Wafer supporting assembly and measuring equipment
By designing a wafer support assembly with a height difference, the problem of the robot arm being incompatible with multiple wafer sizes was solved, and the horizontal maintenance and equipment compatibility of wafers of different sizes were achieved during the measurement process.
Patent Information
- Application Number
- CN202520401480.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-03-07
AI Technical Summary
Existing robotic arms cannot meet the measurement needs of wafers of various sizes, resulting in wafers of different diameters being unable to be kept horizontal during handling and measurement.
A wafer support assembly was designed, including a first support and a second support. The support has a support portion with a height difference. The wafer with a larger diameter is placed on the support portion with a higher diameter than the wafer with a smaller diameter. It is connected to a robot arm through a connector to ensure that wafers of different sizes remain horizontal during handling.
This technology enables wafers of different specifications to remain level during measurement without changing fingers or readjusting, thus improving the compatibility and efficiency of the measurement equipment.
Smart Images
Figure CN223968196U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of wafer measurement technology, and in particular to a wafer support assembly and measurement equipment. Background Technology
[0002] In the semiconductor industry, metrology equipment plays a crucial role in monitoring, identifying, locating, and analyzing process defects during production. It enables timely detection of wafer problems, process improvement, and increased yield. During metrology, a robotic arm is needed to move the wafer stored in the pre-vacuum chamber to the measurement chamber, and simultaneously, the movement of the robotic arm allows for measurement at different points on the wafer. Measurement accuracy is related to wafer height, tilt angle, and other factors; to ensure accuracy, the wafer must remain horizontal at the measurement points at all times.
[0003] To improve measurement efficiency and equipment compatibility, it is necessary to simultaneously meet the handling and measurement needs of wafers of various sizes. However, during the movement within the entire handling and measurement area, when the robot arm is leveled based on a wafer of one diameter, it will be unable to maintain a horizontal position when changing to wafers of different diameters.
[0004] Therefore, the robotic arms in related technologies cannot meet the measurement needs of wafers of various sizes. Utility Model Content
[0005] This application provides a wafer support assembly and a measurement device. The wafer support assembly can ensure that all wafers of different sizes remain horizontal at all times when handling wafers of different sizes.
[0006] In a first aspect, this application provides a wafer support assembly, comprising: a first support member having a plurality of first support portions arranged at intervals along a first circumference, the first support portions being configured to support a first wafer; a second support member having a plurality of second support portions arranged at intervals along a second circumference, the second support portions being configured to support a second wafer; and a connector, one end of which is connected to both the first and second support members, the other end of which is configured to be connected to a robotic arm, the robotic arm driving the wafer support assembly to move; wherein the center of the first circumference coincides with the center of the second circumference, the diameter of the first circumference is larger than the diameter of the second circumference, and the diameter of the first wafer is larger than the diameter of the second wafer; and in the direction of gravity, the first support portion is higher than the second support portion.
[0007] In one possible implementation, each of the first support portions has a height difference with a corresponding second support portion; each of the first support portions is at a preset distance from the rotation center of the robot arm; wherein the height difference increases as the preset distance increases.
[0008] In other words, the height difference of each set of support points is related to the distance between that set of support points and the rotation center of the robot arm. The farther the distance between the support points and the rotation center of the robot arm, the greater the height difference of that set of support points, in order to compensate for the difference in the levelness of wafers of different sizes and specifications.
[0009] In one possible implementation, the line connecting the center of the circle to any point on the circumference is a first connecting line, and each of the first support portions is spaced apart from a corresponding second support portion on the first connecting line.
[0010] In other words, each first support part is set with a corresponding second support part to obtain a set of support points; the corresponding setting of the two support parts can reduce manufacturing difficulty and improve manufacturing efficiency.
[0011] In one possible implementation, the first support member includes a first ring, the second support member includes a second ring, the diameter of the first ring is larger than the diameter of the second ring, one end of the connector is connected to the circumcircle of the first ring, and the inscribed circle of the first ring intersects the circumcircle of the second ring; the first ring has a first surface on which a plurality of first support portions are disposed; the second ring has a second surface on which a plurality of second support portions are disposed.
[0012] In one possible implementation, the first support portion is a first groove disposed on the first surface, the first groove matching the first wafer; the second support portion is a second groove disposed on the second surface, the second groove matching the second wafer.
[0013] The groove matches the wafer, which can limit the wafer's mounting position and prevent the wafer from moving during measurement. The groove does not increase the weight of the ring, and there is no need to add other limiting components to the ring, reducing manufacturing difficulty.
[0014] In one possible implementation, the first support portion is a first annular flange disposed on the first surface, the first annular flange surrounding the first wafer; the second support portion is a second annular flange disposed on the second surface, the second annular flange surrounding the second wafer.
[0015] The annular flange matches the wafer and can limit the wafer's mounting position to prevent the wafer from moving during measurement. When the thickness of the annular flange is thin, the wafer is limited by setting an annular flange on the annular flange.
[0016] In one possible implementation, the first surface is higher than the second surface in the direction of gravity.
[0017] By limiting the surface height of the two rings, a height difference is created between their surfaces, thereby making the first horizontal plane where the first support is located higher than the second horizontal plane where the second support is located, resulting in a simple structure.
[0018] In one possible implementation, the first support member, the second support member, and the connector are integrally formed.
[0019] The one-piece molded wafer support assembly has a simple structure and higher stability.
[0020] In one possible implementation, the plurality of first support portions are arranged at equal circumferential intervals along the first circumference, and the plurality of second support portions are arranged at equal circumferential intervals along the second circumference.
[0021] When measuring multiple wafers simultaneously, multiple large-sized wafers are evenly distributed on the first support, and multiple small-sized wafers are evenly distributed on the second support; this ensures that the multiple large-sized wafers and multiple small-sized wafers are evenly stressed on the wafer support assembly.
[0022] Secondly, this application provides a measurement device that includes the wafer support assembly described above.
[0023] The wafer support assembly provided in this application has the following technical advantages:
[0024] Wafers of different diameters are placed on different support sections with different height differences. The wafers with larger diameters are placed on the first support section, and the wafers with smaller diameters are placed on the second support section. The horizontal plane of the first support section is higher than that of the second support section. When moving the wafers with a robotic arm, it is possible to ensure that wafers of different specifications remain horizontal without changing fingers or readjusting, thus meeting the measurement needs of wafers of different specifications. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 A schematic diagram of the wafer support assembly provided in the embodiments of this application. Figure 1 ;
[0027] Figure 2 A schematic diagram of the wafer support assembly provided in the embodiments of this application. Figure 2 ;
[0028] Figure 3 This is a cross-sectional schematic diagram of the wafer support assembly provided in an embodiment of this application;
[0029] Figure 4 A schematic diagram illustrating the leveling of wafers of different specifications provided in related technologies;
[0030] Figure 5 This is a schematic diagram of leveling wafers of different specifications on a wafer support assembly provided in an embodiment of this application.
[0031] Figure label:
[0032] 100 - First support member; 101 - First support part; 110 - First horizontal plane;
[0033] 200 - Second support member; 201 - Second support part; 210 - Second horizontal plane;
[0034] 300-Connector;
[0035] 501 - Large wafer support finger; 502 - Small wafer support finger; 601 - Large wafer; 602 - Small wafer. Detailed Implementation
[0036] refer to Figure 4 The article discusses the leveling of wafers of different specifications in related technologies. A large-size wafer 601 is placed on a large-size wafer support finger 501, and a small-size wafer 602 is placed on a small-size wafer support finger 502. The large-size wafer 601 and small-size wafer 602 have different diameters, resulting in different masses. When wafers of different diameters are placed on the robotic arm's fingers, the amount of finger drooping will differ. Since the diameter of the large-size wafer 601 is larger than that of the small-size wafer 602, the drooping amount of the large-size wafer support finger 501 is greater than that of the small-size wafer support finger 502. This variation in finger drooping will cause inconsistencies in the height of the upper surface of the wafers placed on the fingers. Due to process constraints, without replacing the fingers or readjusting, it is impossible to ensure that wafers of different sizes remain level, thus making it impossible to simultaneously measure wafers of different diameters.
[0037] The wafer support assembly provided in this application sets wafers of different diameters on different support parts with different height differences. The wafers with larger diameters are set on the first support part, and the wafers with smaller diameters are set on the second support part. The horizontal plane of the first support part is higher than the horizontal plane of the second support part, so as to solve the problem that the amount of finger drooping of the robot arm is different due to wafers of different diameters. When the robot arm moves the wafers, it can ensure that wafers of different diameters remain horizontal without changing the fingers or re-leveling.
[0038] To make the objectives, technical solutions, and advantages of this application clearer, the application will be described in further detail below with reference to the accompanying drawings. The terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be limiting of the application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.
[0039] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., used in this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0040] like Figure 1 , Figure 2 and Figure 3 As shown in the embodiment of this application, a wafer support assembly includes a first support 100 and a second support 200. The first support 100 may include a first ring, and the second support 200 may include a second ring. The center of the first ring and the center of the second ring coincide. The first ring and the second ring are concentric circles, and the diameter of the first ring is larger than the diameter of the second ring. The outer circle of the second ring is connected to the inner circle of the first ring, thereby connecting the first support 100 and the second support 200.
[0041] Meanwhile, the outer circle of the first ring is also connected to a robotic arm, which is used to move the wafer support assembly.
[0042] Along the direction of gravity of the wafer, the first ring has two opposing surfaces, the upper surface being the first surface. Multiple first support portions 101 are provided on the first surface, and the multiple first support portions 101 are arranged at intervals along the circumference of the first circle, which is the circumference of the first ring.
[0043] Similarly, along the direction of gravity of the wafer, the second ring has two opposing surfaces, the upper surface being the second surface. Multiple second support portions 201 are provided on the second surface, and the multiple second support portions 201 are arranged at intervals along the circumference of the second ring.
[0044] The first support portion 101 is used to set the first wafer, and the second support portion 201 is used to set the second wafer; the diameter of the first wafer is larger than the diameter of the second wafer.
[0045] In this configuration, the first horizontal plane 110 where the first support 101 is located is higher than the second horizontal plane 210 where the second support 201 is located, in the direction of wafer gravity. When a large-diameter first wafer is placed on the first support 101 and a small-diameter second wafer is placed on the second support 201, the first wafer exerts a force on the first support 101 due to its own gravity, and the second wafer exerts a force on the second support 201 due to its own gravity. At the same time, since the mass of the large-diameter first wafer is greater than the mass of the small-diameter second wafer, the height to which the first horizontal plane 110 where the first support 101 is located falls is greater than the height to which the second horizontal plane 210 where the second support 201 is located falls. The fact that the first horizontal plane 110 where the first support 101 is located is higher than the second horizontal plane 210 where the second support 201 is located can compensate for the height difference caused by wafers of different diameters. This ensures that the large-diameter first wafer and the small-diameter second wafer are on the same horizontal plane, thus solving the problem of different finger drooping amounts caused by wafers of different diameters.
[0046] In other words, reference Figure 5 As shown, when using a robotic arm to move wafers, there is no need to change fingers or readjust, and wafers of different diameters can still be kept level.
[0047] It should be noted that multiple large-diameter wafers can be set on multiple first support parts 101 respectively, and multiple small-diameter wafers can be set on multiple second support parts 201 respectively. When measuring multiple wafers at the same time, the spatial position status of wafers with different diameters can be independently adjusted.
[0048] Meanwhile, since the mass of the large-diameter first wafer is greater than that of the small-diameter second wafer, and when the large-diameter first wafer is placed on the first support 101 and the small-diameter second wafer is placed on the second support 201, the large-diameter first wafer is located on the outer ring and the small-diameter second wafer is located on the inner ring, it can ensure that wafers of different diameters are subjected to uniform force on the wafer support assembly.
[0049] In this embodiment, along the direction of gravity of the wafer, the first surface of the first ring is higher than the second surface of the second ring; by limiting the surface height of the two rings, the surfaces of the two rings have a height difference, thereby making the first horizontal plane 110 where the first support 101 is located higher than the second horizontal plane 210 where the second support 201 is located, which simplifies the structure and reduces the manufacturing difficulty.
[0050] In this embodiment of the application, the line connecting the center of the circle and any point on the circumference is the first connecting line (radius line). Each first support part 101 is arranged on the first connecting line with a corresponding second support part 201, and each first support part 101 is spaced apart from a corresponding second support part 201.
[0051] In other words, each first support part 101 is correspondingly set with a second support part 201 to obtain a set of support points; the corresponding setting of the two support parts can reduce manufacturing difficulty and improve manufacturing efficiency.
[0052] In this embodiment of the application, the wafer support assembly further includes a connector 300. One end of the connector 300 is connected to the circumference of the outer circle of the first ring, and the other end of the connector 300 is configured to be connected to a robot arm, which drives the wafer support assembly to move.
[0053] Each first support 101 has a height difference with a corresponding second support 201, and each first support 101 is at a preset distance from the rotation center of the robot arm; wherein the height difference increases as the preset distance increases.
[0054] In other words, the height difference of each set of support points (a first support part 101 and a second support part 201) is related to the distance between the set of support points and the rotation center of the robot arm. The farther the distance between the support points and the rotation center of the robot arm, the greater the height difference of the set of support points, so as to compensate for the difference in the levelness of wafers of different sizes and specifications.
[0055] Continue to refer to Figure 1 and Figure 2 In this embodiment of the application, the first support portion 101 is a first groove disposed on the first surface, the first groove matches the first wafer, and the first wafer is disposed in the first groove; the second support portion 201 is a second groove disposed on the second surface, the second groove matches the second wafer, and the second wafer is disposed in the second groove.
[0056] The groove matches the wafer, which can limit the wafer's mounting position and prevent the wafer from moving during measurement. The groove does not increase the weight of the ring, and there is no need to add other limiting components to the ring, reducing manufacturing difficulty.
[0057] The first groove and the second groove can be circular grooves.
[0058] In this embodiment, the first support portion 101 is a first annular flange disposed on the first surface, and the first annular flange surrounds the first wafer; the second support portion 201 is a second annular flange disposed on the second surface, and the second annular flange surrounds the second wafer.
[0059] The annular flange matches the wafer and can limit the wafer's mounting position to prevent the wafer from moving during measurement. When the thickness of the annular flange is thin, the wafer is limited by setting an annular flange on the annular flange.
[0060] In this embodiment, the first support member 100, the second support member 200, and the connector 300 can be integrally formed.
[0061] The one-piece molded wafer support assembly has a simple structure and higher stability.
[0062] In this embodiment of the application, a plurality of first support portions 101 are arranged at equal intervals along the circumference of a first circle, and a plurality of second support portions 201 are arranged at equal intervals along the circumference of a second circle.
[0063] When measuring multiple wafers simultaneously, multiple large-sized wafers are evenly distributed on the first support 100, and multiple small-sized wafers are evenly distributed on the second support 200; ensuring that multiple large-sized wafers and multiple small-sized wafers are evenly stressed on the wafer support assembly.
[0064] This application also provides a measurement device, which includes the wafer support assembly described above.
[0065] In summary, the wafer support assembly and measurement device provided in this application include: a first support member 100 and a second support member 200. The first support member 100 is provided with a plurality of first support portions 101, which are arranged at intervals along the circumference of a first circumference. The first support portions 101 are configured to support a first wafer. The second support member 200 is provided with a plurality of second support portions 201, which are arranged at intervals along the circumference of a second circumference. The second support portions 201 are configured to support a second wafer. The center of the first circumference coincides with the center of the second circumference, and the diameter of the first circumference is larger than the diameter of the second circumference. The diameter of the first wafer is larger than the diameter of the second wafer. In the direction of gravity, the first support portion 101 is higher than the second support portion 201. Wafers of different diameters are placed on different support sections with different height differences. The wafers with larger diameters are placed on the first support section 101, and the wafers with smaller diameters are placed on the second support section 201. The horizontal plane of the first support section 101 is higher than the horizontal plane of the second support section 201. When moving the wafers with a robotic arm, it is possible to ensure that wafers of different specifications remain horizontal without changing fingers or readjusting, thus meeting the measurement needs of wafers of different specifications.
[0066] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A wafer support assembly, characterized in that, include: A first support member is provided with a plurality of first support portions, which are arranged at circumferential intervals along a first circumference. The first support portions are configured to place a first wafer. The second support member has a plurality of second support portions arranged at circumferential intervals along the second circumference, and the second support portions are configured to place the second wafer. A connector, one end of which is connected to both the first support and the second support, and the other end of which is configured to be connected to a robotic arm, the robotic arm driving the wafer support assembly to move; Wherein, the center of the first circumference coincides with the center of the second circumference, the diameter of the first circumference is larger than the diameter of the second circumference, and the diameter of the first wafer is larger than the diameter of the second wafer; In the direction of gravity, the first support portion is higher than the second support portion.
2. The wafer support assembly according to claim 1, characterized in that, Each of the first support portions has a height difference with a corresponding second support portion; Each of the first support components is a preset distance from the rotation center of the robotic arm; The height difference increases as the preset distance increases.
3. The wafer support assembly according to claim 1, characterized in that, The line connecting the center of the circle to any point on the circumference is the first connecting line, and each of the first support parts is spaced apart from a corresponding second support part on the first connecting line.
4. The wafer support assembly according to claim 1, characterized in that, The first support member includes a first ring, the second support member includes a second ring, the diameter of the first ring is larger than the diameter of the second ring, one end of the connector is connected to the outer circle of the first ring, and the inner circle of the first ring intersects the outer circle of the second ring. The first ring has a first surface, and a plurality of the first support portions are disposed on the first surface; The second ring has a second surface, on which a plurality of second support portions are disposed.
5. The wafer support assembly according to claim 4, characterized in that, The first support portion is a first groove disposed on the first surface, and the first groove matches the first wafer; The second support portion is a second groove disposed on the second surface, and the second groove matches the second wafer.
6. The wafer support assembly according to claim 4, characterized in that, The first support portion is a first annular flange disposed on the first surface, and the first annular flange is disposed around the first wafer; The second support portion is a second annular flange disposed on the second surface, and the second annular flange surrounds the second wafer.
7. The wafer support assembly according to claim 4, characterized in that, In the direction of gravity, the first surface is higher than the second surface.
8. The wafer support assembly according to claim 1, characterized in that, The first support member, the second support member, and the connecting member are integrally formed.
9. The wafer support assembly according to claim 1, characterized in that, The plurality of first support portions are arranged at equal intervals along the circumference of the first circumference, and the plurality of second support portions are arranged at equal intervals along the circumference of the second circumference.
10. A measuring device, characterized in that, Includes the wafer support assembly as described in any one of claims 1-9.