Double-beam infrared picosecond laser non-standard micro-nano machining equipment

Abstract

The utility model discloses double-beam infrared picosecond laser non-standard micro-nano machining equipment which comprises an infrared picosecond laser micro-nano equipment body, a high-precision linear module is arranged on the top face of the infrared picosecond laser micro-nano equipment body, and operation panels are arranged on the two sides of a high-precision linear module platform respectively. The clamping assembly is arranged on the top faces of the operation plates and used for clamping a machined workpiece, the clamping assembly comprises two swing columns, and the two swing columns are arranged on the top faces of the two operation plates correspondingly; according to the infrared picosecond laser micro-nano equipment, the arranged infrared picosecond laser micro-nano equipment body, the high-precision linear module, the operation plate, the swing column, the clamping head, the clamping groove, the operation column, the supporting frame and the rotating column are used in cooperation, a trapezoidal table can abut against the lower portion of the swing column, and therefore the clamping head can press and clamp a workpiece, machining workpieces of various sizes and various shapes can be clamped, and the machining efficiency is improved. When a circular workpiece is clamped, the circular workpiece enters the clamping groove, and the circular workpiece can be clamped.

Description

Technical Field

[0001] This utility model relates to the field of infrared picosecond laser micro-nano technology, specifically to a dual-beam infrared picosecond laser non-standard micro-nano processing equipment. Background Technology

[0002] The infrared picosecond laser micro-nano device is a specialized laser processing equipment used for laser marking and material removal. The laser beam is used as a processing tool. A focusing lens focuses the laser beam onto the surface of the material, causing it to melt and vaporize. At the same time, pressurized gas blows away the melted and vaporized material. Through a motion mechanism, the laser beam and the material move relative to each other along a set trajectory, forming a certain processing trajectory to achieve the purpose of precise material removal.

[0003] In existing technologies, infrared picosecond laser micro-nano devices process workpieces by moving the workpiece using a linear module. The workpiece is placed on a processing platform. When the linear module moves rapidly, the workpiece slides on the processing platform due to inertia, causing the workpiece to shift position. In addition, for workpiece processing, one device is usually paired with one type of beam. If different beams are used, the device needs to be changed, which is quite troublesome. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a dual-beam infrared picosecond laser non-standard micro-nano processing device.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0006] A dual-beam infrared picosecond laser non-standard micro-nano processing device includes an infrared picosecond laser micro-nano device body. A high-precision linear module is mounted on the top surface of the infrared picosecond laser micro-nano device body, and operation plates are respectively mounted on both sides of the high-precision linear module platform. A clamping assembly is mounted on the top surface of the operation plates for clamping the workpiece. The clamping assembly includes two swing columns, each mounted on the top surface of one of the operation plates. A clamping head is mounted on one side of each swing column, and a clamping groove is formed on one side of each clamping head. The operation plates are further divided into two sections. The control plate is provided with a threaded hole, the inner circular wall of which is threaded, and an operating column is threaded to the inner circular wall of the threaded hole. The outer circular wall of the operating column is threaded. A trapezoidal platform is provided on the top surface of the control plate. A movable groove is provided on one side of the trapezoidal platform. A bearing is fixedly sleeved on the inner circular wall of the movable groove. The operating column is fixedly sleeved with the inner circular wall of the bearing inner ring. A support frame is fixedly installed on the top surface of the control plate. A rotating column is fixedly installed inside the support frame. A movable hole is provided on one side of the swing column. The movable hole is movably sleeved with the rotating column.

[0007] In order to clamp small workpieces, as a non-standard micro-nano processing device for dual-beam infrared picosecond lasers according to this utility model, preferably, two extension plates are fixedly installed on one side of the clamping head, and two moving slots are opened on one side of the swing column, with the extension plates movably connected to the moving slots.

[0008] To adjust the extension of the clamping head, in a preferred embodiment of this dual-beam infrared picosecond laser non-standard micro-nano processing equipment, operating holes are respectively provided on both sides of the swing column. The operating holes are connected to the moving groove. A fixed column is fixedly installed inside the operating hole. A spring plate is movably sleeved inside the operating hole. A positioning hole is provided on the top surface of the spring plate. The positioning hole is movably sleeved with the fixed column. Several snap-fit ​​grooves are provided on one side of the extension plate. The snap-fit ​​grooves are movably sleeved with the spring plate.

[0009] In order to allow the trapezoidal platform to smoothly enter under the swing column when it contacts the swing column, as a dual-beam infrared picosecond laser non-standard micro-nano processing equipment of this utility model, preferably, a movable column is fixedly installed inside the swing column, and a rotating wheel is movably sleeved on the outer circular wall of the movable column.

[0010] In order to adjust the clamping position, as a dual-beam infrared picosecond laser non-standard micro-nano processing device of this utility model, preferably, the bottom surface of the operation plate is provided with two movable frames, the inside of the movable frames is fixedly installed with guide columns, the bottom surface of the operation plate is fixedly installed with a slider, and a guide hole is opened on one side of the slider, the guide hole is movably sleeved with the guide column.

[0011] To keep the moving frame and control panel away from the processing platform of the high-precision linear module, in a preferred embodiment of this invention, a dual-beam infrared picosecond laser non-standard micro-nano processing device, two slides are fixedly installed on the top surface of the main body of the infrared picosecond laser micro-nano device. The moving frame is slidably connected to the slides. Sliding holes are respectively opened on both sides of the slides, and threaded grooves are respectively opened on both sides of the moving frame. Threaded columns are slidably connected inside the sliding holes, and the threaded columns are threadedly connected to the threaded grooves.

[0012] Meanwhile, addressing the issue of single optical path in existing laser processing equipment, a dual-optical-path design was added. During laser processing, the laser in the infrared picosecond laser micro-nano device body 1 emits a 1064nm wavelength beam. After the laser beam is emitted, it is reflected from the bottom surface to the top surface by a reflecting mirror. Then, the optical path splits into two different paths: one path passes through a galvanometer system to form a galvanometer beam, and the other path passes through a Bessel system to form a Bessel beam. The galvanometer system achieves refraction in both the x and y directions, ultimately outputting the galvanometer beam through the galvanometer laser processing head. The Bessel device converts the input beam into a Bessel beam through a conical lens. The key to the entire system design lies in using a small motor to control the switching between these two different optical paths and integrating them into a single device. Finally, the corresponding beam is output from the corresponding laser processing head.

[0013] In summary, the present invention has the following main advantages:

[0014] The infrared picosecond laser micro-nano device, consisting of a main body, a high-precision linear module, an operation panel, a swing column, a clamping head, a clamping slot, an operating column, a support frame, and a rotating column, works in concert. The swing column drives the clamping head to rotate around the rotating column, and then the other end of the swing column drives the clamping head downwards. One end of the clamping head tilts downwards and contacts the surface of the workpiece. At this point, the trapezoidal platform abuts against the bottom of the swing column, allowing the clamping head to clamp the workpiece tightly. When clamping a circular workpiece, the circular workpiece is allowed to enter the clamping slot for secure clamping. During workpiece processing, dual optical paths can be switched. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the slide structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the movable frame structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the guide column structure of this utility model;

[0019] Figure 5 This is a schematic diagram of the operation panel structure of this utility model;

[0020] Figure 6 This is a schematic diagram of the clamping head structure of this utility model;

[0021] Figure 7 This is a schematic diagram of the swing column structure of this utility model;

[0022] Figure 8 yes Figure 7 A partial structural diagram of A in the middle;

[0023] Figure 9 This is a schematic diagram of the system modules of this utility model.

[0024] Reference numerals in the attached diagram: 1. Main body of the infrared picosecond laser micro / nano device; 2. High-precision linear module; 3. Threaded column; 4. Sliding hole; 5. Operation panel; 6. Swing column; 7. Clamping head; 8. Clamping groove; 9. Threaded hole; 10. Operation column; 11. Trapezoidal platform; 12. Movable groove; 13. Support frame; 14. Rotating column; 15. Movable hole; 16. Extension plate; 17. Moving groove; 18. Operation hole; 19. Fixed column; 20. Spring plate; 21. Positioning hole; 22. Snap-fit ​​groove; 23. Movable column; 24. Rotating wheel; 25. Moving frame; 26. Guide column; 27. Slider; 28. Guide hole; 29. ​​Threaded groove; 30. Slide table. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example 1: Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6A dual-beam infrared picosecond laser non-standard micro / nano processing device includes an infrared picosecond laser micro / nano device body 1. A high-precision linear module 2 is mounted on the top surface of the infrared picosecond laser micro / nano device body 1. Operating plates 5 are respectively mounted on both sides of the platform of the high-precision linear module 2. A clamping assembly is mounted on the top surface of the operating plate 5 for clamping the workpiece. The clamping assembly includes two swing columns 6, which are respectively mounted on the top surfaces of the two operating plates 5. A clamping head 7 is mounted on one side of each swing column 6, and a clamping groove 8 is formed on one side of each clamping head 7. A threaded hole is formed on one side of each operating plate 5. 9. The inner circular wall of the threaded hole 9 is threaded, and the inner circular wall of the threaded hole 9 is threaded to the operating column 10. The outer circular wall of the operating column 10 is threaded. The top surface of the operating plate 5 is provided with a trapezoidal platform 11. A movable groove 12 is provided on one side of the trapezoidal platform 11. A bearing is fixedly sleeved on the inner circular wall of the movable groove 12. The operating column 10 is fixedly sleeved with the inner circular wall of the bearing inner ring. A support frame 13 is fixedly installed on the top surface of the operating plate 5. A rotating column 14 is fixedly installed inside the support frame 13. A movable hole 15 is provided on one side of the swing column 6. The movable hole 15 is movably sleeved with the rotating column 14.

[0027] After the worker places the workpiece on the processing platform surface of the high-precision linear module 2 using the clamping head 7, the operating column 10 is rotated. The operating column 10 rotates within the bearing and pushes the trapezoidal platform 11 forward. The trapezoidal platform 11 is then pushed below the swing column 6, and its inclined surface contacts the bottom surface of the swing column 6. Under the continuous pushing of the trapezoidal platform 11, the end of the swing column 6 in contact with the trapezoidal platform 11 is lifted. At this point, the swing column 6 drives the clamping head 7 to rotate around the rotating column 14. Then, the other end of the swing column 6 drives the clamping head 7 downward, causing one end of the clamping head 7 to tilt downward and contact the surface of the workpiece. At this point, the trapezoidal platform 11... The clamping head 7 presses against the bottom of the swing column 6, thus facilitating the clamping of the workpiece. When clamping a round workpiece, the round workpiece enters the clamping groove 8 for clamping. Two extension plates 16 are fixedly installed on one side of the clamping head 7, and two moving grooves 17 are opened on one side of the swing column 6. The extension plates 16 are movably connected to the moving grooves 17. Through the extension plates 16, the operator can move the extension plates 16 by pulling the clamping head 7, so that the clamping head 7 is away from the side of the swing column 6. Through the increased length of the swing column 6 and the clamping head 7, the clamping head 7 can be extended to the middle of the high-precision linear module 2 platform, which is convenient for clamping small-sized workpieces.

[0028] Example 2: Based on Example 1 above, refer to Figure 1 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 Operating holes 18 are provided on both sides of the swing column 6, and the operating holes 18 are connected to the moving groove 17. A fixed column 19 is fixedly installed inside the operating hole 18, and a spring plate 20 is movably sleeved inside the operating hole 18. A positioning hole 21 is provided on the top surface of the spring plate 20, and the positioning hole 21 is movably sleeved with the fixed column 19. Several snap-fit ​​grooves 22 are provided on one side of the extension plate 16, and the snap-fit ​​grooves 22 are movably sleeved with the spring plate 20. When the extension plate 16 is moved out of the moving groove 17 by the spring plate 20, the spring is pressed. One end of the spring plate 20 is rotated around the fixed post 19, thereby moving one end of the spring plate 20 out of the inside of the snap-fit ​​groove 22, thereby releasing the restriction on the extension plate 16 and moving the extension plate 16 out of the inside of the moving groove 17. Then the operator releases the spring plate 20 and allows it to spring back into the inside of the snap-fit ​​groove 22, thereby restricting the extension plate 16 and facilitating the adjustment of the extension of the clamping head 7. A movable post 23 is fixedly installed inside the swing post 6, and a rotating wheel 24 is movably sleeved on the outer circular wall of the movable post 23.

[0029] Example 3: Based on Example 1 or 2 above, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The bottom surface of the operating panel 5 is provided with two movable frames 25. Guide columns 26 are fixedly installed inside the movable frames 25. A slider 27 is fixedly installed on the bottom surface of the operating panel 5. A guide hole 28 is opened on one side of the slider 27. The guide hole 28 is movably connected to the guide column 26. Through the slider 27, the operator moves the operating panel 5 to drive the slider 27 to move, so that the slider 27 can slide inside the movable frame 25, which facilitates the adjustment of the clamping position. The top surface of the infrared picosecond laser micro-nano device body 1 is fixedly installed with two sliding tables 30. The movable frame 25 is slidably connected to the sliding table 30. Sliding holes 4 are opened on both sides of the sliding table 30. Threaded grooves 29 are opened on both sides of the movable frame 25. Threaded columns 3 are slidably connected inside the sliding holes 4. The threaded columns 3 are threadedly connected to the threaded grooves 29. Through the threaded columns 3, by loosening the threaded columns 3, the movable frame 25 is moved and the threaded columns 3 slide inside the sliding holes 4, so that the movable frame 25 and the operating panel 5 can be moved away from the processing platform of the high-precision linear module 2, so that the operator can put in large workpieces.

[0030] Working principle: Please refer to Figures 1-8As shown, after the operator places the workpiece on the processing platform surface of the high-precision linear module 2 using the clamping head 7, the operator rotates the operating column 10. The operating column 10 rotates within the bearing and pushes the trapezoidal platform 11 forward. The trapezoidal platform 11 is then pushed by the operating column 10 to the bottom of the swing column 6. The inclined surface of the trapezoidal platform 11 then contacts the bottom surface of the swing column 6. Under the continuous pushing of the trapezoidal platform 11, the end of the swing column 6 that contacts the trapezoidal platform 11 is lifted. At this time, the swing column 6 drives the clamping head 7 to rotate around the rotating column 14. Then, the other end of the swing column 6 drives the clamping head 7 to move downward. One end of the clamping head 7 tilts downward and contacts the surface of the workpiece. At this time, the trapezoidal platform 11 abuts against the bottom of the swing column 6, so that the clamping head 7 can press the workpiece, thus facilitating the clamping of the workpiece. When clamping a round workpiece, the round workpiece is allowed to enter the interior of the clamping groove 8 for clamping.

[0031] With the extension plate 16 provided, the operator can move the extension plate 16 by pulling the clamping head 7, so that the clamping head 7 is away from the side of the swing column 6. With the increased length of the swing column 6 and the clamping head 7, the clamping head 7 can be extended to the middle of the high-precision linear module 2 platform, which is convenient for clamping small workpieces.

[0032] When the extension plate 16 is moved out of the moving groove 17 by the spring plate 20, pressing one end of the spring plate 20 causes the spring plate 20 to rotate around the fixed post 19, thereby moving one end of the spring plate 20 out of the snap-fit ​​groove 22. This releases the restriction on the extension plate 16 and moves the extension plate 16 out of the moving groove 17. Then, the operator releases the spring plate 20 and allows it to spring back into the snap-fit ​​groove 22, thus restricting the extension plate 16 and facilitating the adjustment of the extension of the clamping head 7.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A dual-beam infrared picosecond laser non-marking micro-nano machining device, characterized in that, Include: The infrared picosecond laser micro-nano device body (1), the top surface of the infrared picosecond laser micro-nano device body (1) is provided with a high-precision linear module (2), and the two sides of the high-precision linear module (2) platform are respectively provided with an operation plate (5); The clamping assembly is arranged on the top surface of the operation plate (5) and is used for clamping the machining workpiece, and the clamping assembly comprises: two swing columns (6), two swing columns (6) are arranged on the top surface of two operation plates (5) respectively, one side of the swing column (6) is provided with a clamping head (7), one side of the clamping head (7) is provided with a clamping groove (8), one side of the operation plate (5) is provided with a threaded hole (9), the inner circular wall surface of the threaded hole (9) is provided with a thread, the inner circular wall surface of the threaded hole (9) is connected with the operation column (10) through the thread, the outer circular wall surface of the operation column (10) is provided with a thread, the top surface of the operation plate (5) is provided with a trapezoidal table (11), one side of the trapezoidal table (11) is provided with a movable groove (12), the inner circular wall surface of the movable groove (12) is fixedly sleeved with a bearing, the operation column (10) and the inner circular wall surface of the bearing inner ring are fixedly sleeved, the top surface of the operation plate (5) is fixedly installed with a support frame (13), the inside of the support frame (13) is fixedly installed with a rotating column (14), one side of the swing column (6) is provided with a movable hole (15), and the movable hole (15) is movably sleeved with the rotating column (14). 2.The dual-beam infrared picosecond laser non-micro-nano machining device according to claim 1, wherein: One side of the clamping head (7) is fixedly installed with two extension plates (16), one side of the swing column (6) is provided with two moving grooves (17), and the extension plates (16) are movably sleeved with the moving grooves (17).

3. The dual-beam infrared picosecond laser non-micro-nano machining device according to claim 2, characterized in that: The two sides of the swing column (6) are respectively provided with operation holes (18), the operation holes (18) are communicated with the moving grooves (17), the inside of the operation hole (18) is fixedly installed with a fixed column (19), the inside of the operation hole (18) is movably sleeved with a spring sheet (20), the top surface of the spring sheet (20) is provided with a positioning hole (21), the positioning hole (21) is movably sleeved with the fixed column (19), one side of the extension plate (16) is provided with a plurality of clamping grooves (22), and the clamping grooves (22) are movably sleeved with the spring sheet (20).

4. The dual-beam infrared picosecond laser non-micro-nano machining device according to claim 1, characterized in that: The inside of the swing column (6) is fixedly installed with a movable column (23), and the outer circular wall surface of the movable column (23) is movably sleeved with a rotating wheel (24).

5. The dual-beam infrared picosecond laser non-micro-nano machining device according to claim 1, characterized in that: The bottom surface of the operation plate (5) is provided with two moving frames (25), the inside of the moving frame (25) is fixedly installed with a guide column (26), the bottom surface of the operation plate (5) is fixedly installed with a sliding block (27), one side of the sliding block (27) is provided with a guide hole (28), and the guide hole (28) is movably sleeved with the guide column (26).

6. The dual-beam infrared picosecond laser non-micro-nano machining device according to claim 5, characterized in that: The top surface of the infrared picosecond laser micro-nano equipment body (1) is fixedly provided with two sliding tables (30), the moving frame (25) is slidably connected with the sliding tables (30), sliding holes (4) are formed in the two sides of the sliding tables (30) respectively, threaded grooves (29) are formed in the two sides of the moving frame (25) respectively, threaded columns (3) are slidably connected in the sliding holes (4), and the threaded columns (3) are threadedly connected with the threaded grooves (29).

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