Power module heat dissipation module and electronic equipment

Abstract

The utility model discloses a power module heat radiation module and an electronic device, and relates to the power assembly technology field, the power module heat radiation module comprises a radiator, a heat conduction box, a power assembly and a first heat conduction medium; the heat conduction box is attached to the outer side wall of the radiator, and a first containing cavity is formed in the heat conduction box. The power assembly is installed in the first containing cavity in a limited mode. And the first heat-conducting medium is filled in the first accommodating cavity and wraps the outer side of the power assembly. The utility model aims to simplify the installation process of the power tube assembly and improve the heat dissipation efficiency of the power module.

Description

Technical Field

[0001] This utility model relates to the field of power component technology, and in particular to a power module heat dissipation module and electronic device. Background Technology

[0002] In related technologies, electronic components generate heat during operation, requiring timely heat dissipation to ensure their normal operation. Taking power transistors as an example, power transistors are commonly used semiconductor devices, widely applied in amplifiers, switches, voltage control, and power control due to their fast switching speed, high efficiency, and good thermal stability.

[0003] Existing power transistor heat dissipation installation solutions generally use spring clips or adhesive to fix the power transistor to the heat dissipation surface. However, the installation method of fixing the power transistor to the heat dissipation surface with spring clips or adhesive is complicated and requires consideration of material selection, installation process and curing time. At the same time, problems such as poor thermal contact and uneven heat conduction may occur during use, affecting the heat dissipation effect. Therefore, it is not conducive to improving the heat dissipation performance of the power transistor. Utility Model Content

[0004] The main purpose of this invention is to propose a power module heat dissipation module and electronic device, which aims to simplify the installation process of power transistor components and improve the heat dissipation efficiency of power modules.

[0005] To achieve the above objectives, this utility model proposes a power module heat dissipation module, comprising:

[0006] heat sink;

[0007] A heat-conducting box is attached to the outer wall of the heat sink, and a first cavity is formed inside the heat-conducting box.

[0008] A power component, wherein the power component is positioned and installed within the first cavity; and

[0009] A first thermally conductive medium is filled within the first cavity and surrounds the outside of the power component.

[0010] In one embodiment, a second cavity is formed inside the heat sink;

[0011] The power module heat dissipation module further includes a magnetic core device and a second heat-conducting medium. The magnetic core device is housed in the second cavity, and the second heat-conducting medium is housed in the second cavity and surrounds the outside of the magnetic core device.

[0012] In one embodiment, the heat-conducting box has a first filling port that communicates with the first cavity;

[0013] The radiator has a second filling port that connects to the second cavity;

[0014] The first filling port and the second filling port are located on the same side of the radiator.

[0015] In one embodiment, the first thermally conductive medium is a thermally conductive adhesive; and / or

[0016] The second thermally conductive medium is a thermally conductive adhesive.

[0017] In one embodiment, the heat-conducting box includes a main box body and a box sidewall. The interior of the main box body has a communicating mounting groove and a sliding groove. The box sidewall is slidably engaged with the sliding groove so that the box sidewall and the main box body can together enclose the first cavity.

[0018] In one embodiment, the heat-conducting box has a plurality of first cavities spaced apart inside;

[0019] The power module heat dissipation module includes multiple power components, and each of the multiple power components is configured to correspond one-to-one with a multiple of the first cavities.

[0020] In one embodiment, the power assembly includes a substrate and a power element disposed on one side of the substrate, wherein the side of the substrate facing away from the power element is thermally connected to the cavity wall of the first cavity near the heat sink, or the side of the power element facing away from the substrate is thermally connected to the cavity wall of the first cavity near the heat sink.

[0021] In one embodiment, the substrate is a ceramic plate, one side of which is bonded to the cavity wall of the first cavity near the heat sink, and the heat dissipation surface of the power element is thermally connected to the side of the ceramic plate facing away from the heat sink.

[0022] In one embodiment, the substrate is a circuit board, the heat dissipation surface of the power element is thermally connected to the cavity wall of the first cavity near the heat sink, and the circuit board is connected to the side of the power element facing away from the heat sink. The shape of the first cavity is adapted to the shape of the circuit board so that the circuit board can be snapped into the first cavity.

[0023] This utility model also provides an electronic device, including the power module heat dissipation module as described above.

[0024] The power module heat dissipation module proposed in this utility model significantly improves the heat dissipation efficiency of the power components by setting up a heat-conducting box. Specifically, heat dissipation is achieved by installing the power components inside the heat-conducting box and filling it with a thermally conductive medium. This eliminates the need for spring clips or adhesive to fix the power tubes to the heat dissipation surface, greatly simplifying the installation process and reducing manufacturing complexity. Furthermore, the first thermally conductive medium wrapped around the outside of the power components can cover most of the outer surface of the power components, including the corners and edges, thus maximizing the heat dissipation area. Heat can be transferred from multiple directions, which helps to improve the overall heat dissipation efficiency. At the same time, the design of the heat-conducting box ensures good thermal contact between the power components and the heat sink, effectively improving the heat conduction efficiency and avoiding the problem of uneven heat conduction. This improves the heat dissipation performance of the power tubes and effectively solves the problems of low heat transfer efficiency and difficulty in reducing the temperature of power tubes in existing heat dissipation solutions, thereby improving the overall heat dissipation performance and reliability of the power module. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 A schematic diagram of the structure of an embodiment of the power module heat dissipation module provided by this utility model;

[0027] Figure 2 A schematic diagram of the structure of an embodiment of the heat-conducting box provided by this utility model;

[0028] Figure 3 A schematic diagram of another embodiment of the power module heat dissipation module provided by this utility model;

[0029] Figure 4 This is a schematic diagram of another embodiment of the power module heat dissipation module provided by this utility model.

[0030] Explanation of icon numbers:

[0031] 100. Power module heat dissipation module; 1. Heat sink; 11. Second cavity; 12. Second filling port; 2. Heat conduction box; 21. Main box body; 22. Box side wall; 23. Partition; 24. First cavity; 25. Slide groove; 26. First filling port; 3. Power component; 31. Substrate; 311. Circuit board; 312. Ceramic plate; 32. Power element.

[0032] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0034] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] This utility model proposes a power module heat dissipation module 100.

[0037] Please see Figures 1 to 4 In one embodiment of the present invention, the power module heat dissipation module 100 includes a heat sink 1, a heat conduction box 2, a power component 3, and a first heat conduction medium; the heat conduction box 2 is attached to the outer side wall of the heat sink 1, and a first cavity 24 is formed inside the heat conduction box 2; the power component 3 is limited and installed in the first cavity 24; the first heat conduction medium fills the first cavity 24 and wraps around the outside of the power component 3.

[0038] The power module heat dissipation module proposed in this utility model significantly improves the heat dissipation efficiency of the power component 3 by setting up a heat-conducting box 2. Specifically, by installing the power component 3 inside the heat-conducting box 2 and filling it with a thermally conductive medium to achieve heat dissipation, it is no longer necessary to use spring clips or adhesive to fix the power tube to the heat dissipation surface, greatly simplifying the installation process and reducing the complexity of the process. Moreover, the first thermally conductive medium wrapped around the outside of the power component 3 can cover most of the outer surface of the power component 3, including the corners and edges of the power component 3, thus maximizing the heat dissipation area. Heat can be transferred from multiple directions, which helps to improve the overall heat dissipation efficiency. At the same time, the design of the heat-conducting box 2 ensures good thermal contact between the power component 3 and the heat sink 1, effectively improving the heat conduction efficiency and avoiding the problem of uneven heat conduction, thereby improving the heat dissipation performance of the power tube. It effectively solves the problems of low heat transfer efficiency and difficulty in reducing the temperature of the power tube in existing heat dissipation solutions, thereby improving the overall heat dissipation performance and reliability of the power module.

[0039] It should be noted that the heat-conducting box 2 is a component used to improve heat conduction efficiency. It is typically made of materials with good thermal conductivity. Its main function is to effectively conduct the heat generated inside the radiator 1 to the external environment, thereby reducing the temperature of the device. The heat-conducting box 2 can be fixed to the outer surface of the radiator 1 by adhesives, mechanical fastening, or other methods to ensure direct contact with the structure of the radiator 1, thus achieving effective heat transfer and ensuring that the heat-conducting box 2 will not detach during operation and maintain good thermal contact. The material of the heat-conducting box 2 can be metals with good thermal conductivity such as aluminum alloy, copper, and nickel, or insulating thermally conductive materials such as ceramics and plastics.

[0040] In one embodiment, the heat sink 1 has a second cavity 11 and a cooling cavity inside, with the cooling cavity surrounding the second cavity 11; the heat conduction box 2 is located close to the cooling cavity; the power module heat dissipation module 100 also includes a magnetic core device and a second heat conduction medium. The magnetic core device is housed in the second cavity 11, and the second heat conduction medium is housed in the second cavity 11 and surrounds the outside of the magnetic core device. By transferring the heat of the magnetic core device to the heat sink 1 through the second heat conduction medium, and then carrying it away by the cooling medium (coolant or cooling gas) in the cooling cavity, efficient heat dissipation is achieved. The location of the heat conduction box 2 close to the cooling cavity allows the heat in the heat conduction box 2 to be quickly transferred to the cooling cavity and carried away by the cooling medium. Furthermore, the second heat conduction medium surrounding the magnetic core device can cover most or all of the outer surface of the magnetic core device, including its corners and edges, thus maximizing the heat dissipation area. Heat can be transferred from multiple directions, which helps to improve the overall heat dissipation efficiency.

[0041] In one embodiment, the outer wall of the heat-conducting box 2 has a first filling port 26 communicating with the first cavity 24; the outer wall of the radiator 1 has a second filling port 12 communicating with the second cavity 11; wherein the first filling port 26 and the second filling port 12 are located on the same side of the radiator 1. Since the first filling port 26 and the second filling port 12 are located on the same side of the radiator 1, the filling of the first heat-conducting medium and the second heat-conducting medium can be completed simultaneously in one process, avoiding the problem of uneven filling caused by multiple inaccurate positioning, reducing operation steps and improving production efficiency.

[0042] In one embodiment, the first thermally conductive medium is a thermally conductive adhesive; and / or, the second thermally conductive medium is a thermally conductive adhesive. Thermally conductive adhesive is a material with good thermal conductivity, typically used to fill and seal gaps inside devices to improve heat transfer efficiency. Thus, using thermally conductive adhesive as both the first and second thermally conductive mediums allows for rapid heat transfer from the power component 3 and the magnetic core device to the heat sink 1 housing or the external environment. In other embodiments, the first and second thermally conductive mediums can also be thermally conductive pastes, typically made of metal oxides or silicon-based materials. These pastes can also fill gaps between electronic devices and the heat sink 1, improving heat transfer efficiency and aiding in heat dissipation. It should be noted that the materials of the first and second thermally conductive mediums can be the same or different, and the characteristics and advantages / disadvantages of different materials need to be comprehensively considered based on specific application requirements and system design.

[0043] In one embodiment, the heat-conducting box 2 includes a main box body 21 and a side wall 22. The interior of the main box body 21 has a communicating mounting groove and a sliding groove 25. The side wall 22 is slidably engaged with the sliding groove 25 so that the side wall 22 and the main box body 21 can together enclose a first cavity. Generally, the interior of the main box body 21 is provided with a partition 23, which can divide the interior of the main box body 21 into a communicating mounting groove and a sliding groove 25. When it is necessary to install or repair the power component 3, the side wall 22 can be slid open to facilitate the operation and maintenance of the power component 3, improving the flexibility and maintainability of the entire system.

[0044] Please refer to Figure 4 In one embodiment, the heat-conducting box 2 has multiple first cavities 24 formed inside; the power module heat dissipation module includes multiple power components 3, and the multiple power components 3 are arranged one-to-one with the multiple first cavities 24. By forming multiple first cavities 24 inside the heat-conducting box 2, each power component 3 can be effectively provided with an independent heat dissipation space, ensuring that the multiple power components 3 can be adequately cooled simultaneously during operation, thereby improving the stability and performance of the overall system. In this way, not only can the heat dissipation efficiency be improved, but also the thermal interference between the power components 3 can be reduced, and their service life can be extended.

[0045] Please refer to Figure 2In one embodiment, the power component 3 includes a substrate 31 and a power element 32 disposed on one side of the substrate 31. The side of the substrate 31 facing away from the power element 32 is thermally connected to the cavity wall of the first cavity 24 near the heat sink 1; alternatively, the side of the power element 32 facing away from the substrate 31 is thermally connected to the cavity wall of the first cavity 24 near the heat sink 1. It should be noted that the power element 32 is the component that actually performs power processing, such as a power transistor, diode, or IGBT, while the substrate 31 typically serves as a mounting platform for the power element 32, and its material is generally made of ceramic, metal, or other materials with good thermal conductivity, or a circuit board 311. Taking power transistors as an example, they can be divided into two main categories based on the heat dissipation method: top heat dissipation and non-top heat dissipation. When a top heat dissipation package type of power transistor is used, the substrate 31 is a circuit board 311, and multiple power transistors are mounted on the circuit board 311. Since the thermal conductivity of the circuit board 311 is poor, the heat dissipation surface of the power transistor is placed close to the heat sink 1. When a non-top heat dissipation package type of power transistor is used, a ceramic plate 312 is selected as the substrate 31. Since ceramic materials usually have good thermal conductivity and good electrical insulation properties, the ceramic substrate 31 is placed close to the heat sink 1 to more effectively transfer the heat of the power transistor to the heat sink 1.

[0046] Furthermore, in one embodiment, the substrate 31 is a ceramic plate 312. One side of the ceramic plate 312 is bonded to the cavity wall of the first cavity 24 near the heat sink 1, and the heat dissipation surface of the power element 32 is thermally connected to the side of the ceramic plate 312 facing away from the heat sink 1. Bonding is typically achieved using an adhesive, which allows the ceramic substrate 31 to be fixed within the first cavity 24, thereby ensuring that the ceramic substrate 31 will not shift or detach during assembly and use. Furthermore, an adhesive with good thermal conductivity can be selected to help conduct heat from the ceramic substrate 31 to the cavity or other components, thereby improving heat dissipation efficiency.

[0047] Furthermore, in one embodiment, the substrate 31 is a circuit board 311. The heat dissipation surface of the power element 32 is thermally connected to the cavity wall of the first cavity 24 near the heat sink 1. The circuit board 311 is connected to the side of the power element 32 facing away from the heat sink 1. The shape of the first cavity is adapted to the shape of the circuit board 311 so that the circuit board 311 can be snapped into the first cavity. The design of snapping the circuit board 311 into the first cavity simplifies the assembly process, eliminates the need for complex fixing devices, and the adapted shape design helps to achieve a compact structure, saves space, and allows the circuit board 311 to make direct contact with the heat sink 1, reducing thermal resistance and helping to keep the power element 32 at a lower operating temperature.

[0048] This utility model also discloses an electronic device, which includes a power module heat dissipation module 100. The specific structure of the power module heat dissipation module 100 is as described in the above embodiments. Since the electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0049] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A power module heat sink module, characterized by, The power module heat dissipation module comprises: a heat sink; a heat conduction box attached to an outer sidewall of the heat sink, an inner portion of the heat conduction box being formed with a first cavity; a power assembly installed in the first cavity in a limiting manner; and a first heat conduction medium filled in the first cavity and wrapped around an outer side of the power assembly. An inner portion of the heat sink is formed with a second cavity; 2. The power module heat sink module of claim 1, wherein, the power module heat dissipation module further comprises a magnetic core device and a second heat conduction medium, the magnetic core device being contained in the second cavity, and the second heat conduction medium being contained in the second cavity and wrapped around an outer side of the magnetic core device. The heat conduction box is provided with a first potting opening communicating with the first cavity; 3. The power module heat sink module of claim 2, wherein, the heat sink is provided with a second potting opening communicating with the second cavity; wherein the first potting opening and the second potting opening are located on the same side of the heat sink. The first heat conduction medium is heat conduction glue; and / or 4. The power module heat sink assembly of claim 2, wherein, the second heat conduction medium is heat conduction glue. The heat conduction box comprises a main box body and a box sidewall, an inner portion of the main box body being formed with a communicating installation slot and a sliding slot; the box sidewall is in sliding cooperation with the sliding slot, so that the box sidewall can be cooperatively enclosed with the main box body to form the first cavity.

5. The power module heat sink assembly of claim 1, wherein, An inner portion of the heat conduction box is provided with a plurality of the first cavities; 6. The power module heat sink assembly of claim 1, wherein, the power module heat dissipation module comprises a plurality of the power assemblies, and the plurality of the power assemblies are provided in one-to-one correspondence with the plurality of the first cavities. The power assembly comprises a substrate and a power element provided on one side of the substrate, wherein a side of the substrate away from the power element is in heat conduction connection with a cavity wall of the first cavity close to the heat sink, or a side of the power element away from the substrate is in heat conduction connection with the cavity wall of the first cavity close to the heat sink.

7. The power module heat sink module of any one of claims 1 to 6, wherein, The substrate is a ceramic plate, one side of the ceramic plate is bonded with the cavity wall of the first cavity close to the heat sink, and a heat dissipation surface of the power element is in heat conduction connection with a side of the ceramic plate away from the heat sink.

8. The power module heat sink module of claim 7, wherein, The substrate is a circuit board, a heat dissipation surface of the power element is in heat conduction connection with the cavity wall of the first cavity close to the heat sink, and the circuit board is connected to a side of the power element away from the heat sink, wherein a shape of the first cavity is adapted to a shape of the circuit board, so that the circuit board can be clamped in the first cavity.

9. The power module heat sink module of claim 7, wherein, The power module heat dissipation module comprises the power module heat dissipation module according to any one of claims 1 to 9.

10. An electronic device, comprising: ​

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