Cooling structure of vacuum coating machine

Abstract

The utility model relates to the technical field of cooling structures, and discloses a cooling structure of a vacuum coating machine, which comprises an outer frame, a semiconductor chilling plate is fixedly arranged at the left end of the outer frame, and a first heat conducting plate is fixedly arranged at the refrigeration end of the semiconductor chilling plate in the outer frame; the first heat conduction fins are fixedly installed on one side of the outer portion of the first heat conduction plate at equal intervals, heat insulation plates are fixedly installed on the two sides between every two adjacent first heat conduction fins, three heat conduction pipes distributed at equal intervals are installed between every two adjacent heat insulation plates, and second heat conduction pads are fixedly installed on one sides of the outer portions of the heat conduction pipes; the water segregator is fixedly installed at the upper end of the first heat conduction fin, and the water segregator is fixedly connected with the upper end of the heat conduction pipe; the water collector is fixedly mounted at the lower end of the first heat conduction fin, and the water collector is fixedly connected with the lower end of the heat conduction pipe. According to the utility model, the cooling efficiency is improved by using a dual cooling mode of matching liquid cooling with semiconductor refrigeration.

Description

Technical Field

[0001] This utility model relates to the field of cooling structure technology, specifically a cooling structure for a vacuum coating machine. Background Technology

[0002] A vacuum coating machine is a device that deposits materials (such as metals, alloys, or compounds) onto the surface of a substrate in a vacuum environment using physical or chemical methods to form a thin film. This technology is widely used in various industries such as electronics, optics, decoration, and packaging to improve the performance, appearance, or function of materials. Vacuum coating machines generate a significant amount of heat during operation, requiring cooling devices to absorb this heat, reduce the temperature of the working environment, and ensure the machine's normal operation.

[0003] In existing cooling structures, semiconductor cooling chips are used in conjunction with heat dissipation fins. By extending the heat dissipation fins into the vacuum coating machine, the semiconductor cooling chip is activated to cool the interior of the vacuum coating machine. However, since the heat dissipation fins cool the interior of the vacuum coating machine through air, as the heat of the vacuum coating machine increases, this cooling structure alone is insufficient to meet the cooling requirements. Therefore, a new cooling structure for vacuum coating machines is proposed. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] In view of the shortcomings of the prior art, this utility model provides a cooling structure for a vacuum coating machine to solve the problems mentioned in the background art.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution: a cooling structure for a vacuum coating machine, comprising:

[0008] An outer frame, wherein a semiconductor refrigeration chip is fixedly disposed on the left end of the outer frame, and a first heat-conducting plate is fixedly installed inside the outer frame at the cooling end of the semiconductor refrigeration chip;

[0009] The first heat-conducting fins are fixedly installed at equal intervals on one side of the outer side of the first heat-conducting plate. Heat insulation plates are fixedly installed on both sides between adjacent first heat-conducting fins. Three heat-conducting pipes are installed between adjacent heat insulation plates. A second heat-conducting pad is fixedly installed on one side of the outer side of the heat-conducting pipes.

[0010] A water distributor is fixedly installed on the upper end of the first heat-conducting fin, and the water distributor is fixedly connected to the upper end of the heat-conducting pipe.

[0011] A water collector is fixedly installed at the lower end of the first heat-conducting fin, and the water collector is fixedly connected to the lower end of the heat-conducting pipe.

[0012] Water guide pipes are fixedly installed on the left ends of the water distributor and the water collector, respectively. A second return spring is fixedly installed on the outer end of the water distributor and the water collector near the semiconductor cooling chip. The second return spring is located outside the water guide pipe.

[0013] Preferably, a first reset spring is fixedly installed at the center of the right end of the first heat-conducting plate, and a temperature sensor probe is fixedly installed on the outside of the first reset spring. The temperature sensor probe is used to detect the temperature of the inner wall of the vacuum coating machine.

[0014] Preferably, a first thermal pad is installed on one external end of the temperature sensor probe, and the first thermal pad is fixedly connected to the temperature sensor probe. The first thermal pad improves the thermal conductivity between the temperature sensor probe and the vacuum coating machine.

[0015] Preferably, a second heat-conducting plate is fixedly installed on the heating end of the semiconductor cooling chip, and second heat-conducting fins are fixedly installed at equal intervals on the outside of the second heat-conducting plate.

[0016] Preferably, a fan is fixedly installed on the left end of the second heat-conducting plate via a side bracket, and the fan is used to dissipate heat from the second heat-conducting plate.

[0017] Preferably, a sealing gasket is installed on the outer edge of the right end of the outer frame, and the sealing gasket is fixedly connected to the outer frame. The sealing gasket is used to improve the sealing performance between the outer frame and the vacuum coating machine and prevent cold air from leaking out.

[0018] (III) Beneficial Effects

[0019] Compared with the prior art, this utility model provides a cooling structure for a vacuum coating machine, which has the following beneficial effects:

[0020] This invention introduces water into a heat-conducting pipe, which, in conjunction with a second heat-conducting pad, allows the heat-conducting pipe to exchange heat with the inner wall of the vacuum coating machine for cooling. Combined with the cold air generated by the semiconductor cooling chip, it achieves a dual cooling method of liquid cooling and semiconductor cooling, thereby improving cooling efficiency and solving the problems mentioned in the background art. Attached Figure Description

[0021] Figure 1 This is a three-dimensional view of the overall structure of this utility model;

[0022] Figure 2 This is a cross-sectional view of the overall structure of this utility model;

[0023] Figure 3 This is a three-dimensional view of the heat insulation plate and heat conduction pipe structure of this utility model.

[0024] In the diagram: 1. Outer frame; 2. Semiconductor cooling chip; 3. First heat-conducting plate; 4. First heat-conducting fin; 5. First return spring; 6. Temperature sensor probe; 7. First heat-conducting pad; 8. Insulation plate; 9. Water distributor; 10. Water collector; 11. Heat-conducting pipe; 12. Second heat-conducting pad; 13. Water pipe; 14. Second return spring; 15. Sealing gasket; 16. Second heat-conducting plate; 17. Second heat-conducting fin; 18. Fan. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] This utility model provides a technical solution: a cooling structure for a vacuum coating machine. Please refer to [link / reference]. Figure 1 , Figure 2 and Figure 3 ,include:

[0027] The outer frame 1 has a semiconductor cooling chip 2 fixedly installed on its left end. The cooling end of the semiconductor cooling chip 2 is located inside the outer frame 1 and a first heat-conducting plate 3 is fixedly installed thereon.

[0028] The first heat-conducting fin 4 is fixedly installed at equal intervals on one side of the outer side of the first heat-conducting plate 3. Heat insulation plates 8 are fixedly installed on both sides between adjacent first heat-conducting fins 4. Three heat-conducting pipes 11 are installed between adjacent heat insulation plates 8. A second heat-conducting pad 12 is fixedly installed on one side of the outer side of the heat-conducting pipe 11.

[0029] Water distributor 9 is fixedly installed on the upper end of the first heat-conducting fin 4, and the water distributor 9 is fixedly connected to the upper end of the heat-conducting pipe 11.

[0030] The water collector 10 is fixedly installed at the lower end of the first heat-conducting fin 4, and the water collector 10 is fixedly connected to the lower end of the heat-conducting pipe 11.

[0031] Water pipe 13 is fixedly installed on the left end of water distributor 9 and water collector 10 respectively. A second return spring 14 is fixedly installed on the outside of water distributor 9 and water collector 10 near the semiconductor cooling chip 2. The second return spring 14 is located outside of water pipe 13.

[0032] Please see Figure 2 A first return spring 5 is fixedly installed at the center of the right end of the first heat-conducting plate 3. A temperature sensor probe 6 is fixedly installed on the outside of the first return spring 5. The temperature sensor probe 6 is used to detect the temperature of the inner wall of the vacuum coating machine.

[0033] Please see Figure 2 A first thermal pad 7 is installed on one end of the temperature sensor probe 6, and the first thermal pad 7 is fixedly connected to the temperature sensor probe 6. The first thermal pad 7 improves the thermal conductivity between the temperature sensor probe 6 and the vacuum coating machine.

[0034] Please see Figure 1 and Figure 2 The heating end of the semiconductor cooling chip 2 is fixedly mounted with a second heat-conducting plate 16, and the outer side of the second heat-conducting plate 16 is fixedly mounted with second heat-conducting fins 17 at equal intervals.

[0035] Please see Figure 1 and Figure 2 A fan 18 is fixedly installed on the left end of the second heat-conducting plate 16 via a side bracket. The fan 18 is used to dissipate heat from the second heat-conducting plate 16.

[0036] Please see Figure 1 and Figure 2 A sealing gasket 15 is installed on the outer edge of the right end of the outer frame 1, and the sealing gasket 15 is fixedly connected to the outer frame 1. The sealing gasket 15 is used to improve the sealing performance between the outer frame 1 and the vacuum coating machine and prevent cold air from leaking out.

[0037] This solution involves installing the outer frame 1 on one side of the vacuum coating machine. Under the push of the second return spring 14, the second heat-conducting pad 12 on one side of the heat-conducting pipe 11 adheres to the inner wall of the vacuum coating machine. The water pipe 13 at the water distributor 9 is connected to the water source, and the water pipe 13 at the water collector 10 is used for drainage. The first return spring 5 pushes the temperature sensor probe 6 so that it adheres to the inner wall of the vacuum coating machine through the first heat-conducting pad 7. When the vacuum coating machine needs cooling, the semiconductor cooling chip 2 is activated. The cooling end of the semiconductor cooling chip 2 cools the air through the first heat-conducting plate 3 and the first heat-conducting fins 4 to the inside of the vacuum coating machine for cooling. When the temperature sensor probe 6 detects that the temperature drop is slow, the water source is activated to flow water through the heat-conducting pipe 11, which works in conjunction with the second heat-conducting pad 12 for heat exchange. The combination of liquid cooling and semiconductor cooling provides dual cooling, improving cooling efficiency.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cooling structure of a vacuum coating machine, characterized by comprising: The utility model relates to a semiconductor refrigeration device, including: The left end of the outer frame (1) is fixedly provided with a semiconductor refrigeration piece (2), and the refrigeration end of the semiconductor refrigeration piece (2) is fixedly installed with a first heat conduction plate (3) in the inside of the outer frame (1); First heat conduction fins (4) are fixedly installed on the outside of the first heat conduction plate (3) at equal intervals, heat insulation plates (8) are fixedly installed on both sides between adjacent first heat conduction fins (4), three heat conduction pipes (11) are installed between adjacent heat insulation plates (8) at equal intervals, and second heat conduction pads (12) are fixedly installed on the outside of the heat conduction pipes (11); A water distributor (9) is fixedly installed on the upper end of the first heat conduction fin (4), and the water distributor (9) is fixedly connected with the upper end of the heat conduction pipe (11); A water collector (10) is fixedly installed on the lower end of the first heat conduction fin (4), and the water collector (10) is fixedly connected with the lower end of the heat conduction pipe (11); Water pipes (13) are fixedly installed on the left end of the water distributor (9) and the water collector (10) respectively, second return springs (14) are fixedly installed on the end of the water distributor (9) and the water collector (10) outside the semiconductor refrigeration piece (2), and the second return springs (14) are located outside the water pipes (13).

2. The cooling structure of a vacuum coating machine according to claim 1, wherein: A first return spring (5) is fixedly installed at the center of the right end of the first heat conduction plate (3), and a temperature sensor probe (6) is fixedly installed on the outside of the first return spring (5).

3. The cooling structure of a vacuum coating machine according to claim 2, wherein: A first heat conduction pad (7) is installed on the outside of the temperature sensor probe (6), and the first heat conduction pad (7) is fixedly connected with the temperature sensor probe (6).

4. The cooling structure of a vacuum coating machine according to claim 1, wherein: A second heat conduction plate (16) is fixedly installed on the heating end of the semiconductor refrigeration piece (2), and second heat conduction fins (17) are fixedly installed on the outside of the second heat conduction plate (16) at equal intervals.

5. The cooling structure of a vacuum coating machine according to claim 4, wherein: A fan (18) is fixedly installed on the left end of the second heat conduction plate (16) through a side frame.

6. The cooling structure of a vacuum coating machine according to claim 1, wherein: A sealing washer (15) is installed on the right end of the outer frame (1), and the sealing washer (15) is fixedly connected with the outer frame (1).

Images