Wafer dry etching equipment for semiconductor production
By designing a movable placement seat and jet head in the dry etching equipment, the problem of low wafer processing uniformity was solved, achieving higher processing quality and airtightness, and improving the uniformity and effect of wafer processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2026-03-06
AI Technical Summary
Existing dry etching equipment is immobile, resulting in low wafer processing uniformity and affecting processing quality.
A movable mounting base and jet head were designed. The movement of the wafer and jet head is achieved by a motor-driven lead screw that drives the bushing, ensuring that the processing gas is evenly sprayed onto different areas of the wafer.
It improves the uniformity of wafer processing, enhances processing quality, and improves the airtightness of the equipment through the sealing ring, thereby enhancing the processing effect.
Smart Images
Figure CN223979023U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of dry etching equipment technology, specifically a wafer dry etching equipment for semiconductor production. Background Technology
[0002] Dry etching equipment is a device used to etch micron and nanometer-scale structures. It mainly utilizes gas chemical reactions to produce physical or chemical reactions on exposed parts of the chip (wafer) or other material surfaces, thereby achieving the etching purpose.
[0003] Currently, in semiconductor manufacturing, dry etching equipment is required to process wafers. However, existing dry etching equipment cannot be moved during processing, which results in low uniformity of wafer processing and seriously affects the quality of wafer processing.
[0004] To address this, a wafer dry etching device for semiconductor manufacturing is proposed. Utility Model Content
[0005] The purpose of this invention is to provide a wafer dry etching device for semiconductor manufacturing.
[0006] To achieve the above objectives, this utility model provides the following technical solution:
[0007] A wafer dry etching apparatus for semiconductor manufacturing, comprising:
[0008] Sealed box;
[0009] A sealing door is hinged to the front surface of the sealed box;
[0010] The bottom of the sealed box is provided with an installation groove, and the front surface of the sealed box is provided with a first through hole that communicates with the installation groove. A first motor is installed on the front surface of the sealed box, and the output end of the first motor is connected to a first lead screw that passes through the first through hole and is located inside the installation groove via a coupling.
[0011] A first bushing is installed on the outer wall of the first lead screw, a first connecting seat is fixed on the outer wall of the first bushing, and a placement seat is fixed on the top of the first connecting seat;
[0012] The right outer wall of the sealing box has a second through hole, and a second motor is installed on the right outer wall of the sealing box. The output end of the second motor is connected to a second lead screw that passes through the second through hole and extends into the interior of the sealing box through a coupling. A second bushing is installed on the outer wall of the second lead screw, and a second connecting seat is fixed on the outer wall of the second bushing. An air jet head is installed at the bottom of the second connecting seat.
[0013] An air intake pipe is installed on the outer wall of the jet head, and the end of the air intake pipe away from the jet head passes through the sealed box and is connected to the external gas equipment.
[0014] Preferably, the front surface of the sealing box is provided with a first sealing ring that abuts against the first motor.
[0015] Preferably, a second sealing ring is provided on the outer right side wall of the sealing box to abut against the second motor.
[0016] Preferably, the top of the first connecting seat has two symmetrical movable slots, which are respectively located on both sides of the placement seat. Each of the two movable slots has a clamping strip movably installed inside it. Each of the two movable slots has a telescopic rod fixed to one inner wall. One end of the telescopic rod away from the inner wall of the movable slot is fixed to the clamping strip. A spring is provided on the outer wall of the telescopic rod. One end of the spring is fixed to one inner wall of the movable slot, and the other end of the spring is fixed to the clamping strip.
[0017] Preferably, each of the two clamping strips has a soft pad at one end facing the other.
[0018] Preferably, each of the two movable slots has a sliding groove at its bottom, a slider is installed in the sliding groove, and the clamping bar is fixed to the top of the slider.
[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0020] This invention utilizes a first motor, which drives a first lead screw to operate. Under the action of the lead screw, the first bushing moves the wafer mounting base. Similarly, by activating a second motor, the second lead screw drives a second lead screw to operate. Under the action of the second lead screw, the second bushing moves the jet nozzle. Compared to existing designs, both the wafer mounting base and the jet nozzle in this invention are movable. The jet nozzle can spray processing gas to different areas of the wafer, resulting in higher processing uniformity and improved wafer processing quality. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0022] Figure 2 This is a schematic diagram of the internal structure of the sealed box of this utility model;
[0023] Figure 3 This is a schematic diagram of the structure of the first sealing ring and the second sealing ring in this utility model;
[0024] Figure 4 This is a schematic diagram of the clamping strip structure in this utility model.
[0025] In the diagram: 1. Sealed box; 2. Sealed door; 3. Mounting groove; 4. First perforation; 5. First motor; 6. First lead screw; 7. First bushing; 8. First connecting seat; 9. Placement seat; 10. Second perforation; 11. Second motor; 12. Second lead screw; 13. Second bushing; 14. Second connecting seat; 15. Jet nozzle; 16. Inlet pipe; 17. First sealing ring; 18. Second sealing ring; 19. Movable groove; 20. Clamping bar; 21. Soft pad; 22. Telescopic rod; 23. Spring; 24. Slide groove; 25. Slider. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.
[0028] Example 1:
[0029] Please see Figure 1-4 This utility model provides a technical solution: To achieve the above objectives, this utility model provides the following technical solution: A wafer dry etching equipment for semiconductor production, comprising: a sealed box 1; a sealed door 2 hinged to the front surface of the sealed box 1; an installation groove 3 is provided at the bottom of the sealed box 1; a first through hole 4 communicating with the installation groove 3 is provided on the front surface of the sealed box 1; a first motor 5 is installed on the front surface of the sealed box 1; the output end of the first motor 5 is connected to a first lead screw 6 passing through the first through hole 4 and located inside the installation groove 3 via a coupling; a first bushing 7 is installed on the outer wall of the first lead screw 6; a first connecting seat 8 is fixed on the outer wall of the first bushing 7; and a placement seat 9 is fixed on the top of the first connecting seat 8; the right side of the sealed box 1... The wall has a second through hole 10. A second motor 11 is installed on the right outer wall of the sealed box 1. The output end of the second motor 11 is connected to a second lead screw 12 that passes through the second through hole 10 and extends into the interior of the sealed box 1 via a coupling. A second bushing 13 is installed on the outer wall of the second lead screw 12. A second connecting seat 14 is fixed on the outer wall of the second bushing 13. A jet head 15 is installed at the bottom of the second connecting seat 14. An air inlet pipe 16 is installed on the outer wall of the jet head 15. The end of the air inlet pipe 16 away from the jet head 15 passes through the sealed box 1 and communicates with the external gas equipment. A first sealing ring 17 that abuts against the first motor 5 is provided on the front surface of the sealed box 1. A second sealing ring 18 that abuts against the second motor 11 is provided on the right outer wall of the sealed box 1.
[0030] Specifically, in this invention, by activating the first motor 5, the first motor 5 drives the first lead screw 6 to work. Under the action of the first lead screw 6, the first bushing 7 drives the placement seat 9 (wafer) to move. Similarly, by activating the second motor 11, the second motor 11 drives the second lead screw 12 to work. Under the action of the second lead screw 12, the second bushing 13 drives the jet head 15 to move. Compared with the existing technology, in this invention, both the placement seat 9 (wafer) and the jet head 15 are movable. The jet head 15 can spray processing gas to different areas of the wafer, resulting in higher processing uniformity of the wafer and thus improving the processing quality of the wafer.
[0031] Because a first sealing ring 17 and a second sealing ring 18 are provided, and the first sealing ring 17 and the second sealing ring 18 respectively abut against the first motor 5 and the second motor 11, the first sealing ring 17 and the second sealing ring 18 can improve the airtightness at the first through hole 4 and the second through hole 10, thereby improving the overall airtightness of the sealing box 1 and indirectly improving the processing effect on the wafer.
[0032] Example 2:
[0033] Please see Figure 2 , 4 This utility model provides a technical solution: a wafer dry etching device for semiconductor production, wherein two movable slots 19 are symmetrically opened on the top of the first connecting seat 8, and the two movable slots 19 are respectively located on both sides of the placement seat 9. A clamping strip 20 is movably arranged in each of the two movable slots 19. A telescopic rod 22 is fixed to the inner wall of one side of each of the two movable slots 19. One end of the telescopic rod 22 away from the inner wall of the movable slot 19 is fixed to the clamping strip 20. A spring 23 is provided on the outer wall of the telescopic rod 22. One end of the spring 23 is fixed to the inner wall of one side of the movable slot 19, and the other end of the spring 23 is fixed to the clamping strip 20. A soft pad 21 is provided at the opposite end of each of the two clamping strips 20. A sliding groove 24 is opened at the bottom of each of the two movable slots 19. A slider 25 is installed in the sliding groove 24, and the clamping strip 20 is fixed to the top of the slider 25.
[0034] Specifically, the spring 23 will drive the telescopic rod 22 to stretch. When the telescopic rod 22 stretches, it will drive the clamping strip 20 to move. After the two clamping strips 20 come into contact with the wafer, the wafer can be fixed to prevent the wafer from moving during processing and improve the processing effect of the wafer.
[0035] Furthermore, a soft pad 21 is provided at one end of the two clamping bars 20 facing each other, which can prevent the clamping bars 20 from damaging the wafer.
[0036] Working principle:
[0037] The operator first places the wafer onto the surface of the placement base 9. Then, under the action of the spring 23, the telescopic rod 22 is driven to stretch. When the telescopic rod 22 stretches, it drives the clamping strips 20 to move. After the two clamping strips 20 come into contact with the wafer, the wafer is fixed. The operator then closes the sealing door 2 and starts the external gas equipment. The external gas equipment sprays special gas onto the wafer surface through the air inlet pipe 16 and the jet nozzle 15 to process the wafer. At the same time, the operator starts the first motor 5, which drives the first lead screw 6. Under the action of the first lead screw 6, the first bushing 7 drives the placement base 9 (wafer) to move. Similarly, by starting the second motor 11, the second motor 11 drives the second lead screw 12. Under the action of the second lead screw 12, the second bushing 13 drives the jet nozzle 15 to move. Since both the placement base 9 (wafer) and the jet nozzle 15 are movable, the jet nozzle 15 can spray the processing gas to different areas of the wafer, resulting in higher processing uniformity of the wafer.
[0038] In the description of this utility model, it should be understood that the terms "center", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this utility model.
[0039] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A wafer dry etching apparatus for semiconductor manufacturing, characterized in that, Include: Sealed box (1); The front surface of the sealed box (1) is hingedly installed with a sealed door (2); The bottom of the sealed box (1) is provided with a mounting groove (3), and the front surface of the sealed box (1) is provided with a first through hole (4) in communication with the mounting groove (3), and a first motor (5) is installed on the front surface of the sealed box (1), and the output end of the first motor (5) is connected with a first lead screw (6) penetrating through the first through hole (4) and located in the mounting groove (3); The first lead screw (6) is installed on the outer wall of the first lead screw (6), and the first connecting seat (8) is fixed on the outer wall of the first connecting seat (8), and the placing seat (9) is fixed on the top of the first connecting seat (8); The right outer wall of the sealed box (1) is provided with a second through hole (10), and a second motor (11) is installed on the right outer wall of the sealed box (1), and the output end of the second motor (11) is connected with a second lead screw (12) penetrating through the second through hole (10) and extending into the sealed box (1), and the second lead screw (12) is installed on the outer wall of the second lead screw (12), and the second connecting seat (14) is fixed on the outer wall of the second connecting seat (14), and the air jet head (15) is installed on the bottom of the second connecting seat (14); The outer wall of the air jet head (15) is provided with an air inlet pipe (16), and the end of the air inlet pipe (16) away from the air jet head (15) penetrates the sealed box (1) and communicates with the external gas equipment.
2. The wafer dry etching apparatus for semiconductor production according to claim 1, wherein The front surface of the sealed box (1) is provided with a first sealing ring (17) abutting with the first motor (5).
3. The wafer dry etching apparatus for semiconductor production according to claim 1, wherein The right outer wall of the sealed box (1) is provided with a second sealing ring (18) abutting with the second motor (11).
4. The wafer dry etching apparatus for semiconductor production according to claim 1, wherein The top of the first connecting seat (8) is symmetrically provided with two movable grooves (19), and the two movable grooves (19) are respectively arranged on the two sides of the placing seat (9), and the two movable grooves (19) are movably provided with clamping strips (20), and the inner wall of one side of the two movable grooves (19) is fixedly provided with a telescopic rod (22), and one end of the telescopic rod (22) away from the inner wall of one side of the movable groove (19) is fixed with the clamping strip (20), and the outer wall of the telescopic rod (22) is provided with a spring (23), and one end of the spring (23) is fixed with the inner wall of one side of the movable groove (19), and the other end of the spring (23) is fixed with the clamping strip (20).
5. The wafer dry etching apparatus for semiconductor production according to claim 4, wherein The opposite ends of the two clamping strips (20) are provided with soft pads (21).
6. The wafer dry etching apparatus for semiconductor production according to claim 4, wherein The inner bottom of the two movable grooves (19) is provided with a sliding groove (24), and the sliding groove (24) is provided with a sliding block (25), and the clamping strip (20) is fixed on the top of the sliding block (25).