Locking state monitoring device and wafer loading equipment

By monitoring the keyhole status before docking with the wafer loading equipment and wafer transfer box, and utilizing the cooperation of laser sensors and processing units, the docking failure problem caused by abnormal keyhole status was solved, improving the reliability of monitoring and equipment efficiency.

CN223979025UActive Publication Date: 2026-03-06ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2026-03-06

AI Technical Summary

Technical Problem

Existing technology cannot identify whether the lock hole status of the wafer transfer box is abnormal, which leads to wafer transfer box unlocking failure, affects the service life of loading equipment, and reduces equipment efficiency.

Method used

Before the wafer loading equipment and wafer transfer box are docked, the status of the keyhole is monitored by the ranging unit and the processing unit. The distance is measured by the laser sensor and the comparison is used to judge the anomaly. The system includes the transmitting system, receiving system, photoelectric detection system, signal processing circuit and analog-to-digital conversion circuit. The distance is calculated by the time-of-flight method or the phase method.

Benefits of technology

It enables automatic judgment of keyhole status, improves the reliability and efficiency of monitoring, avoids docking failure, and extends the service life of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

A locking state monitoring device and wafer loading equipment, the locking state monitoring device is used for monitoring the locking hole state of a wafer transfer box before the wafer loading equipment and the wafer transfer box are in butt joint, and the locking state monitoring device comprises a distance measuring unit and a processing unit, the distance measuring unit is used for measuring the distance between the wafer loading equipment and a lock hole of the wafer conveying box, and the processing unit is used for receiving distance information measured by the distance measuring unit and comparing the distance with a normal distance so as to judge whether the state of the lock hole of the wafer conveying box is abnormal or not. By monitoring the state of the lockhole before butt joint, the abnormal state of the lockhole of the wafer conveying box can be found in time, and butt joint failure caused by the abnormal state of the lockhole is avoided. In addition, through cooperation of the distance measuring unit and the processing unit, automatic judgment of the state of the lock hole is achieved, and the monitoring reliability and efficiency are improved.
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Description

Technical Field

[0001] This utility model relates to the semiconductor field, and in particular to a locking status monitoring device and a wafer loading device. Background Technology

[0002] In the semiconductor manufacturing industry, the front-opening unified pod (FOUP) is a key device specifically designed for storing and transporting wafers. It features a front-opening design that allows automated equipment to perform wafer storage and retrieval operations without moving the entire container.

[0003] Currently, in wafer manufacturing equipment, the wafer loading port serves as the channel for wafers to enter and exit the equipment. It requires frequent docking and unlocking operations with the wafer transport box. This process primarily relies on reading the positioning pins of the wafer transport box to identify its type and correct placement. Specifically, the wafer transport box is first moved above the wafer loading port, then lowered vertically to ensure its bottom hole accurately aligns with the positioning pins on the wafer loading port platform.

[0004] However, a significant drawback exists: the inability to identify abnormalities in the lock position of the wafer transfer box. When the lock position of the wafer transfer box is incorrect, it leads to two serious problems: firstly, it easily causes wafer transfer box unlocking failure; secondly, it affects the lifespan of the unlocking device on the wafer loading equipment. These problems not only prolong subsequent processing time but also reduce the equipment's wafer handling capacity (WPH). This abnormality stems from the previous process or other machine operations causing the lock to not be properly locked or unlocked. Utility Model Content

[0005] The problem solved by this utility model is to provide a locking status monitoring device and a wafer loading equipment, which can detect abnormal states of the locking holes of the wafer transfer box in a timely manner and avoid docking failures caused by abnormal locking hole states.

[0006] To address the aforementioned problems, this utility model provides a locking status monitoring device for monitoring the locking hole status of the wafer transport box before docking the wafer loading equipment and the wafer transport box. The locking status monitoring device includes: a ranging unit for measuring the distance from the wafer loading equipment to the locking hole of the wafer transport box; and a processing unit for receiving the distance from the wafer loading equipment to the locking hole of the wafer transport box measured by the ranging unit, comparing the measured distance with a normal distance, and determining whether the locking hole status of the wafer transport box is abnormal.

[0007] Accordingly, this utility model also provides a wafer loading device, comprising: the ranging unit employing a laser sensor, the laser sensor comprising: a transmitting system for providing emitted light to the keyhole; a receiving system for receiving reflected light generated by the keyhole reflecting the emitted light; a photoelectric detection system for converting the reflected light into an electrical signal; a signal processing circuit for amplifying and filtering the electrical signal; an analog-to-digital conversion circuit for converting the processed electrical signal into a digital signal; and a calculation unit for calculating the distance based on the digital signal using a time-of-flight method or a phase method.

[0008] Compared with the prior art, the technical solution of this utility model has the following advantages:

[0009] The locking status monitoring device provided in this embodiment of the invention is used to monitor the locking hole status of the wafer transport box before docking between the wafer loading equipment and the wafer transport box. The locking status monitoring device includes a ranging unit and a processing unit. The ranging unit measures the distance from the wafer loading equipment to the locking hole of the wafer transport box. The processing unit receives the distance information measured by the ranging unit and compares this distance with a normal distance to determine whether the locking hole status of the wafer transport box is abnormal. By monitoring the locking hole status before docking, abnormal states of the wafer transport box's locking holes can be detected in a timely manner, avoiding docking failures caused by abnormal locking hole status. Furthermore, the cooperation between the ranging unit and the processing unit enables automatic judgment of the locking hole status, improving the reliability and efficiency of monitoring. Attached Figure Description

[0010] Figure 1 This is a functional block diagram of the locking status monitoring device;

[0011] Figure 2 This is a functional block diagram of the ranging unit of the locking status monitoring device;

[0012] Figure 3 This is a partial schematic diagram of the keyhole in the wafer transfer box when it is functioning normally;

[0013] Figure 4 This is a partial schematic diagram of a lock hole malfunction in a wafer transfer box;

[0014] Figure 5 This is a functional block diagram of the wafer loading equipment;

[0015] Figure 6 This is a flowchart of the wafer loading equipment process;

[0016] Figure 7 This is a schematic diagram of the wafer loading equipment. Detailed Implementation

[0017] As the background technology reveals, a significant drawback exists: the inability to identify abnormalities in the lock hole status of the wafer transfer box. When the lock hole is not in the correct position, two serious problems arise: firstly, it easily leads to wafer transfer box unlocking failure; secondly, it affects the lifespan of the unlocking device on the wafer loading equipment. These problems not only prolong subsequent processing time but also reduce the equipment's wafer handling capacity (WPH). This abnormality stems from the previous process or other machine operations causing the lock to not be properly locked or unlocked.

[0018] To address the technical problem, the locking status monitoring device provided in this embodiment of the invention is used to monitor the locking hole status of the wafer transport box before docking between the wafer loading equipment and the wafer transport box. The locking status monitoring device includes a ranging unit and a processing unit. The ranging unit measures the distance from the wafer loading equipment to the locking hole of the wafer transport box. The processing unit receives the distance information measured by the ranging unit and compares this distance with a normal distance to determine whether the locking hole status of the wafer transport box is abnormal. By monitoring the locking hole status before docking, abnormal states of the wafer transport box's locking holes can be detected in a timely manner, avoiding docking failures caused by abnormal locking hole status. Furthermore, the cooperation between the ranging unit and the processing unit enables automatic judgment of the locking hole status, improving the reliability and efficiency of monitoring.

[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0020] Figure 1 and Figure 2 This is a schematic diagram of the locking status monitoring device according to an embodiment of the present invention.

[0021] like Figure 1 As shown, the locking status monitoring device 100 is used to monitor the locking hole status of the wafer transport box before the wafer loading equipment and the wafer transport box are docked. The locking status monitoring device 100 includes: a ranging unit 10, used to measure the distance from the wafer loading equipment to the locking hole of the wafer transport box; and a processing unit 20, used to receive the distance from the wafer loading equipment to the locking hole of the wafer transport box measured by the ranging unit 10, and compare the measured distance with the normal distance to determine whether the locking hole status of the wafer transport box is abnormal.

[0022] The locking status monitoring device 100 provided in this embodiment of the invention is used to monitor the locking hole status of the wafer transport box before docking the wafer loading equipment and the wafer transport box. The locking status monitoring device 100 includes a ranging unit 10 and a processing unit 20. The ranging unit 10 is used to measure the distance from the wafer loading equipment to the locking hole of the wafer transport box. The processing unit 20 is used to receive the distance information measured by the ranging unit 10 and compare the distance with the normal distance to determine whether the locking hole status of the wafer transport box is abnormal. By monitoring the locking hole status before docking, abnormal states of the locking holes of the wafer transport box can be detected in time, avoiding docking failures caused by abnormal locking hole status. In addition, the cooperation of the ranging unit 10 and the processing unit 20 realizes automatic judgment of the locking hole status, improving the reliability and efficiency of monitoring.

[0023] The ranging unit 10 is used to measure the distance from the wafer loading equipment to the lock hole of the wafer transfer box.

[0024] In this embodiment, the ranging unit 10 is disposed on the wafer loading equipment and is used to measure the distance from the wafer loading equipment to the lock hole of the wafer transfer box. By measuring this critical distance, the state of the lock hole of the wafer transfer box can be determined, and abnormalities in the lock hole can be detected in a timely manner. Therefore, it can prevent equipment damage caused by forced unlocking and is beneficial to improving the service life and working efficiency of the wafer loading equipment.

[0025] like Figure 2 As shown, the ranging unit 10 uses a laser sensor, which includes: a transmitting system 101 that provides emitted light to the keyhole; a receiving system 102 that receives reflected light generated by the keyhole reflecting the emitted light; an electrical detector that converts the reflected light into an electrical signal; a signal processing circuit 104 that amplifies and filters the electrical signal; an analog-to-digital converter 105 that converts the processed electrical signal into a digital signal; and a calculation unit 106 that calculates the distance based on the digital signal using the time-of-flight method or the phase method.

[0026] The ranging unit 10 completes the entire process of converting emitted light signals into distance data through optical ranging. First, the transmitting system 101 emits a light signal, thereby directly relating the light signal to the keyhole status. Then, the receiving system 102 and the photoelectric detection system 103 convert the reflected light into a processable electrical signal. Therefore, the signal can be optimized and digitized by the signal processing circuit 104 and the analog-to-digital conversion circuit 105. Finally, the calculation unit 106 uses a professional ranging algorithm to obtain the accurate distance, which is beneficial for providing a reliable data foundation for subsequent keyhole status determination.

[0027] The emitted light from the transmitting system 101 is reflected by the keyhole and captured by the receiving system 102, directly reflecting the keyhole's state. The received reflected light is converted into an electrical signal by the photoelectric detection system 103, and then amplified and filtered by the signal processing circuit 104 to ensure signal quality. The digital signal, converted by the analog-to-digital converter 105, is finally used by the calculation unit 106 for distance calculation. Through this progressive signal processing, the accuracy and reliability of the ranging results are ensured, providing a basis for the processing unit 20 to determine the keyhole's state.

[0028] The transmitting system 101 monitors the lock hole status by providing emitted light to the lock hole of the wafer transfer box. When the lock hole is abnormal, it is blocked, and when the emitted light shines on the lock hole, the reflected light fails to enter the lock hole. When the lock hole is normal, it is unobstructed, and when the emitted light shines on the lock hole, the reflected light can enter the lock hole. Therefore, when the lock hole is normal, the emitted light travels a greater distance than when it is abnormal.

[0029] like Figure 3 and Figure 4 As shown, keyhole 400 is normally unobstructed, corresponding to the locking mechanism in the wafer transfer box. However, under abnormal conditions, such as... Figure 4 As shown, the keyhole 400 is obstructed by the lock plate or latch in the locking mechanism. Specifically, when the locking mechanism is in its normal state, the keyhole 400 is not obstructed (e.g., Figure 3 As shown in the image, due to issues in the previous process or other machine operation, the locking plate may become stuck in an abnormal position. This abnormal position causes the locking plate to block the measurement path of the laser sensor, resulting in a shorter measured distance. This mechanical obstruction not only affects the unlocking operation but may also cause problems such as the wafer transfer box door jamming or damage to the unlocking mechanism.

[0030] In this embodiment, the transmitting system 101 uses a laser as the emission light source, which features high precision and fast response. The installation position of the transmitting system 101 is precisely calculated and adjusted to ensure that the emitted light can accurately illuminate the keyhole of the wafer transfer box, providing a reliable light source basis for subsequent distance measurement.

[0031] The receiving system 102 receives the emitted light reflected from the keyhole, and the received reflected light is then transmitted to the photoelectric detection system 103 for photoelectric conversion, providing input for subsequent signal processing. This serial operation ensures a complete link from optical signal acquisition to data processing.

[0032] In this embodiment, the receiving system 102 includes optical receiving devices: a condenser lens group for collecting and focusing reflected light; the condenser lens group consists of multiple optical lenses, which can effectively converge reflected light returning from different angles onto the photoelectric detection system 103. An optical filter is used to filter out interfering light sources such as ambient light, allowing only reflected light of specific wavelengths to pass through, thereby improving measurement accuracy. An optical path adjustment mechanism is used to ensure that reflected light can be accurately incident on the photoelectric detection system 103.

[0033] The photoelectric detection system 103 converts the optical signal reflected from the keyhole into an electrical signal, thereby realizing the conversion from optical information to electrical information, and providing basic data for subsequent signal processing and distance calculation.

[0034] In this embodiment, a silicon-based PIN photodiode is used as the photoelectric detection system 103. Silicon-based PIN photodiodes have the characteristics of fast response speed and high sensitivity, enabling them to quickly respond to changes in reflected light; moreover, they operate stably at room temperature, making them suitable for long-term reliable operation in industrial environments; and they possess good linear characteristics, which is beneficial for improving ranging accuracy.

[0035] The signal processing circuit 104 improves the signal-to-noise ratio and quality of the signal through amplification and filtering, thereby ensuring the accuracy and reliability of the ranging data. Therefore, it provides a high-quality signal input for subsequent analog-to-digital conversion and distance calculation, which is beneficial to improving the accuracy of the entire locking state monitoring.

[0036] In this embodiment, the signal processing circuit 104 includes a preamplifier circuit: since the photoelectric detection system 103 outputs a weak current signal, the preamplifier needs to convert and amplify it into a voltage signal. This stage uses a low-noise transimpedance amplifier (TIA), which can achieve current-to-voltage conversion and primary amplification while maintaining a good signal-to-noise ratio. It also includes a main amplifier circuit: employing a variable gain amplifier (VGA), to amplify the signal to a suitable amplitude range so that the subsequent analog-to-digital conversion circuit 105 can sample it correctly.

[0037] The analog-to-digital converter circuit 105 converts the processed electrical signal into a digital signal, thereby realizing the signal form conversion and providing processable digital data for the subsequent computing unit 106. It plays a crucial signal conversion role in the entire ranging process.

[0038] In this embodiment, the analog-to-digital conversion circuit 105 can be a high-speed successive approximation register (SAR) ADC. Choosing a SAR ADC offers the advantages of a faster sampling rate and moderate resolution.

[0039] The computing unit 106 receives the digital signal after analog-to-digital conversion.

[0040] In this embodiment, the calculation unit 106 uses the time-of-flight method or the phase method to calculate the distance, thereby obtaining the accurate distance value from the wafer loading device to the keyhole of the wafer transfer box, and thus providing key data support for judging whether the keyhole status is abnormal.

[0041] The processing unit 20 receives the measurement data from the ranging unit 10 and compares it with the preset normal distance, thereby realizing real-time monitoring and judgment of the key hole status of the wafer transfer box.

[0042] In this embodiment, the processing unit 20 receives distance data measured by the ranging unit 10 in real time through the data interface, forming a complete monitoring-judgment-response link.

[0043] Specifically, the processing unit 20 includes a programmable logic controller (PLC) or an industrial computer (IPC).

[0044] In this embodiment, the processing unit 20 is used to determine that the key hole status of the wafer transfer box is abnormal when the measured distance is less than the normal distance.

[0045] The processing unit 20 determines the keyhole status by comparing the measured distance with the normal distance, thus achieving real-time monitoring of the keyhole status of the wafer transfer box. When the measured distance is less than the normal distance, it indicates an abnormality in the lock's position, and the processing unit 20 can promptly issue an abnormal signal. A complete monitoring closed loop is formed between the processing unit 20 and the ranging unit 10. The ranging unit 10 is responsible for collecting distance data in real time and transmitting this data to the processing unit 20. After receiving this data, the processing unit 20 compares it with the stored normal distance to determine the keyhole status.

[0046] In this embodiment, the locking status monitoring device 100 further includes a memory 30, used to measure the normal distance from the wafer loading device to the locking hole of the wafer transfer box when the locking hole of the wafer transfer box is in normal condition.

[0047] The memory 30 stores the normal distance values ​​from the wafer loading equipment to the keyhole of the wafer transfer box, thus providing a standard reference value for the processing unit 20. This allows the processing unit 20 to accurately determine whether the keyhole status is abnormal by comparing the distance measured in real-time by the ranging unit 10 with the normal distance stored in the memory 30, thereby improving the accuracy and reliability of keyhole status monitoring. The memory 30, ranging unit 10, and processing unit 20 form a complete monitoring link: ranging unit 10 is responsible for real-time distance measurement, memory 30 provides standard distance values ​​under normal conditions, and processing unit 20 determines the keyhole status by comparing these two distance values. When the measured distance is less than the normal distance, processing unit 20 can determine that the keyhole status is abnormal. This collaborative work among the three ensures the accuracy and real-time performance of the monitoring process.

[0048] In this embodiment, the locking status monitoring device 100 further includes a communication interface for sending a signal to the wafer loading device to indicate whether the locking hole status of the wafer transfer box is normal or abnormal.

[0049] The communication interface sends signals to the wafer loading equipment to indicate the status of the wafer transfer box lock hole, enabling the wafer loading equipment to know the status of the wafer transfer box lock hole in a timely manner. When an anomaly is detected, the UNCLAMP command is immediately executed to unlock the wafer transfer box. Therefore, the unlocking device can avoid unlocking the wafer transfer box in an abnormal state, which helps to prevent problems such as the wafer transfer box door jamming or damage to the unlocking mechanism.

[0050] In this embodiment, the communication interface can adopt industrial real-time communication protocols such as RS-485, EtherCAT, or PROFINET, which can respond to changes in the lock hole status in a timely manner.

[0051] refer to Figure 5 and Figure 6 The present invention also provides a wafer loading device, characterized in that it is used to dock with a wafer transfer box. The wafer loading device includes: a locking state monitoring device 100; and a control unit 200, which is used to receive the judgment result of the processing unit 20 in the locking state monitoring device 100, and to perform an error reporting operation 200h when an abnormal state is detected.

[0052] The wafer loading equipment provided in this embodiment includes a locking status monitoring device 100 and a control unit 200. The control unit 200 receives the judgment result from the processing unit 20 in the locking status monitoring device 100 and performs an error reporting operation 200h when an abnormal state is detected. By monitoring the lock hole status of the wafer transfer box through the locking status monitoring device 100 and promptly performing an error reporting operation 200h by the control unit 200, abnormal states can be detected and handled before the wafer loading equipment docks with the wafer transfer box, thereby avoiding equipment damage caused by forced unlocking and effectively extending the service life of the wafer loading equipment.

[0053] In this embodiment, as Figure 7 As shown, the ranging unit 10 is disposed on the wafer loading device, and the transmitting system 101 is located outside the wafer loading device.

[0054] The control unit 200 receives the judgment result from the processing unit 20 in the locking status monitoring device 100 and promptly performs an error reporting operation 200h when an abnormality is detected in the lock hole status of the wafer transfer box, thereby achieving preventive protection for the wafer loading equipment. Through rapid response and timely warning, the control unit 200 effectively avoids equipment damage caused by forced unlocking, effectively extending the service life of the wafer loading equipment.

[0055] In this embodiment, the control unit 200 has signal processing capabilities, automated control functions, and a full protection mechanism.

[0056] Specifically, the signal processing capability is reflected in its ability to receive and process the judgment results from the processing unit 20 in the locking status monitoring device 100, which can monitor the changes in the lock hole status of the wafer transfer box in real time and respond quickly when an anomaly is detected; the automation control function is reflected in its ability to automatically execute the UNCLAMP (unlock) command when an abnormal state is detected, and can be integrated with the wafer fab material handling system (AMHS) to achieve full automation; the safety protection mechanism is reflected in its timely detection and handling of abnormal lock hole status of the wafer transfer box, which reduces the manual handling time when the machine fails, avoids forced unlocking operations, effectively protects the machine's unlocking mechanism, and extends the service life of the wafer loading equipment.

[0057] In this embodiment, the wafer loading device further includes a display 300, which is connected to the control unit 200 and is used to display alarm information when an abnormal state is detected.

[0058] The display 300 serves as the human-machine interface in the wafer loading equipment. Through its connection with the control unit 200, it promptly displays alarm information when an abnormality is detected in the lock hole status of the wafer transfer box, enabling operators to quickly be aware of the abnormal situation and take corresponding manual intervention measures, such as executing the stop locking operation 200g to separate the wafer transfer box from the wafer loading equipment.

[0059] The ranging unit 10 measures the distance from the wafer loading device to the keyhole of the wafer transfer box, providing raw data on abnormal conditions to the display 300. The processing unit 20 receives the measurement data from the ranging unit 10, compares it with the normal distance to determine whether the keyhole status is abnormal, and transmits the determination result to the display 300. The communication interface is used to send signals to the wafer loading device to indicate whether the keyhole status of the wafer transfer box is normal or abnormal, ensuring that the display 300 can accurately receive abnormal status information.

[0060] In this embodiment, the display 300 is connected to the control unit 200 to receive and display abnormal status information.

[0061] Specifically, the workflow is as follows: When the ranging unit 10 detects an abnormal state, the system will display corresponding alarm information on the display 300. Based on the alarm information on the display 300, the operator will promptly intervene manually to adjust the lock to the normal position. It should be noted that this abnormal situation stems from problems in the previous process or other machine operations that resulted in the lock not being properly locked or unlocked.

[0062] In this embodiment, the wafer loading device further includes: a robotic arm for transporting wafers from a wafer transfer box; and a wafer end effector disposed at the end of the robotic arm for gripping wafers.

[0063] Robotic arms and wafer grippers are key components for automated wafer handling. The robotic arm handles large-scale spatial movement, while the wafer gripper at its end precisely grasps and releases wafers, ensuring safe and efficient wafer transport during manufacturing. The combination of robotic arms and wafer grippers not only improves production efficiency but also reduces the risks of contamination and damage associated with manual operation.

[0064] In this embodiment, the robotic arm is used to perform wafer handling functions, responsible for wafer transfer in multiple stages of the wafer manufacturing process, including on / off line operations, pre-process batching, and post-process merging. The robotic arm has multi-degree-of-freedom motion capabilities, enabling complex spatial position movements.

[0065] In this embodiment, the wafer gripper is located at the end of the robotic arm and serves as a tool that directly contacts the wafer, responsible for the precise gripping and release of the wafer.

[0066] In this embodiment, the wafer loading device includes: a loading and unloading platform; and a positioning pin, which is disposed on the loading and unloading platform and is used to dock with the hole at the bottom of the wafer transfer box.

[0067] Precise positioning of the wafer transfer box (FOUP) is achieved by physically aligning a positioning pin with a hole on the bottom of the loading / unloading platform. This positioning mechanism not only ensures the accuracy of the wafer transfer box's position during loading but also provides a reliable positional reference for subsequent processes such as locking status monitoring, unlocking operations, and wafer transfer.

[0068] It should be noted that the loading / unloading platform and the positioning mechanism of the positioning pins provide the working basis for the locking status monitoring device 100. Only when the wafer transfer box is correctly positioned by the positioning pins can the locking status monitoring device 100 accurately measure the distance from the wafer loading equipment to the locking hole of the wafer transfer box.

[0069] It should be noted that the bottom of the wafer transfer box is specially designed with holes that mate with positioning pins. This design allows the wafer transfer box to be precisely positioned without moving the entire container.

[0070] In this embodiment, the loading and unloading platform serves as the carrier platform for the wafer transfer box. Its surface is provided with positioning pins, which are raised columnar structures used for precise docking with the holes at the bottom of the wafer transfer box.

[0071] The specific workflow is as follows: First, move the wafer transfer box above the loading and unloading platform; then lower the wafer transfer box vertically; finally, accurately align the bottom hole of the wafer transfer box with the positioning pin on the loading and unloading platform.

[0072] In this embodiment, the control unit 200 is further configured to perform a locking operation 200a, a docking operation 200b, an opening operation 200c, a wafer transfer operation 200d, a closing operation 200e, and a stopping docking operation 200f when a normal state is detected; the locking operation 200a is used to fix the wafer transfer box to the wafer loading device; the docking operation 200b is used to align and connect the wafer transfer box to the wafer loading device; the opening operation 200c is used to open the lock hole of the wafer transfer box; the wafer transfer operation 200d is used to transfer the wafer from the wafer transfer box to the wafer loading device; the closing operation 200e is used to close the lock hole of the wafer transfer box after the wafer has been transferred from the wafer transfer box to the wafer loading device; the stopping docking operation 200f is used to disconnect the wafer transfer box from the wafer loading device; and the stopping locking operation 200g is used to separate the wafer transfer box from the wafer loading device.

[0073] When the wafer loading equipment detects a normal state, the control unit 200 executes a series of operations according to a preset standard procedure. First, it performs a CLAMP operation 200a to securely fix the wafer foup to the wafer loading equipment, ensuring the stability of subsequent operations. Then, it performs a DOCK operation 200b, which mainly completes the precise alignment and reliable connection between the wafer foup and the loading device, establishing a stable mechanical interface for subsequent wafer transfer.

[0074] After docking is complete, the system performs an OPEN operation 200c, opening the lock hole of the wafer transfer cassette to allow the wafer to be removed. Then, the wafer transfer stage 200d begins, where a robot and an end effector safely transfer the wafer from the wafer transfer cassette to the wafer loading equipment. During this process, the aligner uses LED lighting and image recognition sensors to precisely detect the wafer edges and notch slots, ensuring accurate wafer positioning during transport.

[0075] After wafer transfer is complete, the system performs a close (CLOSE) operation 200e, closing the lock hole of the wafer transfer cassette to protect the remaining wafers. Finally, an undocking (UNDOCK) operation 200f safely disconnects the wafer transfer cassette from the wafer loading equipment, and a stop locking operation 200g separates the wafer transfer cassette from the wafer loading equipment. This entire process can be integrated with the wafer fab material handling system (AMHS) for fully automated operation, significantly improving production efficiency.

[0076] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A locked condition monitoring device, characterized by, The application discloses a locking state monitoring device for monitoring a locking hole state of a wafer transfer box before a wafer loading device and the wafer transfer box are docked. A distance measuring unit is arranged to measure a distance from the wafer loading device to the locking hole of the wafer transfer box. A processing unit is arranged to receive the distance measured by the distance measuring unit, compare the measured distance with a normal distance, and determine whether the locking hole state of the wafer transfer box is abnormal.

2. The lock-up state monitoring apparatus according to claim 1, characterized by The locking state monitoring device further comprises: A memory is arranged to store the normal distance from the wafer loading device to the locking hole of the wafer transfer box when the locking hole state of the wafer transfer box is normal.

3. The lock-up state monitoring apparatus according to claim 1, characterized by The locking state monitoring device further comprises: A communication interface is arranged to send a signal to the wafer loading device to prompt the wafer transfer box to be normal or abnormal.

4. The lock-up state monitoring apparatus according to claim 1, characterized by The processing unit is arranged to determine that the locking hole state of the wafer transfer box is abnormal when the measured distance is less than the normal distance.

5. The lock-up state monitoring apparatus according to claim 1, characterized by The distance measuring unit adopts a laser sensor, and the laser sensor comprises: A transmitting system is arranged to provide transmitting light to the locking hole; A receiving system is arranged to receive reflected light generated by reflecting the transmitting light by the locking hole; A photoelectric detection system is arranged to convert the reflected light into an electric signal; A signal processing circuit is arranged to amplify and filter the electric signal; An analog-digital conversion circuit is arranged to convert the processed electric signal into a digital signal; A calculation unit is arranged to calculate the distance by using a time-of-flight method or a phase method based on the digital signal.

6. A wafer loading apparatus characterized by comprising: The wafer loading device is arranged to be docked with a wafer transfer box, and the wafer loading device comprises: The locking state monitoring device according to any one of claims 1 to 5; A control unit is arranged to receive a determination result of the processing unit of the locking state monitoring device, and perform an error reporting operation when an abnormal state is detected.

7. The wafer load apparatus according to claim 6, wherein The wafer loading device further comprises: A display is connected to the control unit and arranged to display alarm information when an abnormal state is detected.

8. The wafer load apparatus according to claim 6, wherein The wafer loading device further comprises: A mechanical arm is arranged to carry wafers from the wafer transfer box; A wafer gripper is arranged at the end of the mechanical arm and arranged to grip wafers.

9. The wafer load apparatus according to claim 6, wherein The wafer loading device comprises: A loading and unloading platform; A positioning pin is arranged on the loading and unloading platform and arranged to be docked with a hole in the bottom of the wafer transfer box.