Wafer alignment device and wafer bonding equipment
By introducing a position detection component and a micro-stage driving system into the wafer alignment device, the relative position of the wafer is adjusted in real time, which solves the problem of low alignment and bonding accuracy in the prior art and achieves high-precision wafer alignment and bonding.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2026-03-06
AI Technical Summary
Existing wafer alignment devices cannot adjust the relative positions of the upper and lower wafers in real time during the bonding process, resulting in low alignment and bonding accuracy.
A wafer alignment device is adopted, which includes a first micro stage, a first wafer locking component, a second micro stage, a second wafer locking component, and a position detection component. The position detection component detects the relative position of the wafer in real time, and the micro stage drives the wafer locking component to make real-time adjustments to maintain high-precision alignment.
This technology enables real-time detection and adjustment of the relative position of wafers during wafer alignment and bonding, thereby improving alignment and bonding accuracy.
Smart Images
Figure CN223979069U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, and more specifically, to a wafer alignment device and a wafer bonding equipment. Background Technology
[0002] Wafer bonding equipment mainly uses a wafer alignment device to position and align the upper and lower wafers to be bonded, so as to achieve successful bonding.
[0003] Existing wafer alignment devices primarily determine the positions of the upper and lower wafers using vision sensors before wafer alignment and bonding. The micro-stage can then move according to the position information of the upper and lower wafers determined by the vision sensors to align them. However, existing wafer alignment devices cannot obtain the real-time relative positions of the upper and lower wafers during the alignment and bonding process, making it difficult to adjust their positions in real time and ensuring the relative positional relationship of the upper and lower wafers during bonding. This results in low alignment and bonding accuracy. Utility Model Content
[0004] The purpose of this invention is to provide a wafer alignment device and a wafer bonding equipment to alleviate the technical problem of low alignment and bonding accuracy in existing wafer alignment devices.
[0005] The wafer alignment device provided by this utility model includes a first micro stage, a first wafer locking component, a second micro stage, a second wafer locking component, and a position detection component.
[0006] The first wafer locking component is mounted on the first micro-stage and is used to lock the first wafer; the second wafer locking component is mounted on the second micro-stage and is used to lock the second wafer; the first wafer and the second wafer are arranged opposite to each other; both the first micro-stage and the second micro-stage are communicatively connected to the position detection component.
[0007] The position detection component includes a position detection element and a detection auxiliary element. The position detection element is installed on the first wafer locking element, and the detection auxiliary element is installed on the second wafer locking element. The position detection component is used to detect the relative position of the first wafer locking element and the second wafer locking element.
[0008] Preferably, as one possible implementation, the position detection component is mounted on the first wafer locking component via a first adapter, and the detection auxiliary component is mounted on the second wafer locking component via a second adapter, wherein both the first adapter and the second adapter are made of a low coefficient of thermal expansion material.
[0009] Preferably, as one possible implementation, the first wafer locking component and the first micro-stage are respectively connected to the first adapter via a first threaded connector, and / or, the second wafer locking component and the second micro-stage are respectively connected to the second adapter via a second threaded connector;
[0010] And / or, the first adapter is L-shaped, and, or, the second adapter is L-shaped.
[0011] Preferably, as one possible implementation, the first micro-stage and the second micro-stage cooperate with each other to drive the first wafer locking member and the second wafer locking member to perform relative micro-motion of six degrees of freedom; the position detection component can detect the relative position of the first wafer locking member and the second wafer locking member of six degrees of freedom.
[0012] Preferably, as one possible implementation, the first micro-motion stage and the second micro-motion stage are arranged along the Z direction; the first micro-motion stage has three degrees of freedom, namely DX, DY, and RZ; the second micro-motion stage has six degrees of freedom.
[0013] Preferably, as one possible implementation, the position detection component includes a first position detection component, a second position detection component, and a third position detection component. The first position detection component is capable of detecting the relative positions of the first wafer locking component and the second wafer locking component in the DY and DZ degrees of freedom. The second position detection component is capable of detecting the relative positions of the first wafer locking component and the second wafer locking component in the DX and DZ degrees of freedom. The third position detection component is capable of detecting the relative positions of the first wafer locking component and the second wafer locking component in the DY and DZ degrees of freedom.
[0014] Preferably, as one possible implementation, the first position detection component and the third position detection component are symmetrically distributed on both sides of the first wafer locking component, and the second position detection component is located on the symmetrical plane between the first position detection component and the third position detection component.
[0015] Preferably, as one possible implementation, the position detection component includes a reading head, and the detection auxiliary component includes a planar grating body, with the reading head disposed opposite to the corresponding planar grating body;
[0016] And / or, the resolution of the position detection component is less than or equal to 0.5 nm.
[0017] Preferably, as one possible implementation, the first wafer locking member includes a first vacuum chuck, which is used to adsorb the first wafer;
[0018] And / or, the second wafer locking member includes a second vacuum chuck for adsorbing the second wafer.
[0019] The wafer bonding equipment provided by this utility model includes the above-mentioned wafer alignment device.
[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0021] The wafer alignment device provided by this utility model has a first micro-motion stage that can drive the first wafer locking member to move slightly, so as to drive the first wafer to move slightly using the first wafer locking member; and a second micro-motion stage that can drive the second wafer locking member to move slightly, so as to drive the second wafer to move slightly using the second wafer locking member. A position detection component is installed on the first wafer locking component. This allows the position detection component to move synchronously with the first wafer locking component and the first wafer it locks, meaning its position changes with the position of the first wafer. Simultaneously, a detection auxiliary component is installed on the second wafer locking component. This allows the detection auxiliary component to move synchronously with the second wafer locking component and the second wafer it locks, meaning its position changes with the position of the second wafer. Therefore, by cooperating, the position detection component and the detection auxiliary component in the position detection assembly can obtain the real-time relative position of the position detection component and the detection auxiliary component, indirectly obtaining the real-time relative position of the first and second wafer locking components, and further obtaining the real-time relative position of the first and second wafers. Thus, the first and second micro-motion stages can then perform corresponding actions based on the real-time relative position of the first and second wafers detected by the position detection assembly, driving the first and second wafer locking components to move relative to each other. This allows the first and second wafers to adjust their positions in real time to maintain alignment accuracy, thereby achieving high bonding accuracy.
[0022] Therefore, the wafer alignment device provided by this utility model can detect and adjust the relative position of two wafers in real time during the alignment and bonding process, resulting in high alignment and bonding accuracy.
[0023] The wafer bonding equipment provided by this utility model includes the above-mentioned wafer alignment device, and therefore has all the advantages of the above-mentioned wafer alignment device. During the alignment and bonding process of two wafers, the relative position of the two wafers can be detected and adjusted in real time, and the alignment and bonding accuracy is high. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0025] Figure 1 This is a schematic diagram of the structure of the wafer alignment device provided in an embodiment of the present invention;
[0026] Figure 2 This is a layout diagram of the position detection component of the wafer alignment device provided in an embodiment of the present invention.
[0027] Explanation of reference numerals in the attached figures:
[0028] 100 - First micro-motion stage;
[0029] 200 - First wafer locking component;
[0030] 300 - Second micro stage;
[0031] 400 - Second wafer locking component;
[0032] 500 - Position detection component; 510 - Reading head; 520 - Planar grating body; 530 - First position detection component; 540 - Second position detection component; 550 - Third position detection component;
[0033] 600 - First wafer;
[0034] 700 - Second wafer. Detailed Implementation
[0035] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0036] The present invention will be further described in detail below through specific embodiments and in conjunction with the accompanying drawings.
[0037] See Figure 1This embodiment provides a wafer alignment device, which includes a first micro-stage 100, a first wafer locking member 200, a second micro-stage 300, a second wafer locking member 400, and a position detection component 500. The first wafer locking member 200 is mounted on the first micro-stage 100 and is used to lock a first wafer 600. The second wafer locking member 400 is mounted on the second micro-stage 300 and is used to lock a second wafer 700. The first wafer 600 and the second wafer 700 are arranged opposite to each other. Both the first micro-stage 100 and the second micro-stage 300 are communicatively connected to the position detection component 500. The position detection component 500 includes a position detection element and a detection auxiliary element. The position detection element is mounted on the first wafer locking member 200, and the detection auxiliary element is mounted on the second wafer locking member 400. The position detection component 500 is used to detect the relative position of the first wafer locking member 200 and the second wafer locking member 400.
[0038] The wafer alignment apparatus provided in this embodiment includes a first micro-stage 100 that drives a first wafer locking member 200 to micro-motion, thereby driving a first wafer 600 to micro-motion; and a second micro-stage 300 that drives a second wafer locking member 400 to micro-motion, thereby driving a second wafer 700 to micro-motion. A position detection component is mounted on the first wafer locking member 200, allowing it to micro-motion synchronously with the first wafer locking member 200 and the locked first wafer 600, meaning the position of the position detection component changes with the position of the first wafer 600. Simultaneously, a detection auxiliary component is mounted on the second wafer locking member 400, allowing it to micro-motion synchronously with the second wafer locking member 400 and the locked second wafer 700, meaning the position of the detection auxiliary component changes with the position of the second wafer 700. Therefore, by cooperating with the position detection component in the position detection assembly 500, the real-time position of the position detection component and the detection auxiliary component can be obtained. By indirectly obtaining the relative positions of the first wafer locking member 200 and the second wafer locking member 400, the real-time relative positions of the first wafer 600 and the second wafer 700 can be obtained. In this way, the first micro-stage 100 and the second micro-stage 300 can take corresponding actions based on the real-time relative positions of the first wafer 600 and the second wafer 700 detected by the position detection component 500, so as to drive the first wafer locking member 200 and the second wafer locking member 400 to move relative to each other. This allows the first wafer 600 and the second wafer 700 to adjust their positions in real time to maintain the alignment accuracy of the first wafer 600 and the second wafer 700, thereby obtaining higher bonding accuracy.
[0039] Therefore, the wafer alignment device provided in this embodiment can detect and adjust the relative position of the two wafers in real time during the alignment and bonding process, resulting in high alignment and bonding accuracy.
[0040] Preferably, the position detection component is mounted to the first wafer locking component 200 via a first adapter, and the detection auxiliary component is mounted to the second wafer locking component 400 via a second adapter. Both the first and second adapters are made of a low coefficient of thermal expansion material. This ensures a reliable connection between the first wafer locking component 200 and the position detection component, maintaining their relative position. It also ensures a reliable connection between the second wafer locking component 400 and the detection auxiliary component, maintaining their relative position. Therefore, the position detection component 500 can guarantee the accuracy of its detection of the relative position of the first wafer locking component 200 and the second wafer locking component 400. The low coefficient of thermal expansion material can be metal, ceramic, or Invar alloy.
[0041] The first wafer locking component 200 and the first micro-stage 100 can be connected to the first adapter via a first threaded connector, ensuring reliable connection while also providing a detachable design for easy maintenance. Correspondingly, the second wafer locking component 400 and the second micro-stage 300 can be connected to the second adapter via a second threaded connector, ensuring reliable connection while also providing a detachable design for easy maintenance.
[0042] The first adapter can be configured as an L-shaped structure to facilitate connection with the first wafer locking member 200 and the first micro-stage 100. Correspondingly, the second adapter can be configured as an L-shaped structure to facilitate connection with the second wafer locking member 400 and the second micro-stage 300.
[0043] Specifically, the first micro-stage 100 and the second micro-stage 300 cooperate to drive the first wafer locking member 200 and the second wafer locking member 400 to perform relative micro-movements with six degrees of freedom, which can improve the alignment effect of the first wafer 600 and the second wafer 700. At this time, the position detection component 500 can detect the relative position of the first wafer locking member 200 and the second wafer locking member 400 with six degrees of freedom. Thus, the relative position accuracy of the first wafer 600 and the second wafer 700 is high. Therefore, the first wafer 600 and the second wafer 700 can maintain a high relative position accuracy through the movement of the first micro-stage 100 and the second micro-stage 300.
[0044] Setting the second micro-motion stage 300 to have six degrees of freedom and the first micro-motion stage 100 to have three degrees of freedom, namely DX, DY, and RZ, can increase the adjustment range of these three degrees of freedom and reduce the requirements for the loading error of the robot arm. Among them, the X, Y, and Z directions are perpendicular to each other.
[0045] See Figure 1 and Figure 2The arrangement direction of the first micro-stage 100 and the second micro-stage 300 is defined as the Z-direction. Based on this, the aforementioned position detection components 500 are configured into three groups, and the three groups of position detection components 500 are respectively defined as the first position detection component 530, the second position detection component 540, and the third position detection component 550. The first position detection component 530 is configured to detect the relative positions of the first wafer locking component 200 and the second wafer locking component 400 in the DY and DZ degrees of freedom. The second position detection component 540 is configured to detect the relative positions of the first wafer locking component 200 and the second wafer locking component 400 in the DX and DZ degrees of freedom. The third position detection component 550 is configured to detect the relative positions of the first wafer locking component 200 and the second wafer locking component 400 in the DY and DZ degrees of freedom. Component 550 is configured to detect the relative positions of the DY and DZ degrees of freedom of the first wafer locking component 200 and the second wafer locking component 400; the combination of the first position detection component 530 and the third position detection component 540 can detect the relative positions of the RX and RZ degrees of freedom of the first wafer locking component 200 and the second wafer locking component 400; the combination of the first position detection component 530, the second position detection component 540 and the third position detection component 550 can detect the relative positions of the first wafer locking component 200 and the second wafer locking component 400. Therefore, six-degree-of-freedom error detection of the first wafer locking component 200 and the second wafer locking component 400 can be realized.
[0046] Preferably, the first position detection component 530 and the third position detection component 550 can be symmetrically arranged on both sides of the first wafer locking component 200, and the second position detection component 540 can be arranged on the symmetrical plane of the first position detection component 530 and the third position detection component 550, thereby improving the detection accuracy.
[0047] The aforementioned position detection component 500 can be a position sensor.
[0048] The aforementioned position detection component 500 may include a reading head 510, and the detection auxiliary component may include a planar grating body 520. In the same group of position detection components 500, the reading head 510 and the planar grating body 520 are arranged opposite to each other. In this way, the reading head 510 can realize the relative position detection between the reading head 510 and the planar grating body 520 by reading the planar grating body 520, thereby realizing the relative position detection between the first wafer 600 and the second wafer 700.
[0049] A set of planar grating components can measure the error of two degrees of freedom in space (perpendicular to the grating ruler and parallel to the grating ruler). By properly matching three sets of planar grating components, the relative error of six degrees of freedom of the first wafer 600 and the second wafer 700 can be obtained in real time.
[0050] Preferably, the resolution of the position detection component 500 is set to less than or equal to 0.5 nm to ensure detection accuracy, thereby ensuring alignment accuracy and bonding accuracy. Specifically, the resolution of the position detection component 500 can be set to 0.05 nm, 0.005 nm, etc.
[0051] Specifically, the aforementioned first wafer locking component 200 can be a first vacuum chuck, which can adsorb the first wafer 600, thereby achieving adsorption and locking of the first wafer 600 without damaging it, and with a better locking effect. Correspondingly, the aforementioned second wafer locking component 400 can be a second vacuum chuck, which can adsorb the second wafer 700, thereby achieving adsorption and locking of the second wafer 700 without damaging it, and with a better locking effect.
[0052] In actual use, the first wafer locking member 200 can be positioned above the second wafer locking member 400. Accordingly, the first wafer 600 can be regarded as the upper wafer, and the second wafer 700 can be regarded as the lower wafer.
[0053] This embodiment also provides a wafer bonding apparatus, which includes the wafer alignment device described above.
[0054] The wafer bonding equipment provided in this embodiment includes the wafer alignment device described above, and therefore has all the advantages of the wafer alignment device described above. During the alignment and bonding process of two wafers, the relative position of the two wafers can be detected and adjusted in real time, resulting in high alignment and bonding accuracy.
[0055] In the description of this utility model, it should be noted that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0056] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A wafer alignment device, characterized by, The first micro-motion stage (100), the first wafer locking piece (200), the second micro-motion stage (300), the second wafer locking piece (400) and the position detection assembly (500) are included. The first wafer locking piece (200) is installed on the first micro-motion stage (100), and the first wafer locking piece (200) is used for locking a first wafer (600); the second wafer locking piece (400) is installed on the second micro-motion stage (300), and the second wafer locking piece (400) is used for locking a second wafer (700); the first wafer (600) and the second wafer (700) are arranged oppositely; the first micro-motion stage (100) and the second micro-motion stage (300) are in communication connection with the position detection assembly (500). The position detection assembly (500) includes a position detection piece and a detection auxiliary piece, the position detection piece is installed on the first wafer locking piece (200), the detection auxiliary piece is installed on the second wafer locking piece (400), and the position detection assembly (500) is used for detecting the relative position of the first wafer locking piece (200) and the second wafer locking piece (400).
2. The wafer alignment device of claim 1, wherein, The position detection piece is installed on the first wafer locking piece (200) through a first adapter, the detection auxiliary piece is installed on the second wafer locking piece (400) through a second adapter, and the materials of the first adapter and the second adapter are low-expansion materials.
3. The wafer alignment apparatus of claim 2, wherein The first wafer locking piece (200) and the first micro-motion stage (100) are connected with the first adapter through a first threaded connecting piece, and / or the second wafer locking piece (400) and the second micro-motion stage (300) are connected with the second adapter through a second threaded connecting piece. And / or, the first adapter is L-shaped, and / or, the second adapter is L-shaped.
4. The wafer alignment device of claim 1, wherein, The first micro-motion stage (100) and the second micro-motion stage (300) can drive the first wafer locking piece (200) and the second wafer locking piece (400) to perform six-degree-of-freedom relative micro-motion. The position detection assembly (500) can detect the six-degree-of-freedom relative position of the first wafer locking piece (200) and the second wafer locking piece (400).
5. The wafer alignment apparatus of claim 4, wherein The first micro-motion stage (100) and the second micro-motion stage (300) are arranged along the Z direction; the first micro-motion stage (100) has three degrees of freedom, namely DX, DY and RZ; the second micro-motion stage (300) has six degrees of freedom.
6. The wafer alignment apparatus of claim 4, wherein The position detection assembly (500) comprises a first position detection assembly (530), a second position detection assembly (540), and a third position detection assembly (550), the first position detection assembly (530) is capable of detecting the relative position of the first wafer locking piece (200) and the second wafer locking piece (400) in two degrees of freedom DY and DZ, the second position detection assembly (540) is capable of detecting the relative position of the first wafer locking piece (200) and the second wafer locking piece (400) in two degrees of freedom DX and DZ, and the third position detection assembly (550) is capable of detecting the relative position of the first wafer locking piece (200) and the second wafer locking piece (400) in two degrees of freedom DY and DZ.
7. The wafer alignment apparatus of claim 6, wherein The first position detection assembly (530) and the third position detection assembly (550) are symmetrically distributed on both sides of the first wafer locking piece (200), and the second position detection assembly (540) is located on the symmetry plane of the first position detection assembly (530) and the third position detection assembly (550).
8. The wafer alignment device of claim 1, wherein, The position detection assembly (500) comprises a reading head (510) and a plane grating body (520), and the reading head (510) is arranged opposite to the corresponding plane grating body (520). The resolution of the position detection assembly (500) is less than or equal to 0.5 nm.
9. The wafer alignment apparatus of any of claims 1-8, wherein, The first wafer locking piece (200) comprises a first vacuum chuck for adsorbing a first wafer (600). The second wafer locking piece (400) comprises a second vacuum chuck for adsorbing a second wafer (700).
10. A wafer bonding apparatus, characterized by comprising: The wafer alignment device comprises the wafer alignment device according to any one of claims 1-9.