Panel display module

Abstract

The utility model discloses a faceted display module, which relates to the field of semiconductor LED (light-emitting diode) devices and comprises a PCB (printed circuit board) and a plurality of LED devices, the LED devices are welded and fixedly mounted on one side of the PCB to form an LED module, the faceted display module further comprises filling resin, gaps of the LED devices are filled with the filling resin through a silk-screen / spraying process, and the filling resin is adhered to the PCB and the LED devices; according to the panel display module, after the LED device is welded to one side of the PCB, the space between the LED device and the PCB is filled with the filling resin, white marks caused by residues of a welding material and solder paste soldering flux are covered, meanwhile, connection between the LED device and the PCB is enhanced, the problem that the ink colors of the LED module are inconsistent due to the ink color difference of the PCB is solved, and the display effect of the panel display module is improved. And the contrast ratio of the LED module is improved, and the brightness of the module is not influenced, so that the reliability of a product is improved.

Description

Technical Field

[0001] This utility model relates to semiconductor LED device technology, specifically to a panel display module. Background Technology

[0002] LED panels, as an advanced lighting and display technology, are widely used in various places and fields in modern society due to their unique advantages, becoming an important part of the lighting and display industry. The core of this panel lies in the light-emitting diode (LED), these tiny semiconductor elements that can efficiently convert electrical energy into visible light, thereby achieving lighting or image display functions.

[0003] LED panels are typically designed with exquisite detail and diverse styles to meet the needs of various locations and applications. They not only offer excellent lighting effects but also provide clear, detailed image displays, making information delivery more intuitive and vivid. Furthermore, LED panels boast numerous advantages such as energy efficiency, long lifespan, rich colors, adjustable brightness, and ease of control and maintenance.

[0004] In the lighting field, LED panels are widely used in various environments such as homes, offices, commercial spaces, and public areas. They provide comfortable and uniform lighting effects, reduce energy consumption and carbon emissions, aligning with modern green and environmentally friendly lighting concepts. Furthermore, LED panels can adjust brightness and color temperature according to actual needs, creating different lighting atmospheres to meet diverse requirements.

[0005] In the display field, LED panels also perform exceptionally well. They are widely used in televisions, monitors, billboards, stage backdrops, and other applications, providing high-definition, high-color-saturation image displays that allow viewers to enjoy a more realistic and immersive visual experience. Furthermore, LED panels support various display modes and functions, such as 3D display and touch operation, further expanding their application range.

[0006] With the continuous development of technology, LED panel technology is also constantly innovating and upgrading. For example, the emergence of micro-LED technology has enabled LED panels to have higher pixel density and better display effects; at the same time, the application of intelligent control technology has made LED panels more intelligent and convenient, bringing people a more comfortable and efficient user experience.

[0007] Current LED panel packaging technology generally relies on transparent resin materials and compression molding or injection molding processes, which are quite difficult to manufacture. This not only requires huge equipment investment, but also faces the challenge of rapid iteration of LED products, that is, old equipment is often difficult to adapt to the manufacturing process requirements of new products.

[0008] During the packaging process, differences in ink color and dimensions between the PCB board and the finished product result in uneven adhesive layer thickness, affecting ink color consistency and severely weakening the display effect. To solve this problem, secondary lamination or inkjet printing is often required, increasing costs, reducing production efficiency, and leading to difficulties in handling leftover stock and inventory backlog.

[0009] Products manufactured using panelization technologies such as MIP, GOB, and COB often become unusable when encountering problems such as uneven ink color, LED failure, or obvious signs of repair, resulting in a waste of resources. Utility Model Content

[0010] The purpose of this invention is to provide a panel-based display module to address the shortcomings of existing LED panel packaging technology, which relies on transparent resin and molding processes, resulting in high manufacturing difficulty, low first-pass yield, and high maintenance difficulty.

[0011] To achieve the above objectives, this utility model provides the following technical solution: a panel-based display module, comprising a PCB board and several LED devices, wherein the LED devices are soldered and fixedly mounted on one side of the PCB board to form an LED module, and further comprising:

[0012] A filling resin is used to fill the gaps between LED devices through a screen printing / spraying process, and the filling resin is bonded to the PCB board and several LED devices.

[0013] A panel, which is located on the side filled with resin;

[0014] A transparent resin is disposed between the panel and the filler resin, wherein the filler resin and the panel are bonded together by the transparent resin;

[0015] Several driver ICs are fixedly mounted on the side of the PCB board away from the LED device, and the driver ICs are electrically connected to the LED device;

[0016] Low-stress resin is injected onto one side of the driver IC via a glue injection / spraying process. The low-stress resin is bonded and fixed to the driver IC and to the PCB board.

[0017] A plastic steel fixture is disposed on the outside of a low-stress resin, and the plastic steel fixture is fixedly connected to the PCB board.

[0018] Furthermore, the panel is a transparent panel.

[0019] Furthermore, the filling resin is black.

[0020] Furthermore, the transparent resin is transparent.

[0021] Furthermore, the plastic steel fixture is connected to the PCB board by bolts or magnetic posts.

[0022] Furthermore, the panel has a pattern on the side away from the resin filling.

[0023] Compared with the prior art, the panel display module provided by this utility model, after soldering the LED device to one side of the PCB board, uses filling resin to fill the space between the LED device and the PCB board, which covers the white marks caused by the residue of soldering material and solder paste flux, enhances the connection between the LED device and the PCB board, solves the problem of inconsistent ink color of the LED module caused by the difference in ink color of the PCB board, improves the contrast of the LED module without affecting the brightness of the module, thereby increasing the reliability of the product.

[0024] By using injection / spraying processes to fill the drive surface IC with low-stress resin, the manufacturing process is simplified and the first-pass yield is improved. The existing bottom shell is replaced by a plastic steel jig, which enhances the strength of the module.

[0025] By filling the space between the panel and the LED module with transparent resin, the internal stress of the resin is reduced, while the ability to resist impact, bumps and scratches is enhanced. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0027] Figure 1 A schematic diagram of the overall structure provided for an embodiment of this utility model;

[0028] Figure 2 An exploded view of the overall structure provided for an embodiment of this utility model;

[0029] Figure 3 This is a partial structural cross-sectional view of an embodiment of the present utility model;

[0030] Figure 4 A partial structural schematic diagram provided for an embodiment of this utility model;

[0031] Figure 5 This is a partial structural bottom view diagram provided for an embodiment of the present utility model;

[0032] Figure 6 A schematic diagram of the plastic steel fixture structure provided in the embodiment of this utility model.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1. PCB board; 2. Filling resin; 3. Transparent resin; 4. Panel; 5. Plastic steel fixture; 6. Low-stress resin; 7. LED device; 8. Driver IC. Detailed Implementation

[0035] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0036] Example 1:

[0037] Please see Figures 1-5 A panel-type display module includes a PCB board 1 and several LED devices 7, wherein the LED devices 7 are soldered and fixedly mounted on one side of the PCB board 1 to form an LED module, and further includes:

[0038] Filling resin 2 is used to fill the gaps between LED devices 7 through screen printing / spraying process. Filling resin 2 is bonded to PCB board 1 and several LED devices 7.

[0039] Panel 4 is disposed on one side of the resin filling 2;

[0040] Transparent resin 3 is disposed between panel 4 and filling resin 2, and filling resin 2 and panel 4 are bonded together by transparent resin 3;

[0041] Several driving surfaces IC8 are fixedly mounted on the side of the PCB board 1 away from the LED device 7, and the driving surfaces IC8 are electrically connected to the LED device 7.

[0042] Low-stress resin 6 is injected onto one side of drive surface IC8 through injection / spraying process. Low-stress resin 6 is bonded and fixed to drive surface IC8 and to PCB board 1.

[0043] Plastic steel fixture 5 is set on the outside of low-stress resin 6 and is fixedly connected to PCB board 1.

[0044] Panel 4 is a transparent panel.

[0045] The filler resin 2 is black.

[0046] Transparent resin 3 is transparent.

[0047] The plastic steel fixture 5 is connected to the PCB board 1 by bolts or magnetic posts.

[0048] The specific implementation method is as follows: LED device 7 is a CH IP / TOP / M IP device. The single module size range of the LED module is L≤500mm and W≤500mm. The fixing process of LED device 7 and PCB board 1 is SMT, i.e., surface mount technology. The filling resin 2 is a resin material with added black agent and low stress materials, such as glass powder and diffusion powder, which is cured by heating in a tunnel oven / setting it at room temperature. This filling resin 2 has the characteristics of high heat dissipation, high adhesion, low stress, and high contrast. It can effectively solve the delamination and whitening problems caused by solder paste flux residue and insufficient bonding force of LED bead pins. It covers the black color difference on the surface of PCB board 1, improves the contrast of the product, and does not affect the brightness of the normal operation of the LED module. The material of low stress resin 6 includes, but is not limited to, acrylic (PMMA) resin. Low stress resin 6 is applied to the driving surface 1 of the LED module through injection / spraying process. C8 is used for potting. Low-stress resin 6 has the characteristics of high heat dissipation, high airtightness, and low-stress transparency. The existing bottom shell is replaced by a plastic steel fixture 5, which enhances the strength of the LED module and provides a surrounding coating. The top of the plastic steel fixture 5 is equipped with connectors such as screws and magnetic pillars for fixing the LED module. The driving surface I C8 is completely located inside the plastic steel fixture 5, ensuring that the plastic steel fixture 5 will not affect the driving surface I C8, and at the same time, it replaces the bottom shell to provide protection. The panel 4 is a transparent panel, which is one of PC / PP / PET / acrylic or plexiglass. A dam is applied to the interface between the panel 4 and the filling resin 2, and then transparent resin 3 is injected for filling. The panels are then pressed together in a vacuum environment to bond the panel 4 to the surface of the LED module, which enhances the impact resistance, bump resistance and scratch resistance of the LED module. The panel 4 is completely bonded to the surface of the LED module through thermosetting / photosetting / room temperature curing to form a protective layer. Then the edges are cut to finally form the panel display module.

[0049] Example 2:

[0050] Please see Figure 2 , Figure 3 and Figure 6 This embodiment provides a technical solution based on embodiment one: the panel 4 has a pattern on the side away from the filling resin 2.

[0051] The specific implementation method is as follows: the pattern is printed or cut out on the surface of panel 4 using 3D printing, laser or CNC. When using CNC to cut out panel 4, the cutout position is selected directly above the lamp beads of LED device 7 to remove the pattern outline. This solution can display the pattern effect when the screen is off without power, improving the static aesthetics.

[0052] Example 3:

[0053] This embodiment provides a technical solution based on Embodiments 1 and 2: The manufacturing process of this panel display module is as follows:

[0054] S1. Using SMT technology, LED devices 7, namely CH IP / TOP / M IP devices, are fixed on one side of PCB board 1 to form an LED module. The size of a single LED module is L≤500mm and W≤500mm.

[0055] S2. The gaps between the LED beads of the LED device 7 are filled with resin 2 through screen printing / spraying process. After filling, the resin 2 is heated in a tunnel oven / placed at room temperature to cure, which covers the solder paste flux residue generated by welding and the traces of whitening of the LED bead pins, so that the PCB board 1 has a uniform ink color. During filling, a steel mesh is used to protect the LED bead surface to prevent the resin 2 from contaminating the LED bead surface.

[0056] S3. The LED module driver surface, i.e. the side of the driver surface IC8, is potted with glue through the injection / spraying process. The material used is low-stress resin 6. A plastic steel jig 5 is used as the bottom shell to enhance strength and surround the glue. The plastic steel jig 5 is fixed to the bottom of the PCB board 1 with screws or magnetic pillars. Finally, a multi-head injection system is used to inject glue onto the surface of the LED module. Vibration is used to make the glue flow level.

[0057] S4. The LED module is fully encapsulated by vacuum pressing. A damming adhesive is applied to the bottom of panel 4, and then transparent resin 3 is injected. The module is pressed in a vacuum environment to bond panel 4 to the surface of filling resin 2, which enhances the module's ability to resist impact, bumps, and scratches. Then, panel 4 is fully bonded by thermosetting / light curing / room temperature curing to form a protective layer.

[0058] S5. The edges are cut and shaped to form a panel-type display module.

[0059] S6. Aging the panel display module to fully cure the encapsulating adhesive;

[0060] S7. Prepare images of corresponding sizes according to the panel display module size. The images can include one or more of the following: landscape images, mirror images, wood grain images, marble images, etc.

[0061] S8. Print the prepared image on the surface of panel 4 at a 1:1 scale using 3D printing technology, and then perform secondary encapsulation after printing.

[0062] S9. Assemble the printed pattern panel display modules to form an LED display screen.

[0063] The LED display screen made in this way has high strength. When repairing a defective LED module, it can effectively cover the repair marks on the LED module. At the same time, it can also strengthen the connection between the repaired LED device 7 and the PCB board 1. Various resin materials are used for connection, curing and encapsulation, which enhances heat dissipation performance and reduces the amount of movement between the LED device 7 and the PCB board 1 during thermal expansion, thereby improving the product's lifespan. When static, this LED display screen can be used to display the printed patterns on it, enhancing its static viewing experience.

[0064] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A panelized display module comprising a PCB board (1) and a plurality of LED devices (7), the plurality of LED devices (7) being soldered and fixedly mounted on one side of the PCB board (1) to form an LED module, characterized in that, Also included are: a filling resin (2) filling the gap of the LED device (7) through a silk screen / spraying process, the filling resin (2) being bonded with the PCB board (1) and the several LED devices (7); a panel (4) arranged on one side of the filling resin (2); a transparent resin (3) arranged between the panel (4) and the filling resin (2), the filling resin (2) being bonded with the panel (4) through the transparent resin (3); several drive ICs (8) fixedly installed on the side of the PCB board (1) away from the LED device (7), the drive IC (8) being electrically connected with the LED device (7); a low-stress resin (6) injected on one side of the drive IC (8) through a glue injection / spraying process, the low-stress resin (6) being bonded with the drive IC (8) and fixedly bonded with the PCB board (1); a plastic steel jig (5) arranged on the outside of the low-stress resin (6), the plastic steel jig (5) being fixedly connected with the PCB board (1).

2. The panelized display module of claim 1, wherein, The panel (4) is a transparent plate.

3. The panelized display module of claim 1, wherein: The filling resin (2) is black.

4. The panelized display module of claim 1, wherein, The transparent resin (3) is transparent.

5. The panelized display module of claim 1, wherein, The plastic steel jig (5) is connected with the PCB board (1) through bolts or magnetic columns.

6. The panelized display module of claim 5, wherein, The side of the panel (4) away from the filling resin (2) is provided with a pattern.

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