Manual film expanding machine

Abstract

The utility model relates to the technical field of wafer production, and discloses a manual film expanding machine which comprises a machine base, a film expanding table fixed at the upper end of the machine base, a cover plate rotatably connected to one side of the film expanding table, a placement groove formed at the upper end of the film expanding table, a film expanding ring placed in the placement groove, a blue film fixed in the film expanding ring, and a jacking assembly arranged in the machine base. According to the film expanding machine, the jacking assembly, the abutting assembly and the fixing mechanism are arranged, so that film expanding can be conducted on a wafer, the grain spacing after film expanding can be accurately controlled, the problems that an existing film expanding machine is prone to film breakage during film expanding and the grain spacing after film expanding cannot be controlled are solved, and the film expanding machine is simple in structure and convenient to use. And the use requirements of wafer production can be met.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, specifically to a manual film expander. Background Technology

[0002] A wafer, or silicon wafer, is a circular silicon chip used in the fabrication of silicon semiconductor integrated circuits. It is an indispensable carrier for chips in the semiconductor manufacturing process. Wafers are typically made by processing silicon through a series of procedures, such as purification, melting, pulling, grinding, and polishing, before finally being cut. As a carrier, the larger the diameter of the wafer, the more chips it can support, resulting in higher utilization and lower chip production costs. Therefore, wafers generally undergo a film expansion process, and the larger the diameter after film expansion, the better. The size of the wafer diameter represents the level of technological advancement.

[0003] Currently, existing wafers are typically laser-cut or diced onto a blue film, which divides the wafer into individual granules. Then, a film expander stretches the blue film to increase the spacing between the granules and reduce the contact area between the granules and the blue film. Finally, the granules are removed using a suction cup.

[0004] The above-mentioned solutions have many problems with the film expansion machines sold on the market, such as complex structure, easy film breakage, and inability to control the grain spacing after film expansion, which cannot meet the requirements of wafer production. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a manual wafer expander. By providing a lifting component, a pressing component, and a fixing mechanism, it can expand wafers and precisely control the die spacing after expansion. This solves the problems of existing wafer expanders being prone to wafer breakage and unable to control the die spacing after expansion. Moreover, the structure is relatively simple and can meet the requirements of wafer production.

[0006] The solution of this utility model to the aforementioned technical problem is:

[0007] A manual film expanding machine includes a base, an expanding platform fixed to the upper end of the base, a cover plate rotatably connected to one side of the expanding platform, a placement groove formed at the upper end of the expanding platform, an expanding ring placed in the placement groove, a blue film fixed inside the expanding ring, a lifting component inside the base, and a pressing component and a fixing mechanism at the upper end of the base.

[0008] When wafer expansion is required, the cover plate is opened, and then the expansion ring with the blue film fixed on it is placed in the placement slot. The cover plate is then closed and pressed against the upper end of the expansion ring. The pressing component is then activated to press the cover plate and fix it in the required position, thereby fixing the expansion ring and ensuring that it will not shift during the expansion process, thus ensuring that the expansion quality is not affected. The lifting component is then activated to expand the blue film, dispersing the grains on the blue film. Finally, the fixing mechanism is activated to fix the expanded blue film, thus completing the wafer expansion process.

[0009] By incorporating a lifting assembly, a pressing assembly, and a fixing mechanism, wafers can be expanded, and the die spacing after expansion can be precisely controlled. This solves the problems of existing expansion machines that are prone to film breakage during expansion and cannot control the die spacing after expansion. Moreover, the structure is relatively simple and can meet the requirements of wafer production.

[0010] The utility model is further configured such that: the lifting assembly includes a first servo electric cylinder fixed inside the base, and a lifting seat is fixed on the extended end of the first servo electric cylinder that passes through the base.

[0011] With the above technical solution, when it is necessary to expand the blue film, the first servo electric cylinder is activated to drive the lifting seat to move upward, thereby expanding the blue film. At the same time, by providing the first servo electric cylinder, the grain spacing after the film expansion can be precisely controlled.

[0012] The utility model is further configured such that: the pressing component includes two support seats symmetrically fixed on the upper end of the base, and a lever is rotatably connected to the upper end of the support seat, with a rubber block fixed to one end of the lever.

[0013] With the above technical solution, when it is necessary to press the cover plate, rotate the lever to make the rubber block press against the upper end of the cover plate, thereby pressing the cover plate.

[0014] The utility model is further configured such that: the fixing mechanism includes a guide component and a fixing component, the guide component includes multiple guide rods fixed to the upper end of the base, the upper ends of the multiple guide rods are fixed with the same support plate, the side walls of the multiple guide rods are fitted with the same lifting plate, and the fixing component is set at the upper end of the support plate.

[0015] The above technical solution can guide the lifting plate, preventing it from tilting and vibrating during movement, thereby further ensuring that the film expansion quality is not affected.

[0016] The utility model is further configured such that: the fixing component includes a fixing plate fixed to the lower end of the lifting plate, a female ring is inserted into the lower end of the fixing plate, a female ring is inserted into the upper end of the lifting seat, and a second servo electric cylinder is fixed to the upper end of the support plate, with the extended end of the second servo electric cylinder passing through the support plate and fixed to the upper end of the lifting plate.

[0017] With the above technical solution, after the lifting seat expands the blue film, when it is necessary to fix the expanded blue film, the second servo electric cylinder is activated to drive the lifting plate to move downward. The downward movement of the lifting plate drives the fixing plate to move downward, and the downward movement of the fixing plate drives the mother ring to move downward, so that the mother ring is interference-fitted onto the outer wall of the daughter ring, thereby fixing the expanded blue film.

[0018] The beneficial effects of this utility model are:

[0019] Compared with existing technologies, this technology incorporates a lifting component, a pressing component, and a fixing mechanism, enabling wafer expansion and precise control of the die spacing after expansion. This solves the problems of easy film breakage and inability to control the die spacing after expansion in existing expansion machines. Furthermore, the structure is relatively simple and meets the requirements of wafer production. Attached Figure Description

[0020] Figure 1 This is a front view of the present invention;

[0021] Figure 2 This is a three-dimensional structural schematic diagram of the present invention;

[0022] Figure 3 This is a three-dimensional structural diagram of the present invention.

[0023] Reference numerals in the attached drawings: 1. Base; 2. Expanding stage; 201. Placement slot; 3. Cover plate; 4. Expanding ring; 5. Blue film; 6. First servo electric cylinder; 7. Lifting seat; 8. Support seat; 9. Actuating rod; 10. Rubber block; 11. Guide rod; 12. Support plate; 13. Lifting plate; 14. Fixing plate; 15. Mother ring; 16. Daughter ring; 17. Second servo electric cylinder. Detailed Implementation

[0024] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0025] The following is for reference Figures 1 to 3 This utility model will now be described.

[0026] A manual film expanding machine includes a base 1, an expanding platform 2 fixed at the upper end of the base 1, a cover plate 3 rotatably connected to one side of the expanding platform 2, a placement groove 201 formed at the upper end of the expanding platform 2, an expanding ring 4 placed in the placement groove 201, a blue film 5 fixed in the expanding ring 4, a lifting component inside the base 1, and a pressing component and a fixing mechanism at the upper end of the base 1.

[0027] When wafer expansion is required, the cover plate 3 is opened, and the expansion ring 4 with the blue film 5 fixed on it is placed in the placement groove 201. Then, the cover plate 3 is closed and pressed against the upper end of the expansion ring 4. The pressing component is then activated to press the cover plate 3 and fix it in the required position, thereby fixing the expansion ring 4 and ensuring that the expansion ring 4 will not shift during the expansion process, thus ensuring that the expansion quality will not be affected. Then, the lifting component is activated to expand the blue film 5, so that the grains on the blue film 5 are dispersed. Finally, the fixing mechanism is activated to fix the expanded blue film 5, thereby completing the wafer expansion process.

[0028] By incorporating a lifting assembly, a pressing assembly, and a fixing mechanism, wafers can be expanded, and the die spacing after expansion can be precisely controlled. This solves the problems of existing expansion machines that are prone to film breakage during expansion and cannot control the die spacing after expansion. Moreover, the structure is relatively simple and can meet the requirements of wafer production.

[0029] The lifting assembly includes a first servo electric cylinder 6 fixed inside the base 1, and a lifting seat 7 is fixed on the protruding end of the first servo electric cylinder 6 through the base 1.

[0030] When it is necessary to expand the blue film 5, the first servo electric cylinder 6 is activated to drive the lifting seat 7 to move upward, thereby expanding the blue film 5. At the same time, by providing the first servo electric cylinder 6, the grain spacing after the film expansion can be precisely controlled.

[0031] The pressure assembly includes two support seats 8 symmetrically fixed to the upper end of the base 1. The upper end of the support seat 8 is rotatably connected to a lever 9, and a rubber block 10 is fixed to one end of the lever 9.

[0032] When it is necessary to press down on the cover plate 3, rotate the lever 9 so that the rubber block 10 presses against the upper end of the cover plate 3, thereby pressing down on the cover plate 3.

[0033] The fixing mechanism includes a guide assembly and a fixing assembly. The guide assembly includes multiple guide rods 11 fixed to the upper end of the base 1. The upper ends of the multiple guide rods 11 are fixed with the same support plate 12. The side walls of the multiple guide rods 11 are fitted with the same lifting plate 13. The fixing assembly is located at the upper end of the support plate 12.

[0034] The lifting plate 13 can be guided to prevent it from tilting and vibrating when it moves, thereby further ensuring that the film expansion quality is not affected.

[0035] The fixing assembly includes a fixing plate 14 fixed to the lower end of the lifting plate 13, a female ring 15 inserted into the lower end of the fixing plate 14, a female ring 16 inserted into the upper end of the lifting seat 7, and a second servo electric cylinder 17 fixed to the upper end of the support plate 12. The second servo electric cylinder 17 is fixed to the upper end of the lifting plate 13 through the protruding end of the support plate 12.

[0036] After the lifting seat 7 expands the blue film 5, when it is necessary to fix the expanded blue film 5, the second servo electric cylinder 17 is activated, which drives the lifting plate 13 to move downward. The downward movement of the lifting plate 13 drives the fixing plate 14 to move downward. The downward movement of the fixing plate 14 drives the mother ring 15 to move downward, so that the mother ring 15 is interference-fitted onto the outer wall of the daughter ring 16, thereby fixing the expanded blue film 5.

[0037] Working principle:

[0038] When wafer expansion is required, the cover plate 3 is opened, and the expansion ring 4 with the blue film 5 fixed thereon is placed in the placement slot 201. The cover plate 3 is then closed, pressing against the upper end of the expansion ring 4. The lever 9 is then rotated, causing the rubber block 10 to press against the upper end of the cover plate 3, thus fixing the cover plate 3 in the desired position and securing the expansion ring 4. This ensures that the expansion ring 4 will not shift during the expansion process, thereby ensuring that the expansion quality is not affected. Then, the first servo electric cylinder 6 is activated, which drives the lifting seat 7 to move upward, thereby expanding the blue film 5 and dispersing the grains on the blue film 5. Then, the second servo electric cylinder 17 is activated, which drives the lifting plate 13 to move downward. The downward movement of the lifting plate 13 drives the fixing plate 14 to move downward. The downward movement of the fixing plate 14 drives the mother ring 15 to move downward, so that the mother ring 15 is interference-fitted onto the outer wall of the daughter ring 16, thereby fixing the expanded blue film 5, thus completing the wafer expansion process.

[0039] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model. These improvements and modifications assumed above should also be considered within the protection scope of the present utility model.

Claims

1. A hand film expander comprising a base (1), characterized in that: The upper end of the base (1) is fixed with an expanding film table (2), one side of the expanding film table (2) is rotatably connected with a cover plate (3), the upper end of the expanding film table (2) is formed with a placing groove (201), the placing groove (201) is placed with an expanding film ring (4), the expanding film ring (4) is fixed with a blue film (5), the base (1) is provided with a jacking assembly, the upper end of the base (1) is provided with a pressing assembly and a fixing mechanism.

2. A hand film expander as claimed in claim 1, wherein: The jacking assembly comprises a first servo electric cylinder (6) fixed in the base (1), the first servo electric cylinder (6) is fixed with a jacking seat (7) on the extending end of the base (1).

3. A hand film expander as claimed in claim 1, wherein: The pressing assembly comprises two support seats (8) fixed symmetrically on the upper end of the base (1), the upper end of the support seat (8) is rotatably connected with a poking rod (9), one end of the poking rod (9) is fixed with a rubber block (10).

4. A hand film expander as claimed in claim 2, wherein: The fixing mechanism comprises a guiding assembly and a fixing assembly, the guiding assembly comprises a plurality of guiding rods (11) fixed on the upper end of the base (1), the upper end of the plurality of guiding rods (11) is fixed with the same support plate (12), the sidewall of the plurality of guiding rods (11) is inserted with the same lifting plate (13), the fixing assembly is arranged on the upper end of the support plate (12).

5. A hand film expander as claimed in claim 4, wherein: The fixing assembly comprises a fixing disc (14) fixed on the lower end of the lifting plate (13), the lower end of the fixing disc (14) is inserted with a female ring (15), the upper end of the jacking seat (7) is inserted with a male ring (16), the upper end of the support plate (12) is fixed with a second servo electric cylinder (17), the second servo electric cylinder (17) is fixed on the upper end of the lifting plate (13) through the extending end of the support plate (12).

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