Femtosecond laser processing equipment

Abstract

The utility model provides femtosecond laser processing equipment, which comprises a moving platform deck assembly, a laser processing assembly, a laser processing assembly, a laser processing assembly and a laser processing assembly, and is characterized in that the moving platform deck assembly comprises a moving mechanism and an adsorption platform, the femtosecond laser assembly is located above the movable carrying table assembly and used for conducting laser machining on the workpiece on the adsorption platform, and the femtosecond laser assembly comprises a laser device, a light path assembly and a galvanometer assembly which are sequentially communicated; the CCD assembly is used for positioning a workpiece, and the CCD assembly is arranged at the working end of the galvanometer assembly and moves synchronously with the galvanometer assembly; the dust collection assembly comprises a dust collection head, a dust collection drive and an air suction pipe communicated with the dust collection head and the dust collection drive, the plane where an air inlet of the dust collection head is located is parallel to the laser emitting direction of the galvanometer assembly, and the galvanometer assembly is located between the CCD assembly and the dust collection assembly in the horizontal direction. By means of the arrangement, the functions of high-precision positioning, efficient laser machining and synchronous dust collection can be achieved, and the machining precision and efficiency are remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of laser processing equipment, and in particular to a femtosecond laser processing equipment. Background Technology

[0002] Femtosecond lasers have narrower pulse widths, resulting in minimal heat generation during material processing and preventing damage from heat accumulation. They also eliminate discoloration, melting, and material contamination during direct cutting. Furthermore, femtosecond lasers offer excellent beam quality output; after focusing, they ensure consistent edge finish and smoothness of the cut path and end face, achieving truly precision cutting. Therefore, femtosecond lasers are increasingly widely used in fields such as integrated circuits, semiconductors, physics, chemistry, life sciences, and medicine.

[0003] However, existing femtosecond laser processing equipment still faces some challenges in practical applications. For example, dust and debris generated during processing are difficult to remove effectively, or the removal mechanism is poorly designed, which can interfere with the laser components and positioning camera components, further limiting processing accuracy. These issues restrict the application of femtosecond laser processing technology in a wider range of fields.

[0004] Therefore, it is necessary to design a femtosecond laser processing device to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a femtosecond laser processing device that integrates high-precision positioning, high-efficiency laser processing, and dust collection, thereby significantly improving processing accuracy and efficiency.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a femtosecond laser processing device, comprising...

[0007] A mobile platform assembly includes a moving mechanism and an adsorption platform that moves horizontally under the drive of the moving mechanism.

[0008] A femtosecond laser assembly, located above the moving stage assembly, is used to perform laser processing on the workpiece on the adsorption platform. The femtosecond laser assembly includes a laser, an optical path assembly, and a galvanometer assembly connected in sequence.

[0009] A CCD component is used to position the workpiece. The CCD component is located on one side of the galvanometer component and moves synchronously with the galvanometer component.

[0010] The vacuuming assembly includes a vacuum head, a vacuum drive, and an air intake pipe connecting the vacuum head and the vacuum drive. The plane of the air inlet of the vacuum head is parallel to the laser emission direction of the galvanometer assembly. In the horizontal direction, the galvanometer assembly is located between the CCD assembly and the vacuuming assembly.

[0011] As a further improvement of the present invention, the optical path assembly includes a first horizontal optical path assembly, a second horizontal optical path assembly, a third horizontal optical path assembly, a vertical telescopic optical path assembly, and a fourth horizontal optical path assembly connected in sequence; the first optical path assembly is located at the output end of the laser, and the galvanometer assembly is located at the output end of the fourth horizontal optical path assembly.

[0012] As a further improvement of the present invention, the invention also includes a frame, wherein the laser, the first horizontal optical path assembly, the second horizontal optical path assembly, and the third horizontal optical path assembly are horizontally mounted on the frame, and the femtosecond laser assembly further includes a vertical moving mechanism, wherein the fourth horizontal optical path assembly and the galvanometer assembly are vertically raised and lowered under the drive of the vertical moving mechanism.

[0013] As a further improvement of the present invention, the CCD component is mounted on the vertical moving mechanism and moves up and down synchronously with the galvanometer component under the drive of the vertical moving mechanism. The CCD component includes a light source and a camera, with the camera located above the light source.

[0014] As a further improvement of this utility model, the frame is provided with a vertical plate, the vertical moving mechanism is located on one side of the vertical plate, and the dust suction head is located at the lower end of the vertical plate.

[0015] As a further improvement of this utility model, in the horizontal direction, the distance between the plane where the air inlet of the dust suction head is located and the laser emitted by the galvanometer assembly is 30-60mm.

[0016] As a further improvement of the present invention, the vacuum head includes a horizontal base plate, multiple vertical side plates and a top plate. The side plates are respectively provided with an air inlet and an air outlet. The top plate includes a first horizontal section, an upwardly inclined section and a second horizontal section in sequence from the air inlet to the air outlet. The angle between the upwardly inclined section and the horizontal direction is 30-60°.

[0017] As a further improvement of this utility model, the air inlet is rectangular, with a length of 80-110mm and a width of 10-20mm.

[0018] As a further improvement of the present invention, the adsorption platform includes a platform body with a cavity and a vacuum mechanism that communicates with the cavity and provides a vacuum degree. The upper surface of the platform body is provided with a plurality of adsorption holes that communicate with the cavity. The upper surface of the platform body is also provided with a support strip for supporting the workpiece. The support strip surrounds the outside of the plurality of adsorption holes.

[0019] As a further improvement of the present invention, the moving mechanism includes an X-axis linear module and a Y-axis linear module disposed on the X-axis linear module, and the adsorption platform is disposed on the Y-axis linear module.

[0020] As can be seen from the above technical solutions, the femtosecond laser processing equipment of this utility model has the following effects:

[0021] Efficient dust removal: The dust collection component is designed so that the air inlet of the dust collection head is parallel to the laser emission direction of the galvanometer assembly, meaning the suction direction is perpendicular to the processing direction. This design allows dust generated between the galvanometer assembly and the workpiece to be quickly drawn away from the side, keeping the area between the galvanometer assembly and the workpiece clean and preventing dust from interfering with the operation of the galvanometer assembly.

[0022] To prevent smoke and dust from interfering with positioning: In the horizontal direction, the galvanometer assembly is positioned between the CCD assembly and the dust collection assembly, ensuring that the path for smoke and dust removal avoids the CCD assembly, thus preventing smoke and dust from interfering with its positioning. This layout ensures that the CCD assembly can perform high-precision positioning in a smoke-free environment, further improving processing accuracy.

[0023] Keep the processing area clean: The aforementioned dust extraction components effectively remove dust and debris generated during processing, maintaining a clean processing area and reducing contamination of workpieces and equipment. This not only improves processing quality but also extends the lifespan of the equipment.

[0024] Improving processing efficiency and quality: Based on the above design, the femtosecond laser processing equipment of this utility model can achieve high-precision positioning, high-efficiency laser processing and synchronous dust collection, which significantly improves processing accuracy and efficiency and meets the high standards of precision processing required by modern industrial manufacturing. Attached Figure Description

[0025] Figure 1 This is a perspective view of a femtosecond laser processing device according to an embodiment of the present invention.

[0026] Figure 2 for Figure 1 A three-dimensional view of the adsorption platform.

[0027] Figure 3 for Figure 1 Side view of a femtosecond laser processing equipment.

[0028] Figure 4 for Figure 3 A 3D view of the center vacuum head. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Please refer to Figure 1 As shown, this utility model provides a femtosecond laser processing equipment, which includes a frame 10, a mobile stage assembly 20, a femtosecond laser assembly 30, a CCD assembly 40, and a dust collection assembly 50.

[0031] The frame 10 includes a marble base 11 and a gantry frame 12 mounted on the marble base 11. A movable platform assembly 20 is mounted on the marble base 11 and includes a moving mechanism and a suction platform 21 that moves horizontally under the drive of the moving mechanism. Specifically, the moving mechanism includes an X-axis linear module 22 and a Y-axis linear module 23 mounted on the X-axis linear module 22, and the suction platform 21 is mounted on the Y-axis linear module 23. Please refer to... Figure 2 As shown, the adsorption platform 21 includes a platform body 211 with a cavity and a vacuum mechanism that communicates with the cavity and provides a vacuum degree. The upper surface of the platform body 211 is provided with a plurality of adsorption holes 213 that communicate with the cavity. The upper surface of the platform body 211 is also provided with a support bar 212 for supporting the workpiece. The support bar 212 surrounds the outside of the plurality of adsorption holes 211.

[0032] The femtosecond laser assembly 30 is located above the moving stage assembly 20 and is used to perform laser processing on the workpiece on the adsorption platform 21. The femtosecond laser assembly 30 includes a laser 31, an optical path assembly, and a galvanometer assembly 32 connected in sequence on the gantry 12. The optical path assembly includes a first horizontal optical path assembly 33, a second horizontal optical path assembly 34, a third horizontal optical path assembly 35, a vertical telescopic optical path assembly 36, and a fourth horizontal optical path assembly 37 connected in sequence. The first optical path assembly 33 is located at the emission end of the laser 31, and the galvanometer assembly 32 is located at the emission end of the fourth horizontal optical path assembly 37. The laser 31, the first horizontal optical path assembly 33, the second horizontal optical path assembly 34, and the third horizontal optical path assembly 35 are horizontally arranged on the gantry 12.

[0033] The femtosecond laser assembly 30 also includes a vertical moving mechanism 38. A vertical plate is provided on the gantry 12, and the vertical moving mechanism 38 is located on one side of the vertical plate. The fourth horizontal optical path assembly 37 and the galvanometer assembly 32 are vertically raised and lowered under the drive of the vertical moving mechanism 38.

[0034] The CCD component 40 is used for positioning the workpiece. The CCD component 40 is located on one side of the galvanometer component 32 and moves synchronously with it. Specifically, the CCD component 40 is also located on the vertical moving mechanism 38 and moves synchronously with the galvanometer component 32 under the drive of the vertical moving mechanism 38. The CCD component 40 includes a light source 41 and a camera 42, with the camera 42 located above the light source 41.

[0035] The vacuuming assembly 50 includes a vacuum head 51, a vacuum drive, and a suction pipe connecting the vacuum head and the vacuum drive. The vacuum head 51 is located at the lower end of the vertical plate. In the horizontal direction, the galvanometer assembly 32 is located between the CCD assembly 40 and the vacuuming assembly 50. Please refer to... Figure 3 and Figure 4 As shown, the vacuum head 51 includes a horizontal base plate 511, multiple vertical side plates 512, and a top plate 513. Each side plate 512 has an air inlet 51a and an air outlet 51b, positioned opposite each other on either side of the vacuum head 51. The top plate 513, from the air inlet 51a to the air outlet 51b, includes a first horizontal section 513a, an upwardly inclined section 513b, and a second horizontal section. The angle between the upwardly inclined section 513b and the horizontal direction is 30-60°. The air inlet 51a is rectangular, with a length of 80-110 mm and a width of 10-20 mm. The plane containing the air inlet 511 is parallel to the laser emission direction of the galvanometer assembly 32. Horizontally, the distance d between the plane containing the air inlet 51a of the vacuum head 51 and the emitted laser from the galvanometer assembly 32 is 30-60 mm.

[0036] The terms used herein, such as "upper" and "lower," indicating spatial relative position, are for illustrative purposes to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It is understood that, depending on the product's placement, these terms may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting the claims.

[0037] Furthermore, the above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

Claims

1. A femtosecond laser processing apparatus, characterized by: The utility model relates to a laser processing device for workpiece, comprising A mobile platform assembly, comprising a moving mechanism and an adsorption platform moving horizontally under the driving of the moving mechanism; A femtosecond laser assembly located above the mobile platform assembly for laser processing of the workpiece on the adsorption platform, the femtosecond laser assembly comprising a laser, a light path assembly and a galvanometer assembly in turn; A CCD assembly for positioning the workpiece, the CCD assembly being located on one side of the galvanometer assembly and moving synchronously with the galvanometer assembly; A dust suction assembly comprising a dust suction head, a dust suction drive and a suction pipe connecting the dust suction head and the dust suction drive, the plane where the air inlet of the dust suction head is located being parallel to the laser emission direction of the galvanometer assembly, and in the horizontal direction, the galvanometer assembly is located between the CCD assembly and the dust suction assembly.

2. The femtosecond laser processing apparatus according to claim 1, wherein: The light path assembly comprises a first horizontal light path assembly, a second horizontal light path assembly, a third horizontal light path assembly, a vertical telescopic light path assembly and a fourth horizontal light path assembly in turn, the first horizontal light path assembly being located at the emission end of the laser, and the galvanometer assembly being located at the emission end of the fourth horizontal light path assembly.

3. The femtosecond laser processing apparatus according to claim 2, wherein: Further comprising a rack, the laser, the first horizontal light path assembly, the second horizontal light path assembly and the third horizontal light path assembly being horizontally arranged on the rack, the femtosecond laser assembly further comprising a vertical moving mechanism, the fourth horizontal light path assembly and the galvanometer assembly vertically ascending and descending under the driving of the vertical moving mechanism.

4. The femtosecond laser processing apparatus according to claim 3, wherein: The CCD assembly is arranged on the vertical moving mechanism and vertically ascends and descends synchronously with the galvanometer assembly under the driving of the vertical moving mechanism, the CCD assembly comprising a light source and a camera, the camera being located above the light source.

5. The femtosecond laser processing apparatus according to claim 4, wherein: A vertical plate is arranged on the rack, the vertical moving mechanism being arranged on one side of the vertical plate, and the dust suction head being arranged at the lower end of the vertical plate.

6. The femtosecond laser processing apparatus according to claim 1, wherein: In the horizontal direction, the distance between the plane where the air inlet of the dust suction head is located and the emitted laser of the galvanometer assembly is 30-60 mm.

7. The femtosecond laser processing apparatus according to claim 1, wherein: The dust suction head comprises a horizontal bottom plate, a plurality of vertical side plates and a top plate, the side plates each having an air inlet and an air outlet, the top plate comprising a first horizontal section, an upwardly inclined section and a second horizontal section in turn from the air inlet to the air outlet, and the angle between the upwardly inclined section and the horizontal direction being 30-60°.

8. The femtosecond laser processing apparatus as claimed in claim 7, characterized by: The air inlet is rectangular, the length of the air inlet being 80-110 mm and the width being 10-20 mm.

9. The femtosecond laser processing apparatus as claimed in claim 1, wherein: The adsorption platform comprises a platform body having a cavity and a vacuum mechanism communicating with the cavity and providing a vacuum degree, the upper surface of the platform body being provided with a plurality of adsorption holes communicating with the cavity, and the upper surface of the platform body further being provided with a support strip for supporting the workpiece, the support strip being arranged outside the plurality of adsorption holes.

10. The femtosecond laser processing apparatus as claimed in claim 1, wherein: The moving mechanism comprises an X-axis linear module and a Y-axis linear module arranged on the X-axis linear module, and the adsorption platform is arranged on the Y-axis linear module.

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