Heat dissipation equipment suitable for small, long and narrow light-weight three-dimensional flow channel

Abstract

The utility model discloses a light-weight three-dimensional flow channel heat dissipation device suitable for fine and long and narrow, which comprises a rod-shaped main body, a three-dimensional heat dissipation flow channel is constructed in the main body, at least one mounting space for mounting electronic elements is constructed on the peripheral wall of the main body, and a plurality of mounting spaces are sequentially arranged along the circumferential direction. A heat dissipation flow channel is formed in the main body to achieve heat dissipation, and electronic elements can be installed outside the main body through the installation space. Compared with the prior art, the heat dissipation equipment has the advantages that the main body is used as a force bearing piece and a high-efficiency heat dissipation piece at the same time, so that the size and the weight of the heat dissipation equipment are reduced. Meanwhile, the heat dissipation flow channel in the main body is composed of a plurality of flow paths which are staggered transversely and longitudinally, so that heat dissipation can be provided for electronic elements on a plurality of surfaces, and the heat dissipation performance of the heat dissipation structure is high. And the rod-shaped main body is easier to install and use in a narrow space of the airborne front part.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation equipment technology, and in particular, to a lightweight three-dimensional flow channel heat dissipation device suitable for small and narrow structures. Background Technology

[0002] Future fighter jets will place higher demands on integrated missions such as reconnaissance, combat, communication, and navigation, leading to the continuous development of airborne electronic equipment towards miniaturization, lightweighting, and multi-functionality. This will inevitably result in a further increase in heat dissipation and heat flux density. Therefore, improving the heat dissipation capacity of equipment within a limited volume is crucial for achieving miniaturization, lightweighting, and multi-functionality.

[0003] Because the specific heat capacity of liquids is much greater than that of air, the heat dissipation effect of liquid cooling technology is far superior to that of forced convection cooling technology. This results in liquid cooling systems dissipating heat up to 100 times more than traditional air-cooled or conductive cooling systems. However, traditional liquid cooling designs are generally based on regular chassis structures. Under the constraints of miniaturizing and lightweight platform installations, some platforms have elongated installation spaces, making traditional liquid-cooled chassis unsuitable for such environments. The main reason is that traditional liquid-cooled chassis and modules are separate components; the chassis is primarily a load-bearing component, while the module is a heat dissipation component, resulting in large size and weight of the equipment. Therefore, there is an urgent need for a small, lightweight cooling device suitable for the heat dissipation requirements of airborne equipment. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a lightweight three-dimensional flow channel heat dissipation device suitable for small and narrow structures.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A lightweight three-dimensional flow channel heat dissipation device suitable for small and narrow shapes includes a rod-shaped main body, in which heat dissipation channels are constructed, and at least one mounting space for mounting electronic components is constructed on the outer peripheral wall of the main body, and a plurality of mounting spaces are arranged sequentially along the circumference.

[0007] Preferably, the cross-section of the main body is I-shaped, and four installation spaces are provided corresponding to the orthogonal directions of the main body.

[0008] Preferably, the main body is detachably connected to a cover plate for sealing the installation space.

[0009] Preferably, the electronic component includes a printed circuit board.

[0010] Preferably, the heat dissipation channel is adapted to flow through both the longitudinal and transverse directions of the main body simultaneously.

[0011] Preferably, the heat dissipation channel includes a first longitudinal flow path and a second longitudinal flow path arranged side by side, and at least one transverse flow path is connected between the first longitudinal flow path and the second longitudinal flow path.

[0012] Preferably, both of the longitudinal flow paths include a first vertical unit, a first longitudinal unit, a second vertical unit, and a second longitudinal unit connected end to end, wherein the first vertical unit is adapted to allow the cooling fluid to flow in and out of the heat dissipation channel.

[0013] Preferably, a third longitudinal unit extending toward one side of the first vertical unit is provided on the second vertical unit, and the transverse flow path is provided on the third longitudinal unit.

[0014] Preferably, the end of the transverse flow path away from the third longitudinal unit is connected to the corresponding first longitudinal unit or second longitudinal unit, and a plurality of transverse flow paths are arranged alternately with their ends connected to the first longitudinal unit and connected to the second longitudinal unit.

[0015] Preferably, the cross-section of the main body is I-shaped and defines two opposing vertical receiving areas and a transverse receiving area connected to the two vertical receiving areas. The two longitudinal flow paths are respectively constructed in the two vertical receiving areas, and the transverse flow path is constructed in the transverse receiving area.

[0016] The beneficial effects of this invention are: the internal structure of the main body enables heat dissipation through heat dissipation channels, while the exterior of the main body allows for the installation of electronic components through mounting space. Compared with the prior art, the heat dissipation device of this invention reduces its size and weight by having the main body simultaneously serve as a load-bearing and heat dissipation component. Furthermore, the rod-shaped main body is easier to install and use in confined airborne spaces. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment;

[0018] Figure 2 This is a structural diagram of the installation space;

[0019] Figure 3 A schematic diagram of the cross-sectional structure of the main body;

[0020] Figure 4 This is a schematic diagram of the heat dissipation channel structure.

[0021] Reference numerals: 1. Main body; 2. Heat dissipation channel; 3. Installation space; 4. Cover plate; 5. Printed circuit board; 6. First longitudinal flow path; 7. Second longitudinal flow path; 8. Lateral flow path; 9. First vertical unit; 10. First longitudinal unit; 11. Second vertical unit; 12. Second longitudinal unit; 13. Third longitudinal unit; 14. Vertical accommodating area; 15. Lateral accommodating area. Detailed Implementation

[0022] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] like Figures 1 to 4 As shown, a lightweight three-dimensional heat dissipation device suitable for small and narrow shapes includes a rod-shaped body 1. Specifically, a heat dissipation channel 2 is constructed within the body 1, and at least one mounting space 3 for mounting electronic components is constructed on the outer peripheral wall of the body 1. For example, there may be only one mounting space 3, and electronic components such as a printed circuit board 5 can be installed inside it. When the electronic components generate heat during operation, the heat dissipation channel 2 can achieve effective heat dissipation through liquid cooling.

[0024] It is understandable that the rod-shaped main body 1 is easier to install and use in confined airborne spaces. Furthermore, since the main body 1 serves as both a heat dissipation component with heat dissipation channels 2 and a load-bearing component for mounting electronic components, the overall volume and weight of the heat dissipation device are reduced accordingly.

[0025] For example, several mounting spaces 3 can be arranged circumferentially to accommodate the mounting needs of more electronic components. In a preferred example, the cross-section of the main body 1 is I-shaped. Alternatively, the main body 1 can be described as a quadrangular prism rod with mounting spaces 3 on its four sides (i.e., four orthogonal directions). Since the mounting spaces 3 are formed by recesses into the main body 1, the reason for the weight reduction effect of this disclosure can be more clearly understood.

[0026] In other examples, the main body 1 may also preferably be cylindrical, and a number of installation spaces 3 may be arranged sequentially along the circumference on the outer circumferential surface of the main body 1.

[0027] In some embodiments, a cover plate 4 for enclosing the installation space 3 may also be detachably connected to the main body 1, thereby providing reliable protection for the electronic components within the installation space 3. For example, the cover plate 4 may be detachable from the main body 1 by means of fastening bolts, clips, or the like.

[0028] To achieve uniform and effective heat dissipation for electronic components within different installation spaces 3, the heat dissipation channel 2 is adapted to simultaneously flow through both the longitudinal and transverse directions of the main body 1, where the longitudinal direction of the main body 1 can also be understood as its axial direction. Thus, the heat dissipation path can provide heat dissipation for electronic components in different directions.

[0029] like Figure 3 , Figure 4 As shown, in a preferred example, based on the I-shaped cross-section of the main body 1, the main body 1 is defined as two opposing vertical receiving areas 14 and a transverse receiving area 15 connecting the two vertical receiving areas 14. The heat dissipation channel 2 includes a first longitudinal flow path 6 and a second longitudinal flow path 7 respectively constructed in the two vertical receiving areas 14, and a transverse flow path 8 constructed in the transverse receiving area 15. The transverse flow path 8 is connected between the first longitudinal flow path 6 and the second longitudinal flow path 7.

[0030] Each longitudinal flow path includes a first vertical unit 9, a first longitudinal unit 10, a second vertical unit 11, and a second longitudinal unit 12 connected end to end. Both vertical units extend vertically within the vertical accommodating area 14, while the two longitudinal units extend axially along the main body 1. Therefore, the heat dissipation channel 2 can flow not only longitudinally and laterally through the main body 1, but also vertically (or in other words, along the height of the main body 1), thus achieving a three-dimensional heat dissipation effect.

[0031] More specifically, both first vertical units 9 are adapted to allow the inflow and outflow of cooling fluid in the heat dissipation channel 2. That is, when one vertical unit is pumped with cooling fluid, the other vertical unit is used to discharge the cooling fluid from the heat dissipation channel 2 under pressure.

[0032] Furthermore, a third longitudinal unit 13 extending toward the first vertical unit 9 is provided on the second vertical unit 11 of one of the two longitudinal flow paths, and several transverse flow paths 8 are arranged at equal intervals on the third longitudinal unit 13. Therefore, for the longitudinal flow path provided with the third longitudinal unit 13, the cooling fluid can flow in from its first vertical unit 9, then split to its first longitudinal unit 10 and second longitudinal unit 12, until it merges and flows into the third longitudinal unit 13, and finally be guided by the transverse flow path 8 into the longitudinal flow path without the third longitudinal unit 13.

[0033] In some embodiments, the end of the transverse flow path 8 away from the third longitudinal unit 13 is directly connected to the corresponding first longitudinal unit 10 or second longitudinal unit 12 (i.e., the first longitudinal unit 10 or second longitudinal unit 12 without a longitudinal flow path provided with the third longitudinal unit 13). More preferably, a plurality of transverse flow paths 8 are arranged alternately with their ends connected to the first longitudinal unit 10 and to the second longitudinal unit 12, thereby achieving a more uniform flow of cooling fluid and thus achieving the best heat dissipation effect.

[0034] It should be noted that although the above description uses the cross-section of the main body 1 as an I-shape, it does not limit the heat dissipation flow path disclosed herein to be constructed on the main body 1 with other cross-sectional shapes.

[0035] The above description is merely a preferred embodiment of this utility model. It should be understood that this utility model is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of this utility model should be protected within the scope of the appended claims.

Claims

1. A lightweight three-dimensional flow channel heat dissipation device suitable for small and narrow shapes, characterized in that: The application relates to a rod-shaped main body (1) with a heat dissipation flow channel (2) arranged in the main body (1) and at least one mounting space (3) for mounting electronic components arranged on the peripheral wall of the main body (1), wherein a plurality of the mounting spaces (3) are arranged in sequence in the circumferential direction.

2. The lightweight three-dimensional flow channel heat dissipation device suitable for thin and narrow space according to claim 1, characterized in that: The cross section of the main body (1) is in the shape of a H, and the mounting spaces (3) are arranged in four in the orthogonal direction of the main body (1).

3. The lightweight three-dimensional flow channel heat dissipation device according to claim 1 or 2, characterized in that: A cover plate (4) for closing the mounting spaces (3) is detachably connected to the main body (1).

4. The light-weight three-dimensional flow channel heat dissipation device according to claim 1 or 2, characterized in that: The electronic components include printed boards (5).

5. The light-weight three-dimensional flow channel heat sink device according to claim 1, wherein: The heat dissipation flow channel (2) is adapted to flow in the longitudinal direction and the transverse direction of the main body (1) at the same time.

6. The lightweight three-dimensional flow channel heat dissipation device according to claim 5, characterized in that: The heat dissipation flow channel (2) comprises first longitudinal flow channels (6) and second longitudinal flow channels (7) arranged side by side, and at least one transverse flow channel (8) is arranged between the first longitudinal flow channels (6) and the second longitudinal flow channels (7).

7. The lightweight three-dimensional flow channel heat dissipation device according to claim 6, characterized in that: Both the longitudinal flow channels comprise first vertical units (9), first longitudinal units (10), second vertical units (11) and second longitudinal units (12) connected in sequence, and the first vertical units (9) are adapted to allow the inflow and outflow of cooling fluid in the heat dissipation flow channel (2).

8. The lightweight three-dimensional flow channel heat dissipation device according to claim 7, characterized in that: One of the second vertical units (11) is provided with a third longitudinal unit (13) extending to the side of the first vertical unit (9), and the transverse flow channel (8) is arranged on the third longitudinal unit (13).

9. The lightweight three-dimensional flow channel heat dissipation device according to claim 8, characterized in that: The end of the transverse flow channel (8) away from the third longitudinal unit (13) is connected to the corresponding first longitudinal unit (10) or the second longitudinal unit (12), and a plurality of the transverse flow channels (8) are arranged alternately in the mode that the ends are connected to the first longitudinal units (10) and the second longitudinal units (12).

10. The lightweight three-dimensional flow channel heat dissipation device suitable for thin and narrow space according to any one of claims 7-9, characterized in that: The cross section of the main body (1) is in the shape of a H and defines two opposite vertical accommodating areas (14) and a transverse accommodating area (15) connected to one of the vertical accommodating areas (14), the two longitudinal flow channels are arranged in the two vertical accommodating areas (14) respectively, and the transverse flow channel (8) is arranged in the transverse accommodating area (15).

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