Liquid cooling optical module

Abstract

The utility model relates to the technical field of optical communication, and provides a liquid cooling optical module, which comprises a PCB (printed circuit board), an injection molding part wrapped on the PCB, a base for placing the PCB and an air cooling heat dissipation structure for heat dissipation of the power consumption chip, the air cooling heat dissipation structure is arranged between the base and the injection molding part. According to the liquid cooling optical module of the utility model, through the air cooling heat dissipation structure, the heat dissipation effect on the power consumption chip can be realized when the optical module is taken out from the liquid, and the quality of the optical module can be improved.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, specifically to a liquid-cooled optical module. Background Technology

[0002] Existing liquid-cooled optical modules dissipate heat by immersing them in liquid. However, when the optical module is removed from the liquid, such as when it is taken out of the liquid for testing or when it is temporarily removed from the liquid while it is working, the liquid-cooled optical module will no longer have a good heat dissipation effect, which can easily damage the power consumption chip. Utility Model Content

[0003] The purpose of this invention is to provide a liquid-cooled optical module that can at least solve some of the defects in the prior art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a liquid-cooled optical module, comprising a PCB board and an injection-molded part wrapped on the PCB board, wherein a power consumption chip on the PCB board is encapsulated within the injection-molded part, and further comprising a base for mounting the PCB board and a fan-cooled heat dissipation structure for heat dissipation of the power consumption chip, wherein the fan-cooled heat dissipation structure is disposed between the base and the injection-molded part.

[0005] Furthermore, the air-cooled heat dissipation structure includes a heat sink, which is positioned facing the power consumption chip and is attached to the outer wall of the injection molded part.

[0006] Furthermore, the power consumption chip includes a DSP chip and a TIA chip, and there are two heat sinks, which are respectively located on the injection molded part at the position corresponding to the DSP chip and the position on the injection molded part corresponding to the TIA chip.

[0007] Furthermore, the heat sink is located between the base and the injection molded part.

[0008] Furthermore, the base is provided with a boss, and the heat sink is sandwiched between the boss and the injection molded part.

[0009] Furthermore, it also includes high-temperature adhesive tape for separating the PCB board and the base.

[0010] Furthermore, the high-temperature tape is located on the PCB board that is exposed outside the injection molded part and close to the light port.

[0011] Furthermore, the base is provided with a positioning structure for positioning the injection molded part.

[0012] Furthermore, the positioning structure includes a protruding ridge on the base, and one side of the injection molded part is fitted with the protruding ridge.

[0013] Furthermore, the injection molded part is a low-pressure molding structure.

[0014] Compared with the prior art, the beneficial effects of this utility model are: a liquid-cooled optical module, through the air-cooled heat dissipation structure, can also dissipate heat from the power consumption chip when the optical module is taken out of the liquid, thereby improving the quality of the optical module. Attached Figure Description

[0015] Figure 1 An exploded view of a liquid-cooled optical module provided for an embodiment of this utility model;

[0016] Figure 2 A schematic diagram of an injection-molded PCB board for a liquid-cooled optical module provided in an embodiment of this utility model;

[0017] In the attached diagram, the labels are: 1-PCB board; 2-injection molded part; 3-base; 4-heat sink; 5-bore; 6-high temperature tape; 7-protruding ridge. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0019] Please see Figure 1 and Figure 2 This utility model provides a liquid-cooled optical module, including a PCB board 1 and an injection-molded component 2 encapsulated on the PCB board 1. A power consumption chip on the PCB board 1 is encapsulated within the injection-molded component 2. In addition, the liquid-cooled optical module includes a base 3 for mounting the PCB board 1 and a fan-cooled heat dissipation structure for heat dissipation of the power consumption chip, the fan-cooled heat dissipation structure being disposed between the base 3 and the injection-molded component 2. Compared to existing liquid-cooled optical modules with a single heat dissipation method, the heat dissipation effect deteriorates when the module is no longer immersed in liquid. This embodiment uses a fan-cooled heat dissipation structure to fill this heat dissipation gap, enabling fan-cooled heat dissipation when the liquid-cooled optical module is removed from the liquid, thus improving the quality of the optical module. This liquid-cooled optical module can be a 100G DSFP liquid-cooled optical module.

[0020] Please see Figure 1 and Figure 2The air-cooled heat dissipation structure includes a heat sink 4, which is positioned directly opposite the power consumption chip and is attached to the outer wall of the injection molded part 2. In detail, this air-cooled heat dissipation structure, with the heat sink 4 attached to the outer wall of the injection molded part 2, can quickly dissipate the heat transferred from the power consumption chip to the injection molded part 2. The heat sink 4 uses existing heat-absorbing materials, such as tungsten copper. Of course, in addition to using the heat sink 4 for heat conduction, a heat dissipation airflow channel can also be set up to increase the air circulation rate outside the injection molded part 2, thereby achieving the purpose of air-cooling. The heat dissipation airflow channel can be formed by multiple partitions working together to form multiple long, strip-shaped airflow channels. Adjacent partitions are spaced apart and arranged parallel to each other, thus forming an airflow channel between adjacent partitions.

[0021] For further optimization of the above solution, please refer to [link / reference]. Figure 1 and Figure 2 The power consumption chip includes a DSP chip and a TIA chip. There are two heat sinks 4, one for the DSP chip and the other for the TIA chip, respectively, located on the injection-molded part 2. When the power consumption chip is a DSP chip (digital signal processing chip) and a TIA chip (transimpedance amplifier), the same number of heat sinks 4 as the number of chips can be used, which can improve heat dissipation efficiency. Furthermore, since the heat sinks 4 are positioned directly opposite the DSP chip and the TIA chip, they can quickly dissipate the heat generated by the two chips.

[0022] For further optimization of the above solution, please refer to [link / reference]. Figure 1 and Figure 2 The heat sink 4 is located between the base 3 and the injection molded part 2. Preferably, the base 3 is provided with a boss 5, and the heat sink 4 is sandwiched between the boss 5 and the injection molded part 2. The boss 5 facilitates the conduction of heat to the base 3 for heat dissipation, and the boss 5 is also made of a heat-dissipating material.

[0023] Please see Figure 1 and Figure 2 The liquid-cooled optical module also includes a high-temperature adhesive tape 6 for separating the PCB board 1 and the base 3. In this embodiment, the high-temperature adhesive tape 6 can prevent the components on the PCB board 1 from short-circuiting to ground with the base 3. Preferably, the high-temperature adhesive tape 6 is located on the PCB board 1 exposed outside the injection molded part 2 and close to the optical port.

[0024] Please see Figure 1 and Figure 2The base 3 is provided with a positioning structure for positioning the injection molded part 2. The positioning structure facilitates the positioning of the injection molded part 2 on the base 3. Preferably, the positioning structure includes a protruding rib 7 on the base 3, with one side of the injection molded part 2 abutting against the protruding rib 7. Positioning can be achieved by using the protruding rib 7, ensuring the injection molded part 2 is pressed tightly against the protruding rib 7. Preferably, besides using the protruding rib 7, other blocking methods can also be used for positioning; this embodiment does not limit this.

[0025] Please see Figure 1 and Figure 2 The injection molded part 2 is a low-pressure molding structure. The low-pressure molding structure of the injection molded part 2 allows for one-time molding using low-pressure molding technology, which can greatly improve production efficiency. Low-pressure molding technology is existing technology, and this application does not protect this technology, but rather the low-pressure molding structure formed by it. This structure can also better cover the PCB board 1 and prevent leakage.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A liquid-cooled light module comprising a PCB board and an injection molding wrapped on the PCB board, a power consumption chip on the PCB board is packaged in the injection molding, characterized in that: The base is used for placing the PCB, and the air-cooled heat dissipation structure is used for dissipating heat of the power consumption chip, and is arranged between the base and the injection molding part.

2. A liquid-cooled light module as claimed in claim 1, characterized in that: The air-cooled heat dissipation structure comprises heat dissipation fins, the heat dissipation fins are arranged opposite to the power consumption chip, and the heat dissipation fins are arranged on the outer wall of the injection molding part.

3. A liquid-cooled light module as claimed in claim 2, characterized in that: The power consumption chip comprises a DSP chip and a TIA chip, the heat dissipation fins comprise two heat dissipation fins, and the two heat dissipation fins are arranged at positions corresponding to the DSP chip and the TIA chip of the injection molding part respectively.

4. A liquid-cooled light module as claimed in claim 2, characterized in that: The heat dissipation fins are arranged between the base and the injection molding part.

5. A liquid-cooled light module as claimed in claim 4, characterized in that: The base is provided with a boss, and the heat dissipation fins are arranged between the boss and the injection molding part.

6. A liquid-cooled light module as claimed in claim 1, characterized in that: The high-temperature adhesive tape is used for separating the PCB and the base.

7. A liquid-cooled light module as claimed in claim 6, characterized in that: The high-temperature adhesive tape is arranged on the PCB exposed to the outside of the injection molding part and close to the light port.

8. A liquid-cooled light module as claimed in claim 1, characterized in that: The base is provided with a positioning structure used for positioning the injection molding part.

9. A liquid-cooled light module as claimed in claim 8, characterized in that: The positioning structure comprises a convex rib arranged on the base, and one side of the injection molding part is arranged close to the convex rib.

10. A liquid-cooled light module as claimed in claim 1, characterized in that: The injection molding part is a low-pressure forming structure.

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