Silicon carbide power device packaging device

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a silicon carbide power device packaging device, the top of a pillar is fixedly provided with a lower die, the top of the lower die is slidably provided with an upper die through a slide bar, and the two sides of the upper die are fixedly installed with the output ends of hydraulic lifting rods. Liquid epoxy resin is injected into the lower mold and the upper mold through the injection holes, and then the lower mold is driven by the vibration motor to vibrate, so that permeation of the liquid epoxy resin into gaps among the supporting legs is accelerated, and bubbles are reduced; the mold is heated through the upper heating ring and the lower heating ring, so that the rapid solidification of the liquid epoxy resin is accelerated; the hydraulic lifting rod drives the upper mold to move upwards along the sliding rod, and if the epoxy resin shell is clamped in the upper mold, the epoxy resin shell can be pushed out downwards through the injection hole; if the epoxy resin shell is clamped in the lower die, the push plate is driven by the air cylinder to move upwards, the push plate can push out the epoxy resin shell upwards, and therefore material taking of the packaged silicon carbide power device is achieved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically to a silicon carbide power device packaging device. Background Technology

[0002] The packaging process can be roughly divided into eight main steps: backside thinning, wafer dicing, wafer mounting, wire bonding, molding, laser printing, lead cutting and forming, and finished product testing. In the molding process, semiconductors are placed in a mold and epoxy resin is injected to protect the chip and other components from damage and to prevent gas from oxidizing the internal chip. However, the more lead pins there are and the smaller the gaps between the lead pins, the more difficult it is for the injected epoxy resin to penetrate into the gaps between the lead pins. At the same time, after the epoxy resin solidifies, it is not easy to remove it from the mold and requires a certain amount of time to disassemble. Utility Model Content

[0003] (a) Technical problems to be solved

[0004] To address the shortcomings of existing technologies, this invention provides a silicon carbide power device packaging device that has the advantages of penetrating pin gaps, rapid solidification, and easy removal, thus solving the aforementioned problems.

[0005] (II) Technical Solution

[0006] To achieve the aforementioned goals of penetrating the gaps in the pins, rapid solidification, and easy removal, this utility model provides the following technical solution: a silicon carbide power device packaging device, comprising a base, a support column fixedly installed on the top of the base, a lower mold fixedly installed on the top of the support column, an upper mold slidably installed on the top of the lower mold via a sliding rod, the two sides of the upper mold being fixedly installed with the output ends of a hydraulic lifting rod, the hydraulic lifting rod being embedded in the two sides of the lower mold, an injection hole being provided on the top of the upper mold, and clamping plates being fixedly installed on the sides of both the upper and lower molds, the surface of the clamping plates having grooves, and power device support feet being engaged inside the clamping plates via the grooves.

[0007] Preferably, a substrate is fixedly mounted on the side end of the power unit foot, a chip is soldered onto the surface of the substrate, and an epoxy resin shell is wrapped around the outside of the substrate.

[0008] Preferably, an upper heating coil is embedded inside the upper mold, a lower heating coil is embedded inside the lower mold, a core column is fixedly installed on the inner wall of the lower mold, and the substrate is fitted on the outside of the core column.

[0009] Preferably, two symmetrically arranged vibration motors are fixedly installed at the bottom of the lower mold, a cylinder is fixedly installed at the bottom of the lower mold, and a push plate is fixedly installed at the output end of the cylinder, the push plate being movably fitted into the inner bottom wall of the lower mold.

[0010] Preferably, both the inner walls of the lower mold and the upper mold are fixedly equipped with protrusions, and both sides of the side wall of the upper mold are fixedly equipped with semi-circular blocks.

[0011] (III) Beneficial Effects

[0012] Compared with the prior art, the present invention provides a silicon carbide power device packaging device, which has the following beneficial effects:

[0013] This silicon carbide power device packaging device uses liquid epoxy resin injected into the lower and upper molds through injection holes. A vibration motor then drives the lower mold to vibrate, accelerating the penetration of the liquid epoxy resin into the gaps between the support legs and reducing bubble formation. Upper and lower heating coils heat the molds, accelerating the rapid solidification of the liquid epoxy resin. A hydraulic lifting rod drives the upper mold to move upwards along a sliding rod. If the epoxy resin shell is stuck in the upper mold, it can be pushed out through the injection holes. If the epoxy resin shell is stuck in the lower mold, a cylinder drives a push plate to move upwards, pushing the epoxy resin shell out, thus enabling the unloading of the packaged silicon carbide power device. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0015] Figure 2 This is an exploded structural diagram of the present invention;

[0016] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0017] Figure 4 This is a partial bottom view of the structure of this utility model;

[0018] Figure 5 This is a partial top-view exploded structural diagram of the present invention;

[0019] Figure 6 This is a partial bottom-view exploded structural diagram of the present invention.

[0020] In the diagram: 1. Base; 2. Support column; 3. Lower mold; 4. Slide rod; 5. Upper mold; 6. Hydraulic lifting rod; 7. Injection hole; 8. Power unit support foot; 9. Epoxy resin shell; 10. Clamping plate; 11. Groove; 12. Upper heating ring; 13. Lower heating ring; 14. Core column; 15. Vibration motor; 16. Cylinder; 17. Push plate; 18. Protrusion; 19. Semicircular block. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-6 A silicon carbide power device packaging device includes a base 1, a support column 2 fixedly installed on the top of the base 1, a lower mold 3 fixedly installed on the top of the support column 2, an upper mold 5 slidably installed on the top of the lower mold 3 via a slide rod 4, the two sides of the upper mold 5 being fixedly installed with the output ends of a hydraulic lifting rod 6, the hydraulic lifting rod 6 being embedded in the two sides of the lower mold 3, and the upper mold 5 can be driven to slide up and down along the slide rod 4 via the hydraulic lifting rod 6.

[0023] Please see Figure 2-3 The top of the upper mold 5 is provided with an injection hole 7. Both the upper mold 5 and the lower mold 3 are fixedly installed with clamping plates 10. The surface of the clamping plate 10 is provided with a groove 11. The inside of the clamping plate 10 is connected to the power unit support foot 8 through the groove 11. The side end of the power unit support foot 8 is fixedly installed with a substrate. The surface of the substrate is soldered with a chip. The outside of the substrate is wrapped with an epoxy resin shell 9.

[0024] Please see Figure 3-5 The upper mold 5 is equipped with an upper heating ring 12, and the lower mold 3 is equipped with a lower heating ring 13. When the two heating rings are running, they can accelerate the solidification of epoxy resin. The inner wall of the lower mold 3 is fixedly installed with a core column 14, the substrate is fitted on the outside of the core column 14, and the power unit support 8 is embedded in the clamping plate 10. When the upper and lower clamping plates 10 overlap, the substrate and the power unit support 8 can be supported, ensuring that the substrate is wrapped with epoxy resin from top to bottom.

[0025] Please see Figure 2-4 Two symmetrically arranged vibration motors 15 are fixedly installed at the bottom of the lower mold 3. The vibration motors 15 can cause the lower mold 3 to vibrate, thereby allowing the epoxy resin to penetrate into each gap. A cylinder 16 is fixedly installed at the bottom of the lower mold 3. A push plate 17 is fixedly installed at the output end of the cylinder 16. The push plate 17 is movably fitted into the inner bottom wall of the lower mold 3. The cylinder 16 drives the push plate 17 to move upward, and the push plate 17 will push the epoxy resin shell 9 upward and move it out.

[0026] Please see Figure 5-6 Both the lower mold 3 and the upper mold 5 have protrusions 18 fixedly installed on their inner walls to ensure that the epoxy resin shell 9 has a notch on its side; both sides of the upper mold 5 have semi-circular blocks 19 fixedly installed on their side walls to ensure that the epoxy resin shell 9 has a semi-circular stepped notch on its side.

[0027] Working principle: When in use, the upper mold 5 is moved up and opened by the hydraulic lifting rod 6, the base plate is fitted on the core column 14, the power unit support 8 is locked in the groove 11 of the clamping plate 10, and then the upper mold 5 is driven down and closed with the lower mold 3 by the hydraulic lifting rod 6.

[0028] Liquid epoxy resin is injected into the lower mold 3 and the upper mold 5 through the injection hole 7. Air in the mold cavity is also discharged from the injection hole 7 as the epoxy resin enters. Then, the lower mold 3 is vibrated by the vibration motor 15, which accelerates the penetration of liquid epoxy resin into the gap between the support legs and reduces the formation of air bubbles.

[0029] Heating the mold with the upper heating coil 12 and the lower heating coil 13 accelerates the rapid solidification of the liquid epoxy resin.

[0030] The upper mold 5 is driven to move upward along the slide bar 4 by the hydraulic lifting rod 6. If the epoxy resin shell 9 is stuck in the upper mold 5, the epoxy resin shell 9 can be pushed out through the injection hole 7.

[0031] If the epoxy resin shell 9 is stuck in the lower mold 3, the push plate 17 is driven to move upward by the cylinder 16. The push plate 17 can push the epoxy resin shell 9 out, thereby realizing the unloading of the packaged silicon carbide power device.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon carbide power device packaging arrangement comprising a base (1) characterised in that: The top of the base (1) is fixedly installed with a support column (2), the top of the support column (2) is fixedly installed with a lower mold (3), the top of the lower mold (3) is slidingly installed with an upper mold (5) through a sliding rod (4), the two sides of the upper mold (5) are fixedly installed with output ends of hydraulic lifting rods (6), the hydraulic lifting rods (6) are embedded on the two sides of the lower mold (3), the top of the upper mold (5) is provided with an injection hole (7), the side surfaces of the upper mold (5) and the lower mold (3) are fixedly installed with clamping plates (10), the surface of the clamping plate (10) is provided with a groove (11), and the inside of the clamping plate (10) is clamped with a power device foot (8) through the groove (11).

2. A silicon carbide power device package according to claim 1, wherein: The side end of the power device foot (8) is fixedly installed with a substrate, and the surface of the substrate is welded with a chip.

3. A silicon carbide power device package according to claim 2, wherein: The inside of the upper mold (5) is embedded with an upper heating ring (12), the inside of the lower mold (3) is embedded with a lower heating ring (13), the inner wall of the lower mold (3) is fixedly installed with a core column (14), and the substrate is sleeved on the outside of the core column (14).

4. The silicon carbide power device package of claim 1, wherein: The bottom of the lower mold (3) is fixedly installed with two symmetrical vibration motors (15), the bottom of the lower mold (3) is fixedly installed with an air cylinder (16), the output end of the air cylinder (16) is fixedly installed with a push plate (17), and the push plate (17) is movably embedded on the inner bottom wall of the lower mold (3).

5. The silicon carbide power device package of claim 1, wherein: The inner walls of the lower mold (3) and the upper mold (5) are fixedly installed with protrusions (18), and the side walls of the upper mold (5) are fixedly installed with semicircular blocks (19) on the two sides.

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