Energy-saving soft circuit board

Abstract

The utility model belongs to the technical field of flexible circuit boards, and relates to an energy-saving soft circuit board, which comprises a soft circuit board main body. A plurality of groups of staggered stacking holes are formed in the top of the soft circuit board main body; pluggable assemblies are arranged on the two sides of the exterior of the soft circuit board body. A heat dissipation assembly is arranged at the bottom of the inner side of the soft circuit board main body; the flexible circuit board comprises a flexible circuit board main body, the top of the flexible circuit board main body is provided with a reinforcing assembly, and through the use of the heat dissipation assembly, the plugging assembly and the reinforcing assembly, when the flexible circuit board main body works, the flexible circuit board main body has good heat dissipation performance and is convenient to replace and maintain, the service life of the flexible circuit board main body is prolonged, and the service life of the flexible circuit board main body is prolonged. The situation that components in the soft circuit board body are damaged due to the fact that heat is accumulated in the soft circuit board body in the working process of the soft circuit board body is further reduced, the service life of the soft circuit board body is further prolonged, and the usability of the soft circuit board body is further improved.

Description

Technical Field

[0001] This utility model belongs to the field of flexible circuit board technology and relates to an energy-saving flexible circuit board. Background Technology

[0002] Flexible circuit boards are bendable and foldable circuit boards designed for scenarios requiring flexible connections and high-density integration. They consist of a substrate layer, a conductive layer, a cover film, and other structures, and feature flexibility, thinness, high-density integration, and environmental resistance. They have a wide range of applications in aerospace, mobile communications, and other fields.

[0003] For example, patent (CN222338693U) discloses a flexible circuit board, which describes that "it includes a flexible circuit board one, one end of which is electrically connected to a flexible circuit board two, the flexible circuit board one includes a main connector seat, the flexible circuit board two includes a secondary connector seat, a main plug frame plate is fixedly connected to the outer side of one end of the main connector seat, the inner wall of the main plug frame plate is provided with an inner insertion groove, and a main plug electrode plate is fixedly connected to the inner side of one end of the main connector seat; in this utility model, by inserting the main plug frame plate between the outer frame of the secondary plug and the secondary plug electrode plate, inserting the main plug electrode plate into the secondary plug electrode plate, and making multiple sets of main plug electrodes fit against the secondary plug electrodes until the inner insertion groove fits against the outer insertion groove, and the micro-arc surface protrusion is embedded in the micro-arc surface groove, the two sets of flexible circuit boards can be quickly and conveniently connected, and the set insertion structure can be firmly fitted and not easily loosened, and the overlapping insertion can effectively prevent dust or water from entering and provide a good protective effect."

[0004] When using the above technology, the following technical problems were found in the prior art: When using the above circuit board, during operation, due to the low thermal conductivity of polyimide, the material of the flexible circuit board, and its bendable characteristics, it is difficult to integrate high thermal conductivity materials such as graphene and boron nitride, resulting in low heat dissipation effect of the flexible circuit board. The accumulated high temperature will damage the electronic components inside the circuit board, thereby affecting the service life of the device. Utility Model Content

[0005] The technical problem to be solved by this utility model is that when the above-mentioned circuit board is used, during operation, due to the low thermal conductivity of the polyimide material of the flexible circuit board and its bendable characteristics, it is difficult to integrate high thermal conductivity materials such as graphene and boron nitride, resulting in low heat dissipation effect of the flexible circuit board. The accumulated high temperature will damage the electronic components inside the circuit board, thereby affecting the service life of the device.

[0006] The present invention discloses an energy-saving flexible circuit board, comprising a flexible circuit board body; the top of the flexible circuit board body is provided with multiple sets of staggered stacking holes; plug-in components are provided on both outer sides of the flexible circuit board body; a heat dissipation component is provided on the bottom inner side of the flexible circuit board body; and a reinforcement component is provided on the top of the flexible circuit board body.

[0007] The plug-in assembly includes a mounting plate; the mounting plate is located at both ends of the outer side of the flexible circuit board body; a pin is installed on the outside of the mounting plate; and an edge slot is provided on the other side of the mounting plate.

[0008] The heat dissipation component includes a conductive adhesive layer; the conductive adhesive layer is located on the bottom outer side of the flexible circuit board body; flexible heat dissipation fins are installed on the outer side of the conductive adhesive layer away from the flexible circuit board body.

[0009] The reinforcing component includes solder joints; the solder joints are located on the top outer side of the flexible circuit board body; and a copper plating layer is provided inside the staggered stacking holes.

[0010] Multiple sets of conductive tenons are installed on the outer side of the pin; multiple sets of tenons are installed on the inner side of the edge slot.

[0011] The pin has a guide angle on its outer side, and the guide angle is located on the inner side of the pin.

[0012] Compared with the prior art, the beneficial effects of this utility model are: by using heat dissipation components, plug-in components, and reinforcement components, the flexible circuit board body has good heat dissipation when working, while facilitating the replacement and maintenance of the flexible circuit board body. This further reduces the possibility of damage to the internal components of the flexible circuit board body due to heat accumulation during operation, and further increases the service life and usability of the flexible circuit board body.

[0013] The design of conductive tenons and grooves increases the contact area between the two ends of the flexible circuit board body and the connection point, resulting in greater direct friction between the two, which gives it stable signal transmission efficiency and good shock resistance. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the main structure of the flexible circuit board of this utility model.

[0016] Figure 2 This is a schematic diagram of the structure of the pin of this utility model.

[0017] Figure 3 This is a schematic diagram of the edge slot of this utility model.

[0018] Figure 4 This is a schematic diagram of the structure of the conductive adhesive layer of this utility model.

[0019] In the diagram: 1. Flexible circuit board body; 11. Staggered stacking holes; 2. Mounting plate; 21. Pin; 22. Edge slot; 3. Conductive adhesive layer; 31. Flexible heat dissipation fins; 4. Solder joint; 41. Copper plating layer; 5. Conductive tenon; 51. Mortise and tenon; 6. Guide angle. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0022] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0024] Example 1: As Figure 1 - Figure 4As shown, an energy-saving flexible circuit board includes a flexible circuit board body 1. The top of the flexible circuit board body 1 has multiple sets of staggered stacking holes 11. Pull-in assemblies are provided on both outer sides of the flexible circuit board body 1. A heat dissipation assembly is provided on the bottom inner side of the flexible circuit board body 1. A reinforcing assembly is provided on the top of the flexible circuit board body 1. The pull-in assemblies include mounting plates 2. The mounting plates 2 are located at both outer ends of the flexible circuit board body 1. Pins 21 are installed on the outside of the mounting plates 2. An edge slot 22 is provided on the other side of the mounting plates 2. The heat dissipation assembly includes a conductive adhesive layer 3. The conductive adhesive layer 3 is made of silicone and filled with silver powder. Silicone has strong resistance to bending, and the silver powder can reduce stress concentration. The conductive adhesive layer 3 is located on the outside of the flexible circuit board body 1. On the bottom side; a flexible heat dissipation fin 31 is installed on the outer side of the conductive adhesive layer 3 away from the flexible circuit board body 1. The flexible heat dissipation fin 31 is made of silver-plated copper alloy wire with a diameter of 50 micrometers and polyimide fiber mixed in a 3:1 ratio. It has good thermal conductivity and can be bent. Through material composite, the toughness of the flexible heat dissipation fin 31 is increased. The reinforcing component includes a solder joint 4. The solder joint 4 is located on the top outer side of the flexible circuit board body 1. A copper-plated layer 41 is provided inside the staggered stacking hole 11. The copper-plated layer 41 is made of copper and then silver paste is filled inside the copper-plated layer 41. This reduces the problem of micro-cracks when pure chemical copper is bent, and at the same time, it disperses stress and increases the bending life of the circuit board.

[0025] During operation, the conductive adhesive layer 3 and the flexible heat dissipation fins 31 are installed on the bottom of the flexible circuit board body 1. The flexible circuit board body 1 is then installed via the pins 21 and edge slots 22 on the outside of the mounting plate 2, ensuring that the circuit board does not directly contact the mounting area during operation. Simultaneously, the use of the flexible heat dissipation fins 31 increases the strength of the flexible circuit board body 1. The airflow channels inside the flexible heat dissipation fins 31 can carry away the heat generated by the flexible circuit board body 1 during operation, thus improving the heat dissipation efficiency of the device. The use of solder joints 4 allows the circuit board to... The surface component connections are more stable, and it has the characteristics of vibration and shock resistance. The array design reduces the occurrence of substrate cracking due to single-point overload of the flexible circuit board body 1. Through the use of heat dissipation components, plug-in components, and reinforcement components, the flexible circuit board body 1 has good heat dissipation during operation, while facilitating the replacement and maintenance of the flexible circuit board body 1. This further reduces the possibility of damage to the internal components of the flexible circuit board body 1 due to heat accumulation during operation, and further increases the service life and usability of the flexible circuit board body 1.

[0026] Example 2: Figure 2 - Figure 3 As shown, multiple sets of conductive tenons 5 are installed on the outer side of the pin 21; multiple sets of tenons 51 are installed on the inner side of the edge slot 22; a guide angle 6 is provided on the outer side of the pin 21, and the guide angle 6 is also provided on the inner side of the pin 21. By using the guide angle 6, a guiding effect is provided when the flexible circuit board body 1 is plugged in or out, which increases the stability when the flexible circuit board body 1 is plugged in or out.

[0027] During operation, when the pin 21 is inserted or removed from the edge slot 22, the design of the conductive tenon 5 and the tenon 51 increases the contact area between the two ends of the flexible circuit board body 1 and the connection point, resulting in greater direct friction between the two. This gives it stable signal transmission efficiency and good shock resistance. At the same time, a layer of cured silver epoxy resin is coated on the surface of the pin 21 and the edge slot 22, with a thickness between 50 micrometers and 200 micrometers. This maintains shock absorption and conductivity balance while reducing the possibility of increased resistance due to a thicker coating.

[0028] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the present utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present utility model, thereby enabling those skilled in the art to better understand and utilize it. The present utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An energy saving flexible circuit board, characterized by: Including soft circuit board body (1), the top of soft circuit board body (1) is equipped with a plurality of groups of staggered stacking hole (11), the both sides of soft circuit board body (1) are provided with plug and pull assembly, the inside bottom of soft circuit board body (1) is provided with heat dissipation assembly, the top of soft circuit board body (1) is provided with reinforcement assembly.

2. The energy saving flexible circuit board of claim 1, wherein: The plug and pull assembly includes a mounting plate (2), the mounting plate (2) is located at the both ends of the soft circuit board body (1), the outside of the mounting plate (2) is provided with a bolt (21), the other side of the mounting plate (2) is provided with an edge slot (22).

3. The energy saving flexible circuit board of claim 1, wherein: The heat dissipation assembly includes a conductive adhesive layer (3), the conductive adhesive layer (3) is located at the bottom of the soft circuit board body (1), the outside of the conductive adhesive layer (3) is provided with a flexible heat dissipation fin (31) away from the soft circuit board body (1).

4. The energy saving flexible circuit board of claim 1, wherein: The reinforcement assembly includes a welding point (4), the welding point (4) is located at the top of the soft circuit board body (1), the inside of the staggered stacking hole (11) is provided with a copper plating layer (41).

5. The energy saving flexible circuit board of claim 2, wherein: The outside of the bolt (21) is provided with a plurality of groups of conductive tenon (5), the inside of the edge slot (22) is provided with a plurality of groups of mortise (51).

6. The energy saving flexible circuit board of claim 2, wherein: The outside of the bolt (21) is provided with a guide angle (6), the guide angle (6) is opened in the inside of the bolt (21).

Images