Laser cutting control system and method for a profiled flexible product

Abstract

This invention discloses a laser cutting control system and method for flexible products with diverse contours. The system categorizes and groups products according to their contour characteristics, fits closed-loop trajectories, and plans scanning cutting paths and processing sequences. For inclined contour groups, the substrate corresponding to the material to be removed above the inclined surface of each product is divided into several Z-axis array units, with the depth of each array unit decreasing progressively. Ultraviolet picosecond laser processing parameters are matched based on different contour groups, and the number of Z-axis cutting layers is matched according to the depth of each array unit for the inclined contour group. Ultraviolet picosecond laser cutting is completed step-by-step according to the planned paths and processing sequences for each contour group. This method can adapt to the processing needs of ultra-thin, precision, irregularly shaped parts with diverse contours, without causing thermal impact on the product, and can improve the dimensional accuracy and production efficiency of the parts. The edges of the parts are smooth without burrs or microcracks, meeting the high-quality requirements of ultra-thin flexible material precision irregularly shaped parts.

Description

Technical Field

[0001] This invention belongs to the field of laser processing technology, and specifically discloses a laser cutting control system and method for flexible products with diverse contours. Background Technology

[0002] Precision instruments often require flexible materials with diverse contours to meet high-precision requirements. For example, the periscope dome of a smart camera needs serrations on the inner ring to filter out stray light, and bevels are also needed to improve the field of view constraint. Traditional stamping, die-cutting, and engraving processes cannot precisely process diverse contours with inner serrated contours, inner bevels, and outer vertical surfaces in one go. They also have low forming accuracy, large surface roughness, and are prone to burrs and deformation, which cannot meet the processing requirements of flexible high-precision optical devices. Precision instruments such as smart cameras are small and compact, and their components are all ultra-thin parts. The materials are generally special flexible optical materials with conductive carbon coatings on both sides. Conventional lasers use a single-focus direct cutting method, which makes it difficult to form continuous bevels and fine serrations on ultra-thin carbon-coated materials. The heat-affected zone is large, and the material coating is prone to ablation and peeling, which damages the light-shielding and anti-static properties. Traditional bevel laser cutting machines have defects such as beam distortion and poor effect due to the oblique direct cutting, which cannot meet the laser cutting requirements of ultra-thin flexible material precision irregular parts. Summary of the Invention

[0003] To address the aforementioned problems in existing technologies, the present invention aims to provide a laser cutting control system and method for flexible products with diverse contours. This system employs ultraviolet picosecond laser cutting to process the diverse inner and outer contours of parts, and vertical layered milling to process inclined surfaces. It can adapt to the processing needs of precision irregular-shaped parts made of ultra-thin flexible materials with diverse contours, without causing thermal impact on the product, and can improve the dimensional accuracy and production efficiency of parts. The edges of the parts contours are smooth without burrs or microcracks, meeting the high-quality requirements of flexible precision irregular-shaped parts.

[0004] The technical solution adopted in this invention is as follows: The first technical solution provides a laser cutting control method for flexible products with diverse contours, including the following operation steps: Material preparation, loading and clamping of base materials, and layout of product layout schemes; Obtain all contour features of a single product to be processed, and categorize and group them. Closed-loop trajectories are fitted for different types of contour groups, scanning and cutting paths are planned for different types of contour groups, and the processing sequence of all contour groups is determined. For inclined contour groups, the material to be removed above the inclined surface of each product is divided into several array units in the Z-axis direction according to the inclined surface size and substrate thickness parameters. The depth of the array units decreases progressively. Based on different types of contour groups, ultraviolet picosecond laser processing parameters are matched respectively. For the inclined contour group, the number of layer cutting layers in the Z-axis direction is matched according to the depth of each array unit. The ultraviolet picosecond laser cutting is completed step by step according to the planned path and processing sequence of each contour group. Remove waste material and scrap edges; Finished product quality inspection, then transferred to the next process.

[0005] In some embodiments, the material preparation, loading and clamping of substrates, and layout of product schemes include the following operations: The substrate is fixedly clamped by vacuum adsorption using a negative pressure adsorption platform. The negative pressure adsorption platform is fixedly connected to the Z-axis module, which is set on the XY-axis module equipped with a flexible bellows protective cover. Before clamping the substrate, place a bottom film on the negative pressure adsorption platform. The area of ​​the bottom film is larger than the area of ​​the substrate. After the bottom film is adsorbed and clamped stably, place a substrate on top of the bottom film and use a roller brush to remove air, so that the substrate is tightly attached to the bottom film. Based on the external dimensions, contour type, and mass production requirements of the products to be processed, a matrix-style, equally spaced, standardized layout method is adopted for the workpiece array layout.

[0006] In some embodiments, obtaining and classifying all contour features of a single product to be processed includes the following operations: Based on the differences in geometric shape and structural contour, the diverse contours of products are classified and grouped into three independent categories: vertical surface contour group, inclined surface contour group, and toothed contour group.

[0007] In some embodiments, path planning follows an inside-out order.

[0008] In some embodiments, the matching of ultraviolet picosecond laser processing parameters based on different contour groups includes the following operations: This includes matching the laser output power, laser scanning speed, pulse repetition frequency, beam defocus, Z-axis layer-by-layer sinking step distance, and XY plane scanning tool feed step distance of ultraviolet picosecond lasers based on different categories of contour groups; Specifically, for the negative defocus parameter setting of the inclined contour grouping matching, the scanning cutting path scans and cuts each array unit in sequence from deep to shallow.

[0009] In some embodiments, the following operations are also included: Camera-based visual inspection and positioning.

[0010] In some embodiments, negative pressure dust collection is performed on both sides of the laser cutting head during ultraviolet picosecond laser cutting; After the entire substrate is laser-cut, the negative pressure adsorption platform releases the adsorption force, and the bottom film, along with the cut substrate, waste edges, and waste materials on it, are removed as a whole. Then, the waste materials and waste edges are removed by a dust collection device, thus completing the separation of the workpiece.

[0011] In some embodiments, the ultraviolet picosecond laser is an ultraviolet femtosecond laser.

[0012] The second technical solution provides a laser cutting control system for flexible products with diverse contours, used to execute the laser cutting control method for flexible products with diverse contours in the first technical solution above. It includes an equipment control host, a visual positioning and detection module, a contour feature recognition and classification module, a cutting path planning module, a laser parameter adaptation and adjustment module, a three-axis motion control module, a laser processing module, a negative pressure adsorption control module, and a negative pressure dust collection control module. The device control host is electrically connected to each module and serves as the system's computing and control center. It is used to execute control programs, receive feedback signals from each module, issue control commands to each module, and coordinate each module to run synchronously according to a preset process. The visual positioning and detection module is used to acquire images of the substrate and product positions, and to complete substrate positioning, height detection and processing deviation compensation. The contour feature recognition and classification module is used to identify and extract the contour features of the product to be processed, and automatically classify the contours into vertical surface contour group, inclined surface contour group and tooth contour group. The cutting path planning module is used to fit closed-loop trajectories for different contour groups, and to plan differentiated scanning cutting paths, processing sequences, and Z-axis array unit distribution paths for inclined contours. The laser parameter adaptation and control module is used to match the ultraviolet picosecond laser processing parameters for different contour groups, and to match the corresponding number of Z-axis cutting layers for each array unit of the inclined contour. The three-axis motion control module is used to control the XY-axis module and Z-axis module equipped with the negative pressure adsorption platform to realize the workpiece feeding and movement; The laser processing module is used to emit ultraviolet picosecond lasers to complete layered cutting and milling processes. The negative pressure adsorption control module is used to control the negative pressure adsorption platform to complete the adsorption and fixation of the bottom film and substrate, as well as the pressure release after processing. The negative pressure dust extraction control module is used to simultaneously control the air nozzles on both sides of the cutting head to perform negative pressure dust extraction during the laser cutting process.

[0013] The third technical solution provides a laser cutting control device for flexible products with diverse contours, which is used to implement the laser cutting control method for flexible products with diverse contours in the first technical solution through the laser cutting control system for flexible products with diverse contours in the second technical solution. It includes a processing host, a laser processing mechanism, a three-axis motion mechanism, a negative pressure adsorption fixture, a vision inspection mechanism, a negative pressure dust collection mechanism, auxiliary supporting mechanisms, and an electrical control mechanism. The processing host is a closed equipment enclosure, with a marble platform integrated inside as a mounting support mechanism. The laser processing mechanism is fixedly installed on top of the marble platform, including an ultraviolet picosecond laser, a beam expander, a galvanometer, and a focusing assembly, and remains stationary. The three-axis motion mechanism includes an XY-axis module and a Z-axis lifting module equipped with a flexible bellows protective cover, used to drive the negative pressure adsorption fixture to move the negative pressure adsorption platform at high speed. The negative pressure adsorption fixture includes a negative pressure adsorption platform, fixedly installed on the Z-axis lifting module, used to support the adsorption and fixation base film and flexible substrate. The visual inspection mechanism includes height measurement and vision components, fixedly arranged on the processing frame, used for substrate alignment, height detection, and real-time monitoring of the laser cutting process. The negative pressure dust collection mechanism includes negative pressure dust collection nozzles, air ducts, and a dust purifier symmetrically arranged on both sides of the laser cutting head. The auxiliary supporting mechanism includes a chiller for cooling the ultraviolet picosecond laser. The electrical control mechanism is electrically connected to the above mechanisms to achieve integrated control of the entire machine.

[0014] The beneficial effects of this invention are as follows: It provides a laser cutting control system and method for flexible products with diverse contours. The system categorizes and groups all contour features to be processed, fits closed-loop trajectories for different contour groups, plans scanning cutting paths based on different contour groups, and determines the processing sequence for all contour groups. For inclined contour groups, the substrate is divided into several Z-axis array units corresponding to the material to be removed above the inclined surface of each product, with the depth of each array unit decreasing progressively. Ultraviolet picosecond laser processing parameters are matched for different contour groups, and the number of Z-axis cutting layers is matched for each inclined contour group based on the depth of each array unit. Ultraviolet picosecond laser cutting is completed step-by-step according to the planned paths and processing sequence for each contour group. This method can adapt to the processing needs of ultra-thin, precision irregular-shaped parts with diverse contours, does not cause thermal impact on the product, and improves the dimensional accuracy and production efficiency of the parts. The edges of the parts are smooth without burrs or microcracks, meeting the high-quality requirements of precision irregular-shaped parts. Attached Figure Description

[0015] Figure 1 This is a schematic diagram illustrating the principle of the laser cutting control method for flexible products with diverse contours according to the present invention. Figures 2-3This is a three-dimensional structural diagram of the laser cutting control device for flexible products with diverse contours used in the laser cutting control method for flexible products with diverse contours of the present invention. Figure 4 This is a system principle block diagram of the laser cutting control device for flexible products with diverse contours used in the laser cutting control method for flexible products with diverse contours of the present invention. Figures 5-8 This is a schematic diagram of the planar structure of the workpiece product processed in the laser cutting control method for flexible products with diverse contours according to Embodiment 1 of the present invention; wherein Figure 7 yes Figure 5 A schematic diagram of the AA cross-sectional structure. Figure 8 yes Figure 7 A magnified schematic diagram of part I; Figure 9 This is a schematic diagram of the workpiece layout scheme for arranging the workpieces to be processed and manufactured on a virtual substrate in the laser cutting control method for flexible products with diverse contours according to Embodiment 1 of the present invention. Figure 10 This is a schematic diagram of the substrate and the base film in the laser cutting control method for flexible products with diverse contours according to Embodiment 1 of the present invention; Figures 11-12 This is a schematic diagram of the structure of the laser cutting control method for flexible products with diverse contours in Embodiment 1 of the present invention, in which the substrate is divided into several array units along the Z-axis direction corresponding to the material to be removed above the inclined surface of each product. Figure 13 This is a schematic diagram of the tooth profile group of the first part formed by cyclic ultraviolet picosecond laser cutting in the laser cutting control method for flexible products with diverse contours according to Embodiment 1 of the present invention. Figure 14 This is a schematic diagram of the laser cutting control method for flexible products with diverse contours in Embodiment 1 of the present invention, in which an ultraviolet picosecond laser is used to continuously and cyclically cut the tooth-shaped contour group to form a slope contour group. Figure 15 yes Figure 14 A magnified schematic diagram of part II; Figure 16 This is a schematic diagram of the laser cutting control method for flexible products with diverse contours in Embodiment 1 of the present invention, in which a vertical contour group is formed by cyclic cutting of the outer contour using an ultraviolet picosecond laser after the inner tooth contour group and the inclined contour group are completed. Figure 17 This is a schematic diagram of the laser cutting control method for flexible products with diverse contours according to Embodiment 1 of the present invention after cutting the entire workpiece and removing waste edges and waste materials; Figure 18 This is a real-time image of a substrate cut by an ultraviolet picosecond laser in the laser cutting control method for flexible products with diverse contours according to Embodiment 1 of the present invention. Figure 19This is a real-time image of the operation interface for ultraviolet picosecond laser cutting a single workpiece in the laser cutting control method for flexible products with diverse contours according to Embodiment 1 of the present invention. Figure 20 This is a partial view of the actual structure of the workpiece after cutting, as shown under an electron microscope, in the laser cutting control method for flexible products with diverse contours according to Embodiment 1 of the present invention. Detailed Implementation

[0016] To facilitate understanding of the present invention, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only. In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of indicated technical features. Thus, unless otherwise stated, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0017] Furthermore, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections via an intermediate medium, or internal communication between two components. All technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0018] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0019] Please refer to Figures 1-20As shown, this invention provides a laser cutting control system and method for flexible products with diverse contours. The analysis of existing technical solutions is as follows: Precision instruments typically require flexible materials with diverse contours to meet high-precision requirements. For example, the periscope cover of a smart camera needs serrations on the inner ring to filter stray light, and also requires a bevel to improve the field-of-view constraint effect. Its outer contour is a conventional vertical surface. Traditional stamping, die-cutting, and engraving processes cannot precisely process diverse contour structures with inner serrated contours, inner bevels, and outer vertical surfaces in a single operation, and the forming accuracy is low. The large surface roughness of the bevel makes it prone to burrs and deformation, which cannot meet the processing requirements of flexible high-precision optical devices. Precision instruments such as smart cameras are small and compact, and their components are all ultra-thin parts. The materials are generally special flexible optical materials with conductive carbon coating on both sides. Conventional lasers use a single-focus direct cutting method, which makes it difficult to form continuous bevels and fine serrations on ultra-thin carbon-coated materials. The heat-affected zone is large, and the material coating is easy to ablate and fall off, which destroys the light-shielding and anti-static properties. Traditional bevel laser cutting machines have defects such as spot distortion and poor effect due to the oblique direct cutting, which cannot meet the high-precision laser cutting processing requirements of ultra-thin flexible material precision irregular parts.

[0020] The serrated inner ring of the periscope dome in smart cameras is designed to filter out stray light and prevent glare. 1. Break up and diffusely absorb direct stray light and ambient diffuse light to prevent them from reflecting into the lens's light path; 2. It disrupts specular reflection of light, turning it into disordered diffuse reflection, thus preventing the formation of halos, ghosting, and glare within the lens; 3. Equivalent to a miniature extinction tooth or aperture extinction structure, it retains only the effective incident light and filters out oblique stray light.

[0021] The core function of the inner bevel of the periscope housing in a smart camera: 1. Light guiding and field of view narrowing: The inclined surface forms a cone-shaped light-receiving aperture, which limits the effective shooting field of view of the smart camera, and the excess large-angle oblique light is directly blocked by the inclined surface.

[0022] 2. Avoid secondary reflections on vertical surfaces; if the inner wall is made into a straight cylinder, light will easily reflect back and forth vertically and enter the lens; if it is made into a slanted surface, the reflected light will diverge obliquely and will not return into the light path. 3. Structural assembly and dust prevention: The sloping surface facilitates lens module assembly and guidance, prevents scratching the outer ring of the lens, and allows dust and moisture to slide off along the sloping surface, making it less likely to accumulate at the optical path entrance.

[0023] The inner serrations eliminate stray light, break mirror reflections, and suppress ghosting and glare; combined with the inner sloping surface's convergence field of view angle, it changes the reflected light path to prevent backlash and also serves as a guide and dustproof function, forming a standard extinction and field-of-view constraint structure in the field of optics.

[0024] The periscope dome of a smart camera exhibits diverse geometric contours, encompassing various types such as conventional vertical contours, inclined slope contours, and fine toothed contours. These different contours exhibit significant differences in their forming mechanisms, cutting precision requirements, surface roughness standards, and processing technology adaptability. Currently, traditional laser cutting processes have significant technical limitations. They fail to accurately classify and adapt to the diverse irregular contours, generally employing uniform, fixed laser processing parameters and a single cutting mode to handle all contour types, thus failing to meet the differentiated forming requirements of different contours. For vertical contour processing, the conventional one-cut mode easily results in burrs and micro-deformation at the contour edges. For inclined contour processing, the lack of specialized layered cutting planning leads to the use of a direct, oblique cutting method, which easily causes distortion of the inclined laser spot, disordered defocusing, obvious step-like forming, and excessive surface roughness, failing to meet the appearance and performance requirements of precision components. For toothed contour processing, the scanning path strategy is incompatible with the fine tooth structure, easily resulting in defects such as tooth root chipping, tooth size deviation, and incomplete local cutting. Meanwhile, the traditional processing flow lacks continuity. From substrate clamping and fixing, workpiece layout, laser path planning, equipment parameter setting, laser cutting processing to finished product transfer processing, each process lacks standardized adaptation and connection. It does not match exclusive layer cutting and scanning tooling strategies for different contour categories, resulting in poor overall processing consistency, low yield, insufficient mass production stability, and difficulty in adapting to the precision production needs of ultraviolet picosecond laser cold processing for various types of irregular contour workpieces.

[0025] Therefore, to solve the above-mentioned technical problems, the present invention conceives and plans the following technical solution: First, it studies and analyzes the performance comparison between existing laser cutting and stamping processes, and finds that compared with stamping, laser cutting has higher dimensional accuracy and shape profile stability, smaller deviation, and a smooth cut profile surface without chipping, cracks, or burrs; especially in picosecond (10⁻¹² seconds) or femtosecond (10⁻¹² seconds) processes. 5 Ultrafast pulsed lasers (hereinafter referred to as ultrafast lasers or ultrashort pulsed lasers) have extremely short pulse widths (on the order of nanoseconds). The extremely short pulse width allows ultrafast lasers to concentrate energy onto materials for a very short time, resulting in extremely high peak power and a very short duration of influence. Consequently, heat diffusion is low, and the impact on surrounding areas is minimal. The highly concentrated energy beam instantly melts or evaporates materials, and the duration of this melting or evaporation is shorter than the time it takes for heat to diffuse into the material's crystal lattice. Therefore, in the field of laser cutting, the application of ultrafast pulsed lasers, compared to nanosecond pulsed lasers, means that the heat-affected zone generated by ultrafast lasers is much smaller, and the impact on the material is almost negligible. This reduces kerf loss and enables more precise processing. By controlling the laser's power and speed, the processing intensity can also be controlled, thereby achieving a series of processing tasks such as cutting, marking, and cleaning.

[0026] Compared to conventional lasers, ultrafast lasers have the following main characteristics: 1. Ultrashort pulse width: The core advantage of ultrafast lasers lies in their extremely short pulse duration (picosecond to femtosecond). For example, the pulse width of a femtosecond laser is equivalent to one millionth of the time it takes for light to pass through a human hair. This characteristic allows energy to be concentrated in an extremely small spatial area in a very short time, achieving "cold processing" (extremely small heat-affected zone).

[0027] 2. High peak power: Ultra-short pulses compress the energy release time, resulting in extremely high peak power. Although the average power may not be high and the single pulse energy is low, the peak power can still reach the GW (gigawatt) to TW (terawatt) level.

[0028] 3. High-precision processing capability: Due to the short pulse time, the energy is concentrated in the nanoscale action area, and almost no heat diffusion is generated during processing. It can achieve submicron or even nanometer-level precision, and is suitable for fine processing that is difficult to handle by traditional lasers.

[0029] 4. Wide material adaptability: It can be applied to a variety of materials such as metals (e.g., copper, aluminum, titanium), semiconductors (silicon, silicon carbide), ceramics, glass, and polymers, including other high-hardness, high-brittleness, or high-melting-point materials that are difficult to process with lasers (e.g., sapphire, diamond).

[0030] The unique characteristics of ultrafast lasers make them highly sought after in many high-end fields, including microelectronics and semiconductor processing, medical device manufacturing, precision parts manufacturing, new energy and energy storage products, and art and jewelry carving. Typical applications include processing micron-scale electrode patterns on flexible substrates, cutting ultrathin semiconductor films, cooling holes for aero-engine blades, and high-precision cutting of lithium battery electrodes.

[0031] Addressing the pain points of existing laser cutting processes, such as the lack of differentiation between diverse irregular contours, poor adaptability of process parameters and cutting strategies, unsatisfactory bevel forming quality, numerous defects in toothed and vertical contour processing, and non-standardized process connections throughout the entire process, this paper proposes a UV picosecond laser precision layered cutting process adaptable to various irregular contours. By accurately classifying the diverse contours of products, it adapts dedicated scanning paths and layered cutting strategies for different contour categories. It innovatively employs a beveled Z-axis multi-column unit depth-decreasing layered cutting method to form beveled structures. Simultaneously, it optimizes the standardized operation of substrate clamping, layout, path planning, equipment parameter settings, laser cutting, and finished product transfer throughout the entire process, achieving high-precision, low-damage, and consistent mass production processing of various irregular contour workpieces. This improves part dimensional accuracy and production efficiency, resulting in smooth, burr-free, and micro-crack-free parts with clean contour edges, meeting the high-quality requirements of precision irregular parts.

[0032] The first technical solution provides a laser cutting control method for flexible products with diverse contours. The planned technical solution can be summarized into the following operation steps: S01, Material preparation, loading and clamping of base materials, and layout of product layout scheme; S02, Obtain all contour features of a single product to be processed, and classify and group them; S03, fit closed-loop trajectories according to different categories of contour groups, plan scanning cutting paths according to different categories of contour groups, and process the order of all contour groups; among them, for the inclined contour group, according to the inclined surface size and substrate thickness parameters, divide the substrate into several array units in the Z-axis direction corresponding to the material to be removed above the inclined surface of each product, and the depth of several array units decreases. S04, matching ultraviolet picosecond laser processing parameters based on different categories of contour groups, wherein negative defocus parameter settings are matched for inclined contour groups, and the number of Z-axis cutting layers is matched according to the depth of each array unit; S05, UV picosecond laser cutting is completed step by step according to the planned path and processing sequence of each contour group; S06, Remove waste material and waste edges; S07, Finished Product Quality Inspection, Transfer to Next Process.

[0033] The specific steps are detailed below: S01, Material preparation, loading and clamping of base materials, and layout of product layout scheme; The substrate is vacuum-adsorbed and clamped using a negative pressure adsorption platform, which is fixedly connected to the Z-axis module. The Z-axis module is positioned on the XY-axis module equipped with a flexible bellows-style protective cover. Before clamping the substrate, a base film is placed on the negative pressure adsorption platform, with an area larger than the substrate. After the base film is adsorbed and clamped stably, a substrate is placed on top of the base film, and air is removed by a roller brush, ensuring that the substrate adheres tightly to the base film. A laser cutting machine with a negative pressure adsorption fixture can be used to clamp the substrate to be processed. The negative pressure adsorption fixture is placed on the flexible bellows-style negative pressure adsorption structure of the XY-axis module. Utilizing the axial expansion and contraction adaptive characteristics of the flexible bellows structure, it can handle substrates of different materials and thicknesses. The substrate is uniformly fixed by negative pressure adsorption over its entire surface. The negative pressure suction eliminates the risk of substrate warping, wrinkles, and displacement, ensuring that the substrate processing plane is flat and deformation-free. There is no mechanical hard extrusion that damages the substrate surface during the clamping process, providing a flat and stable processing reference surface for subsequent fine laser layer cutting. After clamping, the negative pressure sealing of the tooling is checked to ensure that there are no local vacuum breaks or substrate micro-vibration and displacement problems throughout the entire processing. The Z-axis module and XY-axis module are combined to form a three-axis module drive. During the subsequent ultraviolet picosecond laser cutting process, the negative pressure adsorption platform driven by the three-axis module moves and feeds the substrate, while the laser generator, optical path, galvanometer, and cutting head are all fixed and complete the cutting trajectory.

[0034] The detailed instructions are as follows: Based on the order product information and raw material selection in the production task, prepare flexible substrate rolls, and determine the specifications and dimensions of the substrate 10 to be cut each time according to the specifications of the negative pressure adsorption platform of the equipment. First, pre-lay the bottom film 20 and negative pressure adsorption, then lay the substrate and bond it for air removal. The bottom film 20 is used as a transition medium to achieve indirect adsorption of the flexible substrate. The special bottom film can be used once or repeatedly. It should be replaced or cleaned before each processing to ensure that the clamping state of different batches of substrates is consistent, thereby improving the stability and consistency of batch processing.

[0035] 1. Pre-laying of the base film and negative pressure adsorption; Platform preparation: Clean the surface of the negative pressure adsorption platform to remove dust and debris, and ensure that the platform's micropores are unobstructed; Laying the base film: Lay a special base film with an area larger than the substrate flat on the platform, leaving an extension edge around the base film that extends beyond the outline of the substrate, so as to completely cover the effective adsorption area of ​​the platform. Activate negative pressure adsorption: Activate the negative pressure system. The platform generates uniform negative pressure through micropores, adsorbing and fixing the bottom film over the entire area of ​​the platform surface, eliminating wrinkles, bubbles and displacement of the bottom film, and making the bottom film form a flat and tension-free plane. Adsorption status confirmation: Confirm that the bottom film has no bulges or unadsorbed areas through visual inspection or manual inspection, that the four sides are completely flat, and that the adsorption is stable and without displacement.

[0036] 2. Substrate laying, bonding, and air venting; Substrate placement: Place the whole substrate 10 to be processed flat on the bottom film 20 that has been adsorbed and stabilized, and adjust the position of the substrate so that its outline is completely within the range of the bottom film and does not extend beyond the edge of the bottom film. Roller brush air release bonding: Use a special rubber roller brush to roll evenly from the center of the substrate to the surrounding area to expel the air between the substrate and the base film, so that the substrate is tightly and bubble-free attached to the surface of the base film. Adhesion quality inspection: Visual inspection or low-magnification microscope inspection confirms that there are no residual bubbles, wrinkles, or local warping between the substrate and the base film, and that the substrate surface is flat and the tension is uniform.

[0037] Based on the external dimensions, contour type, and mass production requirements of the products to be processed, a matrix-style, equidistant, standardized layout method is adopted for the workpiece array layout. In the control system, the product layout scheme is arranged on a virtual substrate through a human-machine interface. The specific operation details are based on the external dimensions, contour type, and mass production requirements of the workpieces to be processed. A matrix-style, equidistant, standardized layout method is adopted for the workpiece array layout. During the layout process, interference between processing areas of different types of irregular contours is avoided. Safety clearance distances for laser cutting and scanning buffer areas are reserved. Workpieces of the same type and in the same batch are grouped together for processing in separate areas, while workpieces of different types are divided into separate processing areas. This avoids process interference when switching between different cutting strategies, improves overall processing efficiency, and ensures batch processing consistency.

[0038] S02, Obtain all contour features of a single product to be processed, and classify and group them; Based on the differences in geometric shape and structural contour, the diverse contours of products are categorized and grouped. The diverse contours of flexible products are typically divided into three independent categories: inclined contour group 100, toothed contour group 200, and vertical contour group 300. Abandoning the traditional uniform processing model, this approach classifies only the shape characteristics of the workpiece's geometric processing contours, without considering the workpiece's own structural attributes. All workpiece contours to be processed are uniformly divided into three independent categories: vertical contour group, inclined contour group, and toothed contour group. Specifically, the vertical contour group consists of straight-edge forming contours perpendicular to the substrate processing plane; the inclined contour group consists of slope forming contours at a preset angle relative to the substrate processing plane; and the toothed contour group consists of finely shaped, evenly distributed concave-convex teeth forming contours. After classification, each of the three contour categories is separately marked with a processing zone, providing a classification basis for subsequent differentiated path planning and cutting strategy adaptation.

[0039] S03, fit closed-loop trajectories according to different categories of contour groups, plan scanning cutting paths according to different categories of contour groups, and determine the processing sequence of all contour groups; the path planning follows the order of inside to outside; among them, for the inclined contour group, according to the inclined surface size and substrate thickness parameters, the substrate corresponding to the material to be removed above the inclined surface of each product is divided into several array units in the Z-axis direction, the depth of several array units decreases, and the number of array units in the Z-axis direction is determined by the inclination angle of the inclined surface and the substrate.

[0040] For the three categories of contour groups after classification, dedicated laser scanning cutting paths and tool trajectories were planned. The path planning followed the core principles of contouring from the inside out and rough shaping followed by fine edge finishing. Based on the extension distribution of each contour segment in each contour group, closed-loop trajectories were fitted to ensure that when cutting each contour group using ultraviolet picosecond laser, the process can run cyclically according to the closed-loop trajectory without the need for back-and-forth repositioning. For the tooth contour group, a tooth-following fine scanning path was planned, with denser scanning trajectories in key areas such as the tooth root and tooth tip, and optimized tool buffer paths at tooth corners to avoid cutting defects in the fine structure of the tooth. For the inclined contour group, an innovative Z-axis was adopted. The multi-column unit partitioning path planning mode divides the entire inclined surface to be processed into several equidistant parallel processing columns along the Z-axis depth direction. The cutting depth of each column of processing units decreases gradually along the inclined direction of the surface. The path planning matches the decreasing depth of each column of units to set the corresponding scanning processing trajectory. A continuous and smooth inclined surface is formed by layering and superimposing multiple columns of units for cutting and fitting. For the vertical surface contour group, a fixed contour closed-loop scanning path and a conventional plane filling tool path are planned, without the need for contour offset adjustment, ensuring the verticality and edge flatness of the vertical edge. The path planning of the three types of contour groups is independent of each other and does not interfere with each other. The path data is synchronously stored and associated with the corresponding cutting process strategy.

[0041] S04, matching ultraviolet picosecond laser processing parameters based on different categories of contour groups, wherein negative defocus parameter settings are matched for inclined contour groups, and the number of layer cutting layers in the Z-axis direction is matched according to the depth of each array unit; The ultraviolet picosecond laser processing equipment does not have fixed uniform processing parameters. Instead, it sets differentiated core laser processing parameters based on the substrate material, substrate thickness, contour classification, and forming accuracy requirements. The core adjustable parameters include laser output power, laser scanning speed, pulse repetition frequency, beam defocus, Z-axis layer-by-layer sinking step distance, and XY plane scanning feed step distance. When processing substrates of the same material, the Z-axis layer-by-layer sinking step distance corresponds to the standard cutting thickness of a single layer. The XY plane scanning feed step distance can be selected as a uniform value or finely adjusted according to the contour accuracy requirements. The processing of inclined contour groups is matched with negative defocus parameter settings, the processing of tooth contour groups is matched with low-power encrypted scanning parameter settings, and the processing of vertical contour groups is matched with conventional balanced parameter settings. All parameters are adjusted as needed to ensure that the laser cold processing characteristics remain unchanged and the heat-affected zone is minimized.

[0042] The ultraviolet picosecond laser processing parameters for the inclined plane contour group mainly divide the material area to be laser-cut and milled above the inclined plane of each product into several Z-axis array units. Along the inclined direction, the inclined plane is projected onto the XY plane and divided into N parallel processing columns extending along the Z-axis, i.e., N Z-axis array units. These N Z-axis array units are sequentially defined from deep to shallow as: first column unit 101, second column unit 102, third column unit 103… Nth column unit 10N. Each column unit is further divided into several layers along the Z-axis. The total processing depth in the Z-axis direction decreases sequentially between columns. Within the same column unit, the number of Z-axis cutting layers is superimposed to form each column's Z… The depth of the Z-axis array unit; the width of each Z-axis array unit corresponds to the XY plane scanning feed step distance. The number of Z-axis array units is determined by the inclination angle of the inclined surface and the substrate. The number of Z-axis array units is also the number of XY plane scanning feeds when laser cutting and milling the inclined surface contour group; the number of Z-axis ultraviolet picosecond laser cutting and milling layers is matched for each Z-axis array unit. The number of Z-axis ultraviolet picosecond laser cutting and milling layers for each Z-axis array unit is the ratio of the depth of each Z-axis array unit to the Z-axis layer-by-layer sinking step distance; the ultraviolet picosecond laser processing parameters for the vertical surface contour group and the tooth contour group can be adaptively matched according to the conventional technical solution.

[0043] S05, UV picosecond laser cutting is completed step by step according to the planned path and processing sequence of each contour group; The core processing step of this invention is a refined layered cutting process using ultraviolet picosecond laser. The cutting process is completed step-by-step according to the contour group classification and corresponding exclusive layered cutting strategy: For vertical contour groups, a horizontal, constant-height layered cutting mode is adopted. The Z-axis descends layer by layer with a fixed downward step distance, and the XY plane scans and cuts at a uniform speed according to a preset tool path. The contour dimensions of each layer remain consistent, and the layers are stacked to form a regular vertical surface structure. For tooth contour groups, a refined layered milling cutting mode is adopted, reducing the single-layer cutting thickness and scanning tool step distance. Layer by layer, the process is refined along the tooth trajectory, focusing on enhancing the layered cutting accuracy of the tooth root area and eliminating tooth edge chipping and residual burrs. For inclined contour groups, a Z-axis multi-column unit depth-decreasing layered cutting mode is adopted. Each column of Z-axis direction array units is sequentially layered and cut according to a preset division. A three-axis module, composed of a Z-axis module and an XY-axis module, drives a negative pressure adsorption platform to move and feed the substrate, thereby enabling the galvanometer to perform XY cutting within the contour range of that column of Z-axis direction array units. The process involves scanning and removing material from each column of units, repeating layer by layer until a smooth inclined surface is formed by fitting numerous horizontal steps. These steps can be eliminated through process optimization and are virtually invisible to the naked eye or inspection equipment. The number of layers milled by the Z-axis array units along the Z-axis using ultraviolet picosecond laser cutting, i.e., the Z-axis cutting depth of each column of Z-axis array units, decreases sequentially along the inclined direction of the surface. By superimposing and fitting multiple columns of units cut at different depths, a continuous and smooth inclined surface structure can be formed without oblique cutting. The inclined surface has no obvious step feel and no spot distortion defects. All three types of contour group cutting adopt ultraviolet picosecond laser cold processing, with no heat accumulation and no material ablation damage during the processing.

[0044] The inclined plane contour group divides the inclined plane to be processed into several columns of machining units along the Z-axis depth direction. Each column of machining units is further divided into several cutting layers along the Z-axis. The total cutting depth in the Z-axis of different columns of machining units decreases sequentially along the inclined plane, and the number of cutting layers in the Z-axis of each column of units also decreases sequentially. Through the layered cutting of different columns of units with different numbers of layers, a continuous and smooth inclined plane contour is formed. That is, the inclined plane contour is formed by a multi-column unit depth-decreasing layered cutting method in the Z-axis direction. Specifically, the inclined plane to be processed is divided into multiple parallel machining units along the Z-axis depth direction. Each column of machining units is further divided into several cutting layers along the Z-axis. The total cutting depth in the Z-axis of different columns of machining units decreases sequentially, and the number of cutting layers in the Z-axis of each column of units also decreases sequentially along the inclined plane. Through the layered cutting of different columns of units with different numbers of layers, a continuous inclined plane is formed.

[0045] During the ultraviolet picosecond laser layer cutting and milling process, the double-layer structure of the substrate and the bottom film remains stable under the negative pressure adsorption of the platform. During the ultraviolet picosecond laser layer cutting and milling and contour forming process, there is no substrate displacement, warping or stretching deformation.

[0046] S06, Remove waste material and waste edges; After the substrate is cut and processed, the workpiece is not directly peeled off on the platform. Instead, the bottom film, along with the workpiece, waste material, and scrap edges, is removed as a whole. The waste material and scrap edges are then cleaned up. This avoids workpiece displacement, scratches, or secondary contamination that can occur when operating directly on the platform. Simultaneously, the platform is depressurized to release its adsorption force, preventing damage to the platform's micropores from forceful peeling of the bottom film. Detailed operating procedures are as follows: Negative pressure relief: After the entire substrate is cut, the negative pressure of the platform is closed and released, and the adsorption force of the platform micropores disappears; Complete removal: Remove the base film together with the cut substrate, waste edges and scrap materials from the platform to avoid direct contact with the ultra-thin flexible workpiece, which may cause dirt, stains, displacement or scratches. Waste and edge removal: Use a vacuum pen or a special dust collection device to remove cutting waste, edge debris, and dust from the bottom film, thus separating the workpieces and leaving only qualified workpieces attached to the bottom film. The specific settings can be adapted according to conventional technical methods in this field.

[0047] S07, Finished Product Quality Inspection, Transfer to Next Process.

[0048] After all contour laser layer cutting is completed, a dust-free dust removal device can be used again to thoroughly clean and remove residual micro-debris and dust from the workpiece surface and cutting gaps to avoid dust residue affecting the subsequent performance of the workpiece. After dust removal, sampling and full inspection of the workpiece's contour forming accuracy, edge flatness, bevel roughness, and tooth integrity are carried out to remove defective products with dimensional deviations and processing defects. Qualified products that pass the quality inspection are uniformly and neatly stored and transferred to the next processing station in an orderly manner according to the requirements of the subsequent production process to complete the entire laser cutting process.

[0049] Workpieces attached to the base film can be directly inspected, counted, or transferred to other processes. Alternatively, workpieces can be peeled off the base film and placed onto a transfer tray as needed, completing the entire clamping, processing, and release process. For ultra-thin flexible material products, the base film is usually used directly instead of the carrier tray, eliminating the need for an additional peeling and tray placement process.

[0050] During the ultraviolet picosecond laser cutting process, a dust purifier is connected to the symmetrically arranged negative pressure dust suction nozzles on both sides of the laser cutting head via air ducts. The dust suction nozzles remain relatively stationary with the laser cutting head, and the dust is suctioned synchronously with the workpiece's movement trajectory during the processing. The specific operation procedure is as follows: (1) Pre-processing debugging: Before the laser cutting operation begins, check the air pipeline sealing and confirm that the negative pressure dust suction nozzles on both sides are symmetrically arranged on both sides of the laser focus, and the air suction port of the nozzle is obliquely aligned with the laser processing point; according to the material of the carbon-coated PET flexible substrate, the laser cutting power and the cutting speed, preset the negative pressure suction of the dust purifier to ensure that the dust suction air volume is moderate and avoid excessive suction causing the flexible substrate to shift or wrinkle.

[0051] (2) Synchronous activation: The moment the ultraviolet picosecond laser starts cutting, the dust purifier is activated simultaneously, and the negative pressure suction nozzles on both sides generate negative pressure suction at the same time, forming a symmetrical negative pressure suction area around the laser processing point.

[0052] (3) Follow-up continuous dust suction: During the processing, the laser cutting head remains fixed, the negative pressure adsorption platform drives the substrate to complete the XY feed and Z-axis layer cutting, and the double-sided dust suction nozzles always maintain a fixed position relative to the laser focus, and continuously suck up smoke and dust from the cutting area following the processing trajectory.

[0053] (4) Graded extraction of impurities: The gasified smoke, fine dust and carbonized residue generated during the cutting process are gathered towards the air nozzle under the action of the symmetrical airflow on both sides, and transported to the inside of the smoke and dust purifier through the air intake and air pipeline for filtration, interception and purification.

[0054] (5) Delayed shutdown purification: After the single-section contour or whole plate substrate is cut, the laser light source stops outputting, and the double negative pressure dust suction nozzles continue to work for 2 to 5 seconds to remove residual suspended smoke and dust in the processing area and prevent dust from falling back and adhering to the workpiece surface; after the processing is completed, the dust purifier is turned off to complete a single dust suction operation.

[0055] This invention employs a double-sided symmetrical negative pressure suction structure for the cutting head. Utilizing the principle of fluid negative pressure suction, a stable negative pressure is formed inside the air duct by the dust purifier, enabling the air nozzle to generate continuous suction. The double-sided symmetrically arranged air nozzles can form a balanced and symmetrical airflow field around the laser processing point. Compared with single-sided suction, this can avoid the displacement, bulging, and deformation of the flexible film substrate caused by unidirectional airflow bias.

[0056] When ultraviolet picosecond lasers perform layer milling and contour cutting on carbon-coated PET substrates, the material vaporizes and melts under the action of high-energy lasers, generating fine carbonized dust and smoke. The symmetrical negative pressure airflow can quickly remove impurities generated in the processing area, prevent smoke and dust from obstructing the laser beam path, avoid laser energy attenuation and focus shift, and ensure the stability of laser beam transmission.

[0057] Meanwhile, timely removal of carbonized dust can prevent dust from adhering to the substrate surface, scratching the carbon coating layer, and contaminating the molding contour, thus reducing secondary defects; the air nozzle is fixed to the cutting head and does not shift position with the platform movement, ensuring that every cutting position has the same dust collection effect, adapting to multi-contour, high-density matrix layout processing, and improving the appearance cleanliness and processing consistency of flexible products.

[0058] Throughout the operation, visual detection and positioning are also performed using height measurement and vision components, i.e., cameras. In this invention, the height measurement and vision detection components are fixedly arranged on the equipment frame and remain in a fixed position. The negative pressure adsorption platform carrying the substrate moves with the three-axis module to complete the visual acquisition and positioning operation. The specific operation process is as follows: (1) Equipment calibration stage: After the equipment is turned on, the control system first completes the vision calibration, uses a standard calibration board to perform distortion correction and pixel size calibration on the industrial camera, and establishes the mapping relationship between the image coordinate system and the equipment mechanical coordinate system; at the same time, the height reference calibration is completed to determine the zero position surface of the substrate processing reference.

[0059] (2) After the substrate is loaded and clamped, the three-axis motion mechanism drives the negative pressure adsorption platform to move to the vision inspection station, so that the whole substrate is within the field of view of the camera.

[0060] (3) The camera acquires images of the substrate surface. The system uses image preprocessing, edge extraction, and template matching algorithms to identify the substrate edge, positioning markers, and layout array outline to obtain the current actual position information of the substrate.

[0061] (4) The control system compares the actual position of the substrate with the theoretical processing position, calculates the offset of the substrate in the X and Y directions and the rotation angle deviation, and generates automatic correction compensation command.

[0062] (5) The three-axis motion mechanism finely adjusts the platform position according to the compensation command to complete the high-precision alignment of the substrate and ensure that the cutting trajectory and the product outline are accurately coincident.

[0063] (6) The vision component synchronously completes multi-point height detection, collects height data of different points on the substrate surface, fits the flatness of the substrate and the surface undulation deviation, and corrects the Z-axis processing reference and laser defocusing amount based on the height deviation, so that the laser focus always falls on the optimal processing position of the substrate.

[0064] (7) During the processing, the vision component can perform real-time spot checks on key processing areas, collect images of the forming contour, and determine the cutting and forming quality. After processing, the vision component assists in the detection of the finished product's appearance and contour dimensions, and distinguishes between qualified products and waste materials.

[0065] This invention employs a fixed vision inspection structure, relying on machine vision imaging principles, coordinate system calibration principles, and closed-loop correction and compensation principles to achieve high-precision positioning and height detection. The camera acquires high-definition images of the substrate surface through an optical lens, converting the light signal into a digital image signal and transmitting it to the device control host. The control host's built-in image algorithm performs grayscale processing, noise reduction filtering, and edge recognition on the image, accurately extracting the substrate's outer boundary and positioning feature points.

[0066] By utilizing the image-machine coordinate mapping relationship obtained from calibration, pixel coordinates are converted into physical machine coordinates. By comparing with the preset standard layout coordinates, the translational and rotational deviations caused by clamping are calculated, and the deviations are converted into three-axis module displacement compensation amounts. This enables passive and precise alignment of the workpiece, eliminating positional errors caused by manual clamping and deformation of flexible substrates.

[0067] Meanwhile, the visual height measurement principle relies on optical ranging and recognition to collect multi-point height data of the substrate, fit the flatness of the substrate, and determine whether the substrate has warping or unevenness. The system dynamically corrects the Z-axis layer cutting benchmark and laser defocusing amount based on the height data to avoid processing defects such as uneven cutting depth, slope step error, and energy focusing offset caused by inconsistent substrate height.

[0068] This visual inspection component remains stationary throughout the process, relying on platform movement to complete sampling and inspection. Combined with a negative pressure adsorption clamping method, it is adapted to the thin and easily deformable material characteristics of flexible carbon-coated PET substrates, achieving high-precision positioning, height compensation, and processing quality inspection of the entire substrate, ensuring the cutting consistency and forming accuracy of diverse contour products.

[0069] The second technical solution provides a laser cutting control system for flexible products with diverse contours, used to execute the laser cutting control method for flexible products with diverse contours in the first technical solution. The core control module consists of an equipment control host, a vision positioning and detection module, a contour feature recognition and classification module, a cutting path planning module, a laser parameter adaptation and adjustment module, a three-axis motion control module, a laser processing module, a negative pressure adsorption control module, and a negative pressure dust collection control module; the principles of each module are as follows: The equipment control host is electrically connected to each module and serves as the system's computing and control center. It is used to execute control programs, receive feedback signals from each module, issue control commands to each module, and coordinate each module to run synchronously according to a preset process. The visual positioning and detection module can acquire images of the substrate and product positions to complete substrate positioning, height detection, and processing deviation compensation. The contour feature recognition and classification module can identify and extract the contour features of the product to be processed, and automatically classify the contours into vertical surface contour group, inclined surface contour group and tooth contour group; The cutting path planning module can fit closed-loop trajectories for different contour groups, and plan differentiated scanning cutting paths, processing sequences, and Z-axis array unit distribution paths for inclined contours. The laser parameter adaptation and control module can match the ultraviolet picosecond laser processing parameters to different contour groups, and match the corresponding number of Z-axis cutting layers for each array unit of the inclined contour. The three-axis motion control module can be equipped with XY-axis modules and Z-axis modules of negative pressure adsorption platform to realize workpiece feeding and movement; The laser processing module can emit ultraviolet picosecond lasers to complete layered cutting and milling processes; The negative pressure adsorption control module can control the negative pressure adsorption platform to complete the adsorption and fixation of the base film and substrate, as well as the pressure release after processing; The negative pressure dust collection control module can simultaneously control the air nozzles on both sides of the cutting head to perform negative pressure dust collection during the laser cutting process.

[0070] The third technical solution provides a laser cutting control device for flexible products with diverse contours. This device is used to implement the laser cutting control method for flexible products with diverse contours as described in the first technical solution, through the laser cutting control system for flexible products with diverse contours. The overall structure can refer to a conventional laser cutting machine, mainly consisting of a processing host, a laser processing mechanism, a three-axis motion mechanism, a negative pressure adsorption fixture, a vision inspection mechanism, a negative pressure dust collection mechanism, auxiliary supporting mechanisms, and an electrical control mechanism. The main support structure of the processing host adopts a closed equipment box 1, with a marble platform 2 integrated inside the equipment box 1 as the installation support mechanism. The laser processing mechanism 3 is fixedly installed on the top of the marble platform. The laser processing mechanism 3 is composed of an ultraviolet picosecond laser 31, a beam expander 32, a galvanometer 33, and a focusing component 34, and the laser processing mechanism 3 is fixed in place. The three-axis motion mechanism is composed of an XY axis module 4 with a flexible bellows protective cover and a Z-axis lifting module 5, which can drive the negative pressure adsorption fixture belt. The moving negative pressure adsorption platform is fed at high speed. The main structure of the negative pressure adsorption fixture is the negative pressure adsorption platform 6, which is fixedly installed on the Z-axis lifting module and can bear the adsorption and fixation of the base film and flexible substrate. The main structure of the vision inspection mechanism is the height measurement and vision component 7, which is fixedly arranged on the processing frame and can realize substrate alignment, height detection and real-time monitoring of the laser cutting process. The negative pressure dust collection mechanism is composed of negative pressure dust collection nozzles 8, air pipelines and dust purifiers 9 symmetrically arranged on both sides of the laser cutting head. In actual operation, negative pressure dust collection nozzles 8 are symmetrically set on both sides of the laser cutting head. The negative pressure dust collection nozzles are connected to the dust purifier through air pipelines. The air pipelines are not shown in the figure. The specific settings can be adapted according to the space conditions of the equipment. The auxiliary supporting mechanism is a chiller 11, which can provide cooling for the ultraviolet picosecond laser. The electrical control mechanism is electrically connected to the above mechanisms to realize the linkage control of the whole machine. A display screen 12 is also set on the equipment box 1. The display screen can display the human-machine interface for human-machine interaction operation.

[0071] The laser cutting control device for flexible contour products of the present invention uses an ultraviolet picosecond laser. The laser emitted by the laser is transmitted to the galvanometer and focusing assembly via a beam expander and a 45° reflector. After focusing, the laser acts on the workpiece. The control system controls the laser, the three-axis platform, and the camera positioning assembly to work together. The system control principle is realized through a laser optical path system and a control and auxiliary system. The laser optical path system includes a complete light path from the laser (laser generator + internal lens group), through beam expansion, reflection, and galvanometer focusing, to finally reach the workpiece. The control and auxiliary system includes the signal and control relationship between the control system (host or computer), the chiller, the camera positioning assembly, and the three-axis motion platform (X / Y / Z).

[0072] In the technical solution of this invention, all operations involving ultraviolet picosecond lasers can be replaced by ultraviolet femtosecond lasers.

[0073] Example 1: like Figures 1-20 As shown, according to the above-mentioned planning and design scheme, the first, second, and third technical solutions are implemented to create a laser cutting control device, system, and method for flexible products with diverse contours. A periscope dome for a smart camera is manufactured using ultraviolet picosecond laser cutting technology. The structure of the periscope dome for the smart camera is as follows: Figures 5-8 As shown, the material is a 60μm thick PET light-shielding film coated with conductive carbon black on both sides, specifically 55BZ-KF carbon-coated PET; wherein, the inner circle of the periscope cover is a closed trajectory inner contour composed of two toothed contour segments and two inclined contour segments, with an inclination angle of 45°; the outer circle of the periscope cover is a closed trajectory outer contour composed of multiple straight vertical surfaces and multiple curved vertical surfaces; therefore, in the implementation of Example 1, in the S01 operation step, the adsorption base film 20 is first fixed by the negative pressure adsorption platform, and then the 55BZ-KF carbon-coated PET raw material substrate 10 is laid on top of the base film 20, and the air is vented by a roller brush.

[0074] In the S02 operation procedure, the two toothed contour segments of the inner ring of the periscope dome are classified and grouped into inclined contour group 100, the two inclined contour segments of the inner ring are classified and grouped into toothed contour group 200, and the outer ring is classified and grouped into three independent contour groups: vertical surface contour group 300, which consists of multiple straight vertical surface segments and curved vertical surface segments.

[0075] In operation step S03, each of the two tooth profile segments of the tooth profile group 200 is composed of several teeth and tooth grooves arranged continuously at equal intervals along a single straight line. The tooth protrusions and tooth groove concavities are regularly distributed along the straight line, forming a straight array of straight-line sawtooth profiles. The straight lines of the two tooth profile segments are parallel to each other and located on the same rectangle. Therefore, based on the rectangular characteristics of the two tooth profile segments, an approximate rectangular closed-loop trajectory of the tooth profile group 200 is fitted, and the scanning cutting path of the tooth profile group 200 is planned as a corresponding approximate rectangular path. All tooth protrusions and tooth groove concavities of the tooth profile group 200 are also vertical surface profiles. The two inclined plane profile segments of the inclined plane profile group 100 are both distributed along the same circumferential direction. Therefore, based on the circumferential direction of the two inclined plane profile segments, a circular closed-loop trajectory of the inclined plane profile group 100 is fitted, and the scanning cutting path of the inclined plane profile group 100 is planned as a corresponding circular path. The vertical surface contour group 300 is an irregular closed trajectory outer contour composed of multiple straight line segments and multiple arc segments. Therefore, the planned scanning cutting path of the vertical surface contour group 300 is the corresponding irregular path composed of a combination of straight line segments and multiple arc segments.

[0076] Based on the material properties of the 55BZ-KF carbon-coated PET of the periscope dome of the smart camera and the 45° tilt angle of the inclined surface, the material to be removed above the inclined surface of the inclined surface contour group 100 is divided into 10 columns of array units along the Z-axis, with each column having a width of 4–7 μm, and the optimal width of each column being 6 μm; for example Figures 11-12 As shown.

[0077] Meanwhile, the difference between the inclined surface contour group 100, the toothed contour group 200, and the vertical surface contour group 300 is that the inclined surface contour group 100 and the toothed contour group 200 are the core functional points of the high-precision inner ring of the periscope dome of the intelligent camera, while the vertical surface contour group 300 is the outer ring contour of the non-core functional point. Therefore, the processing order of all contour groups is planned as follows: the toothed contour group 200 is processed first by ultraviolet picosecond laser cutting, then the inclined surface contour group 100, and finally the vertical surface contour group 300. According to this processing order, the inner ring inclined surface contour group 100 and the toothed contour group 200 only need to be positioned and drilled when the toothed contour group 200 is processed by ultraviolet picosecond laser cutting. When the toothed contour group 200 is processed by ultraviolet picosecond laser cutting in the future, it can be directly used as the positioning reference.

[0078] In operation step S04, based on the material characteristics of the 55BZ-KF carbon-coated PET of the periscope dome of the intelligent camera, a UV picosecond laser layer cutting process is adopted. The single-layer milling thickness of the substrate for the bevel contour group 100, toothed contour group 200, and vertical contour group 300 is uniformly matched with a UV picosecond laser cutting substrate thickness of 4–8 μm. In this example, the optimal single-layer milling thickness is selected as 6 μm, which is equivalent to a Z-axis layer-by-layer sinking step of 6 μm. The total number of UV picosecond laser layer cutting layers is 8–12, and in this example, the optimal number of layers is selected as 10. The difference between the bevel contour group 100, toothed contour group 200, and vertical contour group 300 is that the bevel contour group 100 and toothed contour group 200 are the core functional points of the high-precision inner ring of the periscope dome of the intelligent camera, while the vertical contour group 300 is the outer ring contour of non-core functional points. Specific process parameters are as follows: Laser: Ultraviolet picosecond 355nm, pulse width 8-15ps, repetition frequency 500kHz-1MHz; Layered method: Horizontal equal height layer-by-layer milling, with the focal point sinking with each layer (following in the Z direction); Layer thickness: 6μm ± 0.5μm; Number of layers: 10; Scanning speed: 800~2000mm / s; Defocus: negative defocus 0.15-0.3mm (to protect the carbon layer), preferably negative defocus 0.15mm.

[0079] Simultaneously, the inclined contour group 100 also needs to be constructed by layer-cutting with ultraviolet picosecond laser. Based on the 45° tilt angle of the inclined surface, the material to be removed above the inclined surface of the inclined contour group 100 is divided into 10 columns of Z-axis array units, namely the first column unit 101, the second column unit 102, the third column unit 103... and the tenth column unit 1010. The depth of the 10 columns of Z-axis array units is as follows: Figure 12 The width of each column decreases from right to right, with each column being 4 to 7 μm wide. In this example, the width of each column is 6 μm, which means the XY plane scanning feed step is 6 μm. The step effect is weakened by overlapping the light spots, resulting in a smoother, stepless slope.

[0080] In operation step S05, the toothed contour group 200 is first machined by ultraviolet picosecond laser positioning, drilling, and cutting. The XY axis module drives the Z-axis lifting module and the negative pressure adsorption platform to move at high speed and cycle along an approximately rectangular path. At the same time, the Z-axis lifting module drives the negative pressure adsorption platform to descend and rise layer by layer along the Z-axis. Since the laser processing mechanism is fixed, the focal point descends with each layer (Z). (Following) until the tooth profile group 200 is completed by UV picosecond laser positioning drilling and cutting through the thickness of the substrate material; then, the inclined profile group 100 is processed by UV picosecond laser positioning drilling and cutting. Specifically, based on the end of the hollowed-out separation gap formed by UV picosecond laser cutting through the substrate material to complete the tooth profile group 200, the first column unit 101 is formed by UV picosecond laser cutting through the thickness of the substrate material, and then the second column unit 102, the third column unit 103... the 10th column unit 1010 are processed by successively reducing the cutting depth. The final inclined surface Ra of the 10 micro-steps is <2μm, with no obvious step feeling; the effect of the transition connection between the inclined profile and the tooth profile of the workpiece product after UV picosecond laser cutting is observed under an electron microscope as follows. Figure 20 As shown.

[0081] In the actual operation of Example 1, the operation time for clamping the base film and substrate is within 30 seconds each time. The processing time for the tooth contour group 200 UV picosecond laser positioning drilling and cutting of a single workpiece product is no more than 2 seconds, the processing time for the inclined contour group 100 UV picosecond laser cutting is no more than 20 seconds, and the processing time for the vertical contour group 300 UV picosecond laser positioning drilling and cutting is no more than 2 seconds. The total processing time for a single workpiece product is no more than 26 seconds. It can adapt to the processing needs of ultra-thin precision irregular parts with diverse contours, will not cause thermal impact on the product, and can improve the dimensional accuracy and production efficiency of the parts. The edges of the parts contours are smooth without burrs or microcracks, meeting the high-quality requirements of ultra-thin flexible material precision irregular parts.

[0082] The layout schemes in the embodiments of this invention are temporary layout schemes for implementing and verifying the technical solutions of this invention, and are not the final layout schemes in the actual production process. The final layout schemes in the actual production process shall be subject to actual operation.

[0083] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Under the concept of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the present invention as described above. For the sake of brevity, they are not provided in detail. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser cutting control method for flexible products with diverse contours, characterized in that: The following steps are included: Material preparation, loading and clamping of base materials, and layout of product layout schemes; Obtain all contour features of a single product to be processed, and categorize and group them. Closed-loop trajectories are fitted for different types of contour groups, scanning and cutting paths are planned for different types of contour groups, and the processing sequence of all contour groups is determined. For inclined contour groups, the material to be removed above the inclined surface of each product is divided into several array units in the Z-axis direction according to the inclined surface size and substrate thickness parameters. The depth of the array units decreases progressively. Based on different types of contour groups, ultraviolet picosecond laser processing parameters are matched respectively. For the inclined contour group, the number of layer cutting layers in the Z-axis direction is matched according to the depth of each array unit. The ultraviolet picosecond laser cutting is completed step by step according to the planned path and processing sequence of each contour group. Remove waste material and scrap edges; Finished product quality inspection, then transferred to the next process.

2. The laser cutting control method for flexible products with diverse contours according to claim 1, characterized in that: The preparation, loading and clamping of substrates, and layout of the product scheme include the following operations: The substrate is fixedly clamped by vacuum adsorption using a negative pressure adsorption platform. The negative pressure adsorption platform is fixedly connected to the Z-axis module, which is set on the XY-axis module equipped with a flexible bellows protective cover. Before clamping the substrate, place a bottom film on the negative pressure adsorption platform. The area of ​​the bottom film is larger than the area of ​​the substrate. After the bottom film is adsorbed and clamped stably, place a substrate on top of the bottom film and use a roller brush to remove air, so that the substrate is tightly attached to the bottom film. Based on the external dimensions, contour type, and mass production requirements of the products to be processed, a matrix-style, equally spaced, standardized layout method is adopted for the workpiece array layout.

3. The laser cutting control method for flexible products with diverse contours according to claim 1, characterized in that: The process of obtaining and classifying all contour features of a single product to be processed includes the following operations: Based on the differences in geometric shape and structural contour, the diverse contours of products are classified and grouped into three independent categories: vertical surface contour group, inclined surface contour group, and toothed contour group.

4. The laser cutting control method for flexible products with diverse contours according to claim 1, characterized in that: Path planning follows an inside-out order.

5. The laser cutting control method for flexible products with diverse contours according to claim 1, characterized in that: The process of matching ultraviolet picosecond laser processing parameters based on different contour groups includes the following operations: This includes matching the laser output power, laser scanning speed, pulse repetition frequency, beam defocus, Z-axis layer-by-layer sinking step distance, and XY plane scanning tool feed step distance of ultraviolet picosecond lasers based on different categories of contour groups; Specifically, for the negative defocus parameter setting of the inclined contour grouping matching, the scanning cutting path scans and cuts each array unit in sequence from deep to shallow.

6. The laser cutting control method for flexible products with diverse contours according to claim 1, characterized in that: It also includes the following operations: Camera-based visual inspection and positioning.

7. The laser cutting control method for flexible products with diverse contours according to claim 1, characterized in that: Negative pressure dust is applied to both sides of the laser cutting head during ultraviolet picosecond laser cutting. After the entire substrate is laser-cut, the negative pressure adsorption platform releases the adsorption force, and the bottom film, along with the cut substrate, waste edges, and waste materials on it, are removed as a whole. Then, the waste materials and waste edges are removed by a dust collection device, thus completing the separation of the workpiece.

8. The laser cutting control method for flexible products with diverse contours according to any one of claims 1 to 7, characterized in that: The ultraviolet picosecond laser is an ultraviolet femtosecond laser.

9. A laser cutting control system for flexible products with diverse contours, used to execute the laser cutting control method for flexible products with diverse contours as described in any one of claims 1 to 7, characterized in that: It includes an equipment control host, a visual positioning and detection module, a contour feature recognition and classification module, a cutting path planning module, a laser parameter adaptation and adjustment module, a three-axis motion control module, a laser processing module, a negative pressure adsorption control module, and a negative pressure dust collection control module. The device control host is electrically connected to each module and serves as the system's computing and control center. It is used to execute control programs, receive feedback signals from each module, issue control commands to each module, and coordinate each module to run synchronously according to a preset process. The visual positioning and detection module is used to acquire images of the substrate and product positions, and to complete substrate positioning, height detection and processing deviation compensation. The contour feature recognition and classification module is used to identify and extract the contour features of the product to be processed, and automatically classify the contours into vertical surface contour group, inclined surface contour group and tooth contour group. The cutting path planning module is used to fit closed-loop trajectories for different contour groups, and to plan differentiated scanning cutting paths, processing sequences, and Z-axis array unit distribution paths for inclined contours. The laser parameter adaptation and control module is used to match the ultraviolet picosecond laser processing parameters for different contour groups, and to match the corresponding number of Z-axis cutting layers for each array unit of the inclined contour. The three-axis motion control module is used to control the XY-axis module and Z-axis module equipped with the negative pressure adsorption platform to realize the workpiece feeding and movement; The laser processing module is used to emit ultraviolet picosecond lasers to complete layered cutting and milling processes. The negative pressure adsorption control module is used to control the negative pressure adsorption platform to complete the adsorption and fixation of the bottom film and substrate, as well as the pressure release after processing. The negative pressure dust extraction control module is used to simultaneously control the air nozzles on both sides of the cutting head to perform negative pressure dust extraction during the laser cutting process.

10. A laser cutting control device for flexible products with diverse contours, used to implement the laser cutting control method for flexible products with diverse contours according to any one of claims 1 to 7 through the laser cutting control system for flexible products with diverse contours according to claim 9, characterized in that: It includes a processing host, a laser processing mechanism, a three-axis motion mechanism, a negative pressure adsorption fixture, a vision inspection mechanism, a negative pressure dust collection mechanism, auxiliary supporting mechanisms, and an electrical control mechanism; The processing host is a closed equipment enclosure, with a marble platform integrated inside as a mounting support mechanism. The laser processing mechanism is fixedly installed on top of the marble platform, including an ultraviolet picosecond laser, a beam expander, a galvanometer, and a focusing assembly, and remains stationary. The three-axis motion mechanism includes an XY-axis module and a Z-axis lifting module equipped with a flexible bellows protective cover, used to drive the negative pressure adsorption fixture to move the negative pressure adsorption platform at high speed. The negative pressure adsorption fixture includes a negative pressure adsorption platform, fixedly installed on the Z-axis lifting module, used to support the adsorption and fixation base film and flexible substrate. The visual inspection mechanism includes height measurement and vision components, fixedly arranged on the processing frame, used for substrate alignment, height detection, and real-time monitoring of the laser cutting process. The negative pressure dust collection mechanism includes negative pressure dust collection nozzles, air ducts, and a dust purifier symmetrically arranged on both sides of the laser cutting head. The auxiliary supporting mechanism includes a chiller for cooling the ultraviolet picosecond laser. The electrical control mechanism is electrically connected to the above mechanisms to achieve integrated control of the entire machine.

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