Thin film capacitor with heat dissipation structure
By introducing a heat dissipation assembly consisting of a side air distribution box, heat dissipation fins, and a micro air pump into the film capacitor, the problem of low heat dissipation efficiency of film capacitors is solved, achieving rapid heat dissipation and temperature feedback, and enhancing the puncture resistance of the capacitor.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2026-03-06
AI Technical Summary
Existing film capacitors have shortcomings in heat dissipation efficiency, especially large capacitors that rely on natural heat dissipation and cannot dissipate heat quickly and effectively.
A thin-film capacitor with a heat dissipation structure was designed, comprising a heat dissipation assembly consisting of a side air distribution box, heat dissipation fins, a micro air pump, and an air duct. The air pump pumps air through the air duct to the air distribution box and sprays air out from the air outlet. The fins work together to accelerate heat dissipation. A temperature sensor and an LCD screen are set up for temperature feedback. An outer ceramic liner and an inner ceramic liner are added to improve the structural strength.
It achieves rapid heat dissipation of film capacitors, has temperature feedback capability, and improves the puncture resistance of capacitors.
Smart Images

Figure CN223977804U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of capacitor technology, specifically to a thin-film capacitor with a heat dissipation structure. Background Technology
[0002] Film capacitors are capacitors that use metal foil as electrodes, overlap it with plastic films such as polyethylene, polypropylene, polystyrene or polycarbonate from both ends, and then wind them into a cylindrical structure. They are widely used in many industries such as electronics, home appliances, communications, power, electrified railways, hybrid vehicles, wind power generation, and solar power generation.
[0003] Most large film capacitors currently on the market are similar in overall structure, with a metal casing as the main body, a dielectric film roll inside the casing, and protection by dry epoxy resin potting. The electrodes are located on the top of the casing. In actual use, they have some functional shortcomings and room for improvement. For example, the working principle of the capacitor itself determines that it is very easy to generate heat. Small capacitors are generally cooled by applying silicone grease and using a fan, while large capacitors mostly rely on natural heat dissipation. There is room for further improvement in heat dissipation efficiency, and they do not have the function of easy and rapid heat dissipation.
[0004] Now, a novel thin-film capacitor with a heat dissipation structure is proposed to solve the above problems. Utility Model Content
[0005] The purpose of this invention is to provide a thin-film capacitor with a heat dissipation structure to solve the problem mentioned in the background art of not having the function of easy and rapid heat dissipation.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a thin-film capacitor with a heat dissipation structure, comprising a metal shell, a bottom mounting plate welded to the bottom end of the metal shell, four sets of electrode posts fixedly connected to the top end of the metal shell, a dielectric film disposed in the middle position inside the metal shell, and a heat dissipation component disposed outside the metal shell to accelerate heat dissipation.
[0007] The heat dissipation assembly includes two sets of side air distribution boxes, which are vertically fixed to the left and right sides of the top of the bottom mounting plate. Multiple sets of heat dissipation fins are horizontally welded between one side of the two sets of side air distribution boxes. Multiple sets of air outlets are respectively provided at the front and rear ends of the side air distribution box near the metal shell. A miniature air pump is fixedly connected to the top of the side air distribution box away from the metal shell. An air guide pipe is fixedly connected between the top of the side air distribution box and the top of the miniature air pump. A power supply wire is movably connected to the bottom of the miniature air pump.
[0008] Preferably, the front and rear ends of the heat dissipation fins and the metal housing are attached together, and the metal housing and the heat dissipation fins are welded together.
[0009] Preferably, there is a distance between the metal casing and the side air distribution box, and the side air distribution box is symmetrically distributed about the vertical center line of the metal casing.
[0010] Preferably, the side air distribution box, air outlet, micro air pump, and air duct are internally connected, and the air outlets are arranged at equal intervals.
[0011] Preferably, a plastic shell is fixedly connected to the middle position of the top of the metal shell, a buzzer is installed at the rear end of the top of the plastic shell, an LCD screen is fixedly connected to the middle position of the top of the plastic shell, a circuit board is provided at the bottom inside the plastic shell, and a temperature sensor is installed at the front end of the top of the circuit board.
[0012] Preferably, the tops of the plastic housing and the LCD screen are flush, and the buzzer, LCD screen, circuit board, and temperature sensor are electrically connected.
[0013] Preferably, the dielectric film is fitted with an inner ceramic liner, and the inner ceramic liner is fitted with an outer ceramic liner. The inner and outer surfaces of the outer ceramic liner and the inner ceramic liner are respectively filled with a dry epoxy resin infusion layer.
[0014] Preferably, the vertical centerlines of the metal shell, dielectric film, outer ceramic liner, and inner ceramic liner coincide, and the shape and size of the outer surface of the dry epoxy resin infusion layer are compatible with the shape and size of the inner surface of the metal shell.
[0015] Compared with the prior art, the beneficial effects of this utility model are: the thin film capacitor with heat dissipation structure not only realizes the function of convenient and rapid heat dissipation, but also realizes the function of capacitor temperature feedback, and also realizes the function of capacitor surface puncture resistance.
[0016] (1) By setting up a side air distribution box, heat dissipation fins, air outlet, power supply wiring, micro air pump and air duct, when in use, the wiring is connected to the electrode post, the rolled dielectric film can accommodate the charge current, the capacitor itself will have a significant temperature rise during operation, the micro air pump continuously pumps air into the side air distribution box through the air duct, the air pressure in the side air distribution box increases, and airflow is ejected from the air outlet. The heat dissipation fins at the front and rear ends of the metal shell can quickly conduct heat out, and together with the airflow ejected from the air outlet, the heat dissipation is accelerated, thus realizing the function of easy and rapid heat dissipation.
[0017] (2) By setting up a plastic shell, a buzzer, an LCD screen, a circuit board and a temperature sensor, the temperature of the capacitor will rise during operation. The temperature sensor senses the temperature of the top of the capacitor in real time and feeds it back to the LCD screen. When the temperature exceeds the preset warning value, the buzzer sounds an alarm to remind the staff to check in time, thus realizing the function of capacitor temperature feedback.
[0018] (3) By setting an outer ceramic liner, an inner ceramic liner and a dry epoxy resin potting layer, when in use, two sets of ceramic liners, an outer ceramic liner and an inner ceramic liner, are added on the basis of the dry epoxy resin potting layer to increase the internal structural strength. When the capacitor is punctured, the composite structure formed by the two liner layers and the dry epoxy resin potting layer can prevent it from being directly punctured, thus realizing the puncture resistance function of the capacitor surface. Attached Figure Description
[0019] Figure 1 This is a front view structural diagram of the present utility model;
[0020] Figure 2 This is a top view partial cross-sectional structural diagram of the present invention;
[0021] Figure 3 This is a side view of the side air distribution box structure of this utility model;
[0022] Figure 4 This is a front view cross-sectional structural diagram of the metal casing of this utility model;
[0023] Figure 5 This is a top view schematic diagram of the dry epoxy resin infusion layer of this utility model.
[0024] In the diagram: 1. Metal casing; 2. Bottom mounting plate; 3. Side air distribution box; 4. Heat dissipation fins; 5. Air outlet; 6. Power wiring; 7. Miniature air pump; 8. Air duct; 9. Electrode post; 10. Dielectric film; 11. Plastic casing; 12. Buzzer; 13. LCD screen; 14. Circuit board; 15. Temperature sensor; 16. Outer ceramic liner; 17. Inner ceramic liner; 18. Dry epoxy resin infusion layer. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] Example 1: Please refer to Figure 1-5 A thin-film capacitor with a heat dissipation structure includes a metal shell 1, a bottom mounting plate 2 welded to the bottom end of the metal shell 1, four sets of electrode posts 9 fixedly connected to the top end of the metal shell 1, a dielectric film 10 disposed in the middle position inside the metal shell 1, and a heat dissipation component that can accelerate heat dissipation disposed on the outside of the metal shell 1.
[0027] Please see Figure 1-5 A thin-film capacitor with a heat dissipation structure also includes a heat dissipation component, which includes two sets of side air distribution boxes 3. The two sets of side air distribution boxes 3 are vertically fixed to the left and right sides of the top of the bottom mounting plate 2. Multiple sets of heat dissipation fins 4 are horizontally welded between one side of the two sets of side air distribution boxes 3. Multiple sets of air outlets 5 are respectively provided at the front and rear ends of the side of the side air distribution box 3 near the metal shell 1. A micro air pump 7 is fixedly connected to the top of the side of the side air distribution box 3 away from the metal shell 1. A duct 8 is fixedly connected between the top of the side air distribution box 3 and the top of the micro air pump 7. A power supply wire 6 is movably connected to the bottom of the micro air pump 7.
[0028] The heat dissipation fins 4 and the front and rear ends of the metal shell 1 are attached together. The metal shell 1 and the heat dissipation fins 4 are welded together. There is a distance between the metal shell 1 and the side air distribution box 3. The side air distribution box 3 is symmetrically distributed about the vertical center line of the metal shell 1. The side air distribution box 3, the air outlet 5, the micro air pump 7, and the air duct 8 are internally connected. The air outlet 5 is arranged at equal intervals, which can accelerate the heat dissipation of the capacitor.
[0029] Specifically, such as Figure 1 , Figure 2 and Figure 3 As shown, the miniature air pump 7 continuously pumps air into the side air distribution box 3 through the air duct 8. The air pressure inside the side air distribution box 3 increases, and airflow is ejected from the air outlet 5. The heat dissipation fins 4 at the front and rear ends of the metal shell 1 can quickly dissipate heat. Combined with the airflow ejected from the air outlet 5, the heat dissipation is accelerated.
[0030] Example 2: A plastic shell 11 is fixedly connected to the middle position of the top of the metal shell 1. A buzzer 12 is installed at the rear end of the top of the plastic shell 11. An LCD screen 13 is fixedly connected to the middle position of the top of the plastic shell 11. A circuit board 14 is provided at the bottom inside the plastic shell 11. A temperature sensor 15 is installed at the front end of the top of the circuit board 14. The tops of the plastic shell 11 and the LCD screen 13 are flush. The buzzer 12, the LCD screen 13, the circuit board 14, and the temperature sensor 15 are electrically connected, which can provide feedback on the temperature of the capacitor and provide a rapid warning when there is an abnormality.
[0031] Specifically, such as Figure 1 and Figure 2As shown, the temperature sensor 15 senses the temperature at the top of the capacitor in real time and feeds it back to the LCD screen 13. When the temperature exceeds the preset warning value, the buzzer 12 sounds an alarm to remind the staff to check in time.
[0032] Example 3: An inner ceramic liner 17 is sleeved on the outside of the dielectric film 10, and an outer ceramic liner 16 is sleeved on the outside of the inner ceramic liner 17. Dry epoxy resin infusion layers 18 are respectively injected into the inner and outer surfaces of the outer ceramic liner 16 and the inner ceramic liner 17. The vertical center lines of the metal shell 1, the dielectric film 10, the outer ceramic liner 16, and the inner ceramic liner 17 coincide. The shape and size of the outer surface of the dry epoxy resin infusion layer 18 are adapted to the shape and size of the inner surface of the metal shell 1, thereby improving the internal strength and making it more puncture resistant.
[0033] Specifically, such as Figure 1 , Figure 4 and Figure 5 As shown, the two sets of ceramic liners, outer ceramic liner 16 and inner ceramic liner 17, increase the internal structural strength. When the capacitor is punctured, the composite structure consisting of the two liner layers and the dry epoxy resin infusion layer 18 can prevent it from being directly punctured.
[0034] Working Principle: In use, the electrode post 9 is first connected to the wiring. The rolled dielectric film 10 can accommodate the charge current. During operation, the capacitor's temperature rises significantly. The micro air pump 7 continuously pumps air into the side air distribution box 3 through the air duct 8, increasing the air pressure inside the side air distribution box 3. Airflow is then ejected from the air outlet 5. The heat dissipation fins 4 at the front and rear ends of the metal casing 1 quickly dissipate heat, which, combined with the airflow from the air outlet 5, accelerates heat dissipation. The temperature sensor 15 senses the temperature at the top of the capacitor in real time and feeds it back to the LCD screen 13. When the temperature exceeds the preset warning value, the buzzer 12 sounds an alarm to remind staff to check promptly. Based on the dry epoxy resin infusion layer 18, two sets of ceramic liners, an outer ceramic liner 16 and an inner ceramic liner 17, are added to increase the internal structural strength. When the capacitor is punctured, the composite structure formed by the two liner layers and the dry epoxy resin infusion layer 18 prevents direct puncture.
[0035] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A thin film capacitor having a heat dissipating structure, comprising a metal case (1), characterized in that: The bottom end of the metal shell (1) is welded with a bottom mounting plate (2), the top end of the metal shell (1) is fixedly connected with four groups of electrode columns (9), the middle position inside the metal shell (1) is provided with a dielectric film (10), and the outside of the metal shell (1) is provided with a heat dissipation assembly which can accelerate heat dissipation. The heat dissipation assembly comprises two groups of side edge air distribution boxes (3), the two groups of side edge air distribution boxes (3) are respectively fixedly connected on the left and right sides of the top of the bottom mounting plate (2) in the vertical direction, a plurality of heat dissipation fins (4) are transversely welded between one side of the two groups of side edge air distribution boxes (3), a plurality of air outlet nozzles (5) are arranged on the front and back ends of the side close to the metal shell (1) of the side edge air distribution box (3), a micro air pump (7) is fixedly connected to the top of the side away from the metal shell (1) of the side edge air distribution box (3), and a wind guide pipe (8) is fixedly connected between the top ends of the side edge air distribution box (3) and the micro air pump (7). The bottom end of the micro air pump (7) is movably connected with a power supply wire (6).
2. The thin film capacitor with heat dissipation structure according to claim 1, characterized in that: The front and back ends of the heat dissipation fin (4) and the metal shell (1) are in close contact, and the metal shell (1) and the heat dissipation fin (4) are welded.
3. The thin film capacitor with heat dissipation structure according to claim 1, characterized in that: The metal shell (1) and the side edge air distribution box (3) are spaced apart, and the side edge air distribution box (3) is symmetrically distributed about the vertical center line of the metal shell (1).
4. The thin film capacitor with heat dissipation structure according to claim 1, wherein: The interiors of the side edge air distribution box (3), the air outlet nozzle (5), the micro air pump (7) and the wind guide pipe (8) are communicated, and the air outlet nozzles (5) are arranged at equal intervals.
5. The thin film capacitor with heat dissipation structure according to claim 1, wherein: The top of the metal shell (1) is fixedly connected with a plastic shell (11) at the middle position, a buzzer (12) is mounted on the top rear end of the plastic shell (11), a liquid crystal display screen (13) is fixedly connected to the top of the plastic shell (11) at the middle position, a circuit board (14) is arranged at the bottom inside of the plastic shell (11), and a temperature sensor (15) is mounted on the top front end of the circuit board (14).
6. The thin film capacitor with heat dissipation structure according to claim 5, characterized in that: The top ends of the plastic shell (11) and the liquid crystal display screen (13) are flush, and the buzzer (12), the liquid crystal display screen (13), the circuit board (14) and the temperature sensor (15) are electrically connected.
7. The thin film capacitor with heat dissipation structure according to claim 1, wherein: The outside of the dielectric film (10) is sleeved with an inner ceramic lining (17), the outside of the inner ceramic lining (17) is sleeved with an outer ceramic lining (16), and the inner and outer surfaces of the outer ceramic lining (16) and the inner ceramic lining (17) are respectively filled with dry epoxy resin filling layers (18).
8. The thin film capacitor with heat dissipation structure according to claim 7, characterized in that: The vertical center lines of the metal shell (1), the dielectric film (10), the outer ceramic lining (16) and the inner ceramic lining (17) coincide, and the shape and size of the outside of the dry epoxy resin filling layer (18) are adapted to the shape and size of the inside of the metal shell (1).