Heat dissipation structure of optical module

Abstract

The utility model relates to a heat dissipation structure of an optical module, which comprises a shell base, a shell bottom cover, a heat dissipation piece and a vapor chamber, the shell bottom cover is connected to the bottom of the shell base, the heat dissipation piece is connected to the top of the shell base, a PCB (printed circuit board) is arranged in the shell base, a functional chip is arranged on the PCB, one side of the vapor chamber is connected to the bottom of the heat dissipation piece, and the other side of the vapor chamber is connected to the bottom of the heat dissipation piece. The temperature-uniforming plate extends into the shell base, the temperature-uniforming plate and the heat dissipation piece are arranged in the length direction of the shell base, and the temperature-uniforming plate and the heat dissipation piece are of an integrated packaging forming structure. Heat dissipation of the high-heat-density component of the transmitting-receiving integrated optical module is accelerated, heat is prevented from being gathered around the high-heat-density component, internal temperature uniformization of the transmitting-receiving integrated optical module is facilitated, power consumption of the transmitting-receiving integrated optical module can be effectively reduced, and the service life of the transmitting-receiving integrated optical module is prolonged. The performance and the service life of the transmitting-receiving integrated optical module as a core component of an optical fiber communication system are effectively improved, and the stability and the efficiency of the whole communication system are further effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to a heat dissipation structure for an optical module. Background Technology

[0002] With the rapid iteration of AI and the surge in demand for 800G / 1.6T high-speed transceiver optical modules driven by cloud computing power, the power consumption and heat generation of these modules have doubled, making heat dissipation a major challenge for the industry. Existing technologies utilize vapor chambers for heat dissipation, but these are mostly placed inside the housing and connected via soldering or adhesive bonding. Soldering or adhesive bonding results in a relatively high void ratio (approximately 20%), leading to significant interfacial thermal resistance. After absorbing heat, the vapor chamber must transfer it to the housing for final heat dissipation. This process is inefficient, as the vapor chamber must first conduct heat to the housing before the housing can dissipate it. As the transceiver optical module speed increases, chip power consumption and heat generation also rise. The inability to dissipate heat quickly enough can easily lead to heat accumulation, affecting the chip's normal operation. Furthermore, the vapor chamber's placement within the housing can result in inadequate constraint, further impacting its heat dissipation performance. Summary of the Invention

[0003] This invention provides a heat dissipation structure for an optical module, aiming to solve the problem that existing heat dissipation structures fail to dissipate heat in a timely manner, leading to heat accumulation and affecting the normal operation of the chip.

[0004] This utility model provides a heat dissipation structure for an optical module, including a housing base, a housing bottom cover, a heat sink, and a vapor chamber. The housing bottom cover is connected to the bottom of the housing base, and the heat sink is connected to the top of the housing base. A PCB board is provided inside the housing base, and a functional chip is provided on the PCB board. One side of the vapor chamber is connected to the bottom of the heat sink, and the vapor chamber extends into the housing base. The vapor chamber and the heat sink are integrally packaged and formed.

[0005] As a further improvement of this utility model, the heat spreader shell and the heat dissipation duct are integrated by brazing or diffusion welding. One side of the heat spreader shell has a wall thickness in the thickness direction, and the other side of the heat spreader shell uses the heat dissipation duct as a wall thickness to form a sealed cavity.

[0006] As a further improvement of this utility model, the other side of the heat spreader is provided with a plurality of protrusions, the protrusions extending into the interior of the housing base, and the protrusions communicating with the inner cavity of the heat spreader.

[0007] As a further improvement of this utility model, the cavity of the heat exchange plate is provided with microstructured capillary channels and heat dissipation liquid medium.

[0008] As a further improvement of this utility model, the boss contacts the functional chip on the PCB board through a thermally conductive interface material, and the heat spreader diffuses the received heat to the heat sink.

[0009] As a further improvement of this utility model, the heat dissipation component includes a first heat dissipation plate, a second heat dissipation plate, and a plurality of fins. One side of the fins is connected to the top of the second heat dissipation plate, and the other side of the fins is connected to the bottom of the first heat dissipation plate. A heat dissipation air duct is formed between adjacent fins.

[0010] As a further improvement of this utility model, the bottom surface of the first heat sink is provided with several parallel grooves, and the other side of the fin is connected to the grooves.

[0011] As a further improvement of this utility model, the top front end of the housing base is provided with a V-shaped groove, and a placement groove is provided extending from the V-shaped groove to the tail end of the housing base. A through hole is provided in the placement groove, the heat dissipation component is disposed in the placement groove, and the heat spreader plate extends into the interior of the housing base through the through hole.

[0012] As a further improvement of this utility model, the material of the heat sink is copper.

[0013] As a further improvement of this utility model, it also includes a handle and an unlocking plate, wherein the unlocking plate is inserted into the tail end of the handle and is snapped into both sides of the housing base and located between the housing base and the housing bottom cover.

[0014] The beneficial effects of this utility model are: by integrating the heat spreader and the heat sink into a single package structure, with the heat spreader and the heat sink arranged along the length of the housing base, the high thermal conductivity of the heat spreader is fully utilized, heat dissipation is facilitated, the power consumption of the transceiver optical module is effectively reduced, and the performance and service life of the transceiver optical module as a core component of the optical fiber communication system are effectively improved, thereby effectively improving the stability and efficiency of the entire communication system. Attached Figure Description

[0015] Figure 1 This is an overall diagram of the optical module of this utility model;

[0016] Figure 2 This is a schematic diagram of the heat dissipation component, heat spreader, and boss of this utility model;

[0017] Figure 3 This is a cross-sectional view of the heat sink, heat spreader, and boss of this utility model.

[0018] Figure 4 This is a top view of the housing base of this utility model;

[0019] Figure 5 This is a schematic diagram of the first heat sink of this utility model.

[0020] Reference numerals: 1-Shell base, 2-Shell bottom cover, 3-Heat sink, 4-Handle, 5-Unlocking sheet metal, 6-Heat distribution plate, 7-Boss, 10-V-groove, 11-Placement groove, 12-Through hole, 31-First heat sink, 32-Second heat sink, 33-Fin, 34-Heat dissipation duct, 35-Groove. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be noted that the terms "front," "rear," "left," "right," "upper," and "lower" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0022] like Figure 1-5 As shown, this utility model provides a heat dissipation structure for an optical module, including a housing base 1, a housing bottom cover 2, a heat sink 3, and a vapor chamber 6. The housing bottom cover 2 is connected to the bottom of the housing base 1, and the heat sink 3 is connected to the top of the housing base 1. A PCB board is provided inside the housing base 1, and a functional chip is provided on the PCB board. One side of the vapor chamber 6 is connected to the bottom of the heat sink 3, and the vapor chamber 6 extends into the housing base 1. The vapor chamber 6 and the heat sink 3 are integrally packaged. This design makes fuller use of the limited thickness and height of the transceiver optical module.

[0023] As an embodiment of the present utility model, the top front end of the housing base 1 is provided with a V-shaped groove 10, and a placement groove 11 is provided extending from the V-shaped groove 10 to the tail end of the housing base 1. A through hole 12 is provided in the placement groove 11, the heat sink 3 is disposed in the placement groove 11, and the heat spreader 6 extends into the interior of the housing base 1 through the through hole 12.

[0024] In another embodiment of the present invention, the other side of the heat spreader 6 is provided with a plurality of protrusions 7, the protrusions 7 extend into the interior of the housing base 1, and the protrusions 7 communicate with the inner cavity of the heat spreader 6.

[0025] In another embodiment of this utility model, the cavity of the heat spreader 6 is provided with microstructured capillary channels and heat dissipation liquid medium.

[0026] In another embodiment of this utility model, the boss 7 contacts the functional chip on the PCB board through a thermally conductive interface material, and the vapor chamber diffuses the received heat to the heat sink. This results in a larger heat dissipation area to reduce the heat density of the functional chip.

[0027] In another embodiment of the present invention, the heat sink 3 includes a first heat sink 31, a second heat sink 32 and a plurality of fins 33. One side of the fins 33 is connected to the top of the second heat sink 32, and the other side of the fins 33 is connected to the bottom of the first heat sink 31. A heat dissipation air duct 34 is formed between adjacent fins 33.

[0028] In another embodiment of the present invention, the bottom surface of the first heat sink 31 is provided with a plurality of parallel grooves 35, and the other side of the fin 33 is connected in the grooves 35.

[0029] In another embodiment of this utility model, the heat spreader 6 shell and the heat dissipation duct 34 are integrally encapsulated using brazing or diffusion bonding processes. One side of the heat spreader 6 shell has a wall thickness in the thickness direction, while the other side utilizes the heat dissipation duct 34 as a wall thickness, forming a sealed cavity. This makes fuller use of the limited thickness and height of the transceiver optical module.

[0030] In another embodiment of this utility model, the heat sink 3 is made of copper.

[0031] In another embodiment of this utility model, the materials of the housing base 1 and the housing bottom cover 2 are zinc alloy or aluminum alloy.

[0032] As another embodiment of this utility model, it also includes a handle 4 and an unlocking plate 5. The unlocking plate 5 is inserted into the tail end of the handle 4 and is snapped into both sides of the housing base 1 and located between the housing base 1 and the housing bottom cover 2.

[0033] This invention provides a heat dissipation structure for an optical module. Compared to the traditional method of placing the heat spreader inside the housing, this invention integrates the heat spreader 6 and the heat sink 3 into a single, integrally formed structure. The heat spreader 6 and the heat sink 3 are arranged along the length of the housing base 1, maximizing the heat dissipation capacity of the heat spreader 6. The heat spreader 6 passes through the through-hole 12, allowing high-heat-density components on the PCB board to directly transfer heat to the heat spreader 6 for dissipation outside the housing base 1. This direct heat dissipation path bypasses the housing, resulting in more direct and effective heat dissipation. The heat spreader 6 has a cavity containing microstructured capillary channels and a heat dissipation liquid medium. The microstructured capillary channels are tiny channels protruding from the cavity of the heat spreader 6, accelerating heat diffusion. The thermal conductivity of the heat sink 3 and the heat spreader 6 are both greater than that of the housing base 1. The heat dissipation structure of the transceiver optical module provided in this application adopts an integrated encapsulation structure of heat sink 3 and heat spreader 6, which accelerates the heat dissipation of high heat density components of the transceiver optical module, avoids heat accumulation around high heat density components, helps to uniform the internal temperature of the optical module, thereby effectively reducing the power consumption of the transceiver optical module, effectively improving the performance and service life of the transceiver optical module as a core component of the optical fiber communication system, and thus effectively improving the stability and efficiency of the entire communication system.

[0034] The assembly process of the heat sink 3 is as follows: Using C1100 copper material, the second heat sink 32 is milled using a CNC machine tool. Several fins 33 are then machined from the second heat sink 32 using a CNC machine tool. The first heat sink 31 is manufactured by CNC machining or stamping. Several grooves 35 are machined from the first heat sink 31. The first heat sink 31 is then connected to the fins 33 by bonding or SMT reflow soldering, so that the other side of the fins 33 is connected to the grooves 35. After assembly, a heat dissipation channel 34 is formed between adjacent fins 33. The bottom of the second heat sink 32 is encapsulated with the heat spreader 6 using brazing or diffusion soldering processes. Thus, the copper outer shell of the heat spreader 6 has only a thick upper side, while the lower side utilizes the heat dissipation channel 34 as its wall thickness, forming a sealed cavity and making fuller use of the limited thickness and height of the transceiver optical module.

[0035] The copper outer shell of the heat spreader 6 is formed by CNC machine tool stamping. A boss 7 is provided on the other side of the copper outer shell of the heat spreader 6. The boss 7 may be not limited to one or more locations. The boss 7 is connected to the inner cavity of the heat spreader 6, and the two are integrally formed. Compared with existing technologies, this connection method has higher thermal conductivity and eliminates the presence of a joint surface, thus avoiding increased interfacial thermal resistance due to voids, resulting in faster and more efficient heat dissipation. The boss 7 contacts the high heat density functional chips on the PCB board through a thermally conductive interface material. The cavity of the heat spreader 6 contains microstructured capillary channels and a heat dissipation liquid medium, further enhancing heat dissipation efficiency.

[0036] During the assembly of the transceiver optical module, a PCB board, optoelectronic chip, and connectors are installed inside the housing base 1. The unlocking sheet 5 is installed in the slots on both sides of the housing base 1. The housing bottom cover 2 is then connected to the bottom of the housing base 1. The heat sink 3 is placed in the placement slot 11. The protrusion 7 of the heat spreader 6 is inserted into the housing base 1, so that the protrusion 7 contacts the high heat density component on the PCB board, i.e., the functional chip, through the thermal interface material. At this time, the handle 4 is located at the front end of the housing base 1. The assembly of the transceiver optical module is thus completed. The unlocking sheet 5 is used to release the fixed connection between the optical module and the switch, and the transceiver optical module can be removed through the handle 4.

[0037] When the transceiver optical module is operating, the protrusion 7, through its thermally conductive interface material, can promptly conduct the heat from the high-heat-density functional chips on the PCB board to the vapor chamber 6. The vapor chamber 6 then undergoes initial cooling via its microstructure capillary channels and the heat dissipation liquid medium. As the liquid vaporizes and undergoes a phase change, the vapor chamber 6, positioned along the length of the housing base 1, allows for rapid and efficient heat transfer from the high-heat-density functional chips to the entire heat dissipation structure, preventing heat concentration around the chips. Furthermore, it maximizes the heat dissipation effect of the structure, rapidly dispersing the heat from the high-heat-density chips to the outside of the transceiver optical module. This prevents heat accumulation in one area, resulting in a more uniform internal temperature and improved photoelectric performance at high temperatures. Subsequently, the vapor chamber 6 guides the heat to the heat dissipation duct 34, where airflow blows the heat out of the transceiver optical module, achieving rapid heat dissipation. A V-shaped groove 10 is provided at the front end of the placement slot 11, which can better gather airflow and guide the airflow to the heat dissipation duct 34, thereby accelerating the heat dissipation speed. The second heat dissipation plate 32 and fins 33 are integrally formed from C1100 copper material, with the fins 33 being machined using CNC machine tool processing. The handle 4 is made of SANTOPRENE 251-92W232.

[0038] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.

Claims

1. A heat dissipation structure of an optical module, characterized by, The application relates to a heat dissipation device, which comprises a shell base, a shell bottom cover, a heat dissipation piece and a uniform temperature plate.

2. The heat dissipation structure of the optical module according to claim 1, wherein The uniform temperature plate shell and the heat dissipation air duct are integrally packaged by brazing or diffusion welding process, one side of the thickness direction of the uniform temperature plate shell has a wall thickness, the other side of the thickness direction of the uniform temperature plate shell uses the heat dissipation air duct as a wall thickness to form a sealed cavity.

3. The heat dissipation structure of the optical module according to claim 1, wherein The other side of the uniform temperature plate is provided with a plurality of convex bosses, the convex bosses extend into the inside of the shell base, and the convex bosses are communicated with the inner cavity of the uniform temperature plate.

4. The heat dissipation structure of the optical module according to claim 1, wherein The cavity of the uniform temperature plate is provided with microstructure capillary channels and heat dissipation liquid medium.

5. The heat dissipation structure of the optical module according to claim 3, wherein The convex bosses are in contact with the functional chip on the PCB through the heat conductive interface material, and the uniform temperature plate diffuses the received heat to the heat dissipation piece.

6. The heat dissipation structure of the optical module according to claim 1, wherein The heat dissipation piece comprises a first heat dissipation plate, a second heat dissipation plate and a plurality of fins, one side of the fin is connected to the top of the second heat dissipation plate, the other side of the fin is connected to the bottom of the first heat dissipation plate, and the heat dissipation air duct is formed between adjacent fins.

7. The heat dissipation structure of the optical module according to claim 6, wherein The bottom surface of the first heat dissipation plate is provided with a plurality of parallel grooves, and the other side of the fin is connected to the groove.

8. The heat dissipation structure of the optical module according to claim 1, wherein, The top front end of the shell base is provided with a V-shaped groove, a placing groove is arranged from the V-shaped groove to the tail of the shell base, a through hole is arranged in the placing groove, the heat dissipation piece is arranged in the placing groove, and the uniform temperature plate extends into the inside of the shell base through the through hole.

9. The heat dissipation structure of the optical module according to claim 1, wherein, The material of the heat dissipation piece is red copper.

10. The heat dissipation structure of the optical module according to claim 1, wherein, The application further comprises a handle and an unlocking plate, the unlocking plate is inserted into the tail end of the handle, and the unlocking plate is clamped on the two sides of the shell base and between the shell base and the shell bottom cover.

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