Imprinting device with airbag structure, vacuum nanoimprinting equipment

Abstract

This utility model discloses an upper imprinting device and a vacuum nanoimprinting equipment with an airbag structure, including: an upper imprinting mold frame, an airbag assembly, an airbag driving device, an airbag vacuuming device, and a cavity vacuuming device. The upper imprinting mold frame is driven by the upper mold frame driving device, and the upper imprinting mold frame has an upper cavity. The airbag assembly is placed in the upper cavity and includes: an upper locking ring plate, a lower locking ring plate, and an airbag. The upper and lower locking ring plates are concentrically arranged and connected to each other, and the edge of the airbag is clamped between the upper and lower locking ring plates. Under the action of the airbag vacuuming device and the cavity vacuuming device, a vacuum pressure difference is formed inside and outside the airbag, and the airbag expands outward, applying downward pressure to the center area of ​​the wafer, causing the wafer to deform accordingly. This utility model achieves deformation of the center area of ​​the wafer by expanding and applying pressure under vacuum pressure difference, thereby improving the accuracy of wafer bonding with the motherboard and the imprinting yield.

Description

Technical Field

[0001] This utility model belongs to the field of nanoimprint technology, specifically relating to an imprinting device with an airbag structure and a vacuum nanoimprinting equipment. Background Technology

[0002] Nanoimprint lithography, as a high-precision micro / nanostructure manufacturing method, has become one of the core technologies in semiconductor manufacturing, optical device processing, and biomedical sensors due to its ability to transfer high-resolution patterns at the nanoscale. This technology directly transfers nanoscale structures from a template to a target substrate (such as a wafer) through physical imprinting, offering advantages such as low cost, high resolution, and mass production capability. It has demonstrated significant value, particularly in the fabrication of next-generation integrated circuits, photonic crystals, and microfluidic chips.

[0003] Current nanoimprint lithography mainly employs the traditional soft imprinting technique: first, a soft film (usually an elastic material such as PDMS) is used to replicate the microstructure on a rigid substrate, forming an elastic intermediate template. This intermediate template is then used for a second imprint transfer onto the wafer. While this two-step process can adapt to the micro-undulations on the wafer surface to some extent, its inherent multi-step process leads to low production efficiency, and the repeated use of the intermediate template introduces cumulative pattern distortion errors.

[0004] To simplify the process and improve processing efficiency, a rigid substrate (such as glass, quartz, or silicon-based templates) is directly bonded to the wafer, and the pattern transfer is completed in one step through methods such as hot pressing or UV curing. However, this technology faces significant challenges in practical applications: since both the substrate and the wafer are rigid materials, it is difficult to completely eliminate the tiny gaps between them during high-pressure bonding, which easily traps air and forms microbubbles. The presence of these bubbles can cause incomplete pattern transfer, structural deformation, or even damage to the photoresist layer, ultimately leading to a decrease in wafer processing yield.

[0005] Therefore, a new type of nanoimprinting equipment that can retain the efficiency advantages of direct imprinting on rigid master plates, while effectively suppressing bubble formation and improving the consistency of pattern transfer, has become a technical challenge that urgently needs to be overcome in this field. Utility Model Content

[0006] To solve the above-mentioned technical problems, this utility model proposes an upper imprinting device with an airbag structure and a vacuum nanoimprinting equipment.

[0007] To achieve the above objectives, the technical solution of this utility model is as follows:

[0008] In a first aspect, this utility model discloses an upper imprinting device with an airbag structure, comprising:

[0009] The upper impression mold frame is connected to the upper mold frame drive device, and the upper impression mold frame has an upper cavity. The upper mold frame drive device is used to drive the upper impression mold frame to rise and fall.

[0010] An airbag assembly is placed in the upper cavity and includes an upper locking ring plate, a lower locking ring plate, and an airbag. The upper locking ring plate and the lower locking ring plate are concentrically arranged and connected to each other. The edge of the airbag is clamped between the upper locking ring plate and the lower locking ring plate to form a sealed and fixed structure.

[0011] An airbag drive device is connected to the airbag assembly for driving the airbag assembly to rise and fall.

[0012] The airbag vacuum device is connected to the inner cavity of the airbag through a pipeline.

[0013] The cavity vacuum device is connected to the upper cavity through a pipeline.

[0014] In this process, the airbag, under the action of the airbag vacuum pumping device and the cavity vacuum pumping device, forms a pressure difference between the inside and outside of the vacuum. The airbag expands outward and exerts downward pressure on the central area of ​​the wafer, causing the wafer to deform accordingly.

[0015] This utility model discloses an imprinting device with an airbag structure. By expanding the airbag under vacuum pressure difference, it can precisely control the wafer deformation. Compared with the traditional rigid imprinting method, it can effectively avoid wafer damage caused by uneven pressure, achieve uniform pressure in the central area of ​​the wafer, avoid local stress concentration caused by hard imprinting, reduce bubble residue and improve bonding accuracy, and improve the bonding accuracy and imprinting yield of the wafer and the motherboard.

[0016] Based on the above technical solution, the following improvements can be made:

[0017] As a preferred embodiment, the airbag drive device is connected to the airbag assembly via a leveling component, which is used to adjust the parallelism of the airbag assembly relative to the wafer.

[0018] By adopting the above-mentioned preferred solution, the angular deviation between the airbag assembly and the wafer is eliminated by leveling the assembly, ensuring uniform pressure distribution and avoiding pattern distortion caused by tilting.

[0019] As a preferred option, the leveling components include:

[0020] The upper substrate is connected to the airbag driving device via a transmission.

[0021] The lower adjustment plate is concentrically arranged with the upper base plate and is fixedly connected to the airbag assembly.

[0022] At least three adjusting columns are evenly distributed along the circumference of the lower adjusting plate. One end of each adjusting column is connected to the upper base plate, and the other end is connected to the lower adjusting plate.

[0023] The lower adjustment plate is axially displaced by independently rotating each adjustment column, thereby adjusting the parallelism between the lower adjustment plate and the airbag assembly.

[0024] By adopting the above-mentioned preferred scheme, independent control of multiple adjustment columns can achieve micron-level parallelism adjustment, ensuring that the pressure applied by the airbag is evenly distributed on the wafer surface, avoiding excessive or insufficient local pressure on the wafer due to airbag tilt, and further improving the uniformity of imprinting and product quality stability.

[0025] As a preferred embodiment, the upper locking ring plate includes:

[0026] The outer ring portion has an outer diameter that matches the outer diameter of the lower locking ring plate, and the outer ring portion is fixedly connected to the lower locking ring plate.

[0027] The inner ring is positioned above the middle area of ​​the airbag;

[0028] There are at least three transverse ribs, which connect the outer ring and the inner ring, and are evenly distributed along the circumference of the upper locking ring plate.

[0029] By adopting the above-mentioned preferred scheme, the hollow structure of the upper locking ring plate (outer ring, inner ring and transverse ribs) reduces the overall weight and lowers the energy consumption required to drive the airbag assembly to rise and fall while ensuring the airbag fixing strength; the transverse ribs enhance the structural rigidity of the upper locking ring plate and reduce the radial deformation when the airbag inflates, ensuring the accuracy of pressure transmission.

[0030] As a preferred embodiment, the outer diameter of the inner ring is consistent with the outer diameter of the lower adjusting plate of the leveling assembly, and the central axis of the inner ring coincides with the central axis of the lower adjusting plate.

[0031] By adopting the above-mentioned preferred solution, the coaxial design ensures that the pressure transmission path is aligned, thus avoiding device wear or airbag rupture caused by eccentric loads.

[0032] As a preferred embodiment, an intermediate plate is fixedly connected to the upper surface of the airbag assembly, and at least three pressure sensors are provided between the intermediate plate and the lower adjustment plate of the leveling assembly. The pressure sensors detect the inflation pressure of the airbag in real time.

[0033] By adopting the above-mentioned preferred scheme, the pressure of the airbag is dynamically adjusted through feedback from the pressure sensor to achieve closed-loop control and prevent overpressure from damaging the wafer or the imprinted adhesive layer.

[0034] As a preferred embodiment, the middle plate is provided with at least three ear plates evenly arranged along its circumference, and each ear plate is detachably connected to the corresponding transverse rib by a quick-release lock.

[0035] By adopting the above-mentioned preferred solution, the quick-release structure facilitates the maintenance or replacement of airbag components, reduces equipment downtime, and improves production efficiency.

[0036] As a preferred embodiment, guide posts are provided on both sides of the upper impression mold frame. The guide posts pass through the guide holes of the upper impression mold frame and slide with the upper impression mold frame to restrict the lifting path of the upper impression mold frame.

[0037] By adopting the above-mentioned preferred scheme, the guide column constrains the movement trajectory of the upper imprinting mold frame, avoids cavity misalignment caused by swaying, and ensures precise alignment of the upper and lower mold frames.

[0038] Secondly, this utility model discloses a vacuum nanoimprinting device, including the above-mentioned upper imprinting device and lower imprinting device.

[0039] The lower stamping device includes:

[0040] The lower pressure mold holder has a lower cavity;

[0041] The mother plate carrier is placed inside the lower cavity and is used to fix the mother plate.

[0042] The wafer support ring is placed inside the lower cavity to support the wafer.

[0043] The wafer support ring is connected to the support ring drive device, which is used to drive the wafer support ring to rise and fall.

[0044] This utility model discloses a vacuum nanoimprinting device in which the upper and lower imprinting devices work together to achieve bubble-free bonding by controlling the wafer to contact the mother plate in stages. Attached Figure Description

[0045] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is a schematic diagram of the upper embossing device provided in an embodiment of the present invention.

[0047] Figure 2 This is a schematic diagram of the internal structure of the upper embossing device provided in an embodiment of the present utility model.

[0048] Figure 3 A side view of the internal structure of the upper embossing device provided in an embodiment of this utility model.

[0049] Figure 4 This is a schematic diagram showing the connection between the intermediate plate and the airbag assembly provided in an embodiment of the present invention.

[0050] Figure 5 A schematic diagram of the upper locking ring plate provided in an embodiment of this utility model.

[0051] Figure 6 This is a schematic diagram of the structure of the pressing device provided in an embodiment of the present invention.

[0052] Figure 7 A schematic diagram of the structure of the vacuum nanoimprinting device provided in the embodiment of this utility model.

[0053] Figure 8 A partial schematic diagram of the vacuum nanoimprinting device provided in this embodiment of the present invention.

[0054] Wherein: 1-Upper imprinting device, 11-Upper imprinting mold frame, 12-Airbag assembly, 121-Upper locking ring plate, 1211-Outer ring, 1212-Inner ring, 1213-Transverse rib, 122-Lower locking ring plate, 123-Airbag, 13-Airbag driving device, 14-Upper mold frame driving device, 15-Leveling assembly, 151-Upper substrate, 152-Lower adjusting plate, 153-Adjusting column, 16-Intermediate plate, 161-Ear plate, 17-Pressure sensor, 18-Quick release lock, 19-Guide column, 2-Lower imprinting device, 21-Lower imprinting mold frame, 22-Mother board stage, 23-Wafer support ring, 24-Support ring driving device, 3-Wafer, 4-Mother board. Detailed Implementation

[0055] The preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0056] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0057] The expression “includes” is an “open-ended” expression, which means that there is a corresponding component or step, and should not be interpreted as excluding additional components or steps.

[0058] To achieve the purpose of this utility model, in some embodiments of the upper embossing device with an airbag structure, such as Figure 1-5As shown, the upper imprinting device includes: an upper imprinting mold frame 11, an airbag assembly 12, an airbag driving device 13, an airbag vacuuming device (not shown in the figure), and a cavity vacuuming device (not shown in the figure).

[0059] The upper impression mold frame 11 is connected to the upper mold frame drive device 14 for transmission, and the upper impression mold frame 11 has an upper cavity. The upper mold frame drive device 14 is used to drive the upper impression mold frame 11 to rise and fall.

[0060] The airbag assembly 12 is placed in the upper cavity and includes an upper locking ring plate 121, a lower locking ring plate 122 and an airbag 123. The upper locking ring plate 121 and the lower locking ring plate 122 are concentrically arranged and connected to each other. The edge of the airbag 123 is clamped between the upper locking ring plate 121 and the lower locking ring plate 122 to form a sealed and fixed structure.

[0061] The airbag drive device 13 is connected to the airbag assembly 12 for driving the airbag assembly 12 to rise and fall.

[0062] The airbag vacuum device is connected to the inner cavity of the airbag 123 through a pipeline; the cavity vacuum device is connected to the upper cavity through a pipeline.

[0063] In this process, the airbag 123, under the action of the airbag vacuum device and the cavity vacuum device, forms a pressure difference between the inside and outside of the vacuum. The airbag 123 expands outward and exerts downward pressure on the central region of the wafer 3, causing the wafer 3 to undergo corresponding deformation.

[0064] This utility model discloses an imprinting device 1 with an airbag structure. By expanding the airbag under vacuum pressure difference, it can precisely control the deformation of the wafer 3. Compared with the traditional rigid imprinting method, it can effectively avoid damage to the wafer 3 caused by uneven pressure, achieve uniform pressure in the central area of ​​the wafer, avoid local stress concentration caused by hard imprinting, reduce bubble residue and improve bonding accuracy, and improve the bonding accuracy and imprinting yield of the wafer 3 and the motherboard 4.

[0065] In order to further optimize the implementation effect of this utility model, in some other embodiments, the remaining features are the same, except that the airbag driving device 13 is connected to the airbag assembly 12 through the leveling component 15, and the leveling component 15 is used to adjust the parallelism of the airbag assembly 12 relative to the wafer 3.

[0066] By adopting the above-mentioned preferred solution, the angular deviation between the airbag assembly 12 and the wafer 3 is eliminated by the leveling component 15, ensuring the uniformity of pressure distribution and avoiding pattern distortion caused by tilting.

[0067] Furthermore, the aforementioned leveling component 15 includes:

[0068] Upper substrate 151 is connected to airbag driving device 13 via a transmission connection.

[0069] The lower adjustment plate 152 is concentrically arranged with the upper base plate 151, and the lower adjustment plate 152 is fixedly connected to the airbag assembly 12.

[0070] Three adjusting columns 153 are evenly distributed around the lower adjusting plate 152. One end of the adjusting column 153 is connected to the upper base plate 151, and the other end is connected to the lower adjusting plate 152.

[0071] In this process, by independently rotating each adjusting column 153, the corresponding area of ​​the lower adjusting plate 152 is driven to move axially, thereby adjusting the parallelism between the lower adjusting plate 152 and the airbag assembly 12.

[0072] By adopting the above-mentioned preferred scheme, the multi-adjustment column 153 can independently control the micron-level parallelism adjustment, ensuring that the pressure applied by the airbag is evenly distributed on the surface of wafer 3, avoiding excessive or insufficient local pressure on wafer 3 due to airbag tilt, and further improving the uniformity of imprinting and product quality stability.

[0073] To further optimize the implementation effect of this utility model, in some other embodiments, the remaining technical features are the same, except that the upper locking ring plate 121 includes:

[0074] The outer ring portion 1211 has an outer diameter that is the same as the outer diameter of the lower locking ring plate 122, and the outer ring portion 1211 is fixedly connected to the lower locking ring plate 122.

[0075] The inner ring 1212 is positioned above the middle region of the airbag 123;

[0076] Five transverse ribs 1213 connect the outer ring 1211 and the inner ring 1212, and the transverse ribs 1213 are evenly distributed around the upper locking ring plate 121.

[0077] By adopting the above-mentioned preferred scheme, the hollow structure of the upper locking ring plate 121 (outer ring 1211, inner ring 1212 and transverse rib 1213) reduces the overall weight and lowers the energy consumption required to drive the airbag assembly 12 to rise and fall while ensuring the fixing strength of the airbag 123; the setting of the transverse rib 1213 enhances the structural rigidity of the upper locking ring plate 121, while reducing the radial deformation when the airbag expands, ensuring the accuracy of pressure transmission.

[0078] Furthermore, the outer diameter of the inner ring portion 1212 is consistent with the outer diameter of the lower adjusting plate 152 of the leveling assembly 15, and the central axis of the inner ring portion 1212 coincides with the central axis of the lower adjusting plate 152.

[0079] By adopting the above-mentioned preferred solution, the coaxial design ensures that the pressure transmission path is aligned, thus avoiding device wear or airbag rupture caused by eccentric loads.

[0080] Furthermore, an intermediate plate 16 is fixedly connected to the upper surface of the airbag assembly 12. Three pressure sensors 17 are provided between the intermediate plate 16 and the lower adjustment plate 152 of the leveling assembly 15. The pressure sensors 17 detect the inflation pressure of the airbag in real time.

[0081] Using the preferred scheme described above, the airbag pressure is dynamically adjusted via feedback from pressure sensor 17 to achieve closed-loop control and prevent overpressure damage to wafer 3 or the imprinted adhesive layer. The pressure sensor can be, but is not limited to, Zhuohang Precision-ZHA11+10KG+ZHYA01-0~10V.

[0082] Furthermore, the aforementioned intermediate plate 16 is provided with three ear plates 161 evenly arranged along its circumference, and each ear plate 161 is detachably connected to the corresponding transverse rib 1213 by a quick-release lock 18.

[0083] By adopting the above-mentioned preferred solution, the quick-release structure facilitates the maintenance or replacement of the airbag assembly 12, reduces equipment downtime, and improves production efficiency.

[0084] In order to further optimize the implementation effect of this utility model, in some other embodiments, the remaining features are the same, except that guide posts 19 are provided on both sides of the upper imprinting mold frame 11. The guide posts 19 pass through the guide holes of the upper imprinting mold frame 11 and slide with the upper imprinting mold frame 11 to restrict the lifting path of the upper imprinting mold frame 11.

[0085] By adopting the above-mentioned preferred scheme, the guide post 19 constrains the movement trajectory of the upper imprinting mold frame 11, avoids cavity misalignment caused by swaying, and ensures accurate alignment of the upper and lower mold frames.

[0086] In other embodiments, such as Figure 7-8 The present invention also discloses a vacuum nanoimprinting device, including the above-mentioned upper imprinting device 1 and lower imprinting device 2.

[0087] The lower imprinting device 2 includes: a lower imprinting mold frame 21, a motherboard stage 22, a wafer support ring 23, and a support ring driving device 24.

[0088] The lower die holder 21 has a lower cavity, and the motherboard stage 22 is placed in the lower cavity to fix the motherboard 4. The wafer support ring 23 is placed in the lower cavity to support the wafer 3. The wafer support ring 23 is connected to the support ring drive device 24, which is used to drive the wafer support ring 23 to move up and down.

[0089] This utility model discloses a vacuum nanoimprinting device, in which the upper and lower imprinting devices 2 work together to achieve bubble-free bonding by controlling the deformation of the wafer 3 and its contact with the mother plate 4 in stages.

[0090] In other embodiments, the present invention also discloses a vacuum nanoimprinting method, which utilizes a vacuum nanoimprinting device to achieve nanoimprinting, including:

[0091] Step S101: Place the motherboard 4 coated with imprinting adhesive on the motherboard stage 22, and place the wafer 3 on the wafer support ring 23.

[0092] Step S102: The upper imprinting device 1 moves downward, and the upper cavity and lower cavity close to form a sealed space;

[0093] Step S103: Use a cavity vacuum pumping device to evacuate the sealed space to the first vacuum level;

[0094] Step S104: The airbag vacuum device is used to evacuate the inner cavity of the airbag to a second vacuum level, which is lower than the first vacuum level. The airbag 123 expands under the pressure difference between the inside and outside of the vacuum level.

[0095] The airbag 123 applies downward pressure to the central region of the wafer 3, causing the wafer 3 to deform, with the edges of the wafer 3 lifting up and the central region bulging downward.

[0096] Step S105: The airbag driving device 13 drives the airbag downward, so that the downward protruding part of the central area of ​​the wafer 3 contacts the motherboard 4 first.

[0097] Step S106: The support ring drive device 24 drives the wafer support ring 23 to slowly descend, so that the contact surface of the wafer 3 is fully bonded to the mother board 4 in a diffusion manner.

[0098] Furthermore, in some other embodiments, the airbag driving device 13 drives the airbag downward so that when the downward protruding part of the central region of the wafer 3 contacts the motherboard 4, the pressure sensor detects the pressure of the airbag in real time.

[0099] It is worth noting that in step S106, when the wafer support ring 23 moves downward, the airbag drive device 13 does not operate, and the airbag assembly 12 remains fixed.

[0100] This utility model discloses a vacuum nanoimprinting method. Based on the aforementioned vacuum nanoimprinting equipment, through unique airbag pressure and step-by-step bonding process, the wafer 3 and the motherboard 4 can be bonded in a more scientific way in a vacuum environment, effectively reducing air bubbles formed by residual air, improving the integrity and accuracy of pattern transfer, and is especially suitable for nanoscale structure processing with extremely high precision requirements, providing an efficient and reliable production process for semiconductor manufacturing, optical component preparation and other fields.

[0101] In the description of this utility model, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "side", "top", "inner", "front", "center", "both ends", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0102] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0103] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications may be made to this utility model without departing from its spirit and scope. All such changes and modifications fall within the scope of protection of this utility model as defined by the appended claims and their equivalents.

Claims

1. An upper embossing device with an airbag structure, characterized in that, include: An upper impression mold frame is connected to an upper mold frame drive device, and the upper impression mold frame has an upper cavity. The upper mold frame drive device is used to drive the upper impression mold frame to rise and fall. An airbag assembly is placed in the upper cavity and includes an upper locking ring plate, a lower locking ring plate, and an airbag. The upper locking ring plate and the lower locking ring plate are concentrically arranged and connected to each other. The edge of the airbag is clamped between the upper locking ring plate and the lower locking ring plate to form a sealed and fixed structure. An airbag driving device is connected to the airbag assembly for driving the airbag assembly to rise and fall. An airbag vacuum device, wherein the airbag vacuum device is connected to the inner cavity of the airbag through a pipeline; A cavity vacuuming device, which is connected to the upper cavity via a pipeline; In this process, the airbag, under the action of the airbag vacuum device and the cavity vacuum device, forms a pressure difference between the inside and outside of the vacuum. The airbag expands outward and applies downward pressure to the center region of the wafer, causing the wafer to deform accordingly.

2. The upper imprinting device according to claim 1, characterized in that, The airbag drive device is connected to the airbag assembly via a leveling component, which is used to adjust the parallelism of the airbag assembly relative to the wafer.

3. The upper imprinting device according to claim 2, characterized in that, The leveling component includes: Upper substrate, which is connected to the airbag driving device via a transmission connection; The lower adjustment plate is concentrically arranged with the upper base plate and is fixedly connected to the airbag assembly. At least three adjusting columns are evenly distributed along the circumference of the lower adjusting plate, with one end of each adjusting column connected to the upper base plate and the other end connected to the lower adjusting plate. Specifically, by independently rotating each of the adjustment columns, the corresponding area of ​​the lower adjustment plate is driven to move axially, thereby adjusting the parallelism between the lower adjustment plate and the airbag assembly.

4. The upper embossing device according to claim 3, characterized in that, The upper locking ring plate includes: The outer ring portion has an outer diameter that is the same as the outer diameter of the lower locking ring plate, and the outer ring portion is fixedly connected to the lower locking ring plate; Inner ring portion, the inner ring portion being positioned above the middle region of the airbag; At least three transverse ribs are provided, which connect the outer ring and the inner ring, and are evenly distributed along the circumference of the upper locking ring plate.

5. The upper embossing device according to claim 4, characterized in that, The outer diameter of the inner ring is the same as the outer diameter of the lower adjusting plate of the leveling assembly, and the central axis of the inner ring coincides with the central axis of the lower adjusting plate.

6. The upper embossing device according to claim 4, characterized in that, An intermediate plate is fixedly connected to the upper surface of the airbag assembly. At least three pressure sensors are provided between the intermediate plate and the lower adjustment plate of the leveling assembly. The pressure sensors detect the inflation pressure of the airbag in real time.

7. The upper imprinting device according to claim 6, characterized in that, The intermediate plate is provided with at least three ear plates evenly arranged along its circumference, and each ear plate is detachably connected to the corresponding transverse rib by a quick-release lock.

8. The upper embossing device according to claim 1, characterized in that, The upper impression mold frame is provided with guide posts on both sides. The guide posts pass through the guide holes of the upper impression mold frame and slide with the upper impression mold frame to restrict the lifting path of the upper impression mold frame.

9. A vacuum nanoimprinting device, characterized in that, Includes the upper imprinting device and the lower imprinting device as described in any one of claims 1-8; The pressing device includes: A lower pressure mold holder, wherein the lower pressure mold holder has a lower cavity; A mother plate carrier is placed inside the lower cavity to fix the mother plate. A wafer support ring, which is placed in the lower cavity to support the wafer; The wafer support ring is connected to the support ring drive device, which is used to drive the wafer support ring to rise and fall.

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