Precise picosecond laser film cutting machine

Abstract

The utility model discloses a precise picosecond laser film cutting machine, which relates to the technical field of semiconductor processing equipment, and comprises an X-axis linear module extending along the horizontal direction; the Z-axis linear module is in sliding connection with the X-axis linear module; the laser galvanometer is fixedly mounted at the moving end of the Z-axis linear module; the CCD camera is fixedly mounted at the moving end of the Z-axis linear module and is adjacent to the laser galvanometer; the ultraviolet picosecond laser is aligned with the light path of the laser galvanometer; the Y-axis linear module is perpendicular to the plane where the X-axis linear module and the Z-axis linear module are located; and the product jig workbench is fixedly arranged at the moving end of the Y-axis linear module. Accurate space positioning of the laser head and the jig workbench is achieved, flexibility and accuracy in the cutting process are guaranteed, cutting errors caused by deviation of product placement are avoided, meanwhile, damage to materials below is avoided, the requirement for clean production is met, and labor cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and is a precision picosecond laser film cutting machine. Background Technology

[0002] In semiconductor packaging processes, removing the adhesive film from the COB board is a crucial step to ensure the smooth operation of subsequent processes. Currently, the industry mainly uses CNC engraving technology, but this method has many drawbacks:

[0003] Positioning deviation: Inaccurate product positioning can easily lead to milling failure.

[0004] Controlling the processing depth is difficult: processing that is too deep or too shallow will result in product scrap or require secondary processing.

[0005] Contamination issues: Powder impurities generated during processing contaminate the product, requiring additional cleaning procedures.

[0006] High consumable costs: Milling cutters are easily worn out and need to be replaced frequently, increasing costs.

[0007] Complex to operate: It requires highly skilled technicians and is complex to operate.

[0008] The aforementioned problems not only reduce production efficiency and increase labor costs, but also affect product yield and final quality. Utility Model Content

[0009] The purpose of this invention is to provide a precision picosecond laser film cutting machine, which aims to solve the problems of low efficiency, low yield, high cost and pollution in the traditional CNC engraving method during the film removal process.

[0010] To achieve the above objectives, this utility model provides the following technical solution:

[0011] A precision picosecond laser film cutting machine, characterized in that it includes:

[0012] The X-axis linear module extends horizontally;

[0013] The Z-axis linear module is slidably connected to the X-axis linear module and can move in the vertical direction;

[0014] A laser galvanometer is fixedly mounted on the moving end of the Z-axis linear module;

[0015] A CCD camera is fixedly mounted on the moving end of the Z-axis linear module and is arranged adjacent to the laser galvanometer.

[0016] An ultraviolet picosecond laser is aligned with the optical path of the laser galvanometer.

[0017] The Y-axis linear module is arranged perpendicularly to the plane containing the X-axis linear module and the Z-axis linear module;

[0018] The product fixture workbench is fixedly mounted on the moving end of the Y-axis linear module.

[0019] In a preferred embodiment, the X-axis linear module, the Y-axis linear module, and the Z-axis linear module constitute an orthogonal three-dimensional linear motion system.

[0020] In a preferred embodiment, the laser galvanometer and the CCD camera move up and down synchronously under the drive of the Z-axis linear module.

[0021] In a preferred embodiment, the laser output end of the ultraviolet picosecond laser is connected to the optical path of the input end of the laser galvanometer.

[0022] In a preferred embodiment, the upper surface of the product fixture workbench is provided with a positioning groove that matches the shape of the product.

[0023] A preferred technical solution further includes a machine body, wherein the Y-axis linear module is horizontally mounted on the machine body, the X-axis linear module is horizontally mounted on the upper rear side of the machine body and is perpendicular to the Y-axis linear module, and the ultraviolet picosecond laser is fixedly mounted on the top rear side of the machine body.

[0024] In a preferred embodiment, a housing is fixedly installed on the upper part of the machine body, and an openable door panel is provided on the housing. The X-axis linear module, Z-axis linear module, laser galvanometer, CCD camera and ultraviolet picosecond laser are all located inside the housing.

[0025] Compared with the prior art, the beneficial effects of this utility model are:

[0026] Precise motion control, through an orthogonal three-dimensional linear motion system (X-axis, Y-axis, Z-axis linear modules), enables precise spatial positioning of the laser head and fixture table, ensuring flexibility and accuracy in the cutting process.

[0027] Visual guidance positioning integrates a CCD camera for visual positioning. By capturing images of product marker points and performing image processing, the accuracy of the cutting position is ensured, avoiding cutting errors caused by product placement deviations.

[0028] Laser cutting precision is achieved through the use of ultraviolet picosecond lasers in conjunction with laser galvanometers, which enable precise control over the direction and focus of the laser beam, ensuring cutting accuracy while avoiding damage to the underlying material.

[0029] Clean and efficient processing: The non-contact laser cutting process does not produce powder impurities, meets clean production requirements, eliminates the need for additional cleaning steps, and can proceed directly to the next process.

[0030] The equipment boasts highly efficient and automated operation, a high degree of automation, and fast cutting speeds, significantly improving efficiency compared to traditional processes. Ordinary technicians can operate it after simple training, reducing labor costs. Attached Figure Description

[0031] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0032] Figure 2 This is a schematic diagram of the main structure of this utility model;

[0033] Figure 3 This is a top view of the structure of this utility model;

[0034] Figure 4 A three-dimensional structural diagram of this utility model after adding the box body;

[0035] In the diagram: 1-X-axis linear module; 2-Z-axis linear module; 3-laser galvanometer; 4-CCD camera; 5-ultraviolet picosecond laser; 6-Y-axis linear module; 7-product fixture worktable; 8-machine body; 9-box; 10-door panel. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] Please see Figures 1 to 4 ,

[0038] A precision picosecond laser film cutting machine, including

[0039] X-axis linear module 1, which extends horizontally;

[0040] Z-axis linear module 2 is slidably connected to X-axis linear module 1 and can move in the vertical direction;

[0041] The laser galvanometer 3 is fixedly mounted on the moving end of the Z-axis linear module 2;

[0042] CCD camera 4 is fixedly mounted on the moving end of Z-axis linear module 2 and is arranged adjacent to laser galvanometer 3;

[0043] The ultraviolet picosecond laser 5 is aligned with the optical path of the laser galvanometer 3.

[0044] The Y-axis linear module 6 is set perpendicular to the plane containing the X-axis linear module 1 and the Z-axis linear module 2;

[0045] The product fixture workbench 7 is fixedly mounted on the moving end of the Y-axis linear module 6.

[0046] The X-axis linear module 1, Y-axis linear module 6, and Z-axis linear module 2 constitute an orthogonal three-dimensional linear motion system.

[0047] The laser galvanometer 3 and the CCD camera 4 move up and down synchronously under the drive of the Z-axis linear module 2.

[0048] The laser output end of the ultraviolet picosecond laser 5 is connected to the optical path of the input end of the laser galvanometer 3.

[0049] The upper surface of the product fixture workbench 7 is provided with a positioning groove that matches the shape of the product.

[0050] It also includes a body 8, a Y-axis linear module 6 horizontally mounted on the body 8, an X-axis linear module 1 horizontally mounted on the upper rear side of the body 8 and perpendicular to the Y-axis linear module 6, and an ultraviolet picosecond laser 5 fixedly mounted on the top rear side of the body 8.

[0051] A housing 9 is fixedly installed on the upper part of the body 8. The housing 9 has an openable door panel 10. The X-axis linear module 1, Z-axis linear module 2, laser galvanometer 3, CCD camera 4 and ultraviolet picosecond laser 5 are all located inside the housing 9.

[0052] The specific functions of each component of this utility model are as follows:

[0053] X-axis linear module 1: Used to drive the Z-axis module to move left and right, so as to achieve horizontal positioning adjustment.

[0054] Z-axis linear module 2: Used to drive the galvanometer and CCD camera to rise and fall, and adjust the laser focus position.

[0055] Laser galvanometer 3: Controls the output direction and focal point of the laser beam to achieve precise cutting.

[0056] CCD camera 4: Used to capture product marker points for visual positioning, ensuring the accuracy of the cutting position.

[0057] Ultraviolet picosecond laser 5: Emits high-energy-density ultraviolet laser for cutting adhesive films.

[0058] Y-axis linear module 6: Drives the product fixture worktable to move back and forth, thereby adjusting the product position.

[0059] Product jig workbench 7: Used for product positioning and fixing to ensure stability during processing.

[0060] Working principle

[0061] Visual positioning: Marked points on the product surface are captured by a CCD camera, and image processing and coordinate calculation are performed to determine the cutting path.

[0062] Laser cutting: An ultraviolet picosecond laser emits a laser beam, which is focused onto the surface of the adhesive film by a galvanometer. The adhesive film is efficiently removed through the interaction between the laser and the film.

[0063] Motion control: The X, Y and Z axis linear modules work together to drive the laser head and the fixture table to complete the cutting and processing of the entire product.

[0064] This invention employs picosecond laser and CCD (Computer-Assisted Discrete Coding) technology to ensure precise cutting position and avoid cutting errors caused by product placement deviations. By controlling laser energy and focal length, precise control of the cutting depth of the adhesive film is achieved, ensuring thorough cutting without damaging the COB board. The laser cutting process does not generate powder impurities, eliminating the need for additional cleaning procedures and allowing direct entry into the next process. Laser cutting requires no physical cutting tools, incurs no consumable costs, and the equipment is easy to operate, lowering the barrier to entry for users.

[0065] This invention combines visual positioning and laser control, achieving micron-level cutting accuracy. Laser cutting is fast, significantly improving efficiency compared to traditional CNC engraving. It involves no physical contact, producing no powder impurities, meeting clean production requirements. It requires no consumables, is simple to maintain, and has low long-term operating costs. The equipment is highly automated, and can be operated by ordinary technicians with minimal training.

[0066] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A precision picosecond laser film cutting machine, characterized in that, Comprising X-axis linear module (1), which extends along the horizontal direction; Z-axis linear module (2), which is in sliding connection with the X-axis linear module (1) and can move along the vertical direction; Laser galvanometer (3) is fixedly installed on the moving end of the Z-axis linear module (2); CCD camera (4) is fixedly installed on the moving end of the Z-axis linear module (2) and is arranged adjacent to the laser galvanometer (3); Ultraviolet picosecond laser (5) is arranged in optical path alignment with the laser galvanometer (3); Y-axis linear module (6) is arranged perpendicular to the plane where the X-axis linear module (1) and the Z-axis linear module (2) are located; Product fixture workbench (7) is fixedly arranged on the moving end of the Y-axis linear module (6).

2. The precision picosecond laser film cutting machine of claim 1, wherein: The X-axis linear module (1), the Y-axis linear module (6) and the Z-axis linear module (2) constitute an orthogonal three-dimensional linear motion system.

3. The precision picosecond laser film cutting machine of claim 1, wherein: The laser galvanometer (3) and the CCD camera (4) are synchronously lifted and lowered under the driving of the Z-axis linear module (2).

4. The precision picosecond laser film cutting machine of claim 1, wherein: The laser output end of the ultraviolet picosecond laser (5) is in optical path communication with the input end of the laser galvanometer (3).

5. The precision picosecond laser film cutting machine of claim 1, wherein: The upper surface of the product fixture workbench (7) is provided with a positioning groove matched with the product shape.

6. The precision picosecond laser film cutting machine of claim 1, wherein: Further comprising a machine body (8), the Y-axis linear module (6) is horizontally arranged on the machine body (8), the X-axis linear module (1) is horizontally arranged on the upper rear side of the machine body (8) and is arranged perpendicular to the Y-axis linear module (6), and the ultraviolet picosecond laser (5) is fixedly arranged on the top rear side of the machine body (8).

7. The precision picosecond laser film cutting machine of claim 6, wherein: The upper part of the machine body (8) is fixedly provided with a box body (9), the box body (9) is provided with an openable door plate (10), and the X-axis linear module (1), the Z-axis linear module (2), the laser galvanometer (3), the CCD camera (4) and the ultraviolet picosecond laser (5) are all located inside the box body (9).

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