Electronic equipment vapor chamber capable of regulating and controlling heat conduction direction
By introducing a heat spreader with adjustable heat conduction direction into electronic devices, and utilizing components such as non-metallic thermal pads and thermal arms, the problem of difficulty in controlling the heat conduction direction in traditional heat dissipation technologies has been solved, achieving a more efficient and uniform heat dissipation effect and improving equipment performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-03-03
AI Technical Summary
Traditional heat dissipation technologies for electronic devices struggle to control the direction of heat conduction, resulting in low and uneven heat dissipation efficiency, which affects device performance.
An electronic device heat sink with adjustable heat conduction direction is used, including a heat conduction plate and a heat conduction direction adjustment mechanism. It utilizes components such as non-metallic heat conduction pads, heat conduction arms and magnetic rings to achieve directional heat dissipation through gaps and materials with high thermal conductivity.
It improves the heat dissipation speed and efficiency of the heat-generating areas of electronic devices, ensuring normal operation of the equipment, preventing high temperatures, and enhancing performance.
Smart Images
Figure CN223968110U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of heat dissipation technology for electronic devices, specifically relating to a heat dissipation plate for electronic devices with adjustable heat conduction direction. Background Technology
[0002] During normal operation, the internal processor of electronic devices is also performing high-speed calculations, which generates a lot of heat. At this time, it is necessary to cool down the electronic devices to prevent damage from high temperatures.
[0003] Traditional heat dissipation technologies for electronic devices typically involve using cooling fans, heat dissipation films, or heat sinks to dissipate the heat generated by the internal processor. However, since the heat generated by electronic devices is usually concentrated in one or more areas rather than being dissipated evenly, current heat dissipation methods struggle to control the direction of heat conduction, leading to low heat dissipation efficiency and uneven heat dissipation, which in turn affects the performance of electronic devices. Utility Model Content
[0004] To address the problems mentioned in the background section, this invention provides a heat spreader for electronic devices with adjustable heat conduction direction.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat spreader for electronic devices with adjustable heat conduction direction, comprising a heat-conducting plate and a heat conduction direction adjustment mechanism disposed on the heat-conducting plate, wherein the heat-conducting plate and the heat conduction direction adjustment mechanism are both located outside the heat-generating area of the electronic device.
[0006] Furthermore, the heat conduction direction control mechanism includes a non-metallic thermal pad, and a first through hole is formed on the heat-conducting plate along its thickness direction. The non-metallic thermal pad is located in the first through hole. The non-metallic thermal pad is in contact with the heat-conducting plate, and there is at least one gap between them in the direction away from the heat-generating area of the electronic device.
[0007] Furthermore, the thickness of the non-metallic thermal pad is greater than the thickness of the thermal plate. One end face of the non-metallic thermal pad is flush with the thermal plate. A magnetic ring is fitted on the thermal plate at the outer edge of the other end face of the non-metallic thermal pad. The inner diameter of the magnetic ring is equal to the diameter of the first through hole. The magnetic ring is attached to the outside of the first through hole.
[0008] Furthermore, the heat conduction direction control mechanism also includes a non-metallic heat-conducting arm, which is sleeved on the heat-conducting plate at the outer edge of the magnetic ring; the external structure of the non-metallic heat-conducting arm is adapted to the external structure of the heat-conducting plate, and the internal structure is adapted to the external structure of the magnetic ring; the thickness of the non-metallic heat-conducting arm is equal to the thickness of the magnetic ring, and the length of the non-metallic heat-conducting arm is less than the length of the heat-conducting plate.
[0009] Furthermore, the number of heat-conducting plates is one.
[0010] Furthermore, there are two heat-conducting plates, which are respectively located on both sides of the heat conduction direction control mechanism to form a sandwich structure. The two ends of the non-metallic heat-conducting pad are respectively nested in the first through holes of the two heat-conducting plates. The non-metallic heat-conducting arm and the magnetic ring are located between the two heat-conducting plates and separate them. The thickness of the non-metallic heat-conducting pad is equal to the sum of the thicknesses of the two heat-conducting plates and the magnetic ring.
[0011] Furthermore, a thermally conductive graphene patch is provided on the side of the heat-conducting plate closer to the electronic device, and a heat sink is provided on the side away from the electronic device. A second through hole is provided on the heat sink, and the second through hole corresponds to the position of the first through hole. A shell is provided outside the heat sink, and a positioning magnetic block is provided on the shell, and the positioning magnetic block is located below the magnetic ring.
[0012] Furthermore, the heat conduction direction adjustment mechanism includes a heat-conducting extension arm, a first mounting groove is provided on the heat-conducting plate, the heat-conducting extension arm is embedded in the first mounting groove, and the thermal conductivity of the heat-conducting extension arm is greater than the thermal conductivity of the heat-conducting plate; a second mounting groove is also provided on the heat-conducting plate, the second mounting groove is connected to the first mounting groove, a positioning magnetic ring is embedded in the second mounting groove, and a positioning magnetic block is provided on the heat-conducting plate below the positioning magnetic ring.
[0013] Furthermore, a magnetic attraction ring is provided on the heat-conducting plate on the other side opposite to the positioning magnetic ring.
[0014] Furthermore, a thermally conductive graphene patch is provided on the side of the heat-conducting plate closer to the electronic device, and a thermally conductive backplate is provided on the side farther away from the electronic device.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0016] (1) The heat dissipation plate of the present invention can greatly improve the heat dissipation speed in the heat-generating area of the electronic device by setting a heat conduction direction adjustment mechanism on the heat conduction plate, thereby improving the heat dissipation efficiency, making the heat dissipation of the electronic device more uniform, and thus improving the performance of the electronic device.
[0017] (2) The heat dissipation plate of the present invention can transfer and dissipate the heat of the heat-generating area of the electronic device more efficiently by setting gaps or selecting heat-conducting extension arms with higher thermal conductivity, which greatly improves the heat dissipation efficiency of the heat-generating area and can effectively reduce the temperature of the heat-generating area of the electronic device, ensuring the normal operation of the electronic device.
[0018] (3) The heat spreader for electronic devices of this utility model has a simple structure and is easy to implement, making it suitable for mass production. Attached Figure Description
[0019] Figure 1 : First three-dimensional structural diagram of the heat spreader in Example 1.
[0020] Figure 2 : Second three-dimensional structural diagram of the heat spreader in Example 1.
[0021] Figure 3 Assembly diagram of the heat spreader in Example 1.
[0022] Figure 4 : A three-dimensional view of the heat-conducting plate and the heat conduction direction control mechanism in Example 1.
[0023] Figure 5 Assembly diagram of the heat-conducting plate and heat conduction direction control mechanism in Example 1.
[0024] Figure 6 : First three-dimensional structural diagram of the heat spreader in Example 2.
[0025] Figure 7 : Second three-dimensional structural diagram of the heat spreader in Example 2.
[0026] Figure 8 Assembly diagram of the heat spreader in Example 2.
[0027] Figure 9 : First three-dimensional structural diagram of the heat-conducting plate in Example 2.
[0028] Figure 10 : Second three-dimensional structural diagram of the heat-conducting plate in Example 2.
[0029] The components are as follows: 1. Heat-conducting plate; 2. Non-metallic heat-conducting pad; 3. First through hole; 4. First gap; 5. Magnetic ring; 6. Non-metallic heat-conducting arm; 7. Second gap; 8. Graphene patch; 9. Heat sink; 10. Second through hole; 11. Outer shell; 12. Positioning magnet; 13. Heat-conducting extension arm; 14. First mounting groove; 15. Second mounting groove; 16. Positioning magnet; 17. Heat-conducting back plate. Detailed Implementation
[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0031] It is worth noting that the electronic device mentioned in this utility model refers to a mobile phone, and the common heat-generating area of a mobile phone is located in the upper right corner of the back. In other specific application scenarios, those skilled in the art can adjust the shape of each component according to the specific structure of the electronic device to adapt it to the corresponding electronic device.
[0032] Example 1
[0033] like Figure 1-5 As shown, this utility model provides a heat spreader for electronic devices with adjustable heat conduction direction, including a heat conduction plate 1 and a heat conduction direction adjustment mechanism disposed on the heat conduction plate 1, and both the heat conduction plate 1 and the heat conduction direction adjustment mechanism are located outside the heat generation area of the electronic device.
[0034] Specifically, the heat conduction direction control mechanism includes a non-metallic thermal pad 2, and a first through hole 3 is provided on the heat conduction plate 1 along its thickness direction. The non-metallic thermal pad 2 is located in the first through hole 3. The non-metallic thermal pad 2 is in contact with the heat conduction plate 1, and there is a gap between the two in the direction away from the heat generation area of the electronic device, which is referred to as the first gap 4.
[0035] The thickness of the non-metallic thermal pad 2 is greater than the thickness of the thermal plate 1. One end face of the non-metallic thermal pad 2 is flush with the thermal plate 1. A magnetic ring 5 is fitted on the outer edge of the other end face of the non-metallic thermal pad 2 on the thermal plate 1. The inner diameter of the magnetic ring 5 is equal to the diameter of the first through hole 3. The magnetic ring 5 is attached to the outside of the first through hole 3.
[0036] The heat conduction direction control mechanism also includes a non-metallic heat-conducting arm 6, which is sleeved on the heat-conducting plate 1 and located on the outer edge of the magnetic ring 5. The external structure of the non-metallic heat-conducting arm 6 is adapted to the external structure of the heat-conducting plate 1, and the internal structure is adapted to the external structure of the magnetic ring 5. The thickness of the non-metallic heat-conducting arm 6 is equal to the thickness of the magnetic ring 5, and the length of the non-metallic heat-conducting arm 6 is less than the length of the heat-conducting plate 1.
[0037] In a specific application scenario, such as Figure 1-5 As shown, there are two heat-conducting plates 1, which are located on both sides of the heat conduction direction control mechanism to form a sandwich structure. The two ends of the non-metallic heat-conducting pad 2 are nested in the first through holes 3 of the two heat-conducting plates 1. The non-metallic heat-conducting arm 6 and the magnetic ring 5 are located between the two heat-conducting plates 1 and separate the two heat-conducting plates 1 to form a second gap 7. The thickness of the non-metallic heat-conducting pad 2 is equal to the sum of the thicknesses of the two heat-conducting plates 1 and the magnetic ring 5.
[0038] In another specific application scenario, the number of heat-conducting plates 1 is one. That is, only one heat-conducting plate 1 is set on the side closest to the heat-generating area of the electronic device.
[0039] A thermally conductive graphene patch 8 is provided on the side of the heat-conducting plate 1 closest to the electronic device, and a heat sink 9 is provided on the side away from the electronic device. A second through hole 10 is provided on the heat sink 9, and the second through hole 10 corresponds to the position of the first through hole 3. The second through hole 10 serves as a reserved space for the non-metallic thermal pad 2. When the electronic device is charged using a wireless charging device, the current can be transmitted normally through the second through hole 10 and the non-metallic thermal pad 2, so it will not affect the wireless charging process of the electronic device.
[0040] A housing 11 is provided outside the heat sink 9, and a positioning magnetic block 12 is provided on the housing 11. The positioning magnetic block 12 is located below the magnetic ring 5.
[0041] Specifically, in this embodiment 1, when the heat sink of the electronic device is in use, a semiconductor cooler is added to the outside of the housing 11. The semiconductor cooler is a conventional product in the industry, has magnetism, and can be fixedly adsorbed to the outside of the housing 11 by magnetic ring 5 and positioning magnetic block 12.
[0042] The first gap 4 between the non-metallic thermal pad 2 and the thermal plate 1, and the second gap 7 formed by the non-metallic thermal arm 6 separating the two thermal plates 1, play a role in regulating the direction of heat dissipation of the electronic device: (1) Heat is generated from the heat-generating area of the electronic device. Since there is a first gap 4 between the thermal plate 1 and the non-metallic thermal pad 2, most of the heat will be transferred from the heat-generating area of the electronic device along the top of the thermal plate 1 to the non-metallic thermal pad 2; (2) Since there is a non-metallic thermal arm 6 between the two thermal plates 1, and the length of the non-metallic thermal arm 6 is less than the length of the thermal plate 1, a second gap 7 is formed between the two thermal plates 1. Therefore, most of the heat will be transferred from the thermal plate 1 closest to the electronic device to the other thermal plate 1 after passing through the non-metallic thermal arm 6. Thus, the direction of heat conduction is regulated.
[0043] Due to the presence of the heat conduction direction control mechanism, most of the heat is transferred from the heat-generating area of the electronic device along the heat-conducting plate 1, non-metallic heat-conducting pad 2, and non-metallic heat-conducting arm 6 to the semiconductor cooler, thus achieving effective heat dissipation from the heat-generating area of the electronic device. Other areas of the electronic device, which generate less heat, are separated from the heat conduction process by the first gap 4 and the second gap 7, resulting in slower heat dissipation. In this way, the heat from the heat-generating areas of the electronic device can be effectively dissipated, improving the heat dissipation efficiency, preventing overheating, and ultimately improving the performance of the electronic device.
[0044] Example 2
[0045] like Figure 6-10 As shown, the heat conduction direction control mechanism includes a heat-conducting extension arm 13. A first mounting groove 14 is provided on the heat-conducting plate 1. The heat-conducting extension arm 13 is embedded in the first mounting groove 14. The thermal conductivity of the heat-conducting extension arm 13 is greater than that of the heat-conducting plate 1. Specifically, the material of the heat-conducting extension arm 13 can be copper, and the material of the heat-conducting plate 1 can be aluminum, stainless steel, etc.
[0046] A second mounting groove 15 is also provided on the heat-conducting plate 1. The second mounting groove 15 is connected to the first mounting groove 14. A positioning magnetic ring 16 is embedded in the second mounting groove 15. The positioning magnetic ring 16 has a notch, which allows the heat-conducting extension arm 13 to pass through the notch.
[0047] A positioning magnetic block 12 is provided on the heat-conducting plate 1 below the positioning magnetic ring 16. A magnetic attraction ring 5 is provided on the heat-conducting plate 1 on the other side opposite to the positioning magnetic ring 16. A heat-conducting graphene patch 8 is provided on the side of the heat-conducting plate 1 closer to the electronic device, and a heat-conducting back plate 17 is provided on the side away from the electronic device.
[0048] Similarly, in embodiment 2, when the heat spreader is in use, a semiconductor cooler is added to the outside of the heat-conducting back plate 17. The semiconductor cooler is a conventional product in the industry, has magnetism, and can be fixedly adsorbed to the outside of the heat-conducting back plate 17 by magnetic ring 5 and positioning magnetic block 12.
[0049] Specifically, in this embodiment 2, since the thermal conductivity of the heat-conducting extension arm 13 is greater than that of the heat-conducting plate 1, the heat generated by the heat-generating area of the electronic device will preferentially be conducted from the heat-conducting extension arm 13 to the heat-conducting plate 1, and then dissipated by the semiconductor cooler; while other areas of the electronic device generate less heat, resulting in lower heat conduction efficiency. Therefore, the direction of heat conduction can be controlled, improving the heat dissipation efficiency of the heat-generating area of the electronic device, preventing the electronic device from overheating, and thus improving the performance of the electronic device.
[0050] In the above embodiments 1 and 2, the bonding between the various structures can be achieved by using thermally conductive adhesive to improve the structural stability of the product without affecting heat dissipation.
[0051] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0052] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An electronic device vapor chamber with adjustable heat conduction direction, characterized in that: The heat conduction direction regulating mechanism includes a non-metal heat conduction pad, a first through hole is formed in the thickness direction of the heat conduction plate, and the non-metal heat conduction pad is located in the first through hole; the non-metal heat conduction pad is in contact with the heat conduction plate, and at least one gap exists between the two in the direction away from the heat generation area of the electronic device. The thickness of the non-metal heat conduction pad is greater than the thickness of the heat conduction plate, one side end surface of the non-metal heat conduction pad is flush with the heat conduction plate, a magnetic ring is sleeved on the outer side of the heat conduction plate outside the other side end surface of the non-metal heat conduction pad, the inner hole diameter of the magnetic ring is equal to the hole diameter of the first through hole, and the magnetic ring is attached to the outside of the first through hole.
2. The electronic device vapor chamber of claim 1, wherein: The heat conduction direction regulating mechanism further includes a non-metal heat conduction arm, which is sleeved on the outer side of the heat conduction plate outside the magnetic ring; 3. The electronic device vapor chamber of claim 2, wherein: and the outer structure of the non-metal heat conduction arm is matched with the outer structure of the heat conduction plate, and the inner structure is matched with the outer structure of the magnetic ring; The thickness of the non-metal heat conduction arm is equal to the thickness of the magnetic ring, and the length of the non-metal heat conduction arm is less than the length of the heat conduction plate. The number of the heat conduction plate is 1.
4. The electronic equipment vapor chamber of claim 3, wherein: The number of the heat conduction plate is 2, and the two heat conduction plates form a sandwich structure on the two sides of the heat conduction direction regulating mechanism, the two ends of the non-metal heat conduction pad are respectively nested in the first through holes of the two heat conduction plates, the non-metal heat conduction arm and the magnetic ring are located between the two heat conduction plates and separate the two heat conduction plates; the thickness of the non-metal heat conduction pad is equal to the sum of the thicknesses of the two heat conduction plates and the magnetic ring.
5. The electronic device vapor chamber of claim 3, wherein: A graphene patch is provided on one side of the heat conduction plate close to the electronic device, and a heat dissipation plate is provided on the side away from the electronic device, a second through hole is formed in the heat dissipation plate, the position of the second through hole corresponds to that of the first through hole; an outer shell is provided on the outside of the heat dissipation plate, and a positioning magnetic block is provided on the outer shell, which is located below the magnetic ring.
6. The electronic equipment vapor chamber of claim 4 or 5, wherein: The heat conduction direction regulating mechanism includes a heat conduction extension arm, a first installation groove is provided on the heat conduction plate, the heat conduction extension arm is embedded in the first installation groove, and the heat conduction coefficient of the heat conduction extension arm is greater than that of the heat conduction plate; a second installation groove is also provided on the heat conduction plate, the second installation groove and the first installation groove are in communication with each other, a positioning magnetic ring is embedded in the second installation groove, and a positioning magnetic block is provided below the positioning magnetic ring on the heat conduction plate.
7. The electronic device vapor chamber of claim 1, wherein: A magnetic ring is provided on the other side of the heat conduction plate relative to the positioning magnetic ring.
8. The electronic device vapor chamber of claim 7, wherein: A graphene patch is provided on one side of the heat conduction plate close to the electronic device, and a heat dissipation plate is provided on the side away from the electronic device.
9. The electronic device vapor chamber of claim 8, wherein: