Liquid cooling device and liquid cooling system

Abstract

The utility model relates to the technical field of immersed liquid cooling equipment, and discloses a liquid cooling device and a liquid cooling system, and the liquid cooling device comprises a cabinet and a server; the server is arranged in the cabinet, a liquid inlet and a liquid outlet are formed in the cabinet, the liquid inlet is used for allowing cooling liquid to enter the cabinet so that the cooling liquid can immerse the server and absorb heat generated by the server, and the liquid outlet is used for allowing the cooling liquid to be discharged from the interior of the cabinet; the server is provided with a liquid pumping port, the liquid pumping port is located near a CPU of the server, the liquid pumping port is communicated with the liquid outlet through a liquid pumping pipeline, and the liquid pumping port is used for pumping cooling liquid near the CPU and discharging the cooling liquid through the liquid outlet. Through the mode, the heat of the CPU can be timely and effectively dissipated, so that the working performance and the stability of the CPU are ensured.

Description

Technical Field

[0001] This application relates to the field of immersion liquid cooling equipment technology, specifically to a liquid cooling device and liquid cooling system. Background Technology

[0002] In single-phase immersion liquid cooling, the server is completely submerged in coolant, and the heat generated by the heat-generating components on the server is carried away by the circulating flow of the coolant, thus achieving a relatively efficient heat dissipation for the server.

[0003] The CPU is the most core and powerful processing unit in a server, responsible for performing various efficient computing tasks and data processing. It is also the main heat-generating component in a server.

[0004] As the CPU workload increases, its internal circuitry will rapidly generate a large amount of heat. In this case, existing conventional immersion liquid cooling technology is difficult to dissipate the CPU's heat in a timely and effective manner, which will cause the CPU temperature to rise continuously, performance to decline, and in severe cases, it may even cause stability problems such as hardware damage. Utility Model Content

[0005] In view of the above problems, this application provides a liquid cooling device and liquid cooling system that can dissipate the heat of the CPU in a timely and effective manner to ensure the CPU's working performance and stability.

[0006] According to one aspect of the embodiments of this application, a liquid cooling device is provided, including: a cabinet and a server; the server is disposed in the cabinet, the cabinet is provided with a liquid inlet and a liquid outlet, the liquid inlet is used to allow coolant to enter the cabinet so that the coolant immerses the server and absorbs the heat generated by the server, and the liquid outlet is used to allow coolant to be discharged from the cabinet; the server is provided with a liquid extraction port, the liquid extraction port is located near the CPU of the server, and the liquid extraction port is connected to the liquid outlet through a liquid extraction pipe, the liquid extraction port is used to draw in coolant near the CPU and discharge it through the liquid outlet.

[0007] In one alternative approach, the server is provided with a first pipe interface, and the liquid extraction pipe includes a first pipe that is connected to both the liquid extraction port and the first pipe interface; the liquid extraction pipe also includes a second pipe and a liquid extraction manifold, the liquid extraction manifold is located inside the server rack, the liquid extraction manifold is provided with a second pipe interface, and the two ends of the second pipe are detachably connected to the first pipe interface and the second pipe interface, respectively; the liquid extraction manifold is also connected to the liquid outlet.

[0008] In one alternative, a pump is provided on the extraction manifold to draw coolant from the CPU via an extraction port, and then discharges it from an outlet via a first pipe, a second pipe, and the extraction manifold.

[0009] In one alternative approach, the second conduit is a flexible hose.

[0010] In one alternative approach, multiple servers are arranged in a rack, and multiple second pipe interfaces are provided on the liquid extraction manifold. There are multiple second pipes, and the first pipe interface on each server is connected to a second pipe interface through a second pipe.

[0011] In one alternative approach, the server has multiple CPUs and multiple liquid extraction ports, each liquid extraction port corresponding to at least one CPU, and the multiple liquid extraction ports are converged and connected to a first pipe interface via a first pipe.

[0012] In one alternative approach, the inlet is located at the bottom of the rack to allow the coolant to flow upward within the rack. An outlet tank is located on one side inside the rack, with an opening at the top. The coolant flowing upward through the server reaches the height of the opening and then enters the outlet tank. The outlet tank is connected to the outlet port to allow the coolant in the outlet tank to be discharged through the outlet port.

[0013] In one alternative configuration, the server has evenly distributed inlet holes at the bottom and evenly distributed outlet holes at the top. The inlet holes allow coolant to enter the server and the outlet holes allow coolant to flow out of the server.

[0014] In one alternative approach, the top of the rack is provided with an openable cover, which allows servers to be loaded into or removed from the rack when opened.

[0015] According to another aspect of the embodiments of this application, a liquid cooling system is provided, including a heat exchanger cooling device and the liquid cooling device of any of the above. The cooling device is connected to an outlet and an inlet respectively. The cooling device is used to cool the coolant output from the outlet and then input it into the liquid cooling device through the inlet.

[0016] In the liquid cooling device provided in this application embodiment, after absorbing the heat of the CPU in the cabinet, a portion of the coolant can be quickly discharged through the extraction port, thereby reducing the flow rate of the coolant at the CPU and reducing the flow resistance at the CPU. This allows the coolant with a lower temperature to flow to the CPU more quickly to continue absorbing the heat of the CPU, thereby increasing the flow rate of the coolant on the CPU surface. This enables the heat of the CPU to be dissipated in a timely and effective manner, ensuring the working performance and stability of the CPU.

[0017] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0018] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0019] Figure 1 A perspective view of the liquid cooling device provided in the embodiments of this application;

[0020] Figure 2 A perspective view of a server in a liquid cooling device provided in an embodiment of this application;

[0021] Figure 3 A flow path diagram of the coolant at the CPU in the liquid cooling device provided in the embodiments of this application;

[0022] Figure 4 A perspective view of the liquid cooling device provided in the embodiments of this application;

[0023] Figure 5 This is a structural block diagram of a liquid cooling system provided in an embodiment of this application.

[0024] The reference numerals in the detailed embodiments are as follows:

[0025] 100. Liquid cooling device;

[0026] 110. Cabinet; 111. Liquid inlet; 112. Liquid outlet; 113. Liquid outlet tank; 1131. Opening;

[0027] 120. Server; 121. Draw-out port; 122. CPU; 123. Draw-out pipe; 1231. First pipe; 1232. Second pipe; 1233. Draw-out manifold; 1234. Second pipe interface; 1235. Draw-out pump; 124. First pipe interface; 125. Inlet; 126. Outlet;

[0028] 130. Cover plate;

[0029] 200. Cooling device;

[0030] 500. Liquid cooling system. Detailed Implementation

[0031] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0033] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0034] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0035] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0036] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0037] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0038] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0039] To improve the heat dissipation performance of the CPU, this application considers further accelerating the flow rate of the coolant at the CPU on the basis of conventional immersion liquid cooling technology, so that the heat generated by the CPU during operation can be quickly removed, thereby reducing server malfunctions caused by CPU overheating.

[0040] According to one aspect of the embodiments of this application, a liquid cooling device is provided; please refer to the following for details. Figure 1 The figure shows a perspective view of the overall liquid cooling system. As shown, the liquid cooling system 100 includes a cabinet 110 and a server 120, with the server 120 housed inside the cabinet 110. The cabinet 110 is equipped with a liquid inlet 111 and a liquid outlet 112. The liquid inlet 111 allows coolant to enter the cabinet 110, immersing the server 120 and absorbing the heat generated by the server 120. The liquid outlet 112 allows coolant to exit from the cabinet 110.

[0041] Please refer to further information. Figure 2 The diagram shows a perspective view of server 120. Server 120 has a liquid extraction port 121 located near the CPU 122. Please refer to the diagram for further details. Figure 1 and Figure 2 The suction port 121 is connected to the outlet port 112 through the suction pipe 123. The suction port 121 is used to draw in coolant near the CPU 122 and discharge it through the outlet port 112, so that the coolant that has absorbed the heat of the CPU 122 can be discharged more quickly, thereby accelerating the flow rate of the coolant near the CPU 122 and improving the heat dissipation rate of the CPU 122.

[0042] Specifically, please refer to Figure 3 The diagram illustrates the flow path of the coolant at server 120. Taking the coolant flowing from bottom to top in rack 110 as an example, the coolant entering rack 110 from the bottom is at a lower temperature. Initially, the coolant flows along... Figure 3The coolant flows upwards from the bottom, as indicated by arrow ①, absorbing heat from the heat-generating components within the server 120 as it flows through it. When the coolant reaches the CPU 122, it absorbs a significant amount of heat, causing its temperature to rise. If the coolant cannot be drained in time, the heat dissipation rate of the CPU 122 will slow down, thus affecting the stability of its performance. Therefore, by providing the extraction port 121, a portion of the coolant at the CPU 122 with a higher temperature can be promptly removed; that is, this portion of the coolant will flow upwards along... Figure 3 The coolant is drawn in through the suction port 121 in the direction indicated by arrow ②, and flows through the suction pipe 123 in the direction indicated by arrow ③ before being discharged through the outlet 112. The remaining coolant at the CPU 122 continues to flow upwards along... Figure 3 After flowing completely through server 120 in the direction indicated by the middle arrow ④, it is then discharged from outlet 112.

[0043] from Figure 3 As can be seen from the flow path of the coolant, after absorbing the heat of the CPU122, a portion of the coolant can be quickly discharged through the extraction port 121. This reduces the flow rate of the coolant at the CPU122 and lowers the flow resistance at the CPU122, allowing the coolant at a lower temperature to flow to the CPU122 more quickly to continue absorbing the heat of the CPU122. This increases the flow rate of the coolant on the surface of the CPU122, enabling the heat of the CPU122 to be dissipated in a timely and effective manner, ensuring the working performance and stability of the CPU122.

[0044] It should be noted that, Figure 3 This is merely an illustrative example. In other embodiments, the coolant may flow from top to bottom or horizontally. The principle for improving the heat dissipation efficiency of the CPU 122 is the same: a portion of the coolant at the CPU 122 is drawn away through the extraction port 121 to accelerate the flow of coolant at the CPU 122.

[0045] In addition, regarding the specific setting of the liquid extraction port 121, besides adopting... Figure 2 and Figure 3 In addition to setting the corresponding structure and pipeline on the outside of the server 120, the liquid extraction port 121 can also be set inside the server 120 or integrated into the casing wall of the server 120. The specific location is not limited here, as long as the coolant at the CPU 122 can be drawn in and discharged from the liquid outlet 112.

[0046] Considering that server 120 needs to be frequently disassembled and reassembled in rack 110 for maintenance and other operations, therefore, if Figure 1As shown, the top of the rack 110 can be equipped with an openable cover 130, which can be opened and closed by means of flipping, pushing or pulling. When the cover 130 is open, the server 120 can be installed into the rack 110 or removed from the rack 110.

[0047] Furthermore, during the disassembly and assembly of server 120, the liquid extraction pipe 123 connects between the liquid extraction port 121 and the liquid outlet 112, which affects the ease of disassembly and assembly of server 120. Therefore, to make the disassembly and assembly of server 120 more convenient, this application further incorporates a detachable design for the liquid extraction pipe 123. Please refer again for details. Figure 2 The server 120 is equipped with a first pipe interface 124, and the liquid extraction pipe 123 includes a first pipe 1231 that is connected to both the liquid extraction port 121 and the first pipe interface 124. Please refer to... Figure 1 and Figure 4 The liquid extraction pipeline 123 also includes a second pipeline 1232 and a liquid extraction manifold 1233. The liquid extraction manifold 1233 is provided with a second pipeline interface 1234. The two ends of the second pipeline 1232 are detachably connected to the first pipeline interface 124 and the second pipeline interface 1234, respectively. For example, the detachable connection can be achieved by using quick-connect fittings commonly used in liquid pipelines. The liquid extraction manifold 1233 is also connected to the liquid outlet 112.

[0048] In this embodiment, the liquid extraction pipe 123 consists of a first pipe 1231 located on the server 120 and connected to the liquid extraction port 121, a liquid extraction manifold 1233 located in the cabinet 110, and a second pipe 1232 detachably connected between the two. For the detachable connection at both ends of the second pipe 1232, a first pipe interface 124 connected to the first pipe 1231 is provided on the server 120, and a second pipe interface 1234 is provided on the liquid extraction manifold 1233. By connecting the two ends of the second pipe 1232 to the first pipe interface 124 and the second pipe interface 1234 respectively, the first pipe 1231 and the liquid extraction manifold 1233 are interconnected, so that the coolant drawn in from the liquid extraction port 121 can be discharged from the cabinet 110 in sequence through the first pipe 1231, the first pipe interface 124, the second pipe 1232, the second pipe interface 1234, the liquid extraction manifold 1233, and the liquid outlet 112.

[0049] When removing server 120 from rack 110, disconnect at least one end of second pipe 1232 so that second pipe 1232 will not affect the movement of server 120. Then server 120 can be taken out of rack 110. During installation, first connect both ends of second pipe 1232 to first pipe interface 124 and second pipe interface 1234 respectively, and then server 120 can be installed in rack 110 for operation and heat dissipation.

[0050] To prevent damage to the second pipe 1232 during the disassembly and assembly of server 120, the second pipe 1232 can be made of flexible tubing to ensure that it can deform to a certain extent as server 120 is moved, thus ensuring that the second pipe 1232 is not easily damaged when moving server 120 or plugging and unplugging it.

[0051] Furthermore, in order to increase the pumping efficiency of the pumping port 121, such as... Figure 1 and Figure 4 As shown, a liquid extraction pump 1235 can be installed on the liquid extraction manifold 1233. The liquid extraction pump 1235 is used to quickly draw the coolant near the CPU 122 from the liquid extraction port 121, thereby accelerating the flow rate of the coolant in the cabinet 110 on the surface of the CPU 122, so that the coolant can remove the heat of the CPU 122 more timely and quickly. The coolant drawn from the liquid extraction port 121 is discharged from the liquid outlet 112 after passing through the first pipe 1231, the second pipe 1232 and the liquid extraction manifold 1233.

[0052] To enhance the processing capacity of a data center, a large number of servers are typically deployed for data processing. Furthermore, to improve the energy utilization of the data center, multiple servers 120 can be arranged within rack 110, and the manifold 1233 can accommodate... Figure 1 As shown, multiple second pipe interfaces 1234 are set, and multiple second pipes 1232 are also set accordingly. The first pipe interface 124 on each server 120 is connected to a second pipe interface 1234 through a second pipe 1232.

[0053] With this configuration, the coolant drawn in by the extraction ports 121 on all servers 120 will be collected in the extraction manifold 1233 and discharged from the outlet 112 through the extraction manifold 1233. The configuration of the extraction manifold 1233 simplifies the internal piping structure of the rack 110. At the same time, each server 120 is connected to the extraction manifold 1233 by a separate, detachable second pipe 1232, which allows each server 120 to be disassembled and maintained independently and conveniently.

[0054] The server 120 can use dual-core or multi-core processors to improve its data processing capabilities. That is, the server 120 is equipped with two or more CPUs 122. In order to ensure the heat dissipation capacity of each CPU 122, the server 120 can be equipped with multiple liquid extraction ports 121. Each liquid extraction port 121 corresponds to at least one CPU 122. The multiple liquid extraction ports 121 are gathered through the first pipe 1231 and connected to the first pipe interface 124.

[0055] by Figure 2Taking a dual-core server 120 as an example, the server 120 can be equipped with two coolant extraction ports 121, each corresponding to a CPU 122. These ports are used to extract coolant from the vicinity of the corresponding CPU 122, thereby improving the cooling capacity of the CPU 122. The coolant extracted from the two ports 121 first converges through a first pipe 1231, then flows together through a first pipe interface 124 into a second pipe 1232, and finally exits through a manifold 1233 and an outlet 112. Of course, Figure 2 This is just one example. In other embodiments, the number of coolant outlets 121 can be more than that of CPU 122, and the coolant outlets 121 can be facing the front of CPU 122 or can be located around CPU 122, as long as they can accelerate the flow rate of coolant on the surface of CPU 122 and improve the heat dissipation capacity of CPU 122.

[0056] Please refer to it again. Figure 1 In some embodiments, the liquid inlet 111 is located at the bottom of the cabinet 110, specifically... Figure 1 The coolant is located on one side of the bottom of the rack 110, or it can be directly installed at the bottom of the rack 110. After coolant is introduced into the rack 110 through the inlet 111, the coolant will flow from bottom to top within the rack 110. A coolant outlet tank 113 is provided on one side of the rack 110. The top of the outlet tank 113 has an opening 1131. The coolant flowing from bottom to top through the server 120 reaches the height of the opening 1131 and then enters the outlet tank 113. The outlet tank 113 is connected to the outlet port 112, allowing the coolant in the outlet tank 113 to be discharged through the outlet port 112. It should be noted that the outlet port 112 is isolated from the space inside the rack 110 containing the server 120 to prevent the low-temperature coolant entering through the inlet 111 from being discharged directly from the outlet port 112 without absorbing heat from the server 120.

[0057] Specifically, the outlet 112 can be as follows: Figure 1 The coolant is located on one side of the bottom of the cabinet 110 and communicates with the coolant outlet 113, so that the coolant entering the coolant outlet 113 from the top opening 1131 can be discharged from the bottom outlet 112 under its own gravity without external force.

[0058] Based on this, regarding the method of setting up the liquid extraction manifold 1233, such as Figure 1As shown, the extraction manifold 1233 can be directly installed in the outlet tank 113, and the second pipe interface 1234 on the extraction manifold 1233 extends out of the outlet tank 113 for detachable connection with the second pipe 1232. It should be noted that the outer periphery of the second pipe interface 1234 is sealed to the outlet tank 113 to prevent coolant from flowing between the outlet tank 113 and the space containing the server 120 within the rack 110 through any gaps that may exist between the second pipe interface 1234 and the outlet tank 113, thereby affecting the heat dissipation effect on the server 120.

[0059] For a coolant that flows from bottom to top through the server 120 and absorbs heat, the extraction port 121, in addition to being able to... Figure 3 In addition to being positioned opposite the CPU 122, the coolant can also be positioned above the CPU 122, so that the coolant is drawn away by the extraction port 121 only after it has completely flowed over the surface of the CPU 122 and absorbed enough heat, thereby better ensuring the cooling effect on the CPU 122.

[0060] like Figure 2 As shown, in some embodiments, the bottom of the server 120 has uniformly distributed inlet holes 125 and uniformly distributed outlet holes 126. Coolant flows from bottom to top into the interior of the server 120 through the inlet holes 125 and flows out through the outlet holes 126. The uniformly distributed inlet holes 125 and outlet holes 126 allow the coolant to more evenly cover the heat-generating components within the server 120 as it flows upward, ensuring effective heat dissipation for all heat-generating components inside the server 120. Furthermore, the uniformly distributed inlet holes 125, compared to a single-aperture structure, reduce the impact of coolant entering the server 120 on internal electronic components, thereby ensuring the structural stability of the internal electronic components of the server 120.

[0061] According to another aspect of the embodiments of this application, a liquid cooling system is provided, please refer to [the specific details]. Figure 5 The figure shows a structural block diagram of a liquid cooling system 500, which includes a cooling device 200 and a liquid cooling device 100 in any of the above embodiments. The cooling device 200 is connected to the liquid outlet 112 and the liquid inlet 111 respectively. The cooling device 200 is used to cool the coolant output from the liquid outlet 112 and then output it to the liquid cooling device 100 through the liquid inlet 111.

[0062] Specifically, the cooling device 200 can be an air-cooled device, that is, the high-temperature coolant input from the outlet 112 into the cooling device 200 is cooled to a low-temperature coolant by air cooling, and then output from the cooling device 200 and enter the cabinet 110 through the inlet 111 to cool and dissipate heat from the server 120.

[0063] Of course, for some large data centers, the cooling device 200 may also include a heat exchanger and a cooling tower. On the primary side, cooling water circulates between the heat exchanger and the coolant. On the secondary side, the coolant circulates between the liquid cooling device 100 and the heat exchanger. The high-temperature coolant enters the heat exchanger and undergoes thermal cooling with the low-temperature cooling water, causing the coolant temperature to drop to a low-temperature state before entering the liquid cooling device 100 to absorb heat from the server 120. The low-temperature cooling water temperature rises and then enters the cooling tower for further cooling. After cooling, it enters the heat exchanger again to exchange heat with the coolant, thus completing the cycle.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way.

Claims

1. A liquid cooling device, characterized by, include: Server racks and servers; The server is installed in the rack, which is provided with a liquid inlet and a liquid outlet. The liquid inlet is used to allow coolant to enter the rack so that the coolant can immerse the server and absorb the heat generated by the server. The liquid outlet is used to allow the coolant to be discharged from the rack. The server is provided with a liquid extraction port, which is located near the CPU of the server and is connected to the liquid outlet through a liquid extraction pipe. The liquid extraction port is used to draw in the coolant near the CPU and discharge it through the liquid outlet.

2. The liquid cooling device of claim 1, wherein, The server is provided with a first pipe interface, and the liquid extraction pipe includes a first pipe that is connected to the liquid extraction port and the first pipe interface respectively. The liquid extraction pipeline also includes a second pipeline and a liquid extraction manifold. The liquid extraction manifold is located inside the cabinet. The liquid extraction manifold is provided with a second pipeline interface. The two ends of the second pipeline are detachably connected to the first pipeline interface and the second pipeline interface, respectively. The extraction manifold is also connected to the outlet.

3. The liquid cooling device of claim 2, wherein, The manifold is equipped with a pump, which is used to draw the coolant near the CPU from the extraction port and discharge it from the outlet after passing through the first pipe, the second pipe and the manifold.

4. The liquid cooling device of claim 2, wherein, The second pipe is a flexible hose.

5. The liquid cooling device of claim 2, wherein, The server rack contains a plurality of servers, and the liquid extraction manifold is provided with a plurality of second pipe interfaces. There are multiple second pipes, and the first pipe interface on each server is connected to a second pipe interface through a second pipe.

6. The liquid cooling device of claim 2, wherein, The server has multiple CPUs and multiple liquid extraction ports, each liquid extraction port corresponding to at least one CPU, and the multiple liquid extraction ports are converged and connected to the first pipe interface through the first pipe.

7. The liquid cooling device of claim 2, wherein, The liquid inlet is located at the bottom of the cabinet so that the coolant flows from bottom to top inside the cabinet; A coolant outlet tank is provided on one side inside the cabinet. The top of the coolant outlet tank has an opening. The coolant flowing from bottom to top through the server enters the coolant outlet tank after reaching the height of the opening. The liquid outlet tank is connected to the liquid outlet port so that the coolant in the liquid outlet tank can be discharged through the liquid outlet port.

8. The liquid cooling device of claim 7, wherein, The server has evenly distributed inlet holes at the bottom and evenly distributed outlet holes at the top. The inlet holes allow the coolant to enter the interior of the server, and the outlet holes allow the coolant to flow out of the interior of the server.

9. The liquid cooling device of any of claims 1-8, wherein, The top of the rack is provided with an openable cover, which is used to allow the server to be loaded into or removed from the rack when opened.

10. A liquid cooling system, characterized by, The device includes a heat exchanger cooling device and a liquid cooling device according to any one of claims 1-9. The cooling device is connected to the liquid outlet and the liquid inlet respectively. The cooling device is used to cool the coolant output from the liquid outlet and then input it into the liquid cooling device through the liquid inlet.

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