Laser grooving device for wafer

Abstract

The utility model discloses a laser grooving device for wafers, which relates to the technical field of wafer processing and is technically characterized in that the laser grooving device comprises a workbench, a dismounting mechanism is arranged on the workbench and comprises a lifting assembly fixedly connected with the middle of the workbench, and a supporting table is fixedly arranged on a top movable part of the lifting assembly; the edge of the supporting table is provided with at least three clamping through holes facing the center of the supporting table, and the clamping through holes are uniformly distributed in an annular array; positioning and clamping mechanisms for positioning and clamping the wafer are arranged on the workbench, and the number and the position of the positioning and clamping mechanisms correspond to those of the clamping through holes; after the grooving of the wafer is completed, the positioning and clamping mechanism keeps the locking state of the wafer, and the lifting assembly retracts to drive the supporting table to move downwards; the discharging device facilitates discharging and improves the machining efficiency.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a laser grooving device for wafers. Background Technology

[0002] A wafer laser grooving device is a semiconductor manufacturing equipment that uses a high-energy-density laser beam to perform localized processing on the surface of a wafer to achieve precise grooving. This device achieves a high-precision, low-damage grooving process through the interaction between the laser beam and the wafer material, and is one of the key pieces of equipment in advanced semiconductor packaging and wafer-level processing.

[0003] A wafer laser grooving device with application number CN201921254512.5 simplifies the grooving process. However, in the prior art, after grooving the semiconductor wafer, the wafer is attached to the bottom of the operating table, making it difficult for the clamping tool to find a force point when unloading the wafer. This makes it inconvenient to remove the wafer from the operating table, affecting subsequent grooving efficiency and making it unsuitable for operators. Therefore, improvements are needed. Summary of the Invention

[0004] In order to solve the above-mentioned technical problems, the purpose of this utility model is to provide a laser grooving device for wafers, which facilitates unloading and improves processing efficiency.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A laser grooving device for wafers includes a worktable with a disassembly and assembly mechanism. The disassembly and assembly mechanism includes a lifting assembly fixedly connected to the center of the worktable. A support platform is fixedly mounted on the top movable part of the lifting assembly. The support platform has clamping through holes along its edge, facing the center of the support platform. The number of clamping through holes is at least three, and they are evenly distributed in a circular array. A positioning and clamping mechanism for positioning and clamping wafers is provided on the worktable, and the number and position of the positioning and clamping mechanism correspond to the number and position of the clamping through holes. After the wafer is grooved, the positioning and clamping mechanism maintains a locked state on the wafer, and the lifting assembly retracts to move the support platform downwards, facilitating unloading and improving processing efficiency.

[0007] Preferably, the positioning and clamping mechanism includes a clamping electric cylinder, and the movable part of the clamping electric cylinder is provided with an L-shaped clamping plate facing the center of the support platform. The vertical section of the clamping plate passes through the clamping through hole and can move along the direction of the through hole, which facilitates control and clamping.

[0008] Preferably, when slotting the wafer, the upper surface of the horizontal section of the clamping plate is coplanar with the upper surface of the support platform, forming a continuous bearing surface and improving the support stability.

[0009] Preferably, the upper surface of the horizontal section of the clamping plate is coated with an anti-slip coating, the coefficient of friction of which is higher than that of the support surface, thereby improving the anti-slip capability.

[0010] Preferably, the clamping through holes are strip-shaped through holes and are distributed in a ring at equal angles with the center of the support platform as the center. The included angle between the axes of adjacent clamping through holes is 30° to 120°, making the clamping and positioning distribution more reasonable.

[0011] This utility model has the following beneficial effects:

[0012] The detachable unloading design simplifies operation: After the wafer is slotted, the positioning and clamping mechanism keeps the wafer locked in place, while the lifting assembly retracts to lower the support platform. At this point, the wafer, fixed by the positioning and clamping mechanism, does not descend with the support platform, creating a space for easy removal. Operators can directly remove the wafer from the device without additional steps, simplifying the unloading process and significantly improving its convenience.

[0013] Optimized clamping structure for more efficient release: Clamping through-holes are located on the edge of the support platform and face the center. The clamping electric cylinder moves within the clamping through-holes via an L-shaped clamping plate to clamp and release the wafer. When unloading is required, the clamping electric cylinder can quickly control the clamping plate to release the wafer. Combined with the movement of the lifting assembly, this further reduces the difficulty of unloading and improves unloading efficiency.

[0014] Anti-slip and flush design reduces unloading risks: The clamping plate surface is coated with an anti-slip coating and is flush with the upper surface of the support platform when clamped. This design ensures the wafer remains stable during grooving, reducing unloading difficulties caused by slippage or tilting. The stable placement eliminates the need to adjust the wafer position during unloading, further simplifying the operation process.

[0015] Precise positioning and stable clamping reduce rework: The positioning and clamping mechanism corresponds one-to-one with the clamping through holes, ensuring precise positioning and stable clamping of the wafer during the grooving process. Stable clamping prevents wafer movement or wobbling, improves grooving accuracy, reduces processing failures or quality defects caused by positional deviations, thereby reducing rework and reprocessing rates and significantly improving processing efficiency.

[0016] Anti-slip and flush design accelerates the processing flow: The clamping plate and the upper surface of the support platform are flush, and with the anti-slip coating, the wafers are placed stably during slotting. This design reduces adjustment time caused by wafer slippage or tilting, allowing operators to focus on the processing without additional intervention, thereby improving overall processing speed.

[0017] The ring array layout adapts to various size requirements: the clamping channels are evenly distributed in a ring array on the support platform, ensuring uniform clamping force distribution on the wafers. This layout not only improves the device's adaptability to wafers of different sizes and shapes but also reduces the risk of wafer damage due to stress concentration. Stable clamping ensures continuous and efficient processing, further enhancing processing efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a front view of an embodiment of the present utility model.

[0020] Figure 2 This is a top view of the worktable according to an embodiment of the present utility model.

[0021] In the diagram: 1. Workbench; 201. Lifting assembly; 202. Support platform; 203. Clamping through hole; 301. Clamping electric cylinder; 302. Clamping plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figures 1 to 2 As shown, a laser grooving device for wafers includes a worktable 1. A disassembly and assembly mechanism is provided on the worktable 1. The disassembly and assembly mechanism includes a lifting assembly 201 fixedly connected to the center of the worktable 1. A support platform 202 is fixedly mounted on the top movable part of the lifting assembly 201. Clamping through holes 203 are formed on the edge of the support platform 202, facing the center of the support platform 202. The number of clamping through holes 203 is at least three, and they are evenly distributed in a circular array. A positioning and clamping mechanism for positioning and clamping wafers is provided on the worktable 1. The number and position of the positioning and clamping mechanism correspond to the number and position of the clamping through holes 203. After the wafer grooving is completed, the positioning and clamping mechanism maintains a locked state on the wafer, and the lifting assembly 201 retracts to move the support platform 202 downwards. The lifting assembly 201 is a lifting electric cylinder.

[0024] like Figure 1 As shown, the core of this device is to achieve rapid wafer replacement and stable positioning after grooving through a disassembly and assembly mechanism. The lifting assembly 201 is fixed to the center of the worktable 1, and its top movable part connects to the support platform 202. After grooving, the positioning and clamping mechanism keeps the wafer locked. When the lifting assembly 201 retracts, it drives the support platform 202 downwards, thereby reducing the wafer height and facilitating wafer handling. This design avoids the cumbersome process of manually unlocking and disassembling the wafer required by traditional devices, improving operational efficiency. The support platform 202 has at least three clamping through-holes 203 distributed in a ring around its edge, each corresponding to the positioning and clamping mechanism. The ring array layout of the clamping through-holes 203 ensures uniform force on the wafer, preventing wafer breakage due to localized stress. The positioning and clamping mechanism radially clamps the wafer through synchronous movements, ensuring the wafer's positional stability during grooving. Through the automatic lifting of the lifting assembly 201 and the coordinated control of the positioning and clamping mechanism, rapid wafer disassembly and assembly and precise positioning are achieved, reducing manual intervention and improving processing efficiency and yield.

[0025] like Figures 1 to 2 As shown, the positioning and clamping mechanism includes a clamping cylinder 301. An L-shaped clamping plate 302 is positioned on the movable part of the clamping cylinder 301 facing the center of the support platform 202. The vertical section of the clamping plate 302 passes through a clamping through-hole 203 and can move along the direction of the through-hole. The movable part of the clamping cylinder 301 moves radially (towards the center of the support platform 202), causing the vertical section of the L-shaped clamping plate 302 to pass through the clamping through-hole 203. The linear displacement of the vertical section applies a radial clamping force to the wafer edge, thus fixing the wafer. The vertical section of the L-shaped clamping plate 302 is responsible for clamping the wafer's sides, while the horizontal section, together with the surface of the support platform 202, forms a support surface. This structure provides clamping force while preventing the wafer from deforming due to suspension. The dual-function design (clamping + support) of the L-shaped clamping plate 302 simplifies the structure while ensuring uniform force on the wafer during clamping, avoiding localized damage.

[0026] like Figures 1 to 2 As shown, when grooving a wafer, the upper surface of the horizontal section of the clamping plate 302 is coplanar with the upper surface of the support stage 202, forming a continuous bearing surface. During laser grooving, the wafer must remain absolutely flat to avoid laser focusing deviation. The coplanar design of the clamping plate 302 and the support stage 202 eliminates the problem of local wafer concavity or warping caused by traditional clamping mechanisms, ensuring that the wafer is uniformly supported overall. When the clamping cylinder 301 is not clamping, the clamping plate 302 retracts into the through hole, and the support stage 202 independently supports the wafer; when clamping, the clamping plate 302 extends and supports the wafer together with the support stage 202, realizing dynamic switching. The coplanar design ensures the flatness of the wafer during laser processing, avoids processing errors caused by discontinuous support, and improves grooving accuracy.

[0027] like Figures 1 to 2As shown, the upper surface of the horizontal section of the clamping plate 302 is coated with an anti-slip coating, the coefficient of friction of which is higher than that of the support stage 202. During clamping, the anti-slip coating contacts the bottom surface of the wafer, using high friction to counteract vibrations or lateral displacement tendencies generated by laser processing, thus preventing wafer slippage. The anti-slip coating typically uses wear-resistant materials (such as ceramic particle composite coatings) to ensure friction performance while avoiding contamination of the wafer surface. Through differentiated friction coefficient design, the wafer fixation stability is significantly improved while maintaining a constant clamping force, making it particularly suitable for high-speed laser processing scenarios.

[0028] like Figures 1 to 2 As shown, the clamping through-holes 203 are strip-shaped through-holes, distributed in a ring at equal angles around the center of the support platform 202. The included angle between the axes of adjacent clamping through-holes 203 ranges from 30° to 120°. This adapts to the clamping requirements of wafers of different sizes. Smaller included angles (e.g., 30°) are suitable for small-diameter wafers, with densely distributed clamping points; larger included angles (e.g., 120°) are suitable for large-diameter wafers, reducing the number of clamping points while maintaining balance. This allows the clamping plate 302 to move radially a long distance within the through-holes, expanding the clamping range and accommodating wafers of multiple sizes. Through the combination of adjustable clamping angles and strip-shaped through-holes, the device achieves broad compatibility with wafers of different sizes, reducing equipment modification costs.

[0029] The above are merely specific embodiments of this utility model, but the technical features of this utility model are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on this utility model to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of this utility model.

Claims

1. A laser grooving device for wafers, comprising a worktable (1), characterized in that: The workbench (1) is provided with a dismounting mechanism, which comprises a lifting assembly (201) fixedly connected with the middle part of the workbench (1), and a support table (202) fixedly arranged at the top movable part of the lifting assembly (201); a clamping through hole (203) is formed in the edge of the support table (202) and faces the center of the support table (202), the number of the clamping through holes (203) is at least three, and the clamping through holes (203) are evenly distributed in an annular array; the workbench (1) is provided with a positioning and clamping mechanism for positioning and clamping a wafer, the positioning and clamping mechanism corresponds to the number and position of the clamping through holes (203); after the wafer is slotted, the positioning and clamping mechanism keeps locking the wafer, and the lifting assembly (201) is retracted to drive the support table (202) to move downward.

2. The apparatus according to claim 1, wherein: The positioning and clamping mechanism comprises a clamping electric cylinder (301), and an L-shaped clamping plate (302) is arranged at the movable part of the clamping electric cylinder (301) and faces the center of the support table (202), the vertical section of the clamping plate (302) passes through the clamping through hole (203) and can move in the direction of the through hole.

3. The apparatus according to claim 2, wherein: When the wafer is slotted, the upper surface of the horizontal section of the clamping plate (302) is coplanar with the upper surface of the support table (202), so that a continuous bearing surface is formed.

4. The apparatus according to claim 3, wherein: The upper surface of the horizontal section of the clamping plate (302) is coated with an anti-skid coating.

5. The apparatus according to claim 4, wherein: The friction coefficient of the anti-skid coating is higher than that of the surface of the support table (202).

6. The apparatus according to claim 1, wherein: The clamping through hole (203) is a strip-shaped through hole and is annularly distributed at equal angles with the center of the support table (202) as the center.

7. The laser scribing apparatus of claim 6, wherein: The included angle between the axes of adjacent clamping through holes (203) is 30° to 120°.

Images