Triode with temperature sensor

Abstract

The utility model relates to the technical field of triodes, in particular to a triode with a temperature sensor, which comprises a triode body, and the triode body comprises a triode chip, a temperature sensor, a base island and a composite packaging shell. The triode chip is welded and fixed on the base island; the temperature sensor is arranged outside or on the surface of the triode chip; the whole base island is accommodated in the inner space of the composite packaging shell; the top of the composite packaging shell is connected with a heat conduction structure. The heat conduction structure comprises a heat conduction cover plate, heat dissipation fins and heat dissipation columns. The heat conduction cover plate is connected to the upper part of the composite packaging shell; the heat dissipation fins are connected to the upper surface of the heat conduction cover plate; the heat dissipation column is connected with an extension plate, and the extension plate is connected to one side of the heat conduction cover plate. The utility model aims to provide the triode with the temperature sensor, which is efficient in heat dissipation and has a temperature monitoring function.

Description

Technical Field

[0001] This utility model relates to the field of transistor technology, and in particular to a transistor with a temperature sensor. Background Technology

[0002] A transistor, also known as a bipolar junction transistor (BJT), is a semiconductor transistor that amplifies weak signals into larger electrical signals. It is also used as a contactless switch. Transistors are small, lightweight, consume little power, have a long lifespan, and are highly reliable. They are widely used in broadcasting, television, communications, radar, computers, automatic control devices, electronic instruments, and home appliances for amplification, oscillation, and switching functions.

[0003] Traditional transistors generate heat when current flows through them and typically do not have temperature monitoring capabilities. When there is abnormal current or poor heat dissipation in the circuit, the transistor is prone to overheating and damage, leading to circuit failure. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a transistor with efficient heat dissipation and temperature monitoring capabilities, and equipped with a temperature sensor.

[0005] The present invention adopts the following technical solution:

[0006] A transistor with a temperature sensor includes a transistor body comprising a transistor chip, a temperature sensor, a base island, and a composite package shell. The transistor chip is soldered and fixed to the base island. The temperature sensor is disposed on the outside or surface of the transistor chip. The base island is entirely housed within the internal space of the composite package shell. A thermally conductive structure is connected to the top of the composite package shell. The thermally conductive structure includes a thermally conductive cover plate, heat dissipation fins, and heat dissipation pillars. The thermally conductive cover plate is connected to the upper part of the composite package shell. The heat dissipation fins are connected to the upper surface of the thermally conductive cover plate. An extension plate is connected to the heat dissipation pillars, and the extension plate is connected to one side of the thermally conductive cover plate.

[0007] A further improvement to the above technical solution is that the temperature sensor is a dual-redundant thermistor type temperature sensor, including a first sensor and a second sensor. The first sensor is integrated into a transistor chip, and the second sensor is located at the bottom of the composite package.

[0008] A further improvement to the above technical solution is that the bottom four corners of the base island are respectively provided with a first heat-conducting pillar, and the bottom of the first heat-conducting pillar is connected to the composite encapsulation shell.

[0009] A further improvement to the above technical solution is that the composite packaging shell is a composite ceramic-metal packaging shell.

[0010] A further improvement to the above technical solution is that the heat-conducting cover is a U-shaped cover, and the U-shaped cover is fastened to the composite encapsulation shell.

[0011] A further improvement to the above technical solution is that the heat dissipation fins are provided in multiple forms, and the multiple heat dissipation fins are distributed in a comb-like array on the top of the heat-conducting cover plate, with a spacing of 0.5-1.2mm between adjacent heat dissipation fins.

[0012] A further improvement to the above technical solution is that the heat dissipation column is a hollow cylindrical structure, and the interior of the heat dissipation column is filled with a phase change heat dissipation material layer.

[0013] A further improvement to the above technical solution is that the transistor body further includes a first pin, a second pin, and a third pin, the first pin, the second pin, and the third pin are respectively connected to the base island, and a second heat-conducting pillar is respectively connected below the second pin and the third pin.

[0014] A further improvement to the above technical solution is that one end of the first pin is integrally formed and connected to the base island, and the end of the first pin opposite to the base island is provided with a first external terminal. The first external terminal is exposed on the outer surface of the composite package and covered with a first anti-oxidation tin plating layer.

[0015] A further improvement to the above technical solution is that both the second pin and the third pin include a soldering end and a second external terminal. The soldering end is bonded to the transistor chip via a wire, and the second external terminal is exposed on the outer surface of the composite package and covered with a second anti-oxidation tin plating layer.

[0016] The beneficial effects of this utility model are as follows:

[0017] This invention achieves accurate temperature monitoring through an integrated temperature sensor, and the dual redundancy design enhances reliability. The composite package shell, multiple heat-conducting pillars, heat dissipation fins, and phase change materials work together to form an efficient heat dissipation network, comprehensively improving heat dissipation efficiency. The anti-oxidation tin plating layer and reasonable pin design enhance the stability of electrical connections and structural durability, ultimately improving the working stability, lifespan, and environmental adaptability of the transistor. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the transistor with a temperature sensor according to this utility model;

[0019] Figure 2 for Figure 1 Exploded view of a transistor with a temperature sensor;

[0020] Figure 3 for Figure 1 A schematic diagram showing the connection of the base, first pin, second pin, and third pin of a transistor with a temperature sensor.

[0021] The numbers on the map are:

[0022] 10. Transistor body; 11. Transistor chip; 12. Base island; 13. Composite package shell; 14. First heat-conducting pillar; 15. Second pin; 16. Third pin; 17. Second heat-conducting pillar; 20. Temperature sensor; 21. First sensor; 22. Second sensor; 30. Thermal structure; 31. Thermal cover plate; 32. Heat sink fins; 33. Heat sink pillar; 34. Extension plate; 40. First pin; 41. First external terminal; 42. First anti-oxidation tin plating layer; 50. Soldering end; 51. Wire; 60. Second external terminal; 61. Second anti-oxidation tin plating layer. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] In the description of this utility model, it should be noted that the terms "vertical direction," "up," "down," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] like Figures 1 to 3The diagram illustrates an embodiment of the present invention, relating to a transistor with a temperature sensor. The transistor body 10 includes a transistor chip 11, a temperature sensor 20, a base island 12, and a composite package shell 13. The transistor chip 11 is soldered and fixed to the base island 12. The temperature sensor 20 is disposed outside or on the surface of the transistor chip 11. The base island 12 is entirely housed within the internal space of the composite package shell 13. A heat-conducting structure 30 is connected to the top of the composite package shell 13. The heat-conducting structure 30 includes a heat-conducting cover plate 31, heat dissipation fins 32, and heat dissipation pillars 33. The heat-conducting cover plate 31 is connected to the upper part of the composite package shell 13. The heat dissipation fins 32 are connected to the upper surface of the heat-conducting cover plate 31. An extension plate 34 is connected to the heat dissipation pillar 33 and is connected to one side of the heat-conducting cover plate 31.

[0027] Furthermore, by integrating a temperature sensor 20, real-time monitoring of the transistor's operating temperature is achieved. Through the coordinated operation of the heat-conducting cover plate 31, heat dissipation fins 32, and heat dissipation pillars 33 in the heat-conducting structure 30, when heat is generated during operation, heat is conducted from the transistor chip 11 through the base island 12 and the first heat-conducting pillar 14 to the composite package shell 13, and then efficiently discharged through the heat-conducting cover plate 31. The heat dissipation fins 32, with large-area convection heat dissipation as the core, quickly release heat. The phase change material layer of the heat dissipation pillars 33 assists in energy storage when the temperature changes abruptly. The three form a composite heat dissipation system of "conduction-convection-energy storage". This multi-dimensional collaborative design not only optimizes the heat transfer path but also provides differentiated heat dissipation support for different heat dissipation scenarios, ultimately achieving efficient heat dissipation of the transistor under all operating conditions, ensuring stable operation of the device in high-temperature environments, and extending its service life. In some embodiments, the extension plate 34 uses a thermally conductive material (such as metal), which can serve as an additional heat conduction path to further conduct and diffuse the heat from the thermally conductive cover plate 31, thereby helping to improve the overall heat dissipation efficiency. Even if the material does not directly conduct heat, the spatial heat dissipation layout of the heat dissipation structure can be indirectly optimized through the support layout.

[0028] Furthermore, the temperature sensor 20 is a dual-redundant thermistor type temperature sensor, including a first sensor 21 and a second sensor 22. The first sensor 21 is integrated into the transistor chip 11, and the second sensor 22 is located at the bottom of the composite package 13. Specifically, accurate temperature monitoring is achieved by integrating the temperature sensor 20, which adopts a dual-redundant thermistor design: the first sensor 21 is integrated into the transistor chip 11, which can accurately capture temperature changes in the core area of ​​the chip in real time; the second sensor 22 is located at the bottom of the composite package 13, which provides auxiliary monitoring of the overall operating environment temperature. The dual sensors form a redundant backup mechanism, effectively avoiding monitoring failure caused by the failure of a single sensor, and significantly improving the reliability and data integrity of temperature monitoring.

[0029] Furthermore, the base island 12 is provided with first heat-conducting pillars 14 at its four bottom corners, and the bottom of the first heat-conducting pillars 14 is connected to the composite packaging shell 13. Specifically, the first heat-conducting pillars 14 at the bottom of the base island 12 enhance the thermal conductivity between the base island 12 and the composite packaging shell 13, promote uniform heat conduction, and optimize the heat dissipation path.

[0030] Furthermore, the composite encapsulation shell 13 is a composite ceramic-metal encapsulation shell. Specifically, the composite ceramic-metal encapsulation shell combines the insulating properties of ceramics with the thermal conductivity of metals, ensuring the electrical safety of internal components while improving overall thermal conductivity.

[0031] Furthermore, the heat-conducting cover 31 is a U-shaped cover, which is fastened to the composite packaging shell 13. Specifically, the U-shaped fastening design tightly fastens to the composite packaging shell 13, forming a large-area contact interface. This structural design maximizes the coverage of the top of the composite packaging shell 13, eliminates air barriers to heat conduction, and rapidly conducts heat from inside the composite packaging shell 13 to the outside by increasing the heat-conducting contact area, shortening the heat transfer path and significantly improving the efficiency of the overall heat dissipation in the initial stage.

[0032] Furthermore, multiple heat dissipation fins 32 are provided, and these fins 32 are arranged in a comb-like array on the top of the heat-conducting cover plate 31, with a spacing of 0.5-1.2mm between adjacent heat dissipation fins 32. Specifically, this design utilizes the principle of air convection to expand the heat dissipation surface area, while the reasonable spacing ensures smooth airflow and avoids airflow obstruction. By increasing the heat dissipation surface area, the heat exchange efficiency with the air is enhanced; the orderly array layout guides airflow and accelerates heat dissipation into the environment, especially in natural heat dissipation scenarios, which can significantly improve heat dissipation performance.

[0033] Furthermore, the heat dissipation column 33 is a hollow cylindrical structure, and its interior is filled with a phase change heat dissipation material layer (not shown in the figure). Specifically, the heat dissipation column 33 is filled with a phase change heat dissipation material layer (not shown in the figure). When the temperature rises, the phase change material absorbs heat and undergoes a phase transformation (such as from solid to liquid), storing a large amount of latent heat. When the temperature drops, the material releases heat and returns to its original state. By utilizing the latent heat absorption characteristics of the phase change material, it dynamically responds to temperature fluctuations, quickly buffers temperature peaks during the concentrated heat release phase, and assists the heat dissipation fins 32 in balancing the heat dissipation process. This is especially suitable for intermittent high-load conditions, improving the stability and adaptability of the heat dissipation system.

[0034] Furthermore, the transistor body 10 also includes a first pin 40, a second pin 15, and a third pin 16, which are respectively connected to the base island 12. Second heat-conducting pillars 17 are connected below the second pin 15 and the third pin 16. Specifically, the second heat-conducting pillars 17 below the second pin 15 and the third pin 16 help conduct heat to the second pin 15 and the third pin 16, making the overall heat dissipation of the transistor more uniform and avoiding localized heat accumulation.

[0035] Furthermore, one end of the first pin 40 is integrally formed and connected to the base island 12. The end of the first pin 40 facing away from the base island 12 is provided with a first external terminal 41. The first external terminal 41 is exposed on the outer surface of the composite package shell 13 and covered with a first anti-oxidation tin plating layer 42. Specifically, the first pin 40 adopts an integral forming design to simplify the structure. The first anti-oxidation tin plating layer 42 on its outer side prevents oxidation and corrosion of the pin by isolating it from air, ensuring long-term stable external conductivity.

[0036] Furthermore, both the second pin 15 and the third pin 16 include a soldering end 50 and a second external terminal 60. The soldering end 50 is bonded to the transistor chip 11 via a wire 51, and the second external terminal 60 is exposed on the outer surface of the composite package 13 and covered with a second anti-oxidation tin plating layer 61. Specifically, the soldering ends 50 of the second pin 15 and the third pin 16 are reliably connected to the chip via wires 51 made of gold or copper wire, ensuring low resistance and high stability electrical conduction, reducing signal transmission loss and the risk of poor contact. The second anti-oxidation tin plating layer 61 protects the outer side of the pins from oxidation and corrosion. Combined with the scientific pin structure design, this enhances the durability and stability of the electrical connection.

[0037] This utility model achieves accurate temperature monitoring through the integrated temperature sensor 20, and the dual redundancy design improves reliability; the composite package shell 13, multiple heat-conducting pillars, heat dissipation fins 32 and phase change materials and other structures work together to form an efficient heat dissipation network, which improves heat dissipation efficiency in all aspects; the anti-oxidation tin plating layer and reasonable pin design enhance the stability of electrical connection and structural durability, and ultimately improve the working stability, life and environmental adaptability of the transistor.

[0038] The above description merely illustrates the preferred technical solution of this utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and this utility model also intends to include these modifications and variations.

Claims

1. A transistor with a temperature sensor, characterized by The triode body comprises a triode chip, a temperature sensor, a base island and a composite packaging shell; the triode chip is welded and fixed on the base island; the temperature sensor is arranged outside or on the surface of the triode chip; the base island is wholly accommodated in the internal space of the composite packaging shell; the top of the composite packaging shell is connected with a heat conduction structure; the heat conduction structure comprises a heat conduction cover plate, heat dissipation fins and heat dissipation columns; the heat conduction cover plate is connected to the upper part of the composite packaging shell; the heat dissipation fins are connected to the upper surface of the heat conduction cover plate; the heat dissipation columns are connected with extension plates, and the extension plates are connected to one side of the heat conduction cover plate.

2. The temperature sensor-equipped triode according to claim 1, characterized by, The temperature sensor is a thermistor type temperature sensor with a double-redundancy structure, comprising a first sensor and a second sensor; the first sensor is integrated in the triode chip, and the second sensor is arranged at the bottom of the composite packaging shell.

3. The temperature-sensor-equipped triode according to claim 1, characterized by, First heat conduction columns are arranged at the bottom corners of the base island, and the bottoms of the first heat conduction columns are connected to the composite packaging shell.

4. The temperature-sensor-equipped triode according to claim 1, characterized by, The composite packaging shell is a composite ceramic metal packaging shell.

5. The temperature-sensor-equipped triode according to claim 1, characterized by, The heat conduction cover plate is a U-shaped cover plate, which is connected to the composite packaging shell in a clamping manner.

6. The temperature sensor-equipped triode according to claim 1, characterized by A plurality of heat dissipation fins are arranged on the top of the heat conduction cover plate in a comb-shaped array, and the spacing between adjacent heat dissipation fins is 0.5-1.2 mm.

7. The temperature-sensor-equipped triode according to claim 1, characterized by The heat dissipation column is a hollow cylindrical structure, and the inside of the heat dissipation column is filled with a phase change heat dissipation material layer.

8. The temperature sensor-equipped triode according to claim 1, characterized by, The triode body further comprises a first pin, a second pin and a third pin, which are respectively connected to the base island; the second pin and the third pin are respectively connected with second heat conduction columns below.

9. The temperature sensor-equipped triode according to claim 8, characterized by One end of the first pin is integrally connected to the base island, and the end of the first pin away from the base island is provided with a first external terminal which is exposed on the outer surface of the composite packaging shell and covered with a first anti-oxidation tin plating layer.

10. The temperature sensor-equipped triode according to claim 8, characterized by The second pin and the third pin each comprise a soldering end and a second external terminal; the soldering end is bonded and connected to the triode chip through a wire; and the second external terminal is exposed on the outer surface of the composite packaging shell and covered with a second anti-oxidation tin plating layer.

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