Terminal heat dissipation module

Abstract

The utility model provides a terminal heat dissipation module. The terminal heat dissipation module comprises a first-stage heat dissipation module and a second-stage heat dissipation module. A first-stage air duct and a first fan are arranged in the first-stage heat dissipation module, the first-stage air duct comprises a first-stage air inlet, a circuit board mounting cavity and a first-stage air outlet, and the first fan is used for sucking air from the first-stage air inlet to form airflow and enabling the airflow to flow out of the first-stage air outlet after flowing through the circuit board mounting cavity; a second-stage air duct and a second fan are arranged in the second-stage heat dissipation module, the second-stage air duct comprises a second-stage air inlet and a second-stage air outlet, and an inter-stage air inlet communicated with the second-stage air outlet is formed in the side wall of the circuit board mounting cavity; and the second fan is used for sucking air from the secondary air inlet to form airflow and enabling the airflow to flow through the secondary air outlet and the interstage air inlet and then enter the circuit board mounting cavity. The terminal heat dissipation module provided by the utility model is used for assembling the circuit board of the terminal, and can timely and efficiently carry out cooling and heat dissipation on the circuit board.

Description

Technical Field

[0001] This utility model relates to the technical field of accessories for electronic terminal equipment, and more specifically to a terminal heat dissipation module. Background Technology

[0002] When electronic terminal devices such as time attendance machines are running, their internal circuits generate high temperatures. This is especially true for electronic devices installed in open-air environments. Without an efficient cooling mechanism, the internal temperature of the device will become too high, leading to slow processing, crashes, and other problems. Prolonged operation at high temperatures will accelerate the aging of electronic components and shorten the lifespan of electronic devices. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a terminal heat dissipation module for assembling the core circuit board of the terminal, which can cool down the core circuit board of the terminal in a timely and efficient manner, and protect the electronic components inside the terminal.

[0004] The technical solution of this utility model is to provide a terminal heat dissipation module, including a primary heat dissipation module and a secondary heat dissipation module. The primary heat dissipation module is provided with a primary air duct and a first fan. The primary air duct includes a primary air inlet, a circuit board mounting cavity, and a primary air outlet. The first fan is disposed in the primary air inlet and is used to draw in air from the primary air inlet to form an airflow, which then flows through the circuit board mounting cavity and exits from the primary air outlet. The secondary heat dissipation module is provided with a secondary air duct and a second fan. The secondary air duct includes a secondary air inlet and a secondary air outlet. An interstage air inlet communicating with the secondary air outlet is provided on the side wall of the circuit board mounting cavity. The second fan is disposed in the secondary air inlet and is used to draw in air from the secondary air inlet to form an airflow, which then flows through the secondary air outlet and the interstage air inlet before entering the circuit board mounting cavity.

[0005] Compared with existing technologies, the terminal heat dissipation module of this utility model has the following advantages: It has a two-stage heat dissipation module, which can install the core circuit board of the terminal in the circuit board mounting cavity. Both stages of the heat dissipation module can dissipate heat and cool the circuit board through air circulation, which can protect the electronic components in the terminal and is conducive to energy saving and efficiency improvement. When the power consumption of the circuit board is not high and the temperature is normal, only the first fan needs to be turned on to cool the circuit board through the first-stage heat dissipation module. That is, the outside air is drawn in from the first-stage air inlet to form a first-stage heat dissipation airflow. The first-stage heat dissipation airflow flows over the surface of the circuit board in the circuit board mounting cavity, carrying away heat. The high-temperature air after absorbing heat flows out from the first-stage air outlet. When the power consumption of the circuit board is high and the temperature is too high, the second fan is turned on. The second-stage heat dissipation module and the first-stage heat dissipation module work together to cool the circuit board. That is, the outside air is drawn in from the second-stage air inlet to form a second-stage heat dissipation airflow. The first-stage heat dissipation airflow and the second-stage heat dissipation airflow flow together over the surface of the circuit board in the circuit board mounting cavity, which can carry away heat in a timely and efficient manner.

[0006] Preferably, the secondary heat dissipation module is equipped with a semiconductor cooling chip, which is used to cool the airflow entering the secondary air duct. With this structure, the semiconductor cooling chip cools the airflow entering the secondary air duct, ensuring that the air entering the circuit board mounting cavity from the secondary heat dissipation module is cold air, thus rapidly cooling the circuit board within the mounting cavity.

[0007] Preferably, the secondary air inlet and the primary air outlet are arranged adjacent to each other, with the cold end of the thermoelectric cooler located inside the secondary air inlet and the hot end located inside the primary air outlet. This structure ensures that the cooling capacity entering the circuit board mounting cavity from the secondary heat dissipation module is not affected, and that the heat generated by the thermoelectric cooler is concentrated at the primary air outlet and quickly expelled with the airflow.

[0008] Preferably, the sidewall of the secondary air duct is in close contact with the sidewall of the circuit board mounting cavity, and the secondary air outlet and the interstage air inlet are opposite to each other and directly connected. With this structure, since the air flowing in the secondary air duct is cold air, the sidewall of the secondary air duct and the sidewall of the circuit board mounting cavity can directly conduct heat, improving the efficiency of heat exchange and quickly cooling the circuit board environment in the circuit board mounting cavity.

[0009] Preferably, the primary air inlet is located at the lower left corner of the circuit board mounting cavity, the primary air outlet is located at the upper right corner of the circuit board mounting cavity, and the interstage air inlet is located on the lower side wall of the circuit board mounting cavity; the side wall of the secondary air duct is closely attached to the right and lower side walls of the circuit board mounting cavity, the secondary air inlet is located at the right end of the secondary air duct, the secondary air outlet is located at the upper left end of the secondary air duct, and the interstage air inlet and the secondary air outlet are vertically connected. With this structure, the distance between the primary air inlet and the primary air outlet is the greatest, and the distance between the interstage air inlet and the primary air outlet is also large, which increases the length and area of ​​airflow through the circuit board mounting cavity. The heat exchange area between the side wall of the secondary air duct and the side wall of the circuit board mounting cavity is also large, all of which are beneficial for heat absorption by the circuit board.

[0010] Preferably, the primary air outlet is located above the secondary air inlet, with the primary air outlet facing upwards and the secondary air inlet facing to the right. With this structure, hot air blown out from the primary air outlet will not be drawn into the secondary air inlet.

[0011] Preferably, the primary air duct has a hot-end mounting position for the cooling chip on its side wall below the primary air outlet, used to mount the hot end of the thermoelectric cooler; the secondary air duct has a cold-end mounting position for the cooling chip on its upper side wall inside the secondary air inlet, used to mount the cold end of the thermoelectric cooler, with the hot-end mounting positions opposite to the cold-end mounting positions. With this structure, the cold end of the thermoelectric cooler is located inside the secondary air inlet, which does not affect the cooling capacity entering the circuit board mounting cavity from the secondary heat dissipation module, while the hot end of the thermoelectric cooler is located inside the primary air outlet, concentrating the heat generated by the thermoelectric cooler at the primary air outlet, facilitating rapid heat dissipation with the airflow.

[0012] Preferably, the primary heat dissipation module includes a first heat dissipation plate and a first cover plate. The first heat dissipation plate has vertical walls around its perimeter. The first cover plate covers the vertical walls to form the primary air duct. The vertical walls have notches at the interstage air inlet and the hot end mounting position of the cooling element. This structure results in a simple primary air duct structure, easy assembly, and low production cost.

[0013] Preferably, the secondary heat dissipation module includes a second heat dissipation plate and a second cover plate. The second heat dissipation plate has vertical walls around its perimeter. The second cover plate covers the vertical walls to form the secondary air duct. The vertical walls have notches at the secondary air outlet and the cold end mounting position of the cooling element. This structure results in a simple secondary air duct structure, easy assembly, and low production costs.

[0014] Preferably, the terminal heat dissipation module further includes a housing. A first air inlet, opposite to the primary air inlet, is located on the left side of the lower side wall of the housing. An air outlet, opposite to the primary air outlet, is located on the right side of the upper side wall of the housing. A second air inlet, opposite to the secondary air inlet, is located on the upper part of the right side wall of the housing. With this structure, the housing integrates the primary and secondary heat dissipation modules into a single unit, which is beneficial for assembly with the terminal product. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the terminal heat dissipation module of this utility model.

[0016] Figure 2 for Figure 1 Exploded view.

[0017] Figure 3 This is a schematic diagram of the primary heat dissipation airflow of the terminal heat dissipation module of this utility model.

[0018] Figure 4 This is a schematic diagram of the two-stage heat dissipation airflow of the terminal heat dissipation module of this utility model.

[0019] As shown in the figure: 1. First heat sink, 1-1. Circuit board mounting cavity, 1-2. Primary air inlet, 1-3. Primary air outlet, 1-4. Interstage air inlet, 1-5. Hot end mounting position of the cooling chip, 2. First cover plate, 3. First fan, 4. Second heat sink, 4-1. Secondary air inlet, 4-2. Secondary air outlet, 4-3. Cold end mounting position of the cooling chip, 5. Second fan, 6. Semiconductor cooling chip, 7. Second cover plate, 8. Housing, 8-1. First air inlet, 8-2. Air outlet, 8-3. Second air inlet, 9. Circuit board. Detailed Implementation

[0020] To better understand this application, various aspects of this application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of this application and are not intended to limit the scope of this application in any way. Throughout the specification, the same reference numerals refer to the same elements.

[0021] In the accompanying drawings, the thickness, size, and shape of the objects have been slightly exaggerated for illustrative purposes. The drawings are for illustrative purposes only and are not drawn to scale.

[0022] It should also be understood that the terms "comprising," "having," "including," and "containing," when used in this specification, indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Furthermore, when expressions such as "...at least one" appear after a list of listed features, they modify the entire listed feature, not individual elements in the list.

[0023] like Figure 1 and Figure 2 As shown, the terminal heat dissipation module of this utility model includes a housing 8, and a primary heat dissipation module and a secondary heat dissipation module are provided inside the housing 8.

[0024] The primary heat dissipation module includes a first heat sink 1 and a first cover plate 2. The first heat sink 1 has vertical walls around its perimeter. The first cover plate 2 covers these vertical walls to form a primary air duct. The primary air duct includes a primary air inlet 1-2, a circuit board mounting cavity 1-1, and a primary air outlet 1-3. The primary air inlet 1-2 is located at the lower left corner of the circuit board mounting cavity 1-1, and the primary air outlet 1-3 is located at the upper right corner of the circuit board mounting cavity 1-1. A first fan 3 is installed inside the primary air inlet 1-2. The operation of the first fan 3 draws in air from the primary air inlet 1-2 to form an airflow, which then flows through the circuit board mounting cavity 1-1 and exits from the primary air outlet 1-3. The side walls of the primary air duct, including the side walls of the circuit board mounting cavity 1-1, are all formed by the vertical walls of the first heat sink 1. The lower side wall of the housing 8 is provided with a first air inlet 8-1 opposite to the first-stage air inlet 1-2 on the left side, and the upper side wall of the housing 8 is provided with an air outlet 8-2 opposite to the first-stage air outlet 1-3 on the right side.

[0025] The secondary heat dissipation module includes a second heat dissipation plate 4 and a second cover plate 7. The second heat dissipation plate 4 is surrounded by vertical walls. The second cover plate 7 covers the vertical walls to form the secondary air duct. The secondary air duct includes a secondary air inlet 4-1 and a secondary air outlet 4-2. The secondary air inlet 4-1 is located at the right end of the secondary air duct, and the left end of the secondary air duct is closed. The vertical wall of the second heat dissipation plate 4 has a notch at the upper left side of the secondary air duct. The notch is the secondary air outlet 4-2. A second fan 5 is installed inside the secondary air inlet 4-1. When the second fan 5 operates, it can draw in air from the secondary air inlet 4-1 to form an airflow, and make the airflow flow through the secondary air duct and out through the secondary air outlet 4-2.

[0026] The vertical wall of the second heat sink 4 is closely attached to the right and lower side walls of the circuit board mounting cavity 1-1. The primary air outlet 1-3 is located above the secondary air inlet 4-1, with the primary air outlet 1-3 facing upwards and the secondary air inlet 4-1 facing to the right. A second air inlet 8-3 is provided on the upper part of the right side wall of the housing 8, opposite to the secondary air inlet 4-1. The vertical wall of the first heat sink 1 has a notch at the lower side wall of the circuit board mounting cavity 1-1. The notch is an interstage air inlet 1-4, which is vertically connected to the secondary air outlet 4-2. The airflow from the secondary air outlet 4-2 enters the circuit board mounting cavity 1-1 through the interstage air inlet 1-4.

[0027] The first heat sink 1 has a notch located below the primary air outlet 1-3 on its vertical wall; this notch is the hot end mounting position 1-5 for the cooling chip. The second heat sink 4 also has a notch located on the upper side of its vertical wall inside the secondary air inlet 4-1; this notch is the cold end mounting position 4-3 for the cooling chip. The hot end mounting positions 1-5 and 4-3 are vertically opposite each other. A semiconductor cooling chip 6 is installed within the secondary heat dissipation module. The cold end of the semiconductor cooling chip 6 is mounted at the cold end mounting position 4-3, and the hot end is mounted at the hot end mounting position 1-5. The semiconductor cooling chip 6 can cool the airflow entering the secondary air duct.

[0028] By applying the terminal heat dissipation module of this utility model, the core circuit board of the terminal can be installed in the circuit board mounting cavity 1-1. Both heat dissipation modules can dissipate heat and cool the circuit board through air circulation, which can protect the electronic components in the terminal and is also conducive to energy saving and efficiency improvement.

[0029] When the circuit board's power consumption is low and the temperature is normal, simply turn on the first fan 3 to cool the circuit board through the primary heat dissipation module. Figure 3 As shown, outside air is drawn in from the primary air inlet 1-2 to form a primary heat dissipation airflow. The primary heat dissipation airflow flows over the surface of the circuit board in the circuit board mounting cavity 1-1, carrying away heat. The high-temperature air after absorbing heat flows out from the primary air outlet 1-3.

[0030] When the circuit board experiences high power consumption and excessive temperature, the second fan 5 is activated, and the secondary and primary heat dissipation modules work together to cool the circuit board. Figure 4 As shown, outside air is drawn in from the secondary air inlet 4-1 to form a secondary heat dissipation airflow. The airflow entering the secondary air duct is cooled by the semiconductor cooling chip 6, so that the air entering the circuit board mounting cavity 1-1 from the secondary heat dissipation module is cold air, which can quickly cool the circuit board in the circuit board mounting cavity 1-1. The heat generated by the semiconductor cooling chip 6 is concentrated at the primary air outlet 1-3 and can be quickly discharged with the airflow.

[0031] In other embodiments, the secondary air duct can be directly produced using Z-shaped pipe profiles, and the primary air duct can also have a pipe profile welded to the lower left corner and the upper right corner of the plate forming the circuit board mounting cavity 1-1 to form a primary air inlet 1-2 and a primary air outlet 1-3.

[0032] The above are merely specific embodiments of this utility model and are not intended to limit the scope of implementation of this utility model. Any modifications or equivalent substitutions to this utility model without departing from its spirit and scope should be covered within the protection scope of the claims of this utility model.

Claims

1. A terminal heat dissipation module, characterized in that, It includes a primary heat dissipation module and a secondary heat dissipation module; the primary heat dissipation module is provided with a primary air duct and a first fan (3), the primary air duct includes a primary air inlet (1-2), a circuit board mounting cavity (1-1) and a primary air outlet (1-3), the first fan (3) is set in the primary air inlet (1-2), the first fan (3) is used to draw in air from the primary air inlet (1-2) to form an airflow and make the airflow flow through the circuit board mounting cavity (1-1) and then flow out from the primary air outlet (1-3); the secondary heat dissipation module is provided with a primary air duct and a first fan (3). The secondary air duct includes a secondary air inlet (4-1) and a secondary air outlet (4-2). An interstage air inlet (1-4) communicating with the secondary air outlet (4-2) is provided on the side wall of the circuit board mounting cavity (1-1). The second fan (5) is located inside the secondary air inlet (4-1). The second fan (5) is used to draw in air from the secondary air inlet (4-1) to form an airflow and to make the airflow flow through the secondary air outlet (4-2) and the interstage air inlet (1-4) before entering the circuit board mounting cavity (1-1).

2. The terminal heat dissipation module according to claim 1, characterized in that, The secondary heat dissipation module is equipped with a semiconductor cooling chip (6), which is used to cool the airflow entering the secondary air duct.

3. The terminal heat dissipation module according to claim 2, characterized in that, The secondary air inlet (4-1) and the primary air outlet (1-3) are arranged adjacent to each other. The cold end of the semiconductor cooling chip (6) is located in the secondary air inlet (4-1), and the hot end of the semiconductor cooling chip (6) is located in the primary air outlet (1-3).

4. The terminal heat dissipation module according to claim 3, characterized in that, The sidewall of the secondary air duct is closely attached to the sidewall of the circuit board mounting cavity (1-1), and the secondary air outlet (4-2) is connected to the interstage air inlet (1-4) vertically.

5. The terminal heat dissipation module according to claim 4, characterized in that, The primary air inlet (1-2) is located at the lower left corner of the circuit board mounting cavity (1-1), the primary air outlet (1-3) is located at the upper right corner of the circuit board mounting cavity (1-1), and the interstage air inlet (1-4) is located on the lower side wall of the circuit board mounting cavity (1-1). The side wall of the secondary air duct is closely attached to the right side wall and the lower side wall of the circuit board mounting cavity (1-1). The secondary air inlet (4-1) is located at the right end of the secondary air duct, and the secondary air outlet (4-2) is located on the upper left side of the secondary air duct. The interstage air inlet (1-4) and the secondary air outlet (4-2) are connected vertically.

6. The terminal heat dissipation module according to claim 5, characterized in that, The primary air outlet (1-3) is located above the secondary air inlet (4-1), with the primary air outlet (1-3) facing upwards and the secondary air inlet (4-1) facing to the right.

7. The terminal heat dissipation module according to claim 6, characterized in that, The primary air duct is provided with a hot end mounting position (1-5) for a cooling chip on the side wall below the primary air outlet (1-3). The hot end mounting position (1-5) is used to install the hot end of the semiconductor cooling chip (6). The secondary air duct is provided with a cold end mounting position (4-3) for a cooling chip on the upper side wall inside the secondary air inlet (4-1). The cold end mounting position (4-3) is used to install the cold end of the semiconductor cooling chip (6). The hot end mounting position (1-5) and the cold end mounting position (4-3) are vertically opposite each other.

8. The terminal heat dissipation module according to claim 7, characterized in that, The first-stage heat dissipation module includes a first heat dissipation plate (1) and a first cover plate (2). The first heat dissipation plate (1) is surrounded by vertical walls. The first cover plate (2) covers the vertical walls to form the first-stage air duct. The vertical walls are provided with notches at the interstage air inlet (1-4) and the hot end mounting position (1-5) of the cooling chip.

9. The terminal heat dissipation module according to claim 7, characterized in that, The secondary heat dissipation module includes a second heat dissipation plate (4) and a second cover plate (7). The second heat dissipation plate (4) is surrounded by vertical walls. The second cover plate (7) covers the vertical walls to form the secondary air duct. The vertical walls are provided with notches at the secondary air outlet (4-2) and the cold end mounting position (4-3) of the cooling chip.

10. The terminal heat dissipation module according to claim 6, characterized in that, The terminal heat dissipation module also includes a housing (8). The left side of the lower side wall of the housing (8) is provided with a first air inlet (8-1) opposite to the first-stage air inlet (1-2). The right side of the upper side wall of the housing (8) is provided with an air outlet (8-2) opposite to the first-stage air outlet (1-3). The upper part of the right side wall of the housing (8) is provided with a second air inlet (8-3) opposite to the second-stage air inlet (4-1).

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