Mainboard structure and intelligent host

Abstract

The utility model provides a mainboard structure and an intelligent host, the mainboard structure comprises a mainboard body and a circuit structure, and the circuit structure is arranged on the surface of the mainboard body or arranged on the surface and inside of the mainboard body; the mainboard further comprises a net-shaped metal layer, and the net-shaped metal layer is formed by carving copper materials, is integrally formed on the surface of the mainboard body and surrounds at least part of the circuit structure. On one hand, heat generated by a circuit structure on the mainboard body is absorbed and conducted through the net-shaped metal layer to assist the mainboard to dissipate heat in time, and on the other hand, a stable electromagnetic shielding layer is formed on the surface of the mainboard through the net-shaped metal layer to reflect and absorb electromagnetic interference signals generated by electronic elements in the circuit structure. Meanwhile, through the net-shaped metal layer, the overall structural strength of the mainboard body is improved, the impact resistance of the mainboard body is improved, stable and efficient operation of the intelligent host is effectively guaranteed, and the service life of the intelligent host is prolonged.

Description

Technical Field

[0001] This application relates to the field of smart terminal motherboard technology, and further to a motherboard structure and a smart host. Background Technology

[0002] In recent years, with the advancement of technology and the development of science and technology, my country's smart host industry has developed rapidly; for example, smartwatches and other smart wearable devices have become an indispensable part of modern life.

[0003] In related technologies, the motherboard, as the core component of a smart host, directly affects the performance, stability, battery life, and user experience of the corresponding smart host due to its heat dissipation and electromagnetic interference resistance capabilities. Currently, most smart host products in the industry, such as smartwatches, are small in size and highly integrated, with limited heat dissipation capabilities. Severe electromagnetic interference between internal components easily leads to overheating during actual operation, resulting in various problems such as decreased operating speed and shortened battery life. Furthermore, the poor stability of wireless communication functions contributes to a subpar user experience, indicating areas for improvement. Utility Model Content

[0004] The purpose of this application is to provide a motherboard structure and a smart host that, through reasonable heat dissipation and anti-electromagnetic interference design, achieves stable heat dissipation of the motherboard, improves the communication effect of the corresponding smart host product, ensures its stable and efficient operation, extends its battery life, and enhances the performance and user experience of the corresponding product.

[0005] The technical solution provided in this application is as follows:

[0006] On the one hand, this application provides a motherboard structure, including:

[0007] Motherboard itself;

[0008] The circuit structure is disposed on the surface of the motherboard body, or on the surface and inside the motherboard body;

[0009] A mesh metal layer covers the surface of the motherboard body and is integrally formed with the motherboard body; the mesh metal layer surrounds at least a portion of the circuit structure on the surface of the motherboard body.

[0010] The motherboard structure provided in this application utilizes a mesh metal layer to tightly surround key areas on the motherboard body, including areas with concentrated chips, high-speed signal traces, and other critical components prone to heat generation and electromagnetic interference. During the operation of the corresponding smart host product, the mesh metal layer promptly absorbs and conducts heat generated by electronic components such as processor chips in the motherboard's circuit structure, minimizing performance degradation and component aging caused by high temperatures. This effectively extends the lifespan of the smart host and ensures stable and reliable operation. Simultaneously, as a continuous conductor, the mesh metal layer forms an electromagnetic shielding layer that stably reflects and absorbs electromagnetic interference signals generated by electronic components such as communication module chips in the motherboard's circuit structure, effectively shielding against electromagnetic interference. This significantly improves the communication performance of smartwatches and other smart host products, enhancing signal quality and improving user experience.

[0011] In addition, due to the characteristics of the mesh structure, the mesh metal layer covering the surface of the motherboard greatly enhances the structural stability of the motherboard, improves its resistance to pressure and impact, thereby reducing the risk of failure caused by deformation, significantly ensuring the reliability of smartwatches and other smart host products in complex usage environments, and effectively reducing the after-sales maintenance costs of the corresponding smart host products.

[0012] In some embodiments, the mesh metal layer is configured as a mesh copper layer, which is etched into shape.

[0013] The motherboard structure provided in this application utilizes the excellent conductivity of copper. Interference signals induce current within the copper structure, and the reverse magnetic field generated by this induced current cancels out the magnetic field of the interference signal, effectively shielding against electromagnetic interference. Furthermore, the use of copper to form the mesh metal layer ensures readily available materials, convenient production, and cost reduction and efficiency improvement for enterprises.

[0014] In some implementations, the mesh metal layer is connected to the ground wire of the motherboard body.

[0015] In some embodiments, the magnetic bead filter includes a plurality of magnetic bead filters, each of which is disposed at a point corresponding to an intersection of the mesh metal layer and surrounds at least a portion of the circuit structure on the surface of the motherboard body, in order to suppress high-frequency noise and spike interference in the corresponding circuit structure.

[0016] In some embodiments, the mesh metal layer is provided with a wave-absorbing material layer, which is annular and surrounds at least a portion of the circuit structure on the surface of the motherboard body.

[0017] The motherboard structure provided in this application allows for the placement of ferrite bead filters at the grid intersections of the mesh metal layer or the coating of the mesh metal layer with absorbing material to filter interference signals of specific frequencies. This helps to further purify the electromagnetic environment on the motherboard and further reduce electromagnetic interference between different modules within the corresponding smart host product.

[0018] In some embodiments, the motherboard body includes an upper surface and a lower surface located at both ends in its thickness direction;

[0019] The mesh metal layer includes a first metal layer and a second metal layer; the first metal layer and the second metal layer are respectively formed on the upper surface and the lower surface of the motherboard body;

[0020] A connector is provided between the first metal layer and the second metal layer, the connector passing through the motherboard body to connect the first metal layer and the second metal layer.

[0021] The motherboard structure provided in this application utilizes a first metal layer and a second metal layer to cover key parts on the upper and lower surfaces of the motherboard body that are prone to heat generation and electromagnetic interference, which helps to significantly improve the overall heat dissipation effect and anti-electromagnetic interference performance of the motherboard body, thereby effectively ensuring the stable and efficient operation of the corresponding smart host and guaranteeing its performance and user experience.

[0022] In some embodiments, the connector includes a first body portion, which is disposed at the mesh intersection points of the first metal layer and the second metal layer, and corresponds to the first metal layer and the second metal layer respectively.

[0023] The first body portion is located in a region inside the motherboard body where the circuit structure is not located.

[0024] In some embodiments, the first body portion is disposed in the region of the first metal layer and the second metal layer near the edge of the motherboard body.

[0025] The motherboard structure provided in this application places the first body on the first metal layer and the second metal layer in the region near the edge of the motherboard body. While ensuring the circuit conduction between the first metal layer and the second metal layer, the layout structure is simplified, which helps to ensure the ease of production of the corresponding motherboard.

[0026] In some embodiments, the connector includes a second body portion located in a region inside the motherboard body where the circuit structure is not disposed.

[0027] The motherboard structure provided in this application includes a second body section, which, while ensuring circuit continuity between the first and second metal layers, helps to further enhance the structural stability of the motherboard body and further reduce the probability of deformation due to impact or compression.

[0028] On the other hand, this application also provides a smart host, including any of the motherboard structures described above.

[0029] Compared with the prior art, the motherboard structure and intelligent host provided in this application have at least one of the following features:

[0030] Beneficial effects:

[0031] 1. The mesh metal layer structure design in this application, on the one hand, helps to absorb and conduct heat generated by the circuit structure on the motherboard in a timely manner, reducing the probability of problems such as reduced operating speed and accelerated aging of electronic components due to overheating during the operation of the motherboard; at the same time, its mesh structure characteristics and layout significantly improve the structural stability of the motherboard, thereby effectively helping the motherboard resist external forces such as collisions and compressions in daily use, reducing the risk of failure caused by motherboard deformation, and ensuring the operational reliability of the corresponding smart host product in various complex environments; on the other hand, it effectively improves the electromagnetic shielding performance of the motherboard, reduces electromagnetic interference inside the corresponding smart host product, significantly improves the communication effect of the corresponding smart host product, and makes the corresponding smart host product have good overall performance and a good user experience.

[0032] 2. In this application, copper is selected to make the mesh metal layer, and combined with measures such as magnetic bead filters or absorbing materials, the electromagnetic shielding performance of corresponding smart host products such as smartwatches is effectively guaranteed; moreover, all materials are readily available and production is convenient, which is conducive to reducing costs and increasing efficiency for enterprises.

[0033] 3. This application provides a connector to connect the first metal layer and the second metal layer. While ensuring the continuity of the circuit between the first metal layer and the second metal layer, the heat generated by the motherboard body is absorbed by the connector in a timely manner and conducted to the first metal layer and the second metal layer respectively, which helps to further improve the heat dissipation capacity of the motherboard body. Attached Figure Description

[0034] The preferred embodiments will now be described in a clear and easy-to-understand manner, with reference to the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of this solution.

[0035] Figure 1 This is a cross-sectional view illustrating the way the mesh metal layer is disposed on the surface of the motherboard body, which is the main embodiment of this application.

[0036] Figure 2This is a top view of the main structure of the motherboard body, which is the main embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Mainboard body; 2. Circuit structure; 3. Mesh metal layer; 31. First metal layer; 32. Second metal layer; 33. Connector; 331. First body; 332. Second body; 4. Ferrite bead filter. Detailed Implementation

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0040] To keep the drawings concise, each drawing only schematically shows the parts relevant to this application, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of the components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0041] In the smart PC industry, the motherboard, as a core component, significantly impacts product performance and user experience due to its heat dissipation and electromagnetic interference (EMI) resistance. Therefore, optimizing motherboard structural design and improving its heat dissipation and EMI resistance has become a crucial research direction in the smart PC industry, with profound implications for its development.

[0042] For this, please refer to the accompanying drawings in the instruction manual. Figure 1 and Figure 2 In one embodiment, a motherboard structure is provided that significantly reduces electromagnetic interference signals between electronic components while improving its heat dissipation capacity, thereby helping to ensure the stable and reliable performance of the corresponding smart host product and improving its communication effect and user experience. It includes a motherboard body 1 and a circuit structure 2 disposed on its surface. Of course, depending on the function to be implemented, the circuit structure 2 may also be disposed inside the motherboard body 1. It also includes a mesh metal layer 3, which covers the surface of the motherboard body 1 and is integrally formed with the motherboard body 1, and the mesh metal layer 3 surrounds at least a portion of the circuit structure 2 on the surface of the motherboard body 1.

[0043] The mesh metal layer 3 tightly surrounds the surface of the motherboard body 1, covering key areas prone to heat generation and electromagnetic interference, such as the processor chip and high-speed signal traces. In actual operation, the mesh metal layer 3 absorbs and conducts heat generated by electronic components like the processor chip in the circuit structure 2 of the motherboard body 1, assisting in timely heat dissipation and reducing the probability of performance degradation and accelerated aging of electronic components due to high temperatures. This significantly extends the lifespan of the corresponding smart host product and improves its stability and reliability. Furthermore, as a continuous conductor, the mesh metal layer 3 forms a stable electromagnetic shielding layer on the motherboard surface, reflecting and absorbing electromagnetic interference signals generated by electronic components in the circuit structure 2. This shields against electromagnetic interference, significantly improving the communication performance of the corresponding smart host product, enhancing signal quality, reducing data errors from sensors, and effectively ensuring the stability and reliability of the smart host product. Simultaneously, due to the mesh structure of the mesh metal layer 3, its placement on the surface of the motherboard body 1 allows the motherboard body 1 to effectively resist external forces such as collisions and pressure during daily use, reducing deformation and the risk of malfunctions caused by deformation. This effectively improves the reliability of the smartwatch in various complex usage environments and reduces after-sales maintenance costs.

[0044] In one embodiment, based on the above embodiments, specifically, since copper has good electrical conductivity and a simple processing technology, copper is preferred as the production material for the mesh metal layer 3 in this embodiment. The mesh metal layer 3 is processed by an engraving and forming process to achieve its integral molding with the motherboard body 1. Of course, in the embodiments of this application, the mesh metal layer 3 can also be made of other metal materials such as stainless steel, tinplate, and aluminum alloy, and can also be formed using other processing technologies. This application does not impose specific limitations on this.

[0045] Furthermore, the embodiments of this application do not impose specific limitations on the shape and size of the mesh metal layer 3. This embodiment only uses the example of... Figure 2 The square structure shown is used as an example for demonstration and explanation; at the same time, the motherboard body 1 is used as an example of a four-layer motherboard for demonstration and explanation.

[0046] Reference Figure 1The motherboard body 1 includes an upper surface and a lower surface. In this embodiment of the application, the upper surface and the lower surface refer to the two side surfaces of the motherboard body 1 in the thickness direction, respectively. Furthermore, to stably improve the heat dissipation and electromagnetic interference resistance of the motherboard body 1, in this embodiment, the mesh metal layer 3 includes a first metal layer 31 and a second metal layer 32. The first metal layer 31 is fixedly disposed on the upper surface of the motherboard body 1, and the second metal layer 32 is fixedly disposed on the lower surface of the motherboard body 1. Moreover, a connector 33 is provided between the first metal layer 31 and the second metal layer 32 to connect them. During assembly, the connector 33 penetrates the motherboard body 1 along the thickness direction, and its two ends are integrally formed with the first metal layer 31 and the second metal layer 32. After the first metal layer 31 and the second metal layer 32 are connected through the connector 33, they are respectively grounded.

[0047] During the operation of the smart host product, the connector 33 absorbs and conducts the heat of the motherboard body 1 to the first metal layer 31 and the second metal layer 32 respectively, so as to further accelerate the heat dissipation of the motherboard body 1.

[0048] Specifically, refer to Figure 1 The connector 33 includes a first body portion 331. In order to ensure the connection stability between the first metal layer 31 and the second metal layer 32, in this embodiment, the first body portion 331 includes at least a plurality of parts. Each first body portion 331 is provided corresponding to the mesh intersection of the mesh metal layer 3, and its two ends correspond to the first metal layer 31 and the second metal layer 32 respectively.

[0049] In this embodiment, in order to simplify the manufacturing process and facilitate the laying of the circuit structure 2 on the motherboard, it is preferable that the first body part 331 is disposed in the area of ​​the mesh metal layer 3 corresponding to the edge of the motherboard body 1, that is, the first body part 331 is disposed in the area of ​​the first metal layer 31 and the second metal layer 32 near the edge of the motherboard body 1.

[0050] Of course, in this embodiment of the present application, the connector 33 may also include a second body portion 332, which also conducts the first metal layer 31 and the second metal layer 32; the difference is that the second body portion 332 is located in the middle of the motherboard body 1, so as to further enhance the structural stability of the motherboard by utilizing the second body portion 332.

[0051] In the embodiments of this application, the placement of the first body part 331 and the second body part 332 is not specifically limited, as long as they avoid the circuit structure 2 on the motherboard body 1; in addition, the number of the first body part 331 and the second body part 332 is not specifically limited; of course, the number and position of the connector 33 should not be regarded as a specific limitation on the scope of protection of this application, and can be reasonably selected according to the shape, size and circuit structure 2 layout of the motherboard body 1.

[0052] As a preferred embodiment, to further ensure electromagnetic interference resistance, multiple ferrite bead filters 4 are provided at the grid intersections of the first metal layer 31 and / or the second metal layer 32. The multiple ferrite bead filters 4 form one or more preset annular regions. The preset annular regions surround key areas of signal interference such as the communication module chip. That is, the multiple ferrite bead filters 4 surround one or more circuit structures 2 on the surface of the motherboard body 1 to suppress high-frequency noise and spike interference in the corresponding circuit structure 2, filter interference signals of specific frequencies, stabilize and purify the electromagnetic environment on the motherboard body 1, so as to ensure the communication effect of the corresponding smart host products after the motherboard body 1 is applied to various smart host products.

[0053] In the embodiments of this application, the shape and size of the preset annular region are not specifically limited. In this embodiment, only the shape and size of the preset annular region are used as an example. Figure 2 The example shown is a rectangular ring-shaped preset annular area.

[0054] Of course, in addition to setting up the magnetic bead filter 4, the filtering effect can also be achieved by coating the surface of the mesh metal layer 3 with absorbing materials such as ferrite.

[0055] To ensure the completeness of the technical solution of this application, the following will further elaborate on the technical solution of this application by taking the above motherboard structure applied to a smart host as an example. In one embodiment, a smart host may also be provided, the smart host including a smart watch, the smart watch using the motherboard structure described in any of the above embodiments to process various instructions, store data and realize communication and sensor functions.

[0056] Of course, the smart host may also include other smart products such as tablets.

[0057] The implementation principle of this embodiment is as follows: During the operation of the smartwatch, the first metal layer 31 and the second metal layer 32 absorb and conduct the heat generated by electronic components such as processor chips in the circuit structure 2 on the motherboard body 1, while shielding electromagnetic interference signals generated by electronic components such as communication module chips. This effectively solves the heat dissipation problem of the smartwatch motherboard body 1, significantly improves the electromagnetic shielding performance, reduces internal electromagnetic interference, and enhances the overall structural stability of the motherboard body 1, preventing deformation. This ensures the stable and efficient operation of the smartwatch, improving its product performance and user experience.

[0058] It should be noted that the above embodiments can be freely combined as needed. The above description is only a preferred embodiment of this application. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the protection scope of this application.

Claims

1. A motherboard structure, characterized in that, include: Motherboard itself; The circuit structure is disposed on the surface of the motherboard body, or on the surface and inside the motherboard body; A mesh metal layer covers the surface of the motherboard body and is integrally formed with the motherboard body; the mesh metal layer is disposed around at least a portion of the circuit structure on the surface of the motherboard body.

2. The motherboard structure according to claim 1, characterized in that, The mesh metal layer is a mesh copper layer, and the mesh metal layer is etched into shape.

3. The motherboard structure according to claim 1, characterized in that, The mesh metal layer connects to the ground wire of the motherboard body.

4. A motherboard structure according to any one of claims 1-3, characterized in that, The ferrite bead filter includes multiple ferrite bead filters, each of which is disposed at a point corresponding to the intersection of the mesh metal layer and surrounds at least a portion of the circuit structure on the surface of the motherboard body, in order to suppress high-frequency noise and spike interference in the corresponding circuit structure.

5. A motherboard structure according to any one of claims 1-3, characterized in that, The mesh metal layer is provided with a wave-absorbing material layer, which is annular and surrounds at least a portion of the circuit structure on the surface of the motherboard body.

6. A motherboard structure according to any one of claims 1-3, characterized in that, The motherboard body includes an upper surface and a lower surface located at both ends in its thickness direction; The mesh metal layer includes a first metal layer and a second metal layer; the first metal layer and the second metal layer are respectively formed on the upper surface and the lower surface of the motherboard body; A connector is provided between the first metal layer and the second metal layer, the connector passing through the motherboard body to connect the first metal layer and the second metal layer.

7. A motherboard structure according to claim 6, characterized in that, The connector includes a first body portion, which is provided at the intersection point of the grid of the first metal layer and the second metal layer, and corresponds to the first metal layer and the second metal layer respectively. The first body portion is located in a region inside the motherboard body where the circuit structure is not located.

8. A motherboard structure according to claim 7, characterized in that, The first body portion is disposed in the region of the first metal layer and the second metal layer near the edge of the motherboard body.

9. A motherboard structure according to claim 6, characterized in that, The connector includes a second body portion, which is located in the area of ​​the motherboard body in which the circuit structure is not provided.

10. A smart host, characterized in that, Includes the motherboard structure described in any one of claims 1-9 above.

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