PCB layout structure of all-brick module power supply
By placing the power transistors on the back of the PCB in the modular power supply and using heat dissipation aids, the problem of poor heat dissipation in the modular power supply is solved, resulting in more efficient power supply performance and greater output power.
Patent Information
- Application Number
- CN202520308999.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-03-06
- Estimated Expiration
- 2035-02-25
AI Technical Summary
The existing modular power supply's PCB layout has poor heat dissipation, resulting in high temperatures, significant power loss, and reduced lifespan.
In the PCB layout of the modular power supply, the power transistors are distributed on the back of the power board, the energy storage capacitors are placed on the front, and heat dissipation is achieved through heat dissipation auxiliary components. The circuit layout is optimized to reduce losses.
It improves the working efficiency of the modular power supply, reduces the overall power loss, and enables the modular power supply of the same size to achieve higher output power.
Smart Images
Figure CN223978803U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of modular power supply technology, and in particular to a PCB layout structure for a full-brick modular power supply. Background Technology
[0002] High power density is a significant development trend for modular power supplies. For high-power-density modular power supplies, the acceptable losses within a fixed size are also fixed. To increase power density, losses in the power circuit must be reduced, thereby improving overall efficiency. Furthermore, heat dissipation is a pressing issue for the entire industry and the biggest obstacle to increasing power density. This is because, with a fixed efficiency, higher power results in higher losses, leading to higher temperatures for power devices. These devices are more likely to reach their operating limits, affecting the lifespan of the modular power supply and even causing damage. Therefore, significant increases in the power density of modular power supplies are difficult to achieve.
[0003] Most of the existing brick-type modular power supplies on the market use multi-layer board technology, with power devices and control devices only placed on the top and bottom layers. In order to save space, the number of power transistors is reduced, and the internal power routing relies entirely on increasing the number of printed circuit board layers to reduce line loss. However, the layout of the power loop and control circuit of the existing modular power supplies cannot well meet the needs of increasing power density, resulting in higher temperature, greater losses, and a reduced lifespan.
[0004] In the process of developing this utility model, the applicant discovered at least the following problems in the prior art:
[0005] The heat dissipation effect of the existing modular power supply PCB layout is not good. Utility Model Content
[0006] The purpose of this invention is to provide a PCB layout structure for a fully modular power supply, thereby solving the technical problem of poor heat dissipation in existing modular power supply PCB layouts. The various technical effects of the preferred solutions among the many technical solutions provided by this invention are detailed below.
[0007] To achieve the above objectives, the present invention provides the following technical solution:
[0008] This utility model provides a PCB layout structure for a fully modular power supply, including a power board and an input BUCK circuit, an auxiliary power supply circuit, a primary-side full-bridge circuit, a main transformer, a secondary-side synchronous rectification circuit, a primary-side current sampling circuit, and a control circuit disposed on the power board; the power transistors in all circuits on the power board are distributed on the back of the power board, and the energy storage capacitors in all circuits are disposed on the front of the power board; heat dissipation auxiliary components are provided around the power transistors to dissipate heat from the power transistors.
[0009] Optionally, the input BUCK circuit includes a first BUCK inductor and a second BUCK inductor. The first BUCK inductor is disposed on the left side of the power board and close to the upper edge of the power board. The second BUCK inductor is disposed on the left side of the power board and close to the lower edge of the power board. Both the first BUCK inductor and the second BUCK inductor pass through the power board.
[0010] The area between the first BUCK inductor and the second BUCK inductor, and the area at the lower left corner of the power board, on the back side are the BUCK switching transistor and the freewheeling diode; the area between the first BUCK inductor and the second BUCK inductor, and the area at the lower left corner of the power board on the front side are the CT sampling circuit, the input capacitor, and the BUCK driving circuit.
[0011] Optionally, the auxiliary power supply circuit is located on the right side of the second BUCK inductor, and the auxiliary power supply circuit includes a magnetic core embedded in the power board, a power drive circuit, a rectifier and filter circuit, and an auxiliary power transformer.
[0012] Optionally, the primary-side current sampling circuit is located at the right-hand side between the first BUCK inductor and the second BUCK inductor, and is located on the front side of the power board; the primary-side current sampling circuit includes a current sampling resistor and an amplification circuit.
[0013] Optionally, the control circuit is located to the right of the first BUCK inductor. The control circuit includes a primary-side control circuit, a primary-secondary-side isolation circuit, a secondary-side voltage loop circuit, and a secondary-side current sharing loop circuit. The primary-side control circuit is located to the right of the first BUCK inductor. The primary-secondary-side isolation circuit is located to the right of the primary-side control circuit and includes a primary-secondary-side isolation drive circuit, an optocoupler, and a Y capacitor. The secondary-side voltage loop circuit is located to the right of the primary-secondary-side isolation circuit and is situated above the main transformer. The secondary-side current sharing loop circuit is located at the upper right corner of the power board.
[0014] Optionally, the main transformer includes a first transformer and a second transformer, which are located in the middle right position of the power board. Both the first transformer and the second transformer are fixed to the power board by a method of embedding magnetic cores into the power board.
[0015] Optionally, the primary-side full-bridge circuit is located on the left side of the main transformer. The primary-side full-bridge circuit includes a primary-side full-bridge MOSFET, a bus capacitor, and a full-bridge drive circuit. The primary-side full-bridge MOSFET is located on the back side of the power board, the bus capacitor is located on the front side of the power board, and the full-bridge drive circuit is located on both the front and back sides of the power board.
[0016] Optionally, the secondary-side synchronous rectification circuit is located on the right side of the main transformer. The secondary-side synchronous rectification circuit includes a secondary-side full-bridge MOSFET, an output capacitor, and a rectification drive circuit. The secondary-side full-bridge MOSFET is located on the back side of the power board, while the output capacitor and the rectification drive circuit are both located on the front side of the power board.
[0017] Optionally, the power board has a 20-layer structure.
[0018] Implementing one of the above-described technical solutions of this utility model has the following advantages or beneficial effects:
[0019] This utility model improves the overall power supply efficiency and reduces overall power loss through reasonable layout, and also enables the power transistors to have better heat dissipation, allowing the power supply module of the same size to achieve higher output power. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:
[0021] Figure 1 This is a schematic diagram of the circuit layout on the power board according to an embodiment of the present invention;
[0022] Figure 2 This is a schematic diagram of the front distribution of components on the power board according to an embodiment of the present invention;
[0023] Figure 3 This is a schematic diagram of the back side distribution of components on the power board according to an embodiment of the present invention. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments, illustrating various exemplary embodiments that may be adopted to implement this utility model. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this utility model disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this utility model.
[0025] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0026] To illustrate the technical solution described in this utility model, specific embodiments are described below, showing only the parts related to the embodiments of this utility model.
[0027] Example 1:
[0028] like Figure 1As shown, this utility model provides a PCB layout structure for a fully modular power supply, including a power board and an input BUCK circuit, auxiliary power supply circuit, primary-side full-bridge circuit, main transformer, secondary-side synchronous rectification circuit, primary-side current sampling circuit, and control circuit mounted on the power board. The power transistors in all circuits on the power board are distributed on the back side, while the energy storage capacitors in all circuits are located on the front side. Heat dissipation auxiliary components are provided around the power transistors to dissipate heat. Specifically, all power transistors are located on the back side of the power board, and all energy storage capacitors are located on the front side, concentrating the heat generated by the power transistors on the back side of the power board for convenient and efficient heat dissipation, while also minimizing power loops and losses. Filter capacitors are placed close together, and the power loops on both the primary and secondary sides are kept as short as possible to reduce losses. The heat dissipation auxiliary components are busbars or heat sinks; their placement next to the power transistors accelerates heat dissipation and improves the cooling efficiency of the power transistors.
[0029] This utility model improves the overall power supply efficiency and reduces overall power loss through reasonable layout, and also enables the power transistors to have better heat dissipation, allowing the power supply module of the same size to achieve higher output power.
[0030] As an optional implementation, the input BUCK circuit includes a first BUCK inductor and a second BUCK inductor. The first BUCK inductor is located on the left side of the power board, adjacent to the upper edge of the board, and the second BUCK inductor is located on the left side of the power board, adjacent to the lower edge of the board. Both the first and second BUCK inductors penetrate the power board. The back side of the area between the first and second BUCK inductors and the area at the lower left corner of the power board contains the BUCK switch and freewheeling diode. The front side of the area between the first and second BUCK inductors and the area at the lower left corner of the power board contains the CT sampling, input capacitor, and BUCK drive circuit. Specifically, the first and second BUCK inductors are respectively arranged on the upper and lower edges of the input side of the power board. The first and second BUCK inductors are independently installed in their respective positions using flat wire winding, which greatly reduces the current density of the coils, thereby reducing copper losses and temperature rise. The first and second BUCK inductors on the power board are mounted in a perforated structure, both penetrating the board. Their ends are exposed on the front and back of the board, respectively. The BUCK switch (i.e., the MOSFET in the BUCK circuit) controls the switching on and off of the input BUCK circuit. The freewheeling diode provides a path for the inductor to discharge when the BUCK switch is off. The input capacitor stores and filters the input power current, ensuring the reliability and stability of the input BUCK circuit. The BUCK driver circuit controls the switching on and off of the BUCK switch, enabling the charging and discharging of the BUCK inductors.
[0031] As an optional implementation, an auxiliary power supply circuit is located on the right side of the second BUCK inductor. This auxiliary power supply circuit includes a magnetic core embedded in the power board, a power drive circuit, a rectifier and filter circuit, and an auxiliary power transformer. Specifically, the auxiliary power supply circuit provides a stable power supply to each drive circuit and control circuit. The auxiliary power transformer enables voltage conversion, thereby providing the required voltage and current to each control circuit and drive circuit.
[0032] As an optional implementation, the primary-side current sampling circuit is located slightly to the right of the middle of the first and second BUCK inductors, on the front of the power board. The primary-side current sampling circuit includes a current sampling resistor and an amplifier circuit. Specifically, the primary-side current sampling circuit is used to detect the current information on the primary side of the main transformer, realizing short-circuit protection and overcurrent protection, ensuring the safe, stable, and efficient operation of the module power supply.
[0033] As an optional implementation, the control circuit is located to the right of the first BUCK inductor. The control circuit includes a primary-side control circuit, a primary-secondary isolation circuit, a secondary-side voltage loop circuit, and a secondary-side current sharing loop circuit. The primary-side control circuit is located to the right of the first BUCK inductor, and the primary-secondary isolation circuit is located to the right of the primary-side control circuit. The primary-secondary isolation circuit includes primary-secondary isolation drive circuits, optocouplers, and Y capacitors, etc. The secondary-side voltage loop circuit is located to the right of the primary-secondary isolation circuit and above the main transformer. The secondary-side current sharing loop circuit is located in the upper right corner of the power board. Specifically, the control circuit is located to the right of the first BUCK inductor and above the power board. The circuit layout on the power board consists of a power section and a control section, with the power section located below the control section. From the overall layout, the power section and control section loops are clearly defined and do not overlap, avoiding interference from the power section to the control circuit. The control current also includes a secondary-side current loop circuit, used to sample and amplify the current on the secondary side and then feed the current information from the secondary side back to the primary side via an optocoupler.
[0034] As an optional implementation, the main transformer includes a first transformer and a second transformer, which are positioned in the middle right of the power board. Both the first and second transformers are fixed to the power board using a magnetic core embedding method. Specifically, the main transformer is positioned in the middle right of the power board, adjacent to the output circuit of the power board. The main transformer achieves voltage conversion through a reasonably designed coil turns ratio, thereby outputting the required voltage and current, while simultaneously providing electrical isolation between the primary and secondary sides. The main transformer, including the first and second transformers, can increase the output power, enabling the module power supply to have higher power without changing its size.
[0035] As an optional implementation, the primary-side full-bridge circuit is located on the left side of the main transformer. This circuit includes primary-side full-bridge MOSFETs, a bus capacitor, and a full-bridge drive circuit. The primary-side full-bridge MOSFETs are located on the back of the power board, the bus capacitor is located on the front, and the full-bridge drive circuit is located on both the front and back of the power board. Specifically, the primary-side full-bridge circuit achieves voltage and current conversion on the secondary side by providing alternating current to the primary winding of the main transformer. The bus capacitor is used for energy storage and filtering, providing the necessary current to the primary winding of the transformer and improving circuit stability.
[0036] As an optional implementation, the secondary-side synchronous rectification circuit is located on the right side of the main transformer. The secondary-side synchronous rectification circuit includes a secondary-side full-bridge MOSFET, an output capacitor, and a rectification drive circuit. The secondary-side full-bridge MOSFET is located on the back of the power board, while the output capacitor and the rectification drive circuit are located on the front of the power board.
[0037] As an optional implementation, the power board has a 20-layer structure. Specifically, the power board has a 20-layer structure, with 10 layers each for the primary and secondary windings, resulting in good coupling and significantly reducing the current density and copper losses of the main transformer windings.
[0038] The embodiment is merely a special case and does not indicate that this utility model is implemented in such a way.
[0039] The above description is merely a preferred embodiment of the present utility model. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present utility model. Furthermore, under the teachings of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present utility model.
Claims
1. A PCB layout structure for a fully modular power supply, characterized in that, The power board and the input BUCK circuit, the auxiliary power supply circuit, the primary side full bridge circuit, the main transformer, the secondary side synchronous rectification circuit, the primary side current sampling circuit and the control circuit arranged on the power board; the power tubes in all circuits arranged on the power board are distributed on the back of the power board, and the energy storage capacitors in all circuits are arranged on the front of the power board; the peripheral side of the power tube is provided with a heat dissipation auxiliary part, and the power tube is cooled through the heat dissipation auxiliary part.
2. The PCB layout for a full brick modular power supply of claim 1, wherein, The input BUCK circuit comprises a first BUCK inductor and a second BUCK inductor, the first BUCK inductor is arranged on the left side of the power board and close to the board edge of the power board, the second BUCK inductor is arranged on the left side of the power board and close to the board edge of the power board, and the first BUCK inductor and the second BUCK inductor both penetrate through the power board. The back of the area between the first BUCK inductor and the second BUCK inductor and the area at the lower left corner of the power board is a BUCK switch tube and a freewheeling diode; the front of the area between the first BUCK inductor and the second BUCK inductor and the area at the lower left corner of the power board is a CT sampling, an input capacitor and a BUCK drive circuit.
3. The PCB layout for a full brick modular power supply of claim 2, wherein, The auxiliary power supply circuit is arranged on the right side of the second BUCK inductor, and the auxiliary power supply circuit comprises a magnetic core embedded in the power board, a power supply drive circuit, a rectification filter circuit and an auxiliary power supply transformer.
4. The PCB layout for a full brick modular power supply of claim 3, wherein, The primary side current sampling circuit is arranged at a position right to the first BUCK inductor and the second BUCK inductor and on the front of the power board; the primary side current sampling circuit comprises a current sampling resistor and an amplification circuit.
5. The PCB layout for a full brick modular power supply of claim 4, wherein, The control circuit is arranged on the right side of the first BUCK inductor, and the control circuit comprises a primary side control circuit, a primary and secondary side isolation circuit, a secondary side voltage loop circuit and a secondary side current loop circuit; the primary side control circuit is arranged on the right side of the first BUCK inductor; The primary and secondary side isolation circuit is arranged on the right side of the primary side control circuit, and the primary and secondary side isolation circuit comprises a primary and secondary side isolation drive circuit, an optical coupler and a Y capacitor; the secondary side voltage loop circuit is arranged on the right side of the primary and secondary side isolation circuit and above the main transformer; the secondary side current loop circuit is arranged at the upper right corner of the power board.
6. The PCB layout for a full brick modular power supply of claim 1, wherein, The main transformer comprises a first transformer and a second transformer, the first transformer and the second transformer are arranged at a position right to the middle of the power board, and the first transformer and the second transformer are both fixed on the power board by adopting a mounting method of embedding a magnetic core in the power board.
7. The PCB layout for a full brick modular power supply of claim 6, wherein, The primary side full bridge circuit is arranged on the left side of the main transformer, and the primary side full bridge circuit comprises a primary side full bridge MOS tube, a bus capacitor and a full bridge drive circuit, the primary side full bridge MOS tube is arranged on the back of the power board, the bus capacitor is arranged on the front of the power board, and the full bridge drive circuit is arranged on the front and back of the power board.
8. The PCB layout for a full brick modular power supply of claim 7, wherein, The secondary side synchronous rectification circuit is arranged on the right side of the main transformer, and comprises a secondary side full-bridge MOS tube, an output capacitor and a rectification driving circuit.
9. The PCB layout for a full brick modular power supply of any of claims 1-8, wherein, The power board has a 20-layer board structure.