Novel tungsten filament surface copper and tungsten sulfide particle composite plating device

Abstract

The utility model provides a novel tungsten filament surface copper and tungsten sulfide particle composite plating device which comprises a plating bath, an anode plate is arranged at the inner bottom of the plating bath, a cathode rod is arranged in the middle of the inner wall of the plating bath, and the anode plate and the cathode rod can be respectively connected with an anode and a cathode of an external power supply; the two sides of the inner wall of the electroplating bath are each provided with a low-frequency sound generator, the low-frequency sound generators are connected with an external power source, and the low-frequency sound generators can emit vibration sound waves to vibrate the electroplating liquid. During use, the low-frequency sound generator is arranged on the inner wall of the electroplating bath, the low-frequency sound waves emitted by the low-frequency sound generator are used for vibrating the electroplating liquid, tungsten sulfide particles in the electroplating liquid are prevented from being gathered, the vibration frequency of the low-frequency sound waves is high, the amplitude of the low-frequency sound waves is small, and when the electroplating liquid is vibrated at a high speed, the electroplating liquid can be prevented from generating excessive oscillation; the effect of improving the electroplating uniformity of the tungsten sulfide particles is achieved, and the problem that the electroplating liquid shakes greatly is avoided.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to a novel composite plating device for copper and tungsten sulfide particles on the surface of tungsten wire. Background Technology

[0002] In the composite plating technology of copper and tungsten sulfide particles on the surface of tungsten wire, the copper plating solution is mainly based on the sulfate system, and a composite coating with a dispersed particle structure is formed. This involves uniformly dispersing insoluble solid particles in the electroplating solution to create a suspension for electroplating, allowing it to co-deposit with the base metal, thereby obtaining a coating with functions such as wear resistance, self-lubrication, corrosion resistance, decoration, and electrical contact.

[0003] When copper and tungsten sulfide particles are plated together, the particle structure is prone to precipitation, which leads to uneven distribution of tungsten sulfide particles, resulting in increased local porosity and reduced corrosion resistance of the coating.

[0004] To address these issues, existing composite plating equipment often uses a stirring device to agitate the electroplating solution, aiming to distribute tungsten sulfide particles as evenly as possible. However, agitation to evenly distribute tungsten sulfide particles can cause significant agitation in the electroplating solution, leading to instability at the contact surface between the ions and the tungsten wire, resulting in an uneven electroplating layer on the tungsten wire surface.

[0005] Therefore, this application proposes a novel composite plating device for copper and tungsten sulfide particles on the surface of tungsten wire, which avoids the precipitation of tungsten sulfide particles while preventing large-scale shaking of the electroplating solution. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a novel composite plating device for copper and tungsten sulfide particles on the surface of tungsten wire, which solves the problem of uneven electroplating of tungsten sulfide particles in the prior art.

[0007] To achieve the above and other related objectives, this utility model provides a novel composite plating device for copper and tungsten sulfide particles on the surface of tungsten wire, including an electroplating tank, an anode plate provided at the bottom of the electroplating tank, and a cathode rod provided in the middle of the inner wall of the electroplating tank. The anode plate and the cathode rod can be connected to the anode and cathode of an external power source, respectively.

[0008] Low-frequency sounders are respectively installed on both sides of the inner wall of the electroplating tank, and the low-frequency sounders can emit vibration sound waves to vibrate the electroplating solution.

[0009] Preferably, the number of low-frequency sounders on one side is multiple, and the multiple low-frequency sounders are linearly and horizontally distributed;

[0010] The low-frequency sounders on both sides are symmetrically distributed along the center line of the electroplating tank.

[0011] Preferably, both sides of the low-frequency sounder are provided with a water-proof protective part to completely cover the low-frequency sounder, and the water-proof protective part can vibrate with the sound wave.

[0012] Preferably, the water-proof protective part includes a loudspeaker cover, and a water-proof membrane is provided in the middle section inside the loudspeaker cover, the water-proof membrane completely separating the two ends of the loudspeaker cover;

[0013] A gap is left between the waterproof membrane and the low-frequency speaker.

[0014] Preferably, the inner diameter of the speaker cover at one end near the inner wall of the electroplating tank is smaller than the inner diameter at the other end.

[0015] The waterproof membrane is elastic.

[0016] Preferably, a tungsten wire guide support plate is provided at the end of the electroplating tank away from the low-frequency speaker. The top of the tungsten wire guide support plate is an inclined surface that slopes inward toward the inside of the electroplating tank. Lower guide partition grooves are provided at equal intervals on the top of the tungsten wire guide support plate.

[0017] The electroplating tank is provided with a tungsten wire lead-out groove at one end away from the tungsten wire guide support plate, and a rotatable protective roller is provided on the side of the tungsten wire lead-out groove.

[0018] Preferably, a tungsten wire drawing section is provided above the tungsten wire guide support plate, and the tungsten wire drawing section cooperates with the lower guide partition groove to guide the tungsten wire.

[0019] Preferably, the tungsten wire drawing section includes a limiting clamping block. The bottom of the limiting clamping block is provided with an inclined surface that matches the top of the tungsten wire guide support plate. The bottom of the limiting clamping block is provided with an upper guide dividing groove that matches the position and diameter of the lower guide dividing groove. The tungsten wire passes through the lower guide dividing groove and the upper guide dividing groove and is led out into the electroplating tank between the cathode rod and the protective roller.

[0020] Preferably, after the bottom of the limiting clamping block abuts against the top of the tungsten wire guide support plate, the lower guide partition groove and the upper guide partition groove are perfectly circular, and the inner walls of the lower guide partition groove and the upper guide partition groove are completely in contact with the outer surface of the tungsten wire.

[0021] Preferably, the top of the limiting clamp is provided with a support wing, the bottom of the support wing is in contact with the top of the electroplating tank, and the support wing is fixed to the top of the electroplating tank by a locking device.

[0022] As described above, the novel composite plating device for copper and tungsten sulfide particles on the surface of tungsten wire of this utility model has the following beneficial effects:

[0023] 1. This utility model provides a low-frequency sounder installed on the inner wall of the electroplating tank. The low-frequency sounder emits low-frequency sound waves to vibrate the electroplating solution, preventing the tungsten sulfide particles in the electroplating solution from agglomerating. The low-frequency sound waves have a high vibration frequency and small amplitude, which can prevent the electroplating solution from shaking excessively while vibrating it at high speed. This achieves the effect of improving the uniformity of tungsten sulfide particle electroplating and avoids the problem of large-scale shaking of the electroplating solution.

[0024] 2. This utility model guides the tungsten wires into the electroplating tank by setting a tungsten wire guide support plate on one side of the electroplating tank, and sets a lower guide partition groove on the top of the tungsten wire guide support plate to isolate multiple tungsten wires at equal intervals, so as to avoid the tungsten wires sticking together and causing uneven electroplating.

[0025] Meanwhile, the movement path of all tungsten wires is restricted by the cathode rod, which makes the spacing between the tungsten wires and the anode plate equal, making the current distribution of all tungsten wires more uniform and improving the uniformity of the tungsten wire electroplating layer.

[0026] 3. This utility model sets a limiting block above the tungsten wire guide support plate, and sets an upper guide partition groove and a lower guide partition groove at the bottom of the limiting block to limit the tungsten wire, which can prevent the tungsten wire from deviating and falling out of the lower guide partition groove during the movement.

[0027] Meanwhile, the lower guide partition groove and the upper guide partition groove work together to form a complete circle that fits tightly against the outer surface of the tungsten wire. When the tungsten wire passes through, it can be drawn, making the larger diameter part of the tungsten wire thinner, improving the uniformity of the tungsten wire, and thus improving the uniformity of electroplating.

[0028] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value. Attached Figure Description

[0029] Figure 1 The diagram shown is a structural schematic of this utility model.

[0030] Figure 2 The image shown is an exploded view of the tungsten wire drawing section of this utility model.

[0031] Figure 3 The diagram shown is a structural schematic of the low-frequency sounder of this utility model.

[0032] Figure 4 This utility model is shown. Figure 3 A magnified schematic diagram of the structure at point A in the middle.

[0033] Figure 5 The image shown is a front view of the structure of the waterproof protective part of this utility model.

[0034] Figure 6The image shown is a rear view of the structure of the waterproof protective part of this utility model.

[0035] Figure 7 The image shown is a bottom view of the tungsten wire drawing section of this utility model.

[0036] Component designation explanation:

[0037] 1. Electroplating tank; 101. Tungsten wire guide support plate; 102. Lower guide partition groove; 103. Tungsten wire lead-out groove; 104. Low-frequency sounder; 2. Anode plate; 3. Cathode rod; 4. Protective roller; 5. Tungsten wire drawing section; 501. Restriction clamp; 502. Upper guide partition groove; 503. Support wing; 6. Waterproof protection section; 601. Sound amplification cover; 602. Waterproof membrane. Detailed Implementation

[0038] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0039] Please see Figures 1 to 7 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the technical content disclosed in this invention. Furthermore, the terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and are not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0040] like Figures 1-3 As shown, this utility model provides a novel composite plating device for copper and tungsten sulfide particles on the surface of a tungsten wire, including an electroplating tank 1. The interior of the electroplating tank 1 is used to store a copper plating solution and tungsten sulfide particles for electroplating the tungsten wire. The copper plating solution is mainly a sulfate system (containing 180-220 g / L copper sulfate and 50-80 g / L sulfuric acid). An anode plate 2 is provided at the bottom of the electroplating tank 1, and a cathode rod 3 is provided in the middle of the inner wall of the electroplating tank 1. The anode plate 2 and the cathode rod 3 are respectively connected to the anode and cathode of an external power supply. When the tungsten wire comes into contact with the cathode rod 3, the tungsten wire forms a cathode and reacts with the cations in the electroplating solution to form an electroplating layer, realizing the composite plating of copper and tungsten sulfide particles on the surface of the tungsten wire.

[0041] To prevent tungsten sulfide particles from accumulating and settling in the electroplating solution, low-frequency sounders 104 are installed on both sides of the inner wall of the electroplating tank 1. These sounders 104 are connected to an external power source. When the low-frequency sounders 104 are powered on and emit sound waves, these waves propagate through the electroplating solution. The peaks and troughs generated during sound wave propagation cause the electroplating solution to vibrate. This vibration suspends the tungsten sulfide particles settled in the solution and disperses any clumps of tungsten sulfide particles.

[0042] like Figure 3 and Figure 4 In some embodiments shown, the present invention employs multiple single-sided low-frequency sounders 104, which are arranged linearly and horizontally. When powered on, each low-frequency sounder 104 emits sound simultaneously, and sounds of the same frequency resonate, thereby enhancing the vibration effect of the electroplating solution. Furthermore, multiple sound waves collide at their intersection, changing their propagation direction and achieving complete vibration of the electroplating solution. The low-frequency sounders 104 on both sides are symmetrically distributed along the centerline of the electroplating tank 1 to further increase the propagation area of ​​the sound waves and to allow the sound waves emitted by the two sides to form more complex sound waves that cancel each other out, preventing large-amplitude vibration of the electroplating solution.

[0043] like Figure 2 As shown, in some embodiments, the exterior of both low-frequency sounders 104 of this invention is provided with a water-proof protective part 6 to completely cover the low-frequency sounders 104, for the purpose of protecting the low-frequency sounders 104. The water-proof protective part 6 can vibrate with the sound waves, thereby propagating the sound waves generated by the low-frequency sounders 104 through the water-proof protective part 6. Furthermore, the vibration of the water-proof protective part 6 can cause the electroplating solution to slosh.

[0044] like Figure 5 and Figure 6 As shown, in some embodiments, the water-proof protective part 6 of this utility model includes a soundproof cover 601, which is made of rigid insulating material to prevent wire phenomena from occurring during electroplating. A water-proof membrane 602 is disposed in the middle section inside the soundproof cover 601, completely separating the two ends of the soundproof cover 601, thereby protecting the low-frequency speaker 104 through the cooperation of the soundproof cover 601 and the water-proof membrane 602. The water-proof membrane 602 is also a membrane made of insulating material. When sound waves act on the water-proof membrane 602, the water-proof membrane 602 is driven by the sound waves to vibrate. This rapid low-frequency vibration is directly transmitted to the electroplating solution, causing the electroplating solution to also vibrate at high speed and low frequency. A gap is left between the water-proof membrane 602 and the low-frequency speaker 104, which is beneficial for the transmission of sound waves and the vibration of the water-proof membrane 602. When the water-proof membrane 602 is attached to the surface of the low-frequency speaker 104, the vibration of the water-proof membrane 602 is hindered.

[0045] like Figure 5 and Figure 6 As shown, in some embodiments, the inner diameter of the sound amplification cover 601 near the inner wall of the electroplating tank 1 is smaller than that of the other end, thereby allowing sound to diffuse outward and increasing the effective area and range of the sound waves. The water-resistant membrane 602 is elastic. When sound waves propagate through the water-resistant membrane 602 into the electroplating solution, the water-resistant membrane 602 is driven by the sound waves and vibrates at high speed and low frequency under its own elasticity to drive the electroplating solution to vibrate, thereby improving the stirring and mixing effect.

[0046] like Figure 2 As shown, in some embodiments, a tungsten wire guide support plate 101 is provided at the end of the electroplating tank 1 away from the low-frequency speaker 104. The top of the tungsten wire guide support plate 101 is an inclined surface that slopes inward toward the inside of the electroplating tank 1 to guide the externally introduced tungsten wire into the interior of the electroplating tank 1 to be immersed in the electroplating solution for electroplating reaction. Lower guide partition grooves 102 are equidistantly provided on the top of the tungsten wire guide support plate 101. When the tungsten wire enters the interior of the electroplating tank 1, it is separated by the lower guide partition grooves 102, thereby maintaining an equal spacing between multiple tungsten wires and improving the current uniformity during tungsten wire electroplating.

[0047] A tungsten wire lead-out groove 103 is provided at one end of the electroplating tank 1 away from the tungsten wire guide support plate 101. A rotatable protective roller 4 is provided on the side of the tungsten wire lead-out groove 103 to support the tungsten wire after electroplating and prevent the tungsten wire from being damaged by hard friction with the edge of the electroplating tank 1.

[0048] like Figure 1 and Figure 2 As shown, in some embodiments, a tungsten wire drawing part 5 is provided above the tungsten wire guide support plate 101 of this utility model. The tungsten wire drawing part 5 applies downward pressure to the tungsten wire, thereby preventing the tungsten wire from detaching from the lower guide partition groove 102 during movement and ensuring the stability of the distance between the tungsten wires.

[0049] like Figure 7As shown, in some embodiments, the tungsten wire drawing part 5 of this utility model includes a limiting clamp 501. The bottom of the limiting clamp 501 is provided with an inclined surface adapted to the top of the tungsten wire guide support plate 101. When the limiting clamp 501 is placed on the top of the tungsten wire guide support plate 101, the bottom of the limiting clamp 501 can be completely fitted with the top of the tungsten wire guide support plate 101. The bottom of the limiting clamp 501 is provided with an upper guide partition groove 502 adapted to the position and diameter of the lower guide partition groove 102. After the bottom of the limiting clamp 501 is completely fitted with the top of the tungsten wire guide support plate 101, the lower guide partition groove 102 and the upper guide partition groove 502 can form a complete circular hole for the tungsten wire to pass through. The tungsten wire passes through the lower guide partition groove 102 and the upper guide partition groove 502, and after electroplating, it is led out from between the cathode rod 3 and the protective roller 4 and wound up inside the electroplating tank 1.

[0050] After the bottom of the limiting clamp 501 abuts against the top of the tungsten wire guide support plate 101, when the tungsten wire passes between the lower guide partition groove 102 and the upper guide partition groove 502, the inner walls of the lower guide partition groove 102 and the upper guide partition groove 502 are completely in contact with the outer surface of the tungsten wire. When the diameter of the tungsten wire is uneven, the circular hole formed by the lower guide partition groove 102 and the upper guide partition groove 502 will create a wire-drawing effect on the tungsten wire, keeping the diameter of the tungsten wire relatively uniform, thereby improving the uniformity of the electroplating layer.

[0051] like Figure 1 and Figure 7 As shown, in some embodiments, the top of the limiting clamp 501 of this invention is provided with a support wing 503. The bottom of the support wing 503 is attached to the top of the electroplating tank 1 to support the limiting clamp 501. This prevents the limiting clamp 501 from sliding down the inclined surface of the top of the tungsten wire guide support plate 101. The support wing 503 is fixed to the top of the electroplating tank 1 by a locking device, positioning the limiting clamp 501 and preventing displacement of the limiting clamp 501 when the tungsten wire moves. At the same time, when the limiting clamp 501 is released, the tungsten wires can be easily placed into the lower guide partition groove 102 in batches.

[0052] The specific usage process of this utility model is as follows:

[0053] One end of the tungsten wire is passed through the lower guide partition groove 102, and then through the bottom of the cathode rod 3 to the top of the protective roller 4 before exiting the device. Electroplating solution is then injected into the electroplating tank 1 to immerse the main body of the tungsten wire. The anode plate 2 and the protective roller 4 are connected to the anode and cathode of the power supply to form a current path. Simultaneously, the low-frequency sounder 104 is energized, generating sound waves. These sound waves are transmitted through the water-resistant membrane 602 to the electroplating solution, causing the solution to vibrate and suspending and diffusing the tungsten sulfide particles.

[0054] In summary, the novel copper and tungsten sulfide particle composite plating device for tungsten wire surface of this utility model, by setting a low-frequency sounder 104 on the inner wall of the electroplating tank 1, and by emitting low-frequency sound waves to vibrate the electroplating solution, avoids the aggregation of tungsten sulfide particles in the electroplating solution. Moreover, the low-frequency sound waves have a high vibration frequency and small amplitude, which can avoid excessive shaking of the electroplating solution while vibrating it at high speed, thereby improving the uniformity of tungsten sulfide particle electroplating and avoiding the problem of large-scale shaking of the electroplating solution.

[0055] This invention guides tungsten wires into the electroplating tank 1 by setting a tungsten wire guide support plate 101 on one side of the electroplating tank 1, and sets a lower guide partition groove 102 on the top of the tungsten wire guide support plate 101 to isolate multiple tungsten wires at equal intervals, so as to avoid the tungsten wires from sticking together and causing uneven electroplating.

[0056] Meanwhile, the movement paths of all tungsten wires are restricted by the cathode rod 3, thereby making the spacing between the tungsten wires and the anode plate 2 equal, making the current distribution of all tungsten wires more uniform, and improving the uniformity of the tungsten wire electroplating layer.

[0057] This utility model provides a limiting clamp 501 above the tungsten wire guide support plate 101, and provides an upper guide partition groove 502 at the bottom of the limiting clamp 501 to cooperate with the lower guide partition groove 102 to limit the tungsten wire, which can prevent the tungsten wire from deviating and falling out of the limit of the lower guide partition groove 102 during the movement.

[0058] Meanwhile, the lower guide partition groove 102 and the upper guide partition groove 502 work together to form a complete circle that fits tightly against the outer surface of the tungsten wire. When the tungsten wire passes through, it can be drawn, so that the part with a larger diameter of the tungsten wire is drawn thinner, thereby improving the uniformity of the tungsten wire and thus improving the uniformity of electroplating.

[0059] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0060] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A novel tungsten wire surface copper and tungsten sulfide particle composite plating device, characterized in that, The electroplating tank (1) is provided with an anode plate (2) at the inner bottom, and a cathode rod (3) is arranged at the middle of the inner wall of the electroplating tank (1), which can be connected with the anode and cathode of the external power supply, respectively. Low-frequency sounders (104) are arranged on both sides of the inner wall of the electroplating tank (1), which can emit vibration sound wave to oscillate the electroplating solution.

2. The novel tungsten wire surface copper and tungsten sulfide particle composite plating device according to claim 1, characterized in that: The number of low-frequency sounders (104) on one side is multiple, and the multiple low-frequency sounders (104) are linearly and horizontally distributed. The low-frequency sounders (104) on both sides are symmetrically distributed along the center line of the electroplating tank (1).

3. The novel tungsten wire surface copper and tungsten sulfide particle composite plating device according to claim 2, characterized in that: The low-frequency sounders (104) on both sides are completely covered by waterproof protection parts (6), which can vibrate with sound waves.

4. The novel tungsten wire surface copper and tungsten sulfide particle composite plating device according to claim 3, characterized in that: The waterproof protection part (6) comprises a sound amplifier cover (601), and a waterproof film (602) is arranged at the middle of the sound amplifier cover (601). A gap is left between the waterproof film (602) and the low-frequency sounder (104).

5. The novel tungsten wire surface copper and tungsten sulfide particle composite plating device according to claim 4, characterized in that: The inner diameter of the sound amplifier cover (601) near one end of the inner wall of the electroplating tank (1) is smaller than that of the other end. The waterproof film (602) has elasticity.

6. The novel tungsten wire surface copper and tungsten sulfide particle composite plating device according to any one of claims 1-5, characterized in that: A tungsten wire guide support plate (101) is arranged at one end of the electroplating tank (1) away from the low-frequency sounder (104), the top of the tungsten wire guide support plate (101) is an inclined surface inclined towards the inside of the electroplating tank (1), and equidistantly arranged on the top of the tungsten wire guide support plate (101) are lower guide separation grooves (102). A tungsten wire leading groove (103) is arranged at one end of the electroplating tank (1) away from the tungsten wire guide support plate (101), and a rotatable protection roller (4) is arranged on the side of the tungsten wire leading groove (103).

7. The novel tungsten wire surface copper and tungsten sulfide particle composite plating device according to claim 6, characterized in that: A tungsten wire drawing part (5) is arranged above the tungsten wire guide support plate (101), which cooperates with the lower guide separation groove (102) to guide the tungsten wire.

8. The novel tungsten wire surface copper and tungsten sulfide particle composite plating device according to claim 7, characterized in that: The tungsten wire drawing part (5) comprises a limiting clamp block (501), the bottom of the limiting clamp block (501) is provided with an inclined surface matched with the top of the tungsten wire guide support plate (101), and the bottom of the limiting clamp block (501) is provided with an upper guide separation groove (502) matched with the position and diameter of the lower guide separation groove (102), and the tungsten wire passes through the lower guide separation groove (102) and the upper guide separation groove (502) to be led out of the inside of the electroplating tank (1) between the cathode rod (3) and the protection roller (4).

9. The novel tungsten wire surface copper and tungsten sulfide particle composite plating device according to claim 8, characterized in that: After the bottom of the limiting clamp block (501) abuts against the top of the tungsten wire guide support plate (101), the lower guide separation groove (102) and the upper guide separation groove (502) are in a whole circle, and the inner walls of the lower guide separation groove (102) and the upper guide separation groove (502) are completely matched with the outer surface of the tungsten wire.

10. The novel tungsten wire surface copper and tungsten sulfide particle composite plating device according to claim 9, characterized in that: The top of the limiting clip block (501) is provided with a supporting wing (503), the bottom of the supporting wing (503) is attached to the top of the electroplating tank (1), and the supporting wing (503) is fixed on the top of the electroplating tank (1) through a locking device.

Images