copper, for example. Heat pipe 2 and heat spreader 1 can be fixedly connected by welding.
[0036] Specifically, connection holes can be provided on the four side walls of the base plate 12, and each connection hole is connected to a heat pipe 2, that is, heat pipes 2 are provided on all four sides of the cavity 14. In this embodiment, multiple connection holes are provided on both sides of the cavity 14 along its length, and each connection hole is connected to a heat pipe 2. In this embodiment, several heat pipes 2 are provided on opposite sides of the cavity 14. The number of heat pipes 2 can be determined by considering factors such as space, cost, and heat dissipation requirements. The more heat pipes 2 there are, the stronger the heat dissipation capacity of the radiator. To further improve the vacuuming effect of the cavity 14, one or more of the heat pipes 2 on the same side of the cavity 14 can be selected as liquid injection pipes 3. In this way, the heat pipes 2 located on both sides of the cavity 14 can be used simultaneously to vacuum the heat spreader 1. Alternatively, depending on the distance of the vacuum station of the vacuum equipment, the number and position of the heat pipes 2 used as injection pipes 3 (the heat pipes 2 used as injection pipes 3 are equipped with injection ports 21, which are also used to evacuate the heat spreader 1) can be selected to form multiple evacuation paths, which can significantly shorten the time required for evacuation and improve the evacuation effect.
[0037] The heat sink in this embodiment also includes heat sink fins (not shown) and a cold source (not shown). The heat sink fins are disposed on the heat spreader 1 and / or heat pipe 2, and the cold source is used for heat exchange with the heat spreader 1. The heat sink fins may be, for example, heat dissipation fins, etc., and the cold source may be, for example, a fan, a cold plate, etc.
[0038] The vapor chamber and radiator provided in this application reduce the need for welding injection pipes in conventional radiators, effectively lowering production costs and improving production efficiency. Using heat pipes as injection pipes effectively reduces the difficulty of sealing the injection pipe ends, improving production efficiency and sealing reliability. Simultaneously, the large-diameter heat pipes are used for vacuuming the vapor chamber, effectively improving vacuuming efficiency and enhancing the vacuuming effect. The installation of injection pipes on the vapor chamber and the elimination of the mounting groove for injection pipes reduce the processing difficulty of the vapor chamber, increase its heat conduction area, and enhance the heat dissipation effect of the radiator. This design effectively improves the heat dissipation capacity of the radiator, prevents overheating of the device to be cooled, and ensures stable performance. The vapor chamber and radiator product structure of this application has strong applicability, does not affect the original appearance of the product, and effectively improves heat dissipation capacity without increasing the radiator volume.
[0039] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0040] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A vapor chamber, characterized by: The even temperature plate comprises a top plate and a bottom plate, which are fixedly connected and form a cavity between them, the cavity is used to fill cooling medium and form a vacuum environment; at least one connecting hole is arranged on the top plate and / or the bottom plate, the connecting hole is communicated with the cavity, and the connecting hole is used to connect a heat pipe, and at least one heat pipe is used to inject liquid into the cavity.
2. The vapor chamber of claim 1, wherein: The top plate is a flat plate, the inner side of the bottom plate is provided with a groove, the cavity is formed between the groove and the top plate, the top plate is used to exchange heat with a cold source, and the bottom plate is used to exchange heat with a heat source.
3. The vapor chamber of claim 1, wherein: The top plate and the bottom plate are copper plates respectively.
4. The vapor chamber of claim 2, wherein: The connecting hole is arranged on the side wall of the groove, or the connecting hole is arranged on the top plate.
5. The vapor chamber of claim 1, wherein: A capillary layer and a copper column are further arranged in the cavity, the capillary layer is arranged on the inner wall of the top plate and / or the bottom plate, and the two ends of the copper column are abutted with the top plate, the bottom plate and the capillary layer respectively.
6. A heat spreader characterized by: The even temperature plate comprises at least one heat pipe and the even temperature plate as claimed in any one of claims 1 to 5, the evaporation end of the heat pipe is connected to the connecting hole, and the condensation end of at least one heat pipe is used as a liquid injection port of the even temperature plate.
7. The heat spreader of claim 6, wherein: The connecting hole is arranged on the side wall of the groove, or the connecting hole is arranged on the top plate.
8. The heat spreader of claim 6, wherein: A capillary layer and a copper column are further arranged in the cavity, the capillary layer is arranged on the inner wall of the top plate and / or the bottom plate, and the two ends of the copper column are abutted with the top plate, the bottom plate and the capillary layer respectively.
9. The heat spreader of claim 6, wherein: The even temperature plate comprises at least one heat pipe and the even temperature plate as claimed in any one of claims 1 to 5, the evaporation end of the heat pipe is connected to the connecting hole, and the condensation end of at least one heat pipe is used as a liquid injection port of the even temperature plate.
10. A heat sink as claimed in any one of claims 6 to 9, wherein: The connecting hole is arranged on the side wall of the groove, or the connecting hole is arranged on the top plate. A capillary layer and a copper column are further arranged in the cavity, the capillary layer is arranged on the inner wall of the top plate and / or the bottom plate, and the two ends of the copper column are abutted with the top plate, the bottom plate and the capillary layer respectively. The even temperature plate comprises at least one heat pipe and the even temperature plate as claimed in any one of claims 1 to 5, the evaporation end of the heat pipe is connected to the connecting hole, and the condensation end of at least one heat pipe is used as a liquid injection port of the even temperature plate.