Mounting mechanism, case and electronic equipment

Abstract

The embodiment of the utility model provides a mounting mechanism, a case and electronic equipment, the mounting mechanism is applied to the case, the case is provided with a placement cavity, the case comprises a first case wall and a second case wall which are perpendicular to each other, and the mounting mechanism comprises a mounting assembly which is arranged in the placement cavity of the case, the accommodating cavity of the mounting assembly is used for arranging a board card module of the electronic equipment, and the mounting assembly is parallel to the first box wall; and the electric connecting piece is used for electrically connecting a board card module and a mainboard of the electronic equipment, and the mainboard is parallel to the first box wall.

Description

Technical Field

[0001] This application relates to an installation mechanism, a chassis, and electronic equipment. Background Technology

[0002] With societal development and improved living standards, people have increasingly higher demands for computer performance. This has spurred the rapid development of high-performance components. For example, as graphics cards have improved in performance, they have become larger and heavier, rendering the conventional direct-plug installation method no longer suitable for small-sized computer cases.

[0003] When faced with the problem of large graphics cards that are difficult to install directly onto the motherboard in small cases, the current solution is to install the graphics card using an adapter cable. While this method allows the graphics card to be installed in a small case, it also presents problems such as difficulty in securing the graphics card and instability. Utility Model Content

[0004] In view of the above-mentioned problems existing in the prior art, the purpose of this application embodiment is to provide a mounting mechanism applied to a chassis, the chassis having a placement cavity, the chassis including a first chassis wall and a second chassis wall perpendicular to each other, the mounting mechanism comprising:

[0005] The mounting assembly is disposed within the placement cavity of the chassis, and the receiving cavity of the mounting assembly is used to house the board module of the electronic device. The mounting assembly is parallel to the first chassis wall.

[0006] Electrical connectors are used to electrically connect the board module and the motherboard of the electronic device, wherein the motherboard is parallel to the first enclosure wall;

[0007] When the board module is disposed in the receiving cavity, the mounting assembly has a first use state and a second use state, and the volume of the receiving cavity is different in the first use state and the second use state.

[0008] As an optional embodiment, the mounting assembly includes a mounting frame and a constraint plate detachably connected to the mounting frame. The mounting frame is parallel to the first box wall, and the constraint plate is perpendicularly disposed on one end of the mounting frame, forming a receiving cavity between the constraint plate and the other end of the mounting frame.

[0009] As the constraint plate moves along the mounting frame, it switches between a first position and a second position, thereby switching the mounting assembly between a first use state and a second use state.

[0010] As an optional embodiment, the constraint plate has a groove on the side away from the mounting bracket to fix the board module in the receiving cavity.

[0011] As an optional embodiment, the mounting mechanism further includes a heat dissipation component, which includes a cooling fan and a bracket for fixing the cooling fan to the mounting frame. The air inlet surface of the cooling fan is parallel to the constraint plate, and the constraint plate has a plurality of heat dissipation holes.

[0012] As an optional embodiment, the heat dissipation assembly further includes a telescopic member, one end of which abuts against the constraint plate and the other end of which is fixed to the bracket. The telescopic member is arranged parallel to the mounting frame, and the side of the telescopic member near the mounting frame has a groove-shaped surface to form a heat dissipation airflow between the mounting frame and the telescopic member.

[0013] As an optional embodiment, the telescopic member includes a first grooved plate and a second grooved plate. One end of the first grooved plate is inserted into the second grooved plate so that the first grooved plate can be displaced along the length direction of the second grooved plate. A first fixing member connected to the bracket is provided on the side of the first grooved plate near the bracket, and a second fixing member connected to the second grooved plate is provided on the side of the first grooved plate near the second grooved plate.

[0014] As an optional embodiment, the second fastener includes a groove and a mounting hole. The groove is disposed on the second grooved plate and is parallel to the length direction of the second grooved plate. The mounting hole is disposed on the first grooved plate. The second fastener also includes a fastener that passes through the groove and connects to the mounting hole to fix the first grooved plate and the second grooved plate together.

[0015] As an optional embodiment, the mounting bracket is provided with a connecting bracket at the end away from the constraint plate. The connecting bracket is detachably connected to the chassis. The connecting bracket is provided with a first IO interface and / or a second IO interface, and the first IO interface and the second IO interface are perpendicular to each other.

[0016] The purpose of this application embodiment is to provide a chassis, including:

[0017] First box wall;

[0018] The second box wall is vertically disposed on the first box wall and forms a placement cavity between the box wall and the first box wall;

[0019] The mounting assembly is disposed within the placement cavity of the chassis, and the receiving cavity of the mounting assembly is used to house the board module of the electronic device. The mounting assembly is parallel to the first chassis wall.

[0020] Electrical connectors are used to electrically connect the board module and the motherboard of the electronic device, wherein the motherboard is parallel to the first enclosure wall;

[0021] When the board module is disposed in the receiving cavity, the mounting assembly has a first use state and a second use state, and the volume of the receiving cavity is different in the first use state and the second use state.

[0022] The purpose of this application embodiment is to provide an electronic device, including a chassis, a motherboard disposed within the chassis, and board modules, wherein the chassis includes:

[0023] First box wall;

[0024] The second box wall is vertically disposed on the first box wall and forms a placement cavity between the box wall and the first box wall;

[0025] The mounting assembly is disposed within the placement cavity of the chassis, and the receiving cavity of the mounting assembly is used to house the board module. The mounting assembly is parallel to the first chassis wall.

[0026] Electrical connectors are used to electrically connect the board module and the motherboard, wherein the motherboard is parallel to the first enclosure wall;

[0027] When the board module is disposed in the receiving cavity, the mounting assembly has a first use state and a second use state, and the volume of the receiving cavity is different in the first use state and the second use state. Attached Figure Description

[0028] Figure 1 This is a schematic diagram illustrating the separation of the installation mechanism from the board module in an embodiment of this application.

[0029] Figure 2 This is a schematic diagram of the connection between the installation mechanism and the board module in an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the connection between the installation mechanism and the telescopic component in an embodiment of this application;

[0031] Figure 4 This is a schematic diagram of the structure of the telescopic component according to an embodiment of this application;

[0032] Figure 5 This is a schematic diagram of the assembly of a full-height card installed inside the chassis according to an embodiment of this application.

[0033] Figure 6 This is a schematic diagram of the assembly of a half-height card installed inside the chassis according to an embodiment of this application;

[0034] Figure 7 This is a schematic diagram of the chassis structure according to an embodiment of this application.

[0035] in,

[0036] 1. Mounting components; 11. Mounting bracket; 12. Constraint plate; 121. Groove section; 122. Heat dissipation hole; 2. Electrical connector; 31. Cooling fan; 32. Bracket; 4. Telescopic component; 41. First grooved plate; 42. Second grooved plate; 43. Groove surface; 44. Heat dissipation duct; 45. First fixing component; 46. Second fixing component; 461. Slide groove; 462. Fastener; 5. Connecting bracket; 51. First I / O interface; 52. Second I / O interface; 61. First enclosure wall; 62. Second enclosure wall; 7. Board module. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0038] Unless otherwise defined, the technical or scientific terms used in this invention shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0039] To keep the following description of the embodiments of the present invention clear and concise, detailed descriptions of known functions and known components are omitted.

[0040] This application provides an installation mechanism applied to a chassis, the chassis having a placement cavity, and the chassis including a first chassis wall 61 and a second chassis wall 62 that are perpendicular to each other.

[0041] In this embodiment, the chassis can be an SFF (Small Form Factor) chassis, which is a small-sized chassis that is typically small in size, compact in space, and has high requirements for the installation layout of internal components.

[0042] The chassis is used to house and protect the internal components of electronic equipment (such as the motherboard, board module 7, etc.), and the mounting cavity is the space inside the chassis used to house the various components of the electronic equipment. The first chassis wall 61 and the second chassis wall 62 serve as reference surfaces for installing the relevant components.

[0043] The mounting mechanism is a structural device used to install electronic equipment components (such as board module 7) inside the chassis. Board module 7 needs to connect to the main card of the electronic equipment. The main card is the circuit board in the electronic equipment that carries the main electronic components (such as the CPU and memory) and connects to other components. Board module 7 can be a graphics card, sound card, network card, video capture card, etc.

[0044] like Figure 1 and Figure 2 As shown, the mounting mechanism includes a mounting component 1 and an electrical connector 2.

[0045] The mounting component 1 is disposed in the placement cavity of the chassis. The receiving cavity of the mounting component 1 is used to house the board module 7 of the electronic device. The mounting component 1 is parallel to the first chassis wall 61.

[0046] Electrical connector 2 is used to electrically connect the board module 7 and the motherboard of the electronic device, the motherboard being parallel to the first enclosure wall 61.

[0047] When the board module 7 is disposed in the receiving cavity, the mounting assembly 1 has a first use state and a second use state, and the volume of the receiving cavity is different in the first use state and the second use state.

[0048] In this embodiment, the electrical connector 2 is a component used to realize the electrical connection between the board module 7 and the motherboard of the electronic device, such as a ribbon cable or connector. The first usage state and the second usage state are two different working states of the mounting component 1, and the volume of the receiving cavity is different in these two states.

[0049] In application, firstly, the mounting component 1 is installed inside the chassis cavity, parallel to the first chassis wall 61. The motherboard is also installed inside the chassis, parallel to the first chassis wall 61.

[0050] When it is necessary to install the board module 7 of the electronic device, the board module 7 is placed in the receiving cavity of the mounting component 1. Depending on the size of the board module 7, the mounting component 1 is adjusted to a first use state or a second use state to accommodate board modules 7 of different sizes, so that the volume of the receiving cavity is appropriate.

[0051] The board module 7 and the motherboard are electrically connected through the electrical connector 2, so as to realize the functions of data transmission and power supply between the board module 7 and the motherboard.

[0052] For example, in an SFF (Surface Mount Folding) chassis, the first wall 61 is a horizontal bottom wall, and the second wall 62 is a vertical side wall. The mounting assembly 1 is designed as an adjustable frame structure, with a cavity for installing the graphics card. When installing a smaller graphics card, the mounting assembly 1 is adjusted to its first operating state, where the cavity volume is small enough to accommodate the small graphics card. When installing a larger, high-performance graphics card, the mounting assembly 1 is adjusted to its second operating state, increasing the cavity volume to accommodate the larger graphics card. The electrical connector 2 uses a flexible ribbon cable to connect the graphics card to the corresponding interface on the motherboard, enabling the graphics card to function properly.

[0053] This application improves the utilization rate of the internal space of the chassis. By installing component 1 with different volumes, it can accommodate different sizes of board modules 7, meeting diverse user needs, which is especially important in space-constrained SFF chassis. It allows users to easily replace board modules 7 of different sizes according to their needs without replacing the entire chassis or making large-scale modifications.

[0054] like Figure 1 and Figure 2 In one embodiment, the mounting assembly 1 includes a mounting frame 11 and a constraint plate 12 detachably connected to the mounting frame 11. The mounting frame 11 is parallel to the first box wall 61, and the constraint plate 12 is vertically disposed on one end of the mounting frame 11. A receiving cavity is formed between the constraint plate 12 and the other end of the mounting frame 11. When the constraint plate 12 moves along the mounting frame 11, it switches between a first position and a second position, so that the mounting assembly 1 switches between a first use state and a second use state.

[0055] In this embodiment, the mounting bracket 11 is part of the mounting assembly 1. It is arranged parallel to the first box wall 61 in the chassis placement cavity and is the basic support structure of the mounting mechanism. It is used to support and fix other components (such as the constraint plate 12) and at the same time provide a frame foundation for the installation of the board module 7.

[0056] The constraint plate 12 is a component that is detachably connected to the mounting frame 11. It is vertically disposed at one end of the mounting frame 11 and forms a receiving cavity between the constraint plate 12 and the other end of the mounting frame 11. The volume of the receiving cavity is changed by moving along the mounting frame 11, thereby allowing the mounting assembly 1 to switch between different usage states.

[0057] The connection between the constraint plate 12 and the mounting bracket 11 can be easily disassembled and installed, for example, by means of screw connection, snap connection, etc., which facilitates the adjustment or replacement of the position of the constraint plate 12.

[0058] The constraint plate 12 can be moved to two different positions on the mounting bracket 11, corresponding to the first and second use states of the mounting assembly 1. The volume of the receiving cavity is different when the constraint plate 12 is in different positions.

[0059] In application, the constraint plate 12 is detachably connected to one end of the mounting bracket 11 (at this time, the constraint plate 12 is perpendicular to the mounting bracket 11), and a receiving cavity is formed between the constraint plate 12 and the other end of the mounting bracket 11. The mounting bracket 11 is then installed in the placement cavity of the chassis, making it parallel to the first chassis wall 61.

[0060] When a smaller electronic device board module 7 needs to be installed, the constraint plate 12 is moved to the first position. At this time, the volume of the receiving cavity is smaller to accommodate the small-sized board module 7, and the mounting assembly 1 is in the first use state. The board module 7 is placed in the receiving cavity.

[0061] To install a larger board module 7, remove the constraint plate 12 from the first position, move it along the mounting bracket 11 to the second position, and reinstall and secure it. At this time, the volume of the receiving cavity increases, and the mounting assembly 1 switches to the second usage state. Then, place the larger board module 7 into the adjusted receiving cavity.

[0062] Finally, the board module 7 and the motherboard are electrically connected via electrical connector 2 to complete the entire installation process.

[0063] For example, in an SFF chassis, the mounting bracket 11 uses a metal frame structure and is fixed to the chassis near one side wall (i.e., the first chassis wall 61). The constraint plate 12 is a plastic plate with multiple snap-fit ​​holes, which is connected to the mounting bracket 11 by snap-fit.

[0064] When installing a small wireless network card module 7, the constraint plate 12 is installed on the mounting bracket 11 at the first position near the other end. At this time, the receiving cavity can just accommodate the wireless network card, and the mounting component 1 is in the first use state.

[0065] When a user needs to upgrade to a larger professional graphics card, first release the clips on the constraint plate 12, slide it along the mounting bracket 11 to the second position away from the other end of the mounting bracket 11, and then re-fasten the clips to secure it. At this time, the receiving cavity becomes larger, allowing the professional graphics card to be placed, and the installation component 1 switches to the second usage state. Then, connect the graphics card and the motherboard through the corresponding electrical connector 2 (such as a PCI-E cable) to enable the graphics card to work normally.

[0066] This application utilizes the movable and detachable design of the constraint plate 12 to easily adjust the size of the receiving cavity to accommodate board modules 7 of different sizes, thereby meeting users' installation needs for electronic equipment boards of different performance and sizes.

[0067] like Figure 1 As shown, in one embodiment, the constraint plate 12 has a groove 121 on the side away from the mounting bracket 11 to fix the board module 7 in the receiving cavity.

[0068] In this embodiment, the groove-shaped portion 121 is a structural part with a certain shape (similar to a groove) constructed on the side of the constraint plate 12 away from the mounting bracket 11. Its function is to fix the board module 7 placed in the receiving cavity. By cooperating with the board module 7, it restricts the movement of the board module 7 in the receiving cavity, thus playing a role in fixing and positioning.

[0069] When applying this application, firstly, the mounting bracket 11 is installed in the placement cavity of the chassis and parallel to the first chassis wall 61 according to the previous steps. Then, the constraint plate 12 is installed on the mounting bracket 11, so that the constraint plate 12 and the other end of the mounting bracket 11 form a receiving cavity.

[0070] When the board module 7 is placed in the receiving cavity, a portion of the board module 7 is embedded in the groove 121 on the side of the constraint plate 12 away from the mounting bracket 11.

[0071] Then, based on the dimensions of the board module 7, the constraint plate 12 is adjusted to a suitable position (first position or second position) so that the volume of the receiving cavity is adapted to the board module 7. The groove-shaped part 121 cooperates with the edge or specific part of the board module 7 to fix the board module 7 and prevent it from shaking or displacing in the receiving cavity.

[0072] Finally, the board module 7 and the motherboard are electrically connected via electrical connector 2 to complete the installation of board module 7.

[0073] For example, in an SFF chassis, the mounting bracket 11 is fixed to the side of the chassis (first chassis wall 61). A constraint plate 12 is detachably connected to the mounting bracket 11 via screws. A U-shaped groove 121 is machined on the side of the constraint plate 12 away from the mounting bracket 11. When installing a small sound card module 7, the constraint plate 12 is first adjusted to a suitable position so that the receiving cavity can accommodate the sound card. Then, the sound card is placed into the receiving cavity, and the edge of the sound card fits precisely into the U-shaped groove 121 of the constraint plate 12. The constraint plate 12 is then fixed to the mounting bracket 11, at which point the groove 121 tightly holds the edge of the sound card, stably fixing it within the receiving cavity. Afterwards, the sound card and motherboard are connected via appropriate electrical connectors 2 (such as audio interface cables) to allow the sound card to function properly.

[0074] The slotted portion 121 of this application can effectively restrict the movement of the board module 7 within the receiving cavity, preventing the board module 7 from becoming loose due to chassis vibration, handling, or other reasons, thereby ensuring a reliable connection between the board module 7 and the electrical connector 2 and improving the stability of the electronic equipment operation.

[0075] like Figures 1-2 As shown, in one embodiment, the mounting mechanism further includes a heat dissipation component, which includes a cooling fan 31 and a bracket 32 ​​that fixes the cooling fan 31 to the mounting frame 11. The air inlet surface of the cooling fan 31 is parallel to the constraint plate 12, and the constraint plate 12 has a plurality of heat dissipation holes 122.

[0076] In this embodiment, the heat dissipation assembly is a combination of components used to help dissipate heat from electronic devices (such as board module 7) inside the chassis. It removes heat through airflow to ensure the normal operating temperature of the equipment.

[0077] The cooling fan 31 is the core component of the heat dissipation assembly. It uses the rotation of the fan blades to circulate air, accelerate heat dissipation, and cool the components such as the circuit board modules 7 inside the chassis. The bracket 32 ​​is a structural component used to fix the cooling fan 31 to the mounting bracket 11, which serves to support and position the cooling fan 31 and ensure the stability of the cooling fan 31 during operation.

[0078] The air intake side is the side of the cooling fan 31 that draws in air, and it is located on the side of the cooling fan 31 closest to the constraint plate 12. The cooling fan 31 draws out the hot air emitted by the board module 7, creating airflow around the board module 7. This, in turn, draws in cool air from other directions, filling the space left by the drawn-out hot air and creating an air circulation, thus achieving the effect of heat dissipation.

[0079] Alternatively, the air intake surface can be located on the side of the cooling fan 31 away from the constraint plate 12. Air enters from the air intake surface, is accelerated by the fan, and then blows onto the board module 7, carrying away heat. The heat dissipation hole 122 is a hole made in the constraint plate 12, the function of which is to allow air to pass through the constraint plate 12, thereby better dissipating heat from the board module 7 placed in the receiving cavity and improving heat dissipation efficiency.

[0080] In application, the mounting bracket 11 is first installed inside the housing cavity of the chassis and parallel to the first chassis wall 61. At the same time, the constraint plate 12 is installed on the mounting bracket 11 at a suitable position to form a receiving cavity. The cooling fan 31 is fixedly connected to the mounting bracket 11 using the bracket 32, ensuring that the air intake surface of the cooling fan 31 is parallel to the constraint plate 12.

[0081] When the chassis is working, the cooling fan 31 starts, and air enters from the air intake side. The air will carry away the heat generated by the board module 7, and then the air will be exhausted from other ventilation openings in the chassis, thus achieving heat dissipation for the board module 7.

[0082] For example, an 8cm cooling fan 31 is fixed to the mounting bracket 11 by a metal bracket 32, with the air intake surface of the cooling fan 31 parallel to the constraint plate 12. Multiple circular ventilation holes 122 with a diameter of 5mm are evenly distributed on the constraint plate 12. When installing a high-performance gaming graphics card, the card is placed into the receiving cavity, and its edges are secured by the slot-shaped part 121. After powering on, the cooling fan 31 begins to rotate, drawing air in from the air intake surface and carrying away the heat generated by the graphics card through the ventilation holes 122 on the constraint plate 12, maintaining the graphics card at a suitable operating temperature and ensuring smooth game operation.

[0083] The cooling fan 31 of this application cooperates with the heat dissipation holes 122 on the constraint plate 12 to directly dissipate heat from the board module 7 in the housing cavity, accelerate the airflow around the board module 7, remove heat in time, and prevent the board module 7 from degrading or being damaged due to overheating.

[0084] like Figure 3 As shown, in one embodiment, the heat dissipation assembly further includes a telescopic member 4, one end of which abuts against the constraint plate 12 and the other end of which is fixed to the bracket 32. The telescopic member 4 is arranged parallel to the mounting frame 11, and the side of the telescopic member 4 near the mounting frame 11 has a groove-shaped surface 43 to form a heat dissipation air duct 44 between the mounting frame 11 and the telescopic member 4.

[0085] In this embodiment, the telescopic component 4 is part of the heat dissipation assembly and has telescopic characteristics. Its function is to assist in forming the heat dissipation air duct 44 and to adapt to different installation requirements or spatial changes to a certain extent.

[0086] The grooved surface 43 is a groove-like surface structure on the side of the telescopic component 4 near the mounting bracket 11. It works with the mounting bracket 11 to form a heat dissipation air duct 44, guiding airflow to enhance the heat dissipation effect on the board module 7.

[0087] In application, the cooling fan 31 is fixedly connected to the mounting bracket 11 using the bracket 32, so that the air inlet surface of the cooling fan 31 is parallel to the constraint plate 12. One end of the telescopic member 4 is placed against the constraint plate 12, and the other end is fixed to the bracket 32, ensuring that the telescopic member 4 is parallel to the mounting bracket 11, and that the grooved surface 43 of the telescopic member 4 near the mounting bracket 11 forms a heat dissipation airflow channel 44 between the telescopic member 4 and the mounting bracket 11. The board module 7 is placed into the receiving cavity and fixed in place.

[0088] When the chassis is running, the cooling fan 31 starts, and air enters from the air intake side (the side of the cooling fan 31 closest to the constraint plate 12 is the air intake side). It then passes through the heat dissipation air duct 44 formed by the grooved surface 43 of the mounting bracket 11 and the telescopic component 4 and the heat dissipation holes 122 on the constraint plate 12, drawing away the hot air around the board module 7 and carrying away the heat. Finally, the hot air is discharged from the air outlet of the chassis, achieving effective heat dissipation for the board module 7.

[0089] The heat dissipation duct 44 formed by the telescopic component 4 and the mounting bracket 11 in this application can guide the airflow more effectively, allowing the air to come into full contact with the surface of the board module 7, thereby improving the efficiency of heat exchange and further enhancing the heat dissipation effect on the board module 7.

[0090] like Figure 4 As shown, in one embodiment, the telescopic member 4 includes a first grooved plate 41 and a second grooved plate 42. One end of the first grooved plate 41 is inserted into the second grooved plate 42 so that the first grooved plate 41 can be displaced along the length direction of the second grooved plate 42. A first fixing member 45 connected to the bracket 32 ​​is provided on the side of the first grooved plate 41 near the bracket 32, and a second fixing member 46 connected to the second grooved plate 42 is provided on the side of the first grooved plate 41 near the second grooved plate 42.

[0091] In this embodiment, both the first grooved plate 41 and the second grooved plate 42 are grooved. The first fixing member 45 is used to fix the first grooved plate 41 to the bracket 32 ​​to ensure the stability of the first grooved plate 41 during operation. Common fixing methods include screw connection, snap-fit ​​connection, etc.

[0092] The second fixing member 46 is used to connect the first channel plate 41 and the second channel plate 42 together. After the first channel plate 41 is telescopically moved to a suitable position, it is fixed by the second fixing member 46 so that the telescopic member 4 is kept in the corresponding length state. The fixing method can also be screws, buckles, etc.

[0093] In application, one end of the second slotted plate 42 is placed against the constraint plate 12, while one end of the first slotted plate 41 is inserted into the second slotted plate 42. Based on the size of the board module 7 and the internal space of the chassis, the insertion depth of the first slotted plate 41 within the second slotted plate 42 is adjusted, i.e., the first slotted plate 41 is moved along the length of the second slotted plate 42, so that the length of the telescopic member 4 reaches a suitable value, thereby forming a heat dissipation duct 44 of appropriate size.

[0094] The first fastener 45 is used to connect and fix the side of the first channel plate 41 near the bracket 32 ​​to the bracket 32, ensuring that the relative position of the first channel plate 41 and the bracket 32 ​​is stable. The second fastener 46 is used to connect and fix the side of the first channel plate 41 near the second channel plate 42 to the second channel plate 42, so that the telescopic member 4 is fixed in the adjusted length state.

[0095] This application allows the first slotted plate 41 to extend and retract within the second slotted plate 42, enabling precise adjustment of the length of the telescopic component 4 according to the different sizes of the board modules 7 and the specific conditions of the internal space of the chassis. This allows for flexible changes in the size and shape of the heat dissipation duct 44 to achieve the best heat dissipation effect.

[0096] like Figure 4 As shown, in one embodiment, the second fixing member 46 includes a sliding groove 461 and a mounting hole. The sliding groove 461 is disposed on the second grooved plate 42 and is parallel to the length direction of the second grooved plate 42. The mounting hole is disposed on the first grooved plate 41. The second fixing member 46 also includes a fastener 462, which passes through the sliding groove 461 and connects to the mounting hole to fix the first grooved plate 41 and the second grooved plate 42 together.

[0097] In this embodiment, the slide groove 461 is strip-shaped. The function of the slide groove 461 is to provide space for the fastener 462 to move, so that when the first groove plate 41 moves in and out of the second groove plate 42, the fastener 462 can slide in the slide groove 461. When the first groove plate 41 is adjusted to a suitable position, the first groove plate 41 and the second groove plate 42 are fixed by the fastener 462.

[0098] The mounting hole is a hole-like structure formed on the first groove plate 41, which is used in conjunction with the slide groove 461 and the fastener 462 to fix the first groove plate 41 and the second groove plate 42 together.

[0099] Fastener 462 can be a component such as a screw or bolt, which can pass through the slide groove 461 and the mounting hole, and fasten the first groove plate 41 and the second groove plate 42 together by tightening or other operations, thereby playing a fixing role.

[0100] In application, one end of the first grooved plate 41 of the telescopic member 4 is inserted into the second grooved plate 42.

[0101] Based on the dimensions of the board module 7 and the internal space of the chassis, the first slotted plate 41 is moved along the length of the second slotted plate 42, and the length of the telescopic component 4 is adjusted to make the heat dissipation duct 44 reach a suitable size. During the movement, the fasteners 462 installed on the first slotted plate 41 slide synchronously within the grooves 461 of the second slotted plate 42.

[0102] After the first groove plate 41 is adjusted to the appropriate position, use a tool (such as a screwdriver) to tighten the fastener 462 so that the fastener 462 passes through the slide groove 461 and is tightly connected to the mounting hole, fixing the first groove plate 41 and the second groove plate 42 together. At this time, the telescopic member 4 is fixed in the adjusted length state.

[0103] This application, through the cooperation of the slide groove 461, mounting holes, and fasteners 462, allows for convenient adjustment and fixation of the relative positions of the first slotted plate 41 and the second slotted plate 42. When adjusting the length of the telescopic component 4 to accommodate different board modules 7, no complicated operations are required; simply move the first slotted plate 41 and tighten the fasteners 462. Moreover, the telescopic component 4 can be precisely fixed at the required length position, ensuring that the dimensions of the heat dissipation duct 44 meet the requirements.

[0104] like Figure 1 , Figure 5 and Figure 6 As shown, in one embodiment, the mounting bracket 11 is provided with a connecting bracket 532 at one end away from the constraint plate 12. The connecting bracket 532 is detachably connected to the chassis. The connecting bracket 532 is provided with a first IO interface 51 and / or a second IO interface 52, and the first IO interface 51 and the second IO interface 52 are perpendicular to each other.

[0105] In this embodiment, the connecting bracket 532 is used to realize the detachable connection between the mounting bracket 11 and the chassis, and is provided with an I / O interface. The connection between the connecting bracket 532 and the chassis can be easily disassembled and installed, for example, by means of screw connection, snap-fit ​​connection, etc., which facilitates the installation, adjustment or disassembly of the mounting bracket 11.

[0106] The first I / O interface 51 and the second I / O interface 52 are input / output interfaces located on the connecting bracket 532, used to realize data transmission and signal connection between electronic devices and external devices. I / O interfaces, or Input / Output interfaces, are channels for data transmission and interaction between devices and external devices; common examples include USB interfaces, HDMI interfaces, and audio interfaces.

[0107] In this embodiment, the first IO interface 51 can be configured to be parallel to the first box wall 61, and the second IO interface 52 can be configured to be perpendicular to the first box wall 61.

[0108] When this application is applied, the mounting bracket 11 is first installed in the placement cavity of the chassis, and the connecting bracket 532 at the end of the mounting bracket 11 away from the constraint plate 12 is detachably connected to the chassis (e.g., fixed with screws).

[0109] Depending on the type of graphics card, a first I / O interface 51 and / or a second I / O interface 52 are provided on the connection bracket 532. If the installed graphics card is a full-height card, the first I / O interface 51 is provided. If the installed graphics card is a half-height card, the second I / O interface 52 is provided.

[0110] This application provides a first IO interface 51 and a second IO interface 52 that are perpendicular to each other on the connection bracket 532 of the mounting bracket 11, which increases the diversity and flexibility of the chassis's external interfaces. Users can more easily connect different types of external devices to meet diverse usage needs and improve the ease of use of the equipment.

[0111] like Figure 7 As shown in the illustration, this application also provides a chassis, including a first chassis wall 61, a second chassis wall 62, a mounting assembly 1, and an electrical connector 2. The second chassis wall 62 is vertically disposed on the first chassis wall 61, forming a placement cavity between the second and first chassis walls 61.

[0112] The mounting component 1 is disposed in the placement cavity of the chassis. The receiving cavity of the mounting component 1 is used to house the board module 7 of the electronic device. The mounting component 1 is parallel to the first chassis wall 61.

[0113] Electrical connector 2 is used to electrically connect the board module 7 and the motherboard of the electronic device, the motherboard being parallel to the first enclosure wall 61.

[0114] When the board module 7 is disposed in the receiving cavity, the mounting assembly 1 has a first use state and a second use state, and the volume of the receiving cavity is different in the first use state and the second use state.

[0115] This application, by installing component 1 in a first and second usage state with different volumes, can flexibly adjust the size of the receiving cavity according to the actual size of the board module 7, thereby maximizing the use of the internal space of the chassis in the case of limited space such as SFF chassis and improving space utilization.

[0116] This application can accommodate board modules 7 of different sizes, giving users greater flexibility in selecting and replacing board modules 7. Users do not need to replace the entire chassis due to changes in the size of board modules 7, which reduces costs and enhances the chassis's compatibility with different electronic device board modules 7.

[0117] It should be noted that the principle of the chassis provided in this application embodiment to solve the technical problem is similar to that of the installation mechanism provided in this application embodiment. Therefore, the implementation of the chassis provided in this application embodiment can refer to the implementation of the installation mechanism provided in this application embodiment, and the repeated parts will not be described again.

[0118] This application also provides an electronic device, including a chassis, a motherboard and board module 7 disposed in the chassis, the chassis including a first chassis wall 61, a second chassis wall 62, a mounting component 1, and an electrical connector 2.

[0119] The second box wall 62 is vertically disposed on the first box wall 61, and forms a placement cavity between the second and first box walls 61.

[0120] The mounting component 1 is disposed in the placement cavity of the chassis, and the receiving cavity of the mounting component 1 is used to house the board module 7. The mounting component 1 is parallel to the first chassis wall 61.

[0121] Electrical connector 2 is used to electrically connect the board module 7 and the motherboard, the motherboard being parallel to the first enclosure wall 61;

[0122] When the board module 7 is disposed in the receiving cavity, the mounting assembly 1 has a first use state and a second use state, and the volume of the receiving cavity is different in the first use state and the second use state.

[0123] In this embodiment, the electronic device is a device with specific functions, such as a computer or server, composed of components such as a chassis, motherboard, and board module 7.

[0124] It should be noted that the principle by which the electronic device provided in the embodiments of this application solves the technical problem is similar to that of the mounting mechanism provided in the embodiments of this application. Therefore, the implementation of the electronic device provided in the embodiments of this application can refer to the implementation of the mounting mechanism provided in the embodiments of this application, and repeated details will not be described again. The above description is intended to be illustrative and not restrictive. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this disclosure. Moreover, the above examples (or one or more of them) can be used in combination with each other, and these embodiments can be combined with each other in various combinations or arrangements.

Claims

1. A mounting mechanism applied to a case, characterized by, The chassis has a placing cavity, the chassis comprises a first box wall and a second box wall which are perpendicular to each other, the mounting mechanism comprises: A mounting assembly is arranged in the placing cavity of the chassis, a containing cavity of the mounting assembly is used for arranging a board card module of an electronic device, and the mounting assembly is parallel to the first box wall; An electrical connector is used for electrically connecting the board card module of the electronic device and a mainboard, and the mainboard is parallel to the first box wall; When the board card module is arranged in the containing cavity, the mounting assembly has a first use state and a second use state, and the volumes of the containing cavities in the first use state and the second use state are different.

2. The mounting mechanism of claim 1, wherein The mounting assembly comprises a mounting frame and a constraint plate which is detachably connected to the mounting frame, the mounting frame is parallel to the first box wall, the constraint plate is vertically arranged on one end of the mounting frame, and a containing cavity is formed between the constraint plate and the other end of the mounting frame, When the constraint plate moves along the mounting frame, the constraint plate is switched between a first position and a second position, so that the mounting assembly is switched between the first use state and the second use state.

3. The mounting mechanism of claim 2, wherein A groove-shaped portion is arranged on the side of the constraint plate which is away from the mounting frame, so as to fix the board card module in the containing cavity.

4. The mounting mechanism of claim 3, wherein The mounting mechanism further comprises a heat dissipation assembly, the heat dissipation assembly comprises a heat dissipation fan and a support which is fixedly connected to the mounting frame, an air inlet surface of the heat dissipation fan is parallel to the constraint plate, and a plurality of heat dissipation holes are arranged on the constraint plate.

5. The mounting mechanism of claim 4, wherein, The heat dissipation assembly further comprises an extension piece, one end of the extension piece abuts against the constraint plate, and the other end of the extension piece is fixed to the support, and the extension piece is arranged parallel to the mounting frame, A groove-shaped surface is arranged on the side of the extension piece which is close to the mounting frame, so as to form a heat dissipation air duct between the mounting frame and the extension piece.

6. The mounting mechanism of claim 5, wherein The extension piece comprises a first groove-shaped plate and a second groove-shaped plate, one end of the first groove-shaped plate is inserted into the second groove-shaped plate, so that the first groove-shaped plate can be displaced along the length direction of the second groove-shaped plate, a first fixing member which is connected to the support is arranged on the side of the first groove-shaped plate which is close to the support, and a second fixing member which is connected to the second groove-shaped plate is arranged on the side of the first groove-shaped plate which is close to the second groove-shaped plate.

7. The mounting mechanism of claim 6, wherein The second fixing member comprises a sliding groove and a mounting hole, the sliding groove is arranged on the second groove-shaped plate, and the sliding groove is parallel to the length direction of the second groove-shaped plate, and the mounting hole is arranged on the first groove-shaped plate, The second fixing member further comprises a fastener, the fastener is connected to the mounting hole through the sliding groove, so as to fix the first groove-shaped plate and the second groove-shaped plate together.

8. The mounting mechanism of claim 2, wherein A connecting support is arranged on the end of the mounting frame which is away from the constraint plate, the connecting support is detachably connected to the chassis, a first IO interface and / or a second IO interface are arranged on the connecting support, and the first IO interface and the second IO interface are perpendicular to each other.

9. A cabinet, characterized in that The chassis comprises: A first box wall; A second box wall which is vertically arranged on the first box wall and forms a placing cavity with the first box wall; An installation assembly is arranged in the placing cavity of the case, and a receiving cavity of the installation assembly is used for arranging a board module of the electronic device, and the installation assembly is parallel to the first case wall; An electrical connector is used for electrically connecting the board module and the main board, and the main board is parallel to the first case wall; When the board module is arranged in the receiving cavity, the installation assembly has a first use state and a second use state, and the volumes of the receiving cavities in the first use state and the second use state are different.

10. An electronic device, comprising: A case, a main board and a board module arranged in the case, the case comprising: A first case wall; A second case wall vertically arranged on the first case wall and forming a placing cavity with the first case wall; An installation assembly arranged in the placing cavity of the case, and a receiving cavity of the installation assembly is used for arranging the board module, and the installation assembly is parallel to the first case wall; An electrical connector is used for electrically connecting the board module and the main board, and the main board is parallel to the first case wall; When the board module is arranged in the receiving cavity, the installation assembly has a first use state and a second use state, and the volumes of the receiving cavities in the first use state and the second use state are different.

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