Wafer temporary storage mechanism of semiconductor equipment and thin film deposition equipment thereof

Abstract

The utility model discloses a wafer temporary storage mechanism of semiconductor equipment, which comprises a cooling buffer cavity unit, a heating buffer cavity unit connected to the cooling buffer cavity unit, a first wafer loading unit used for driving a wafer to lift in the cooling buffer cavity unit, and a second wafer loading unit used for driving the wafer to lift in the cooling buffer cavity unit. And the second wafer loading unit is used for driving the wafer to ascend and descend in the heating buffer cavity unit. The utility model further discloses thin film deposition equipment which integrates the wafer heating cavity and the wafer cooling cavity, so that the distance between wafer process equipment and a cooling or heating unit is reduced, the time required for wafer transfer is shortened, the transfer efficiency is improved, and the space utilization rate is improved due to the integrated structure on the same day; and the lifting module is adopted to drive the wafer to lift, so that the wafer is convenient to heat or cool and transfer, and the universality is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of thin film deposition equipment technology, and in particular to a wafer storage mechanism for semiconductor equipment and its thin film deposition equipment. Background Technology

[0002] With the rapid development of microelectronics technology, the critical dimensions of wafer fabrication are gradually decreasing, while the complexity of wafer fabrication is constantly increasing, leading to a continuous lengthening of the overall wafer fabrication cycle. To obtain the wafer products needed by customers more quickly, effectively reducing the overall wafer fabrication time without affecting the wafer fabrication process has become crucial for improving wafer fabrication efficiency. The overall wafer fabrication time includes the wafer process time and the wafer transport time. Therefore, improving the wafer transport time is essential for enhancing wafer fabrication efficiency. The transport module is a vital component in the wafer fabrication process, and the length of the wafer transport time directly affects the utilization efficiency of the machine chamber.

[0003] Furthermore, wafer fabrication processes are complex and precise, many of which involve high-temperature operations. These high-temperature processes require heating and cooling of the wafer, but the heating and cooling times significantly impact the processing efficiency of the equipment. Based on these technical challenges, a fast and efficient mechanism is needed between the wafer heating or cooling unit and the processing unit. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a wafer temporary storage mechanism for semiconductor equipment and its thin film deposition equipment, so as to solve the technical problem that the wafer buffer and its transmission time in the existing wafer processing equipment are long and affect the process efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] In a first aspect, embodiments of the present invention provide a wafer temporary storage mechanism for a semiconductor device, comprising: a cooling buffer cavity unit, a heating buffer cavity unit connected to the cooling buffer cavity unit, a first wafer loading unit for driving the wafer to move up and down within the cooling buffer cavity unit, and a second wafer loading unit for driving the wafer to move up and down within the heating buffer cavity unit.

[0007] The cooling buffer cavity unit and the heating buffer cavity unit are stacked vertically.

[0008] The cooling buffer cavity unit and the heating buffer cavity unit are connected to a single frame.

[0009] The first wafer loading unit includes: a loading ring, a lifting rod connected to the edge of the loading ring, a first lifting module connected to the lifting rod, and a first driving module for driving the first lifting module.

[0010] The loading ring includes an annular member and two fixing parts connected to the bottom edge of the annular member. The fixing parts and the annular cavity of the annular member form a fixing cavity for loading the wafer, and the two fixing parts are arranged opposite each other.

[0011] The fixing part includes: a positioning part whose inner side is parallel to the inner ring wall of the annular part, and two supporting parts that extend laterally from the inner side of the positioning part.

[0012] The first lifting module is a linear lifting module.

[0013] The second wafer loading unit includes: a second driving module, a second lifting module connected to the driving end of the second driving module, a connecting rod connected to the moving end of the second lifting module, and a loading plate connected to the connecting rod.

[0014] The loading plate includes a plate body and three top rods extending from the top surface of the plate body.

[0015] Secondly, embodiments of the present invention provide a thin film deposition apparatus, the thin film deposition apparatus including a wafer storage mechanism of a semiconductor device as described in any of the above claims.

[0016] The present invention relates to a wafer storage mechanism for semiconductor equipment and a thin film deposition device, which integrates a wafer heating chamber and a wafer cooling chamber together, reducing the distance between the wafer process equipment and the cooling or heating unit, reducing the time required for wafer transfer, improving transfer efficiency, and improving space utilization through the integrated structure. Furthermore, the use of a lifting module to drive wafer lifting facilitates wafer heating or cooling and wafer transfer, enhancing versatility.

[0017] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, which are described in detail below. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the wafer storage mechanism of the semiconductor device according to an embodiment of the present invention.

[0019] Figure 2 This is a side view of the wafer storage mechanism of a semiconductor device according to an embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the overall structure of the wafer storage mechanism of the semiconductor device according to an embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of the first wafer loading unit of the wafer storage mechanism of the semiconductor device according to an embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram of the second wafer loading unit of the wafer storage mechanism of the semiconductor device according to an embodiment of the present invention.

[0023] Explanation of reference numerals in the attached figures:

[0024] The semiconductor equipment includes a wafer storage mechanism 100, a frame 1, a cooling buffer cavity unit 2, a heating buffer cavity unit 3, a cooling cavity structure 21, a coolant delivery unit 22, a first wafer loading unit 23, a buffer chamber 211, a loading ring 231, a lifting rod 232, a first lifting module 233, a first drive module 234, an annular component 2310, a fixing part 2311, a positioning part 2312, a supporting part 2313, a second wafer loading unit 31, a heating plate 32, a second wafer loading unit 33, a heating chamber 311, a second drive module 331, a second lifting module 332, a connecting rod 333, a loading plate 334, a top rod 335, a plate body 3340, and a circular cavity 3341. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0031] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0032] With the rapid development of microelectronics technology, the critical dimensions of wafer fabrication are gradually decreasing, while the complexity of wafer fabrication is constantly increasing, leading to a continuous lengthening of the overall wafer fabrication cycle. To obtain the wafer products needed by customers more quickly, effectively reducing the overall wafer fabrication time without affecting the wafer fabrication process has become crucial for improving wafer fabrication efficiency. The overall wafer fabrication time includes the wafer process time and the wafer transport time. Therefore, improving the wafer transport time is essential for enhancing wafer fabrication efficiency. The transport module is a vital component in the wafer fabrication process, and the length of the wafer transport time directly affects the utilization efficiency of the machine chamber.

[0033] Furthermore, wafer fabrication processes are complex and precise, many of which involve high-temperature processes. These high-temperature processes require heating and cooling of the wafer, but the heating and cooling time affects the processing efficiency of the equipment. To address these issues, this embodiment discloses a wafer storage mechanism 100 for a semiconductor device. This wafer storage mechanism 100 aims to reduce the wafer transfer time during processing, thereby improving processing efficiency.

[0034] Please see Figures 1 to 5 In this embodiment, a wafer storage mechanism 100 of a semiconductor device is disclosed, which is used to provide wafer cooling or heating processes during wafer processing, specifically in a thin film deposition apparatus, for preheating the wafer before it enters the process chamber and cooling the wafer after it leaves the process chamber. The wafer storage mechanism 100 of the semiconductor device includes: a cooling buffer cavity unit 2, a heating buffer cavity unit 3 connected to the cooling buffer cavity unit 2, a first wafer loading unit 23 for driving the wafer to move up and down within the cooling buffer cavity unit 2, and a second wafer loading unit 33 for driving the wafer to move up and down within the heating buffer cavity unit 3.

[0035] In this embodiment, the wafer storage mechanism 100 of the semiconductor device integrates the cavity units for heating or cooling the wafer. This wafer storage mechanism 100 corresponds to a set of wafer thin-film deposition cavity equipment. It has a compact structure, occupies little space, and has a short wafer transfer path, making wafer transfer quick and convenient. Compared to the existing design where a set of thin-film deposition equipment corresponds to one set of cooling units and one set of heating units, the overall structure is more streamlined and compact, and the execution path for the wafer transfer units is significantly reduced, thereby reducing the wafer transfer time and improving the overall process efficiency.

[0036] In this embodiment, as Figure 3 As shown, the cooling buffer cavity unit 2 and the heating buffer cavity unit 3 are stacked vertically. That is, the cooling buffer cavity unit 2 can be located directly above the heating buffer cavity unit 3, or it can be located directly below the heating buffer cavity unit 3.

[0037] Of course, it is understood that in other embodiments, the cooling buffer cavity unit 2 and the heating buffer cavity unit 3 may also be connected in the front-to-back direction or in any other direction at close range, and are not limited to this embodiment. The goal is to minimize the distance between the two.

[0038] The cooling buffer cavity unit 2 and the heating buffer cavity unit 3 are connected together on a frame 1.

[0039] The cooling cavity buffer unit 2 includes a cooling cavity structure 21 and a coolant delivery unit 22 connected to the cooling cavity structure 21. The cooling cavity structure 21 is provided with a buffer chamber 211. The output pipe of the coolant delivery unit 22 is connected to the buffer chamber 211 and is used to circulate coolant to the buffer chamber 211. The buffer chamber 211 is a sealed chamber.

[0040] The heating cavity buffer unit 3 includes: a heating cavity structure 31 and a heating plate 32 disposed in the heating cavity structure 31. The heating cavity structure 31 is provided with a heating chamber 311 and the heating plate 32 is disposed in the heating chamber 311.

[0041] In order to precisely control the wafer cooling process in the cooling cache cavity unit 2, a temperature sensor is also provided in the cache cavity 211 to monitor the temperature in the cache cavity 211 in real time.

[0042] Similarly, a temperature sensor is also provided in the heating chamber 311, which is used to monitor the temperature in the heating chamber 311 in real time.

[0043] Once the wafer in the buffer chamber 211 has cooled to a preset temperature, the first wafer loading unit 23 and the external wafer transfer unit work together to send the wafer out of the cooling buffer chamber unit 2. Once the wafer in the heating chamber 311 has been preheated to a preset temperature, the second wafer loading unit 33 and the external wafer transfer unit work together to send the wafer out of the heating chamber 311.

[0044] Please refer to it again. Figure 3 In order to reduce the distance between the cooling cavity structure 21 and the heating cavity structure 31 and reduce the wafer transfer time, most of the structure of the first wafer loading unit 23 is connected above the buffer chamber 211, while the second wafer loading unit 33 is located below the heating chamber 311, thereby minimizing the distance between the cooling cavity structure 21 and the heating cavity structure 31.

[0045] Please refer to it again. Figure 4 The first wafer loading unit 23 includes: a loading ring 231, a lifting rod 232 connected to the edge of the loading ring 231, a first lifting module 233 connected to the lifting rod 232, and a first driving module 234 for driving the first lifting module 233.

[0046] The loading ring 231 includes an annular member 2310 and two fixing parts 2311 connected to the bottom edge of the annular member 2310. The fixing parts 2311 and the annular cavity of the annular member 231 form a fixing cavity for loading the wafer. The two fixing parts 2311 are arranged opposite each other.

[0047] In this embodiment, the fixing part 2311 includes: a positioning part 2312 whose inner side is parallel to the inner ring wall of the annular part 2310, and two supporting parts 2313 extending laterally from the inner side of the positioning part 2312. The annular part 2310 is a sheet-like annular structure, and the bottom of the sheet-like annular part is connected to the two positioning parts 2312. The internal annular cavity of the annular part 2310 is a circular cavity (corresponding to the shape of the wafer). Therefore, the inner side of the positioning part 2312 is also a partially circular sidewall. The inner sides of the two opposing positioning parts 2312 can fix the wafer and prevent it from moving back and forth. At the same time, the supporting parts 2313 protruding laterally from the inner side of the fixing part 2311 support the wafer in the vertical direction. When the wafer is cooled in the buffer chamber 211, an inert cooling gas is usually introduced. The loading ring 231 structure of this embodiment can fix the wafer well and will not be displaced by airflow disturbance, thus affecting wafer transfer.

[0048] In this embodiment, the first lifting module 233 is a linear lifting module, which is an existing linear guide rail module, and the lifting action is efficient, stable and reliable.

[0049] The first drive module 234 is a drive motor.

[0050] Please refer to it again. Figure 5 The second wafer loading unit 33 includes: a second drive module 331, a second lifting module 332 connected to the drive end of the second drive module 331, a connecting rod 333 connected to the moving end of the second lifting module 332, and a loading plate 334 connected to the connecting rod 333. The fixed portions of the second drive module 331 and the second lifting module 332 are both fixedly connected to the bracket 1.

[0051] Similarly, the second lifting module 332 is a linear lifting module, such as a linear track module. The second drive module 331 is a drive motor.

[0052] The loading plate 334 includes a plate body 3340 and three push rods 335 extending from the top surface of the plate body 3340. The three push rods 335 are arranged in a triangle to support the wafer. Using three push rods 335 to support the wafer not only reduces the contact area with the wafer but also simplifies the wafer support structure. The plate body 3340 has a circular cavity 3341 with an edge opening in its center. This circular cavity 3341 is located above the heating plate 32. The hollow design of this circular cavity 3341 facilitates heating of the wafer by the heating plate 32, reduces the obstruction of heat conduction from the plate body 3340 to the heating plate 32, and improves its heating efficiency and heating uniformity.

[0053] Below, please refer to the appendix again. Figures 1 to 5 The cooling and heating processes of the wafer storage mechanism 100 of the semiconductor device in this embodiment are briefly described below:

[0054] The heating process is as follows: Before the wafer enters the process chamber of the thin film deposition equipment, the wafer transfer unit transfers the wafer to the loading plate 334 of the second wafer loading unit 33. Then, the second drive module 331 drives the moving part of the second lifting module 332 to rise, simultaneously driving the loading plate 334 and the wafer on it to rise into the heating chamber 311. Then, the heating plate 32 is turned on to heat the wafer until the wafer reaches the preset temperature. The second drive module 331 reverses and drives the loading plate 334 to descend, and the wafer transfer unit takes out the wafer and transfers it to the process chamber.

[0055] Cooling process: After the wafer is deposited in the process chamber of the thin film deposition equipment, the wafer transfer unit transfers the wafer to the loading ring 231. The first drive module 234 drives the first lifting module 233 to descend, causing the loading ring 231 to descend into the buffer chamber 211. Then, the coolant delivery unit 22 is turned on to input cooling gas into the buffer chamber 211 until the wafer is cooled to a preset value. The first drive module 234 reverses its action, and the external wafer transfer unit takes out the wafer and transfers it to the next station.

[0056] An embodiment of this utility model provides a thin film deposition apparatus, which includes a wafer storage mechanism 100 of a semiconductor device as described in any of the above claims.

[0057] The wafer storage mechanism and thin film deposition equipment of the semiconductor device in this embodiment integrate the wafer heating cavity and the wafer cooling cavity together, reducing the distance between the wafer process equipment and the cooling or heating unit, reducing the time required for wafer transfer, improving transfer efficiency, and improving space utilization through the integrated structure. Furthermore, the use of a lifting module to drive wafer lifting facilitates wafer heating or cooling and wafer transfer, enhances versatility, and enables it to interface with different wafer transfer units.

[0058] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A wafer temporary storage mechanism of a semiconductor device, characterized by comprising: The semiconductor device includes a cooling buffer cavity unit, a heating buffer cavity unit connected to the cooling buffer cavity unit, a first wafer loading unit for driving the wafer to move up and down in the cooling buffer cavity unit, and a second wafer loading unit for driving the wafer to move up and down in the heating buffer cavity unit. The cooling buffer cavity unit and the heating buffer cavity unit are arranged in a vertical direction.

2. The wafer staging mechanism of claim 1, wherein The cooling buffer cavity unit and the heating buffer cavity unit are connected to a rack.

3. The wafer staging mechanism of claim 2, wherein the wafer staging mechanism further comprises a wafer transfer robot configured to transfer the wafer between the wafer storage area and the wafer processing area. The first wafer loading unit includes a loading ring, a lifting rod connected to the edge of the loading ring, a first lifting module connected to the lifting rod, and a first driving module for driving the first lifting module.

4. The wafer temporary storage mechanism of any one of claims 1 to 3, wherein The loading ring includes a ring member and two fixing parts connected to the bottom edge of the ring member, the fixing parts and the ring cavity of the ring member form a fixing cavity for loading the wafer, and the two fixing parts are arranged opposite to each other.

5. The wafer staging mechanism of claim 4, wherein the wafer staging mechanism further comprises a wafer transfer robot configured to transfer the wafer between the wafer storage area and the wafer processing area. The fixing part includes a positioning part extending in parallel with the inner ring wall of the ring member, and two supporting parts extending transversely from the inner side of the positioning part.

6. The wafer staging mechanism of claim 5, wherein the wafer staging mechanism further comprises a wafer transfer robot configured to transfer the wafer between the wafer storage area and the wafer processing area. The first lifting module is a linear lifting module.

7. The wafer staging mechanism of claim 6, wherein the wafer staging mechanism further comprises a wafer transfer robot configured to transfer the wafer between the wafer staging mechanism and the wafer processing chamber. The second wafer loading unit includes a second driving module, a second lifting module connected to the driving end of the second driving module, a connecting rod connected to the moving end of the second lifting module, and a loading plate connected to the connecting rod.

8. The wafer temporary storage mechanism of any one of claims 1 to 3, wherein The loading plate includes a plate body and three top rods extending from the top surface of the plate body, and the three top rods are distributed in a triangular shape.

9. The wafer staging mechanism of claim 8, wherein the wafer staging mechanism further comprises a wafer transfer robot configured to transfer the wafer between the wafer staging mechanism and the wafer processing chamber. The thin film deposition device includes the wafer temporary storage mechanism of any one of claims 1 to 9.

10. A thin film deposition apparatus, characterized by, ​

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