Mounting dislocation prevention chip resistor
By designing a combination structure of conical groove and guide groove, the problems of positioning difficulties, uneven solder distribution and air retention in the traditional chip resistor welding process are solved, realizing high-efficiency welding quality and stability of chip resistors in automated production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2026-03-06
AI Technical Summary
Traditional surface mount resistors suffer from welding quality problems due to difficulties in positioning, uneven solder distribution, and air retention during the soldering process, which affect automated production and product performance.
The design incorporates a combination of conical grooves and guide grooves. This structure utilizes the surface tension of the molten solder to automatically guide the pins back into position. The notch and beveled groove increase the solder contact area, while the guide groove guides the flow of molten solder and prevents air from accumulating.
It achieves automatic anti-misalignment, improves welding quality, reduces the risk of cold solder joints and short circuits, ensures uniform solder distribution, and improves mechanical adhesion.
Smart Images

Figure CN223977753U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of surface mount resistor technology, specifically to a surface mount resistor designed to prevent misalignment. Background Technology
[0002] In the electronic circuit assembly process, the soldering quality of surface mount resistors directly affects product performance. The traditional planar lead design of surface mount resistors has the following problems:
[0003] Positioning difficulties: During welding, precise alignment requires manual labor or a vision system. In automated production, pin misalignment is easily caused by vibration or mechanical errors.
[0004] Uneven solder distribution: Planar structures make it difficult to guide solder flow, which can easily lead to cold solder joints or short circuits;
[0005] Air trapping risk: Tiny gaps between pins and pads may trap air, causing solder to accumulate and affecting soldering strength. Utility Model Content
[0006] The purpose of this invention is to provide a surface mount resistor that prevents misalignment during installation, in order to solve the problems mentioned in the background art.
[0007] To achieve the above objectives, this utility model provides the following technical solution: a surface mount resistor for preventing misalignment, comprising a surface mount resistor body and pins disposed at both ends of the surface mount resistor body, wherein the top and bottom of the pins are provided with tapered grooves, and two adjacent tapered grooves are connected.
[0008] Guide grooves are provided on the inner walls of both sides of the conical groove.
[0009] Preferably, a notch is provided on the outer wall of the end of the pin away from the main body of the chip resistor. The notch is connected to the conical groove. The notch can effectively prevent the solder from accumulating in the bottom of the conical groove due to poor air circulation inside the conical groove.
[0010] Preferably, the inner wall of the conical groove is provided with several sloping grooves at equal intervals to increase the contact area and bonding effect between the solder and the pin.
[0011] Preferably, the inner wall of the guide groove is provided with an arc-shaped groove, which can further improve the contact area and bonding effect between the solder and the pin.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] 1. Automatic anti-misalignment:
[0014] The combined design of the conical groove and the guide groove utilizes the surface tension of the solder when it melts to automatically guide the pins to return to the center, reducing the need for manual or visual-assisted positioning.
[0015] The notch connects to the conical groove, preventing air trapping during soldering and ensuring even solder distribution.
[0016] 2. Improved welding quality:
[0017] The sloping groove and arc-shaped structure increase the solder contact area, enhance mechanical adhesion, and reduce the risk of cold solder joints;
[0018] The guide groove directs excess solder flow in a specific direction, reducing the probability of short circuits between adjacent pins. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ;
[0020] Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 ;
[0021] Figure 3 This is a top view of the present invention.
[0022] In the diagram: 1. Surface mount resistor body; 2. Lead; 21. Tapered groove; 211. Angled groove; 22. Notch; 23. Guide groove; 231. Arc-shaped groove. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] Please see Figure 1-3 The present invention provides the following technical solution:
[0025] Example 1: A surface mount resistor with anti-misalignment feature includes a surface mount resistor body 1 and pins 2 disposed at both ends of the surface mount resistor body 1. The top and bottom of each pin 2 are provided with a tapered groove 21, and two adjacent tapered grooves 21 are connected. Guide grooves 23 are provided on the inner walls on both sides of each tapered groove 21.
[0026] In use, flux is filled into the conical groove 21 or guide groove 23 on pin 2. When the solder wire is heated by the soldering iron, the solder wire will form a spherical structure after melting. Since the chip resistor is small in size and weight, the molten solder will automatically drive pin 2 to be aligned and make the solder concentrated inside the conical groove 21. Excess solder will be distributed along the guide groove 23. The surface tension and fluidity of the solder during melting guide pin 2 to automatically align, thus preventing misalignment of the chip resistor.
[0027] Example 2: The technical solution of this example, which differs from that of Example 1, includes a notch 22 on the outer wall of the end of the pin 2 away from the surface mount resistor body 1, the notch 22 being connected to the conical groove 21, a plurality of inclined grooves 211 being equally spaced on the inner wall of the conical groove 21, and an arc-shaped groove 231 being formed on the inner wall of the guide groove 23.
[0028] When in use, the opening 22 can effectively prevent the solder from accumulating in the bottom of the cone groove 21 due to poor air circulation inside the cone groove 21;
[0029] Both the inclined groove 211 and the arc groove 231 can improve the contact area and bonding effect between the solder and the pin 2.
[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A mounting mistake-proofing chip resistor comprising a chip resistor body (1) and a pin (2) arranged at both ends of the chip resistor body (1), characterized in that: The top and bottom of the pin (2) are provided with taper grooves (21), and two adjacent taper grooves (21) are communicated. The inner walls on the two sides of the taper groove (21) are provided with guide grooves (23).
2. The anti-misplacement chip resistor according to claim 1, characterized in that: The outer wall of the end of the pin (2) away from the chip resistor body (1) is provided with an opening (22), and the opening (22) is communicated with the taper groove (21).
3. The anti-misinstallation chip resistor according to claim 1, characterized in that: The inner wall of the taper groove (21) is provided with a plurality of inclined surface grooves (211) at equal intervals.
4. The anti-misinstallation chip resistor according to claim 1, characterized in that: The inner wall of the guide groove (23) is provided with an arc-shaped groove (231).