Secondary reflow soldering heat insulation device

Abstract

The utility model discloses a secondary reflow soldering heat insulation device which comprises a carrier, a flexible circuit board, a steel sheet, a soft heat insulation material and an upper cover plate. The upper surface of the carrier sinks to form a first sinking area and a second sinking area so as to position the flexible circuit board and give way to a first welding device of the flexible circuit board; the steel sheet can be magnetized, and the steel sheet is windowed in a region corresponding to a second welding pad of the flexible circuit board and a region corresponding to the second welding pad; the soft heat insulation material is matched with the upper cover plate, a window is formed in a corresponding area of a second welding pad of the flexible circuit board, and a closed space is formed above the corresponding area of the second welding pad of the flexible circuit board; a plurality of permanent magnets are embedded in the bottom of the carrier; a plurality of permanent magnets are embedded in the top of the upper cover plate; the secondary reflow soldering nickel sheet heat insulation device is assembled and fixed through attraction of the permanent magnet, the steel sheet, the carrier and the upper cover plate.

Description

Technical Field

[0001] This utility model relates to the field of new energy integrated busbar CCS production technology, and in particular to a secondary reflow soldering heat insulation device. Background Technology

[0002] When performing double-sided reflow soldering on the FPC circuit board of the new energy integrated busbar CCS, some components have their bottom surfaces soldered on the entire surface, making them unsuitable for fixation with adhesive. Therefore, during the second reflow soldering of the FPC circuit board, the pads that were soldered in the first reflow may experience secondary solder melting during the second reflow, leading to soldering quality issues. This soldering quality is difficult to assess visually, thus posing a significant safety risk. Utility Model Content

[0003] This utility model aims to provide a heat insulation device for secondary reflow soldering to solve the above-mentioned problems. The technical solution is as follows:

[0004] A secondary reflow soldering heat insulation device includes a carrier, a flexible circuit board, steel sheets, flexible heat insulation material, and a top cover plate;

[0005] The upper surface of the carrier is lowered to form a first lowered area and a second lowered area; the first lowered area is used to position the flexible circuit board, and its depth is the same as the thickness of the flexible circuit board; the second welding pad of the flexible circuit board is placed upwards, and the second lowered area is used to make way for the first welding device on the flexible circuit board.

[0006] The steel sheet is magnetizable, and the steel sheet has windows in the corresponding areas of the second welding pads of the flexible circuit board.

[0007] The flexible thermal insulation material and the upper cover plate work together to create a window in the corresponding area of ​​the second welding pad of the flexible circuit board, and form a sealed space above the corresponding area of ​​the second welding pad of the flexible circuit board.

[0008] Multiple permanent magnets are embedded in the bottom of the carrier; multiple permanent magnets are embedded in the top of the upper cover plate; through the permanent magnets, the steel sheet is attracted to the carrier and the upper cover plate, thereby realizing the assembly and fixation of the secondary reflow welding heat insulation device.

[0009] Furthermore, the flexible thermal insulation material is disposed between the steel sheet and the upper cover plate, and the flexible thermal insulation material has a window in the area corresponding to the second welding pad of the flexible circuit board; the upper cover plate does not have a window in the area corresponding to the second welding pad of the flexible circuit board.

[0010] Furthermore, the flexible thermal insulation material is disposed on the upper cover plate, and the flexible thermal insulation material does not have windows in the area corresponding to the second welding pad of the flexible circuit board; the upper cover plate has windows in the area corresponding to the second welding pad of the flexible circuit board.

[0011] Furthermore, the flexible thermal insulation material and the top cover are bonded together as a single unit using high-temperature resistant adhesive.

[0012] Furthermore, the flexible thermal insulation material is silicone with a thickness of 1.5–2.5 mm.

[0013] Furthermore, the material of the vehicle and the upper cover plate is synthetic stone.

[0014] Furthermore, the thickness of the steel sheet is 0.08–0.20 mm.

[0015] Furthermore, the steel sheet has a window at the MARK point on the second welding surface of the flexible circuit board.

[0016] Furthermore, the steel sheet limits the maximum size of a single window by setting a 2-3mm wide pressure strip in the window opening area.

[0017] Furthermore, the secondary reflow soldering heat insulation device is also fixed by positioning columns.

[0018] Compared with the prior art, the significant feature of this utility model is that the device sinks or opens the bottom carrier, steel sheet and top cover plate on the device position on the flexible circuit board to prevent direct contact and heat conduction between them and the device on the flexible circuit board. By taking advantage of the poor thermal conductivity of air, it prevents the temperature of the first welding position from being too high and causing secondary solder melting. Attached Figure Description

[0019] Figure 1 This is a stacked view of the secondary reflow soldering heat insulation device according to the first embodiment of this utility model;

[0020] Figure 2 This is a front view of the bottom carrier of the first embodiment of this utility model;

[0021] Figure 3 This is a front view of the FPC according to the first embodiment of this utility model;

[0022] Figure 4 This is a reverse view of the FPC of the first embodiment of this utility model;

[0023] Figure 5 This is a front view of the steel sheet according to the first embodiment of this utility model;

[0024] Figure 6 This is a front view of the flexible thermal insulation material according to the first embodiment of this utility model;

[0025] Figure 7 This is a front view of the top cover plate according to the first embodiment of this utility model;

[0026] Figure 8 This is a stacked view of the secondary reflow soldering heat insulation device according to the second embodiment of this utility model;

[0027] Figure 9 This is a front view of the top cover plate of the second embodiment of this utility model;

[0028] Figure 10 This is a front view of the flexible thermal insulation material according to the second embodiment of this utility model. Detailed Implementation

[0029] To further illustrate the various embodiments, the present invention provides accompanying drawings. These drawings are part of the disclosure of the present invention and are mainly used to illustrate the embodiments, and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these drawings, those skilled in the art should be able to understand other possible implementations and the advantages of the present invention. Components in the drawings are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0030] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0031] Example 1

[0032] like Figures 1 to 7 As shown, the secondary reflow soldering heat insulation device in this embodiment, from bottom to top, consists of a carrier 1, an FPC 2, a steel sheet 3, silicone or other soft heat insulation material 4, and a top cover plate 5. Wherein:

[0033] FPC 2 requires two reflow soldering processes. The first reflow soldering is mainly for soldering components such as chip resistors, chip capacitors, chip inductors, and chips, and the corresponding pad is the first soldering pad 201. The second reflow soldering is mainly for soldering components such as sockets, and the corresponding pad is the second soldering pad 202. Both reflow soldering processes can be performed on one or both sides of the FPC 2. The FPC 2 also has a marker point 203 for positioning.

[0034] The carrier 1 is generally made of synthetic stone with a thickness of 3-7mm. The carrier 1 is precision-machined and milled to create a first recessed area 101 and a second recessed area 102. The first recessed area 101 is recessed according to the product shape of the FPC 2. Preferably, the recessed dimension is 0.5-1.0mm larger than the product shape of the FPC, and the recessed depth is the thickness of the FPC 2, so that the secondary welding pads are flush with the surface of the carrier 1. Magnets 7 are embedded in the bottom of the carrier 1. The diameter of the magnets 7 is preferably 5-20mm, and the spacing is preferably 25-50mm for uniform distribution. These magnets are used to attract the steel sheet 3 and the upper cover plate 5, ensuring a better fit, preventing reflow soldering hot air from entering, and also serving a fixing function.

[0035] The second recessed area 102 serves as a buffer zone for the first soldering pad 201 of the FPC 2. The buffer can be designed as a single pad or multiple pads as a whole. Preferably, the buffer zone is compensated by 1-10mm on each side according to the size of the pad, with a recessed depth of 2-4mm, to prevent the soldered device from contacting the carrier 1. This is mainly achieved by utilizing the poor thermal conductivity of air.

[0036] The thickness of the steel sheet 3 is preferably 0.08–0.20 mm. The steel sheet 3 has a window cut at the pad location of the component to be soldered on the FPC 2. For the first soldering pad 201, the window size is 1–10 mm larger on one side than the first soldering pad 201 (multiple pads can also be made into a single window). If the window is large, a 2–3 mm wide pressure strip 303 can be added at 1 / 2–1 / 3 of the opening to prevent the FPC pad from lifting during the second reflow soldering. The pressure strip should avoid being directly above the first soldering pad 201 to prevent direct heat conduction from contacting it. For the second soldering pad 202, the size is determined based on the convenience of reflow soldering and is not limited here.

[0037] The flexible thermal insulation material 4 is generally made of 1.5-2.5mm thick red silicone or other flexible thermal insulation materials. A window is made in the corresponding area 402 of the second welding pad 202 of the flexible thermal insulation material 4, with the same window size as the corresponding area 302 of the steel sheet 3; a window is also made in the corresponding area 401 of the first welding pad, with the window size increasing by 1-10mm on each side compared to the first welding pad (or multiple pads can be made into a single window).

[0038] The top cover plate 5 is generally made of synthetic stone, with a thickness of 3-7mm. An opening is made in the corresponding area 502 of the second welding pad 202 on the top cover plate 5, the size of which is the same as the corresponding area 302 of the steel sheet 3; no opening is made in the corresponding area of ​​the first welding pad, its function being to isolate the reflow soldering hot air from direct exposure. A magnet 8 is embedded in the top of the top cover plate 5, preferably with a diameter of 5-20mm and a uniform spacing of 25-50mm.

[0039] The flexible insulation material 4 and the top cover 5 can be used separately or bonded together with high-temperature resistant adhesive for easy operation.

[0040] In this embodiment, each shelf is provided with positioning holes 103, 303, 403 and 503 at its four corners, and is fixed by four positioning posts 9 to achieve precise positioning between the shelves.

[0041] Welding steps:

[0042] 1. Install the FPC by lowering it according to the shape of the bottom carrier 1, with the pads to be reflowed facing upwards.

[0043] 2. Install steel sheet 3 onto FPC 2 according to the positioning holes based on the shape of the steel sheet window, ensuring that steel sheet 3 is flat.

[0044] 3. By recognizing the mark points, the solder paste printer applies solder to the area to be soldered on the second soldering surface of FPC 2, and then performs placement.

[0045] 4. The flexible thermal insulation material 4 is installed on the steel sheet 3 by manual labor or a robotic arm through the positioning holes.

[0046] 5. Place the top cover plate 5 onto the soft insulation material 4 by manually or with a robotic arm through the positioning holes.

[0047] 6. Place the assembled heat insulation device on the reflow soldering rail for welding.

[0048] This device lowers or opens the bottom carrier, steel sheet 3, and flexible heat insulation material 4 at the device positions on the FPC circuit board, preventing them from directly contacting the nickel sheet for heat conduction. It also takes advantage of the poor thermal conductivity of air to prevent the temperature at the first soldering position from becoming too high and causing secondary solder melting.

[0049] Example 2:

[0050] like Figure 8 As shown, the secondary reflow soldering heat insulation device in this embodiment consists of, from bottom to top, a carrier 1, an FPC 2, a steel sheet 3, an upper cover plate 5, and silicone or other soft heat insulation material 4.

[0051] This embodiment is similar to Embodiment 1; the processing of carrier 1, FPC 2, and steel sheet 3 is as follows. Figure 2 - Figure 5 As shown in Example 1, the materials selected for the upper cover plate 5 and the flexible thermal insulation material 4 are the same as those in Example 1. The main difference lies in the stacking order of the flexible thermal insulation material 4 and the upper cover plate 5 and the opening treatment.

[0052] like Figure 9 and Figure 10As shown, in this embodiment, the upper cover plate 5 has an opening at the corresponding position of the first welding pad 201. The size of the opening is 1-10mm larger on one side than the pad within the first welding pad 201 (or multiple pads can be opened as a whole). The flexible heat insulation material 4 does not have an opening at the position of the first welding pad, and its function is to isolate the reflow soldering hot air from blowing directly. Similarly, the flexible heat insulation material 4 and the upper cover plate 5 can be used separately, or they can be bonded together with high-temperature resistant adhesive for easy operation.

[0053] The welding steps are as follows:

[0054] 1. Install the FPC by lowering it according to the shape of the bottom carrier, with the pads to be reflow soldered facing upwards.

[0055] 2. Install steel sheet 3 onto FPC 2 according to the positioning holes based on the shape of the steel sheet window, ensuring that steel sheet 3 is flat.

[0056] 3. By recognizing the mark points, the solder paste printer applies solder to the area to be soldered, and then the components are mounted.

[0057] 4. Place the top cover plate 5 onto the steel sheet 3 manually or with a robotic arm through the positioning holes.

[0058] 5. The silicone is installed on the upper cover plate 5 by manually or with a robotic arm through the positioning holes.

[0059] 6. Place the assembled heat insulation device on the reflow soldering rail for welding.

[0060] This device lowers or opens the bottom carrier, steel sheet, and top cover plate on the FPC circuit board to prevent direct contact and heat conduction between them and the components on the FPC circuit board. It also takes advantage of the poor thermal conductivity of air to prevent the temperature at the first soldering position from becoming too high and causing secondary solder melting.

[0061] Although the present invention has been specifically shown and described in conjunction with preferred embodiments, those skilled in the art should understand that various changes in form and detail may be made to the present invention without departing from the spirit and scope of the present invention as defined in the appended claims, and all such changes shall be within the scope of protection of the present invention.

Claims

1. A secondary reflow soldered nickel fin thermal isolation device characterized by: The carrier, the flexible circuit board, the steel sheet, the soft thermal insulation material and the upper cover plate; The upper surface of the carrier is sunken to form a first sunken area and a second sunken area; the first sunken area is used to position the flexible circuit board, and the depth of the first sunken area is consistent with the thickness of the flexible circuit board; the second sunken area is used to give space to the first soldering device of the flexible circuit board, and the second soldering pads of the flexible circuit board are placed upward; The steel sheet is magnetizable, and the steel sheet is windowed in the corresponding area of the second soldering pads of the flexible circuit board and the area of the corresponding area of the second soldering pads; The soft thermal insulation material and the upper cover plate cooperate to window the corresponding area of the second soldering pads of the flexible circuit board and form a closed space above the corresponding area of the second soldering pads of the flexible circuit board; The bottom of the carrier is embedded with a plurality of permanent magnets, and the top of the upper cover plate is embedded with a plurality of permanent magnets; through the permanent magnets, the steel sheet is attracted to the carrier and the upper cover plate to realize the assembly and fixation of the secondary reflow soldering nickel sheet thermal insulation device.

2. The secondary reflow soldering nickel sheet heat insulating device according to claim 1, characterized by: The soft thermal insulation material is arranged between the steel sheet and the upper cover plate, and the soft thermal insulation material is windowed in the corresponding area of the second soldering pads of the flexible circuit board; the upper cover plate is not windowed in the corresponding area of the second soldering pads of the flexible circuit board.

3. The secondary reflow soldering nickel sheet heat insulating device according to claim 1, wherein: The soft thermal insulation material is arranged on the upper cover plate, and the soft thermal insulation material is not windowed in the corresponding area of the second soldering pads of the flexible circuit board; the upper cover plate is windowed in the corresponding area of the second soldering pads of the flexible circuit board.

4. The secondary reflow soldering nickel sheet heat insulating device according to claim 1, wherein: The soft thermal insulation material and the upper cover plate are bonded into one body by high-temperature resistant glue.

5. The secondary reflow soldering nickel sheet heat insulating device according to claim 1, wherein: The soft thermal insulation material is silica gel, and the thickness is 1.5-2.5 mm.

6. The secondary reflow soldering nickel fin heat barrier apparatus of claim 1, wherein: The materials of the carrier and the upper cover plate are synthetic stone.

7. The secondary reflow soldering nickel sheet heat insulating device according to claim 1, wherein: The thickness of the steel sheet is 0.08-0.20 mm.

8. The secondary reflow soldering nickel fin heat barrier device of claim 1, wherein: The steel sheet is windowed at the MARK point of the second soldering surface of the flexible circuit board.

9. The secondary reflow soldering nickel fin heat barrier device of claim 1, wherein: The steel sheet limits the maximum size of a single window by arranging a 2-3 mm wide pressing strip in the windowed area.

10. The secondary reflow soldering nickel fin heat barrier device of claim 1, wherein: It is also fixed by a positioning column.

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