A press for a circuit board

Abstract

This application provides a laminating machine for circuit boards, comprising: a body, a moving mechanism, a laminating mechanism, and a placement assembly. The body is placed on a fixed surface. The moving mechanism is fixedly connected to the body. The laminating mechanism is slidably connected to the moving mechanism to generate a laminating force. The placement assembly is fixedly connected to the body and disposed opposite to the laminating mechanism, the laminating mechanism sliding to fit against the placement assembly. The laminating assembly includes a flexible laminating member disposed at one end near the placement assembly. The placement assembly has a placement groove with its open end facing the flexible laminating member, the placement groove holding a flexible circuit board, and a gap forming between the flexible circuit board and the placement groove. Under the action of the laminating force, the flexible laminating member wraps around the flexible circuit board and fills the gap, resulting in a laminating state. This structure improves the uniformity of the laminating process.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing, and more particularly to a laminating machine for circuit boards. Background Technology

[0002] Flexible printed circuits (FPCs) are lightweight, thin, and bendable, making them widely used in highly integrated electronic products such as mobile phones, laptops, wearable devices, and camera modules. During the manufacturing or packaging of FPCs, lamination equipment is often used to bond the FPC to adhesive films, protective layers, or other components.

[0003] Existing lamination devices typically employ rigid plate structures, which work well for laminating conventional rigid circuit boards. However, when applied to flexible circuit boards (FPCs), the traditional rigid lamination structure cannot effectively adhere to the board surface due to the FPC's inherent flexibility, tendency to warp, significant thickness variations, and the potential presence of irregularly shaped components. This can easily lead to uneven adhesion, gaps, air bubbles, and even damage to the circuitry, affecting the reliability and yield of subsequent products.

[0004] To address this, some technical solutions have attempted to introduce elastic layers or vacuum adsorption platforms to alleviate the FPC deformation problem. However, these solutions still suffer from defects such as excessively rigid support structures, limited bonding range of pressed parts, and localized stress concentration. They cannot adequately accommodate the gaps or shape differences between the FPC and the support surface, resulting in unsatisfactory pressing effects.

[0005] Therefore, there is a need for a laminator for circuit boards that improves the uniformity of the lamination process. Utility Model Content

[0006] In view of this, it is necessary to provide a laminator for circuit boards that improves the uniformity of the lamination process in order to solve the above problems.

[0007] Embodiments of this application provide a laminating machine for circuit boards, comprising:

[0008] The main body is placed on a fixed surface;

[0009] The moving mechanism is fixedly connected to the main body;

[0010] A pressing mechanism is slidably connected to the moving mechanism to generate a pressing force;

[0011] A placement component is fixedly connected to the main body and is disposed opposite to the pressing mechanism, wherein the pressing mechanism slides to fit and connect with the placement component.

[0012] The pressing assembly includes a flexible pressing member disposed near one end of the placement assembly;

[0013] The placement component has a placement groove with its open end facing the flexible pressing component. A flexible circuit board is placed in the placement groove, and a gap is formed between the flexible circuit board and the placement groove. Under the action of pressing force, the flexible pressing component wraps around the flexible circuit board and fills the gap, thus forming a pressed state.

[0014] In at least one embodiment of this application, the flexible press-fit member is made of an elastic material.

[0015] In at least one embodiment of this application, the placement groove consists of a placement plane and the gap, wherein the opening direction of the gap is from the placement plane to the direction away from the moving mechanism.

[0016] In at least one embodiment of this application, the flexible pressing element is made of silicone.

[0017] In at least one embodiment of this application, the flexible pressing member is hemispherical, with the protruding end of the hemispherical shape facing the placement groove.

[0018] In at least one embodiment of this application, the hemispherical cross section is denoted as A, and the placement plane is denoted as B, satisfying the following relationship:

[0019] Under compression, A > B;

[0020] In the uncompressed state, A < B.

[0021] In at least one embodiment of this application, the placement component includes:

[0022] A vacuum adsorption component is connected to the placement plane to adsorb and fix the Ouxing circuit board.

[0023] In at least one embodiment of this application, the moving mechanism includes:

[0024] The first sliding component is vertically mounted on the body and slides along the height direction of the body. It is fixedly connected to the pressing mechanism so as to drive the pressing mechanism to slide along the height direction of the body and generate a pressing force.

[0025] The second sliding component is disposed on the body and is perpendicularly connected to the first sliding component. The second sliding component is slidably connected to the placement component.

[0026] In at least one embodiment of this application, the second sliding component slides along either the width direction or the length direction of the body.

[0027] In at least one embodiment of this application, the fixed surface is either the ground or a tabletop.

[0028] The aforementioned laminating machine for circuit boards provides flexible support and flexible bonding of the flexible circuit board by setting a flexible laminating component on the laminating mechanism and having it wrap around the flexible circuit board and fill the gap between it and the placement groove under the action of laminating force. This effectively solves the problem that traditional rigid laminating structures cannot adapt to the bending, thickness changes and uneven surface of the circuit board, thereby improving the uniformity and reliability of the laminating process. Attached Figure Description

[0029] Figure 1 This is a perspective view of a laminating machine for circuit boards as described in this application;

[0030] Figure 2 This is a front view of a laminating machine for circuit boards as described in this application;

[0031] Figure 3 for Figure 1 A magnified view of a portion of the image;

[0032] Figure 4 for Figure 2 A magnified view of a portion of the image;

[0033] Explanation of main component symbols

[0034] 100. Pressing machine for circuit boards; 10. Body; 20. Moving mechanism; 30. Pressing mechanism; 40. Placement assembly; 31. Flexible pressing component; 41. Placement groove; 411. Placement plane; 412. Gap; 42. Vacuum adsorption component; 21. First sliding assembly; 22. Second sliding assembly; F1. Height direction of the body; F2. Width direction of the body; F3. Length direction of the body. Detailed Implementation

[0035] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0036] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have an intervening component. When a component is considered to be "placed" on another component, it can be directly placed on the other component or may also have an intervening component. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "back," and similar expressions used in this article are for illustrative purposes only.

[0037] This application provides a laminating machine for circuit boards, comprising: a body, a moving mechanism, a laminating mechanism, and a placement assembly. The body is placed on a fixed surface. The moving mechanism is fixedly connected to the body. The laminating mechanism is slidably connected to the moving mechanism to generate a laminating force. The placement assembly is fixedly connected to the body and disposed opposite to the laminating mechanism, the laminating mechanism sliding to fit against the placement assembly. The laminating assembly includes a flexible laminating member disposed at one end near the placement assembly. The placement assembly has a placement groove with its open end facing the flexible laminating member, the placement groove holding a flexible circuit board, and a gap forming between the flexible circuit board and the placement groove. Under the action of the laminating force, the flexible laminating member wraps around the flexible circuit board and fills the gap, resulting in a laminating state.

[0038] The aforementioned laminating machine for circuit boards provides flexible support and flexible bonding of the flexible circuit board by setting a flexible laminating component on the laminating mechanism and having it wrap around the flexible circuit board and fill the gap between it and the placement groove under the action of laminating force. This effectively solves the problem that traditional rigid laminating structures cannot adapt to the bending, thickness changes and uneven surface of the circuit board, thereby improving the uniformity and reliability of the laminating process.

[0039] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0040] Please see Figures 1-4 This application provides a laminating machine 100 for circuit boards, comprising: a body 10, a moving mechanism 20, a laminating mechanism 30, and a placement assembly 40. The body 10 is placed on a fixed surface. The moving mechanism 20 is fixedly connected to the body 10. The laminating mechanism 30 is slidably connected to the moving mechanism 20 to generate a laminating force. The placement assembly 40 is fixedly connected to the body 10 and is disposed opposite to the laminating mechanism 30, the laminating mechanism 30 sliding to fit against the placement assembly 40. The laminating assembly includes a flexible laminating member 31 disposed at one end near the placement assembly 40. The placement assembly 40 has a placement groove 41 with its open end facing the flexible laminating member 31, the placement groove 41 holding a flexible circuit board, and a gap 412 forming between the flexible circuit board and the placement groove 41. Under the action of the laminating force, the flexible laminating member 31 wraps around the flexible circuit board and fills the gap 412, resulting in a laminating state.

[0041] Specifically, the main body 10 is mounted on a fixed surface. The fixed surface is either the ground or a tabletop. The fixed surface serves as a stable support base for the entire pressing equipment. The main body 10 provides stable mechanical support, preventing the equipment from shaking or shifting during the pressing process. By fixing the main body 10 to the tabletop or ground via mechanical connection, it ensures that all components are stable and controllable during operation, avoiding any impact on pressing accuracy due to equipment vibration.

[0042] The moving mechanism 20 is fixedly connected to the main body 10. The moving mechanism 20 drives the pressing mechanism 30 to slide towards the placement component 40. The moving mechanism 20 includes a first sliding component and a second sliding component. The first sliding component slides vertically, driving the pressing mechanism 30 to move up and down. The second sliding component slides horizontally, enabling the pressing mechanism 30 to align with the target circuit board in a horizontal position. The moving mechanism 20 achieves precise movement and positioning of the pressing mechanism 30 in three dimensions. This facilitates multi-position, multi-batch pressing operations, improving equipment flexibility.

[0043] The first sliding component uses an electric lead screw structure to achieve precise pressure drop in the Z-axis direction. The second sliding component uses an electric guide rail platform to achieve X / Y direction position adjustment. Together, the two components allow the pressing mechanism 30 to be precisely aligned with circuit boards at different positions, ensuring accurate pressing action.

[0044] The mobile mechanism 20 is existing technology and will not be described in detail here.

[0045] The pressing mechanism 30 is slidably connected to the moving mechanism 20. The pressing mechanism 30 slides downward to be close to the placement component 40 and applies a pressing force through the flexible pressing member 31.

[0046] The pressing mechanism 30 enables controllable pressing action, suitable for circuit board products of various thicknesses or heights, avoiding excessive or insufficient pressing force. The moving mechanism 20 provides an adjustable pressing distance, and combined with the elasticity of the pressing component, it ensures that flexible circuit boards of different thicknesses can obtain appropriate and uniform pressing force.

[0047] A flexible pressing element 31 is disposed at the lower end of the pressing mechanism 30. The flexible pressing element 31 is preferably a hemispherical structure with its protruding end facing downwards. The flexible pressing element 31 is made of elastic silicone.

[0048] The flexible pressing component 31 can undergo elastic deformation under stress, thereby wrapping and bonding the flexible circuit board and filling the gap 412 between the board and the placement groove 41. This solves the problem of uneven bonding in traditional rigid pressing plates.

[0049] In its unpressed state, the flexible press-fit component 31 has a diameter smaller than the width of the placement plane 411. During pressing, it is compressed in the vertical direction and expands laterally, thereby deforming to cover the entire circuit board surface and enter the gap area 412, achieving "soft contact" pressing and avoiding damage and gaps.

[0050] The placement component 40 is fixedly mounted on the main body 10. The placement component 40 includes an upwardly opening placement slot 41. The placement slot 41 includes a placement plane 411. A gap 412d is provided between the placement plane 411 and the flexible circuit board.

[0051] The placement component 40 provides a stable positioning groove space, making it difficult for the flexible circuit board to slide. At the same time, the reserved gap 412 facilitates the deformation and entry of the flexible pressing component 31 to achieve a fit. The placement groove 41 is formed by machining, with a controllable depth and width, so that the flexible pressing component 31 can precisely fill the gap between the circuit board and the groove during pressing, while avoiding direct contact between the pressing plate and the groove to prevent interference.

[0052] The flexible circuit board is placed in the placement slot 41. During the downward movement of the pressing mechanism 30, the flexible pressing component 31 presses against the flexible circuit board. Under the action of the pressing force, the pressing component undergoes elastic deformation and makes full contact with the surface of the circuit board.

[0053] The placement component 40 achieves a comprehensive and uniform bonding effect through a flexible wrapping bonding method. This effectively avoids problems such as air bubbles and local delamination, improving bonding quality and product yield. The surface of the flexible bonding component 31 has a large contact area with the circuit board, while filling all corner gaps 412, ensuring that the entire circuit board surface is subjected to consistent pressure. By controlling the bonding depth and duration, bonding stability is ensured.

[0054] The horizontal cross-sectional diameter of the flexible press-fit component 31 is A, and the width of the placement plane 411 is B. The following relationship must be satisfied:

[0055] Before pressing: A <B;

[0056] Under compression: A > B.

[0057] The horizontal cross-sectional diameter A and the width B of the placement plane 411 ensure that the flexible pressing part 31 will not press against the edge of the groove before pressing, and its deformation range after pressing is sufficient to completely cover and wrap the circuit board, improving the bonding consistency.

[0058] The initial dimensions are designed based on the elastic modulus of the silicone material. By adjusting the pressing force, the silicone material deforms and expands under the pressing state, forming a deformation dimension larger than the placement plane 411, thus achieving full adhesion.

[0059] A vacuum adsorption component 42 is provided within the placement assembly 40. The vacuum adsorption component 42 is connected to the placement plane 411 and is used to adsorb the bottom surface of the flexible circuit board. The vacuum adsorption component 42 fixes the position of the circuit board before pressing to prevent it from shifting or warping during operation and to ensure pressing accuracy.

[0060] By connecting an external vacuum pump, adsorption is activated after the circuit board is placed in the placement slot 41, causing it to adhere to the bottom of the slot. When the pressing mechanism 30 presses down, the suction is turned off to avoid affecting the bonding path of the flexible pressing part 31.

[0061] Therefore, the above-mentioned laminating machine 100 for circuit boards provides flexible support and flexible fit for the flexible circuit board by setting a flexible laminating member 31 on the laminating mechanism 30 and having it wrap around the flexible circuit board and fill the gap 412 between it and the placement groove 41 under the action of laminating force. This effectively solves the problem that traditional rigid laminating structures cannot adapt to the bending, thickness change and surface unevenness of the circuit board, thereby improving the uniformity and reliability of the laminating process.

[0062] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A laminating machine for circuit boards, characterized in that, include: The main body is placed on a fixed surface; The moving mechanism is fixedly connected to the main body; A pressing mechanism is slidably connected to the moving mechanism to generate a pressing force; A placement component is fixedly connected to the main body and is disposed opposite to the pressing mechanism, wherein the pressing mechanism slides to fit and connect with the placement component. The pressing assembly includes a flexible pressing member disposed near one end of the placement assembly; The placement component has a placement groove with its open end facing the flexible pressing component. A flexible circuit board is placed in the placement groove, and a gap is formed between the flexible circuit board and the placement groove. Under the action of pressing force, the flexible pressing component wraps around the flexible circuit board and fills the gap, thus forming a pressed state.

2. The laminating machine for circuit boards according to claim 1, characterized in that, The flexible press-fit component is made of an elastic material.

3. The laminating machine for circuit boards according to claim 1, characterized in that, The placement slot consists of a placement plane and the gap, and the gap is opened in the direction from the placement plane away from the moving mechanism.

4. The laminating machine for circuit boards according to claim 1, characterized in that, The flexible pressing component is made of silicone.

5. The laminating machine for circuit boards according to claim 3, characterized in that, The flexible pressing component is hemispherical, with the protruding end of the hemispherical shape facing the placement groove.

6. The laminating machine for circuit boards according to claim 5, characterized in that, The hemispherical cross section is denoted as A, and the placement plane is denoted as B, satisfying the following relationship: Under compression, A > B; In the uncompressed state, A < B.

7. The laminating machine for circuit boards according to claim 1, characterized in that, The placement component includes: A vacuum adsorption component is connected to the placement plane to adsorb and fix the Ouxing circuit board.

8. The laminating machine for circuit boards according to claim 1, characterized in that, The moving mechanism includes: The first sliding component is vertically mounted on the body and slides along the height direction of the body. It is fixedly connected to the pressing mechanism so as to drive the pressing mechanism to slide along the height direction of the body and generate a pressing force. The second sliding component is disposed on the body and is perpendicularly connected to the first sliding component. The second sliding component is slidably connected to the placement component.

9. The laminating machine for circuit boards according to claim 8, characterized in that, The second sliding component slides along either the width direction or the length direction of the body.

10. The laminating machine for circuit boards according to claim 1, characterized in that... The fixed surface can be either the ground or a tabletop.

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