Medical hot compress device for rheumatic joints
By using a semiconductor cooling chip and fan design in the hot compress device, the problem of inaccurate temperature control is solved, realizing safe and convenient hot and cold compress functions and improving the practicality of the device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2026-03-06
AI Technical Summary
Existing hot compress devices are difficult to control precisely in terms of temperature, which can easily lead to burns and affect patient recovery.
It adopts a design that combines a semiconductor cooling chip with a fan and a heat sink, and achieves precise temperature control through the Peltier effect. Combined with air cooling, it provides hot and cold compress functions.
It achieves precise temperature control, avoids the risk of burns, improves the safety and convenience of the hot compress device, and extends its service life.
Smart Images
Figure CN223969207U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of medical device technology, and in particular relates to a medical hot compress device for rheumatic joints. Background Technology
[0002] Rheumatoid arthritis is an allergic disease and one of the main manifestations of rheumatic fever. It typically begins with acute fever and joint pain, primarily affecting large joints such as the knee, ankle, shoulder, elbow, and wrist. The disease often spreads from one joint to another. The affected areas are red, swollen, hot, and extremely painful. Some patients may experience simultaneous involvement of several joints. Atypical cases may only present with joint pain without other inflammatory signs. Acute inflammation usually subsides within 2-4 weeks without leaving sequelae, but recurrence is common. If rheumatic activity affects the heart, myocarditis may occur, potentially leading to valvular heart disease.
[0003] Currently, hot compresses are a common treatment for rheumatoid arthritis. There are various types of hot compress treatments. Although the methods are simple to operate, temperature control is extremely difficult. It is impossible to effectively control the temperature of the externally applied object. If the operation is incorrect, it may cause serious consequences such as burns, which is not conducive to the patient's recovery. Utility Model Content
[0004] The purpose of this invention is to provide a medical hot compress device for rheumatic joints to solve the technical problems mentioned in the background art.
[0005] To achieve the above objectives, the specific technical solution of this utility model is as follows: A medical hot compress device for rheumatic joints includes a skin care strip, the surface of which is provided with an installation groove, in which a hot compresser is installed, and fixing straps are provided on the upper left side and the lower right side of the skin care strip. A semiconductor cooling chip is provided inside the hot compresser, and a first heat-conducting sheet is in contact with the surface of the semiconductor cooling chip. Multiple heat dissipation fins are provided on the side of the first heat-conducting sheet away from the semiconductor cooling chip, and a fan is installed on the heat dissipation fins.
[0006] Preferably, the fixing strap and the surface of the skin care strap are fixedly connected by Velcro.
[0007] Preferably, the skin care strip is composed of an outer layer of fabric, a second heat-conducting sheet, a 3D spacer fabric, and an inner layer of fabric from the outside to the inside.
[0008] Preferably, the end of the semiconductor cooling chip away from the first heat-conducting chip extends to the outside of the heat applicator and contacts the surface of the second heat-conducting chip.
[0009] Preferably, the semiconductor cooling chip includes a first ceramic plate and a second ceramic plate. A plurality of orderly distributed N-type semiconductors and P-type semiconductors are disposed between the first ceramic plate and the second ceramic plate. The tops of the N-type semiconductors and P-type semiconductors are in contact with the first ceramic plate through a first metal conductor. The bottoms of the N-type semiconductors and P-type semiconductors are respectively connected to a second metal conductor through solder. The bottom of the second metal conductor is in contact with the second ceramic plate, and the second ceramic plate is in contact with the surface of the first heat-conducting sheet.
[0010] Preferably, the surface of the heat therapy device is provided with a display screen, control buttons and heat dissipation holes.
[0011] Preferably, the inner cavity of the heat therapy device is provided with a circuit board, and the surface of the circuit board is respectively provided with a microcontroller, a temperature sensor and a power module.
[0012] The medical heat therapy device for rheumatic joint pain of this invention has the following advantages:
[0013] 1. This utility model achieves the function of hot and cold compress therapy through the synergistic cooperation between various modules, realizing hot and cold compress therapy and further improving the practicality and convenience of the medical rheumatoid arthritis hot compress device. The semiconductor cooling chip 7 achieves heating and cooling through the Peltier effect, without the need for other mechanical structure assistance, has a long service life and does not require maintenance. When applied to the medical rheumatoid arthritis hot compress device, it can avoid patients from disassembling and maintaining the structure of the medical rheumatoid arthritis hot compress device, making it a very convenient and safe heating and cooling source.
[0014] 2. This utility model uses a fan as the core device for air cooling and heat dissipation, and works with an aluminum heat sink to dissipate heat at the hot end of the semiconductor cooling chip. The first heat-conducting sheet conducts heat by heat transfer, and the heat sink expands the contact area with the air. The fan forces the air to flow, forming forced convection. Attached Figure Description
[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0017] Figure 2 This is a schematic diagram of the internal structure of the heat therapy device in this utility model;
[0018] Figure 3This is a schematic diagram of the structure of the semiconductor cooling chip in this utility model;
[0019] Figure 4 This is a schematic diagram of the skin care strip in this utility model.
[0020] The markings in the diagram are as follows: 1. Skin care strip; 2. Heat pack; 3. Display screen; 4. Control button; 5. Heat dissipation hole; 6. Fixing strap; 7. Semiconductor cooling chip; 8. First heat conduction sheet; 9. Heat sink; 10. Fan; 11. Circuit board; 12. Microcontroller; 13. Temperature sensor; 14. Power module; 15. First ceramic plate; 16. N-type semiconductor; 17. P-type semiconductor; 18. First metal conductor; 19. Second metal conductor; 20. Solder; 21. Second ceramic plate; 22. Outer fabric; 23. Second heat conduction sheet; 24. 3D spacer fabric; 25. Inner fabric. Detailed Implementation
[0021] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.
[0022] In the description of the embodiments of this utility model, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.
[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0024] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.
[0025] The following disclosure provides many different implementations or examples for different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.
[0026] To better understand the purpose, structure, and function of this utility model, the following description, in conjunction with the accompanying drawings, provides a more detailed account of a medical hot compress device for rheumatic joint pain.
[0027] like Figure 1-4 As shown, this utility model discloses a medical heat therapy device for rheumatic joints, including a skin care belt 1. The surface of the skin care belt 1 has an installation groove, in which a heat therapy device 2 is installed. Fixing straps 6 are located on the upper left and lower right sides of the skin care belt 1, and are fixed to the surface of the skin care belt 1 via Velcro. The cooperation between the fixing straps 6 and the skin care belt 1 facilitates quick and easy wearing of the device. The skin care belt 1, from the outside to the inside, consists of an outer fabric 22, a second heat-conducting sheet 23, a 3D spacer fabric 24, and an inner fabric 25. The outer fabric 22 is fleece, which has good heat retention properties, ensuring that the generated heat can be retained at the joint for a longer time, while also ensuring breathability and reducing the impact of sweat evaporation. The inner fabric 25 is a pure cotton lining, which is soft and smooth, ensuring the patient's comfort and breathability at the joint, while also ensuring sweat evaporation during heat therapy and avoiding a sticky feeling.
[0028] The heat therapy device 2 contains a semiconductor cooling chip 7. A first heat-conducting plate 8 contacts the surface of the semiconductor cooling chip 7. Multiple equally spaced heat sinks 9 are arranged on the side of the first heat-conducting plate 8 away from the semiconductor cooling chip 7, and a fan 10 is mounted on each heat sink 9. The end of the semiconductor cooling chip 7 away from the first heat-conducting plate 8 extends to the outside of the heat therapy device 2 and contacts the surface of a second heat-conducting plate 23. The temperature generated by the semiconductor cooling chip 7 is directly transferred to the first heat-conducting plate 8, and thus directly to the patient's joint. The thermoelectric cooler 7 includes a first ceramic plate 15 and a second ceramic plate 21. Multiple orderly distributed N-type semiconductors 16 and P-type semiconductors 17 are disposed between the first ceramic plate 15 and the second ceramic plate 21. The tops of the N-type semiconductors 16 and P-type semiconductors 17 are in contact with the first ceramic plate 15 through a first metal conductor 18. The bottoms of the N-type semiconductors 16 and P-type semiconductors 17 are respectively connected to a second metal conductor 19 through solder 20. The bottom of the second metal conductor 19 is in contact with the second ceramic plate 21, and the second ceramic plate 21 is in contact with the surface of the first heat-conducting sheet 8. A large number of PN junctions are often encapsulated in a thermoelectric cooler. The dense PN junctions are fixed between the upper and lower ceramic plates, and each PN junction is connected in series through a copper strip. The two ends of the circuit are powered by external wires. According to the Peltier effect, changes in current cause changes in the temperature of the thermoelectric cooler, generating different amounts of heat. By changing the actual voltage of the thermoelectric cooler, the current changes, thereby changing the heating or cooling capacity. The voltage value can be mapped to a temperature value. This invention uses a fan 10 as the core air-cooled heat dissipation device, and works in conjunction with an aluminum heat sink 9 to dissipate heat from the hot end of the thermoelectric cooler. The first heat-conducting plate 8 conducts heat via heat transfer, while the heat sink 9 increases the contact area with the air. The fan 10 forces the air to flow, creating forced convection. The thermoelectric cooler can be placed against the patient's affected area through fabric, achieving contact heat conduction and fulfilling its hot and cold compress function. The heat sink 9 and fan 10, as auxiliary heat dissipation components, reduce the impact of temperature changes at the non-contact end of the thermoelectric cooler on the temperature changes at the contact end, ensuring stable temperature control. A microcontroller controls the thermoelectric cooler 7 and fan 10, enabling them to work collaboratively and achieve effective temperature control. The bottom of the heat compressor 2 provides contact area for the thermoelectric cooler 7, which is wrapped in fabric and directly applied to the patient's affected area. The surface of the heat compressor 2 is equipped with a display screen 3, control buttons 4, and heat dissipation holes 5. The heat dissipation holes 5 assist in heat dissipation, and the display screen 3 and control buttons 4 provide an interactive interface for patient use.The inner cavity of the heat therapy device 2 contains a circuit board 11. The surface of the circuit board 11 is equipped with a microcontroller 12, a temperature sensor 13, and a power module 14. The temperature sensor 13 collects and detects temperature in real time. The microcontroller 12 has a built-in temperature control algorithm that can control the Peltier element to perform different functions such as heating, cooling, and maintaining temperature by changing the magnitude and direction of the current. The Peltier element is the main component for heating and cooling. Combined with a heat sink 9 and a fan 10, it ensures stable heat output and allows for rapid restoration of room temperature after operation stops. Through the collaborative work of various modules, the hot and cold compress therapy function is achieved, further improving the practicality and convenience of the medical heat therapy device for rheumatoid arthritis. The semiconductor cooling chip 7 achieves heating and cooling through the Peltier effect, requiring no other mechanical structure assistance. It has a long service life and requires no maintenance. Its application in the medical heat therapy device for rheumatoid arthritis avoids the need for patients to disassemble and maintain the device, making it a very convenient and safe source of heat and cooling.
[0029] It is understood that this utility model has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this utility model. Furthermore, under the teachings of this utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this utility model.
Claims
1. A medical heat therapy device for rheumatic joint pain, characterized in that: The application relates to a skin care belt (1), which is provided with a mounting groove on the surface, a hot compress device (2) is mounted in the mounting groove, and fixing belts (6) are arranged above the left side and below the right side of the skin care belt (1). The hot compress device (2) is provided with a semiconductor refrigerating sheet (7), the surface of the semiconductor refrigerating sheet (7) is in contact with a first heat conducting sheet (8), a plurality of equidistantly distributed radiating fins (9) are arranged on the side, away from the semiconductor refrigerating sheet (7), of the first heat conducting sheet (8), and a fan (10) is mounted on the radiating fins (9).
2. A medical rheumatic joint heat application device according to claim 1, characterized in that: The fixing belts (6) and the surface of the skin care belt (1) are fixedly connected through magic tapes.
3. A medical rheumatic joint heat application device according to claim 1, characterized in that: The skin care belt (1) is composed of an outer fabric (22), a second heat conducting sheet (23), a 3D spacing fabric (24) and an inner fabric (25) from outside to inside.
4. A medical rheumatic joint heat application device according to claim 3, characterized in that: The semiconductor refrigerating sheet (7) extends to the outside of the hot compress device (2) from the end, away from the first heat conducting sheet (8), and is in contact with the surface of the second heat conducting sheet (23).
5. A medical rheumatic joint heat application device according to claim 1, characterized in that: The semiconductor refrigerating sheet (7) comprises a first ceramic plate (15) and a second ceramic plate (21), a plurality of orderly distributed N-type semiconductors (16) and P-type semiconductors (17) are arranged between the first ceramic plate (15) and the second ceramic plate (21), the top ends of the N-type semiconductors (16) and the P-type semiconductors (17) are in contact with the first ceramic plate (15) through a first metal conductor (18), the bottoms of the N-type semiconductors (16) and the P-type semiconductors (17) are respectively connected with second metal conductors (19) through solders (20), the bottoms of the second metal conductors (19) are in contact with the second ceramic plate (21), and the surface of the second ceramic plate (21) is in contact with the first heat conducting sheet (8).
6. A medical rheumatic joint heat application device according to claim 1, characterized in that: The surface of the hot compress device (2) is respectively provided with a display screen (3), a control button (4) and radiating holes (5).
7. A medical rheumatic joint heat application device according to claim 1, characterized in that: The inner cavity of the hot compress device (2) is provided with a circuit board (11), the surface of the circuit board (11) is respectively provided with a single-chip microcomputer (12), a temperature sensor (13) and a power module (14).